JP3207375B2 - Ion acceleration electrode plate and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ion accelerating electrode for accelerating ions in plasma to generate a high-speed ion beam in an ion source applied to a neutral particle injection device or an ion mixing device of a nuclear fusion device. The present invention relates to a plate and a method for manufacturing the plate.

[0002]

2. Description of the Related Art In a neutron injection device and an ion mixing device of a nuclear fusion device, an ion source for generating a high-speed ion beam from plasma is used.

For example, an ion source of a neutron injector generates a plasma by performing an arc discharge through a filament in a plasma generating section having a filament into which a gas such as hydrogen is introduced. The gas in the plasma draws ionized ions out of the plasma by an electric field formed on the electrode plate, accelerates the gas, and generates a high-speed ion beam having high energy.

The ion accelerating electrode plate in the above-mentioned ion source is adapted to extract an ion beam from plasma through ion beam extraction holes formed in a large number of the electrode plate. It has a structure that comes into direct contact with the ion beam. Therefore, in the ion accelerating electrode plate, a cooling channel is provided between the beam extraction holes for cooling in order to reduce the heat load of the ion accelerating electrode plate itself and maintain durability.

FIG. 20A is a sectional view showing the structure of a conventional ion accelerating electrode plate, and FIG.
It is a figure which expands and shows a part in (a).

According to the ion acceleration electrode plate 90, grooves 92 are provided between the beam extraction holes 91 in the surface of the electrode plate main body 90a on the plasma 93 side having a large number of beam extraction holes 91 for extracting the ion beam. About half the area of the cooling pipe 94 is embedded in the groove 92 and brazed by a brazing material 95. The cooling of the ion accelerating electrode plate 90 is performed by flowing a refrigerant through the cooling pipe 94. The cooling pipe 94 is provided on the plasma 93 side because another electrode plate (a suppression electrode plate to which a negative voltage is applied) is installed on the opposite side (beam extraction side). This is to prevent the electric field formed between the ion accelerating electrode plates from being disturbed by the cooling pipe and to prevent the distance between the electrode plates from being restricted by the cooling pipe.

However, when the ion beam is extracted from the plasma 93 by using the above-described ion accelerating electrode plate 90, the cooling pipe 94 and the brazing material 95 are directly exposed to the plasma 93. By heating by the ion injection in the plasma 93 and heat radiation from the plasma 93 and the filament,
The material forming the brazing material 95 and the cooling pipe 94 is mixed into the plasma 93 as an impurity, and unnecessary elements contained in the impurity are mixed in the ion beam, thereby deteriorating the purity of the ion beam. Was.

Further, since the entire outer peripheral surface of the cooling pipe 94 is not in contact with the electrode plate main body 90a, the contact area between the cooling pipe 94 and the electrode plate main body 90a is small. As a result, it is difficult to obtain a large cooling efficiency. . Therefore, in the conventional ion accelerating electrode plate, the material that can be used as the electrode plate main body 90a is limited to a thermally stable metal such as molybdenum. There is a problem that the cost of the 90 itself increases.

Further, the cooling pipe 94 is connected to the electrode plate main body 90.
At the time of brazing to (a), depending on the brazing conditions, for example, the type of brazing material to be used, there is a possibility that the cooling pipe 94 may have a defect that causes refrigerant leakage.

Therefore, an ion-accelerated electrode plate in which the brazing filler metal and the cooling pipe are not directly exposed to the plasma and the cooling area is improved by increasing the contact area between the cooling pipe and the electrode plate, and a method of manufacturing the same are proposed. Have been.

For example, in an ion acceleration electrode plate disclosed in Japanese Patent Application Laid-Open No. 2-244546, a cooling pipe for flowing a refrigerant is sandwiched between two upper and lower electrode plates, and a space between the two upper and lower electrode plates and the cooling pipe is provided. Brazing (for example, using a brazing material containing silver in a vacuum) or hot isostatic pressing (hot isostatic sintering; Hot Isostatic Pressing, HIP)
Method).

According to the method for manufacturing an ion accelerating electrode plate disclosed in Japanese Patent Application Laid-Open No. Hei 3-12938, a groove surface of a grooved molybdenum plate in which a groove for a cooling water passage is formed in a molybdenum plate which is a high melting point material. A nickel-coated molybdenum plate is superimposed thereon, and the molybdenum plate with the groove and the molybdenum plate are fixed and integrated by diffusion bonding to form a groove with the groove of the molybdenum plate with the groove. A cooling water passage covered with nickel is formed between the cooling water passage and the cooling water passage. Then, a beam extraction hole is formed in the integrated molybdenum plate to obtain an ion acceleration electrode plate.

Further, according to the ion accelerating electrode plate and the manufacturing method thereof disclosed in JP-A-5-29093, a molybdenum plate and a molybdenum flat plate having the same groove as the ion accelerating electrode plate disclosed in JP-A-3-12938 are disclosed. An ion accelerating electrode plate configured as a main component, the ion accelerating electrode plate has a polymerized plate structure formed by integrating a grooved molybdenum plate and a molybdenum plate by diffusion bonding, and the grooved molybdenum plate is The peripheral surface of a cooling water passage (cooling hole) formed between the groove and the molybdenum flat plate is covered with a ceramic coating layer based on ceramic deposition to obtain an ion acceleration electrode plate.

According to the ion accelerating electrode plate and the manufacturing method thereof disclosed in Japanese Patent Application Laid-Open No. 6-314600, a tantalum plate with a groove and a tantalum plate are integrated by diffusion bonding using titanium as an insert metal to reduce weight. An ion accelerating electrode plate having a plywood structure is obtained.

[0015]

However, according to the ion acceleration electrode plate disclosed in Japanese Patent Application Laid-Open No. 2-244546, the space between the upper and lower electrode plates and the cooling pipe (between three members) is brazed or removed. Since they are bonded and integrated by the HIP method, they have the following problems.

That is, when the above three members are bonded by brazing, the bonding (bonding) area is 400 cm ² or more, which is relatively large as viewed from a general bonding area. It is very difficult to braze the steel uniformly and without defects even from the current technical level of brazing.

Therefore, when an unjoined portion due to brazing appears on the joined surface, the heat conduction efficiency of the upper and lower electrode plates for removing a high heat load due to the ion beam is reduced due to the presence of the unjoined portion, and the ion accelerating electrode plate is reduced. The cooling efficiency of the whole deteriorated, and the ion acceleration electrode plate was heated and deformed. Due to the heating and deformation of the ion acceleration electrode plate, the position of the beam extraction hole shifts, causing a problem that the ion acceleration electrode plate loses its function as an acceleration electrode plate.

On the other hand, when the above three members are joined by the HIP method, a vacuum seal is welded over the entire periphery of the joint surface to perform a vacuum before the isostatic pressing by the HIP method. It is necessary to seal to a state. This vacuum seal can be easily welded in a vacuum by using an electron beam welding machine.

However, the ion accelerating electrode plate is made of copper, a copper alloy or the like having good thermal conductivity, and has a thickness of about 5 to 1
Since it is formed to be relatively thin, about 0 mm, the heat input must be set high as a condition for electron beam welding.
Due to this high heat input, the electrode plate was bent or undulated due to thermal deformation during welding. As a result, after the vacuum seal is welded, the ion acceleration electrode plate obtained by joining the upper and lower two electrode plates and the cooling pipe by the HIP method is also bent or undulated.

The ion accelerating electrode plate having such a bend or undulation is modified after the joining step by the HIP method. However, it is difficult to obtain a predetermined shape and flatness. As a result, the position of the beam extraction hole is shifted,
There has been a problem that the ion acceleration electrode plate loses its function as an acceleration electrode plate.

On the other hand, in order to perform the joining by the HIP method, a helium gas is sprayed on a vacuum seal welding portion over the entire periphery of the joining surface using a helium leak detector to perform a leak test, and high airtightness (1 × 10 ^{− 9} Torr · l / se
c) It is necessary to confirm that it has the following leak amount). Further, the leak test is performed in a static state.
High airtightness is required even during joining in a high temperature and high atmosphere by the P method. If the vacuum seal breaks, high-temperature, high-pressure gas enters the joint surface,
Good bonding cannot be performed.

As described above, in order to join the three members by the HIP method, it is possible to maintain a sufficiently high airtightness even during the joining by the HIP method without causing bending or undulation to the electrode plate. Such extremely difficult seal welding technology is required. However, in order to realize such a highly difficult seal welding, at the current technical level, there are many problems to be solved, such as sophistication of a welding machine and improvement of skills of a welding operator.

On the other hand, any of the ion accelerating electrode plates disclosed in JP-A-2-244546, JP-A-3-12938, JP-A-5-29093, and JP-A-6-314600 has a high It is made of molybdenum or tantalum, which is a melting point material, and has a structure in which a grooved plate made of molybdenum (tantalum) and a flat plate made of molybdenum (tantalum) are integrated by diffusion bonding. There is a point.

That is, in the ion accelerating electrode plates disclosed in the above publications, since expensive molybdenum and tantalum are used as the electrode plate material, the production and production of the ion accelerating electrode plates are difficult.
This is one of the factors that increase the manufacturing cost and deteriorate the practicality.

On the other hand, in the above-mentioned diffusion bonding, the grooved plate and the flat plate are brought into close contact with each other in a high vacuum or in a gas atmosphere (or, with titanium as an insert metal, sandwiched between the joining surfaces) and kept at a constant temperature at a high temperature. The grooved plate and flat plate are joined by pressing for a time, and the diffusion temperature, the surface roughness of the joining surface, the pressing force, and the joining time (high-temperature maintaining time / pressing time) are good for diffusion joining. It is an important factor to perform.

It is generally said that the bonding temperature required for diffusion bonding is 0.7 times or more the melting point of the bonding material, or is higher than the recrystallization temperature of the material. Further, as for the pressing force, an appropriate pressure is determined according to the surface roughness of the bonding surface and the bonding temperature. Therefore, when the bonding temperature is high, the pressing force is small, and when the bonding temperature is low, the pressing force must be set high. Also, regarding the surface roughness of the bonding surface, if the unevenness of the bonding surface is fine and smooth, and if it has a high cleanliness, the bonding surface adheres even if the bonding temperature is low and the pressing force is small, If the unevenness of the bonding surface is rough and has low cleanliness, it is necessary to increase the bonding temperature and the pressing force. Further, the welding time depends on the welding temperature, the pressing force and the like. For example, if the bonding temperature is high and the pressing force is high, the mutual diffusion will actively proceed, and the bonding time can be set short.

In this regard, the above-mentioned molybdenum (tantalum)
In the case of manufacturing an ion accelerating electrode plate by integrating a grooved plate made of and a flat plate made of molybdenum (tantalum) by diffusion bonding, in order to easily and firmly adhere the grooved plate to the flat plate, In order to set the smoothing accuracy of the joining surface of the grooved plate and the flat plate to 5S or less, which is higher than the normal 6S, it is necessary to smooth the joining surface by mechanical processing and then to further perform buffing. there were. Also, even if a bonded surface with high flatness and cleanliness is obtained by buffing, it is necessary to manage the bonded surface during and after processing to maintain the high flatness and high cleanliness. .

Further, in order to join the grooved molybdenum plate and the molybdenum plate to each other with sufficient strength and high airtightness by diffusion bonding, a diffusion device equipped with a pressurizing device capable of easily performing bonding in a high temperature and high atmosphere. Although a bonding device is necessary, such diffusion bonding devices are expensive devices in which only a few units exist in Japan, and an ion accelerating electrode plate is manufactured by diffusion bonding using this expensive diffusion bonding device. In this case, the production and manufacturing costs of the ion accelerating electrode plate are increased, and the practicality is deteriorated.

The thickness of the grooved plate and the flat plate, which are the materials of the ion accelerating electrode plate, is relatively thin, about 5 to 10 mm. It is very difficult to press the wide joint surface evenly with a high pressure and to control the pressure so as to suppress the deformation of the groove, and there is a risk that the airtightness of the joint surface is deteriorated and its reliability is reduced. there were. Therefore, it is considered to manufacture a diffusion bonding apparatus having a pressurizing device capable of uniformly pressing a wide bonding surface with a variable high pressing force. However, such a device is very complicated and expensive. Therefore, it was not practical.

That is, if the ion accelerating electrode plate is produced and manufactured by pressure bonding the grooved plate and the flat plate by diffusion bonding, the production / manufacturing cost of the ion accelerating electrode plate is increased and the entire joint surface is increased. As a result, the airtightness and reliability of the device were deteriorated.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to use a thin plate made of an inexpensive material without causing the risk of mixing of impurities such as brazing material into plasma and leakage of refrigerant. An object of the present invention is to make it possible to manufacture an ion acceleration electrode plate having high cooling efficiency, reduce the production and production costs of the ion acceleration electrode plate, and improve the airtightness and reliability of the entire joint surface.

[0032]

According to a first aspect of the present invention, there is provided a method of manufacturing an ion accelerating electrode plate comprising a highly heat conductive metal or an alloy thereof. In each cooling groove of the thin plate on which a plurality of cooling grooves for cooling medium distribution are formed, an embedding material which is equal to the shape of the cooling groove and which can be dissolved and removed is buried in the cooling groove to planarize the cooling groove forming surface. A metal material equivalent to the thin plate is coated on the cooling groove forming surface in a layer form to form a plate-like metal material layer on the cooling groove forming surface, and the embedding material is formed from the thin plate on which the metal material layer is formed. By dissolving and removing, a plurality of cooling water passages are formed in the plurality of cooling grooves and the metal material layer, and a beam hole for extracting an ion beam is formed between adjacent cooling water passages in the plurality of cooling water passages. There.

In particular, according to the method of manufacturing an ion accelerating electrode plate according to the second aspect, the step of coating a metal material on the cooling groove forming surface of the thin plate includes the steps of degreasing and cleaning the thin plate. By activating the cooling groove forming surface of the thin plate subjected to the degreasing and cleaning treatment, and plating the activated cooling groove forming surface of the thin plate with a metal material equivalent to the thin plate to a predetermined thickness. This is a plating step for forming the metal material layer.

According to a third aspect of the present invention, the step of coating the cooling groove forming surface of the thin plate with a metal material comprises a metal material equivalent to the thin plate. This is a thermal spraying process of forming the metal material layer by spraying and colliding the melted or nearly melted particles against the cooling groove forming surface.

According to a fourth aspect of the present invention, the step of coating the cooling groove forming surface of the thin plate with a metal material comprises the step of forming a metal material equivalent to the thin plate. This is a build-up welding process step of forming the metal material layer by welding a metal to the cooling groove forming surface.

According to a fifth aspect of the present invention, the step of coating the cooling groove forming surface of the thin plate with a metal material includes the plating step,
A step of forming the metal material layer into a multilayer structure by performing at least two of the thermal spraying process and the overlay welding process in combination.

According to the method of manufacturing an ion accelerating electrode plate according to claim 6, between the step of forming the plurality of cooling water passages and the step of processing and forming the beam hole for extracting the ion beam. Applying a diffusion heat treatment to the thin plate on which the metal material layer and the plurality of cooling water passages are formed.

Further, according to the method of manufacturing an ion accelerating electrode plate according to claim 7, the diffusion heat treatment step is performed on the thin plate on which the metal material layer and the plurality of cooling water passages are formed by hot isotropy. This is a step of performing pressure and pressure treatment.

On the other hand, in order to solve the above-mentioned problems, the ion accelerating electrode plate of the present invention is made of a high heat conductive metal or an alloy thereof and has a plurality of cooling mediums for flowing a refrigerant. In each cooling groove of the grooved thin plate, an embedding material that is equal to the shape of the cooling groove and that can be dissolved and removed is buried in each cooling groove to planarize the cooling groove forming surface. An electrode plate formed by coating a metal material equivalent to the thin plate in a layer to form a plate-shaped metal material layer on the cooling groove forming surface, and dissolving and removing the filling material from the thin plate on which the metal material layer is formed. And a plurality of cooling water passages formed between the plurality of cooling grooves of the thin plate and the metal material layer in the electrode plate, and ions formed between adjacent cooling water passages in the plurality of cooling water passages. Beam extraction And a beam hole of use.

[0040]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the ion acceleration electrode plate of the present invention will be described with reference to the drawings.

(First Embodiment) A first embodiment of the present invention will be described below with reference to FIGS.

As shown in FIG. 1, in order to manufacture the ion accelerating electrode plate of this embodiment, first, one surface (the upper surface in the drawing) of a thin plate 1 made of inexpensive copper or a copper alloy which is a metal having high thermal conductivity and is inexpensive. A cooling groove 2 having a rectangular shape (a rectangular shape having a long side parallel to the upper surface of the thin plate 1) for cooling water circulation is formed at a predetermined interval in parallel with each other, and then, as shown in FIG. Is embedded in each cooling groove 2 of a thin plate (hereinafter referred to as a substrate) 3 on which a cooling material is formed, and is made of a conductive material which is equal in shape to the cooling groove 2 and can be dissolved and removed. Is flattened. The embedding material 4 can be made of a material such as wood metal, low melting point metal such as lead, aluminum, or solder.

Then, as shown in FIG. 2, copper or copper alloy, which is a metal material equivalent to the thin plate 1 (substrate 3), is coated in a layered manner so as to have a predetermined thickness on the cooling groove forming surface. A plate-like metal material layer 5 on the cooling groove forming surface 3
Is formed and integrated to form an electrode plate 6 including the substrate 3 and the metal material layer 5. Next, the embedding material 4 embedded in the cooling groove 2 is put into, for example, a melting tank to raise the temperature in the bath, or the embedding material 4 is chemically melted (for example, the embedding material 4) suitable for the material. When aluminum is used, the cooling groove 2 of the grooved copper plate 3 and the metal material layer 5 are dissolved and removed by a method such as immersion in a tank containing caustic soda) as shown in FIG. A large number of cooling water passages 2a are formed parallel to each other and at a predetermined interval.

As shown in FIGS. 4 and 5, a beam extraction hole for extracting an ion beam along the laminating direction between adjacent cooling water passages 2a in the electrode plate 6 in which a number of cooling water passages 2a are formed. 7, each having a cooling water passage 2a therein and an adjacent cooling water passage 2a
An ion acceleration electrode plate 8 having a beam extraction hole 7 between them can be generated.

That is, according to the ion accelerating electrode plate 8 of the present configuration, the cooling water passage 2a is connected to the adjacent beam extraction hole 7
Between the cooling water passages 2a
The cooling water is allowed to flow through the ion accelerating electrode plate 8 directly. Therefore, the cooling performance and the cooling efficiency are improved as compared with the conventional ion acceleration electrode plate in which the cooling pipe is embedded, and the neutron injector and the ion mixing device using the ion acceleration electrode plate 8 can be continuously operated for a long time. Become.

Further, since the cooling water passage 2a is obtained by forming and processing the cooling groove 2 in the thin plate 1, the processing is relatively easy. Further, the groove shape and size can be arbitrarily selected (for example, rectangular, circular, elliptical, etc.). Therefore, as in the present embodiment, it is possible to form the cooling water passage 2a close to the beam extraction hole 7 even in a narrow gap between the adjacent beam extraction holes 7, thereby improving the cooling efficiency. Can be done. Also,
Since it is not necessary to use a cooling pipe as in the related art, it is possible to reduce the production and manufacturing costs of the ion acceleration electrode plate.

In particular, according to the ion accelerating electrode plate 8 of this configuration, the substrate 3 made of inexpensive material copper or copper alloy is used.
On the other hand, the ion accelerating electrode plate is manufactured by directly forming a metal material layer 5 by performing a coating process of a metal material made of copper or a copper alloy equivalent to the material of the substrate 3. There is no need to use an expensive material such as a tantalum plate or a diffusion bonding device having a complicated and expensive pressurizing device, and the production and manufacturing costs of the ion acceleration electrode plate can be greatly reduced.

In this configuration, since the plate-like metal material layer 5 is formed directly on the cooling groove forming surface of the substrate 3 by a coating process to form the electrode plate, the conventional brazing and HIP methods are used. The cooling water passage 2a is formed in a very simple process as compared with the case where the upper and lower two electrode plates and the cooling pipe are joined using diffusion bonding and the case where the upper and lower two electrode plates are joined via insert metal. Electrode plate 6 having therein
Can be created. Further, in the present embodiment, the metal material layer 5 corresponding to the upper electrode plate is attached to the substrate 3 in comparison with the conventional case of joining two electrode plates (or joining via insert metal). Since the metal material layer 5 is formed by coating, the metal material layer 5 is hermetically and strongly bonded to the substrate 3. Further, since the cooling groove 2 is protected by the filling material 4 before the coating process, there is no fear that the shape of the cooling groove 2 is damaged by the coating material.

That is, according to the ion accelerating electrode plate 1 of the present configuration, the electrode plate manufacturing process can be simplified compared with the conventional ion accelerating electrode plate manufactured by joining electrode plates such as a molybdenum plate and a tantalum plate. However, the joining strength and the airtightness can be improved, and the production and manufacturing costs can be significantly reduced.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to FIGS. In addition,
In the present embodiment, a case where a plating process is used will be described as a specific example of the coating process in the first embodiment.

In this embodiment, as in the first embodiment (FIG. 1), one surface (the upper surface in the figure) of a thin plate 1 made of copper or a copper alloy, which is a metal having a high thermal conductivity, has a rectangular shape for flowing cooling water. A substrate 3 in which cooling grooves 2 are formed in parallel with each other at predetermined intervals is prepared, and each cooling groove 2 of the substrate 3 is filled with a conductive material having the same shape as the cooling groove 2 and capable of being dissolved and removed. The material 4 is buried to flatten the cooling groove forming surface of the substrate 3.

Then, as shown in FIG.
Then, the inside of the container is put into the chamber 0 and the degreasing and cleaning treatment is performed by the steam 11. Next, the substrate 3 degreased and cleaned by the steam 11 is plated with copper or a copper alloy as a material to form a metal material layer.

That is, the substrate 3 that has been degreased and cleaned
After activating the flattened cooling groove forming surface (plating surface) 3a, as shown in FIG. 7, the substrate 3 is placed in a bathtub 13 containing copper sulfate 12, and the substrate 3 (non-plated The cooling groove forming surface 3a activated with the material (material) and the electrode 14 made of pure copper are arranged to face each other. Then, the power supply 15 is connected as the substrate 3 (cathode) and the electrode 14 (anode), and the power supply 15
For example, the current density number A /
By applying a current for 100 to 300 hours under the condition of dm ² , as shown in FIG. 8A, a plate formed of copper or copper alloy having a thickness of 2 to 3 mm with respect to the cooling groove forming surface 3 a of the substrate 3. Is formed and integrated. As a result, an electrode plate 17 including the substrate 3 and the plating portion 15 is generated.

Since the plating portion coating side surface (the upper surface in FIG. 8A) of the electrode plate 17 where the plating portion 16 has been formed has irregularities peculiar to thick plating, machining is performed on the plating portion coating side surface. By applying the coating, the side surface of the plating portion is finished to a predetermined thickness and surface roughness.

Next, the filling material 4 buried in the cooling groove 2 is put into, for example, a melting tank to raise the temperature in the bath, or the filling material 4 is filled with a chemical melting material suitable for the material. As shown in FIG. 8 (b), by dissolving and removing using a method such as immersion in a immersed bath, the cooling groove 2 of the grooved copper plate 3 and the plating portion 16 are parallel to each other and at a predetermined interval. In this case, a number of cooling water passages 2a are formed.

Then, as shown in FIGS. 4 and 5,
A beam extraction hole for extracting an ion beam is formed between adjacent cooling water passages 2a in the electrode plate 16 in which a large number of cooling water passages 2a are formed along the stacking direction, and the cooling water passage 2a is provided therein. In addition, an ion acceleration electrode plate having a beam extraction hole between adjacent cooling water passages 2a can be generated.

As described above, according to the ion acceleration electrode plate of the present configuration, a metal material equivalent to that of the substrate 3 is plated in a state where the cooling grooves 2 of the substrate 3 are protected by the filling material 4. The electrode plate 17 is formed by forming the portion 16, the embedding material 4 is dissolved and removed from the electrode plate 17 to provide the cooling water passage 2 a, and the cooling water passage 2 a is formed between the adjacent beam extraction holes. Therefore, similarly to the first embodiment, the cooling performance and the cooling efficiency can be improved, and the production and manufacturing costs of the ion acceleration electrode plate can be reduced.

Further, according to the ion accelerating electrode plate of this configuration, the plating portion 16 made of the same metal material as the substrate 3 is formed by plating while the cooling groove 2 of the substrate 3 is protected by the filling material 4. An electrode plate 17 is formed, and the embedding material 4 is dissolved and removed from the electrode plate 17 to remove the cooling water passage 2.
a, the upper and lower two electrode plates and the cooling pipe are joined by using the conventional brazing, the HIP method, and the diffusion bonding, or the two upper and lower electrode plates are joined via the insert metal. In comparison, the electrode plate 17 having the cooling water passage 2a therein can be formed by a very simple process, and the plating portion 16 and the substrate 3 corresponding to the upper electrode plate can be formed.
And can be joined tightly and airtightly. Further, since the cooling groove 2 is protected by the filling material 4 before the coating process, there is no fear that the shape of the cooling groove 2 is damaged by the coating material.

(Third Embodiment) A third embodiment of the present invention will be described below with reference to FIGS. In this embodiment, a case where a thermal spraying process is used will be described as a specific example of the coating process in the first embodiment.

In the present embodiment, as in the first embodiment (FIG. 1), one surface (the upper surface in the figure) of a thin plate 1 made of copper or a copper alloy, which is a metal having high thermal conductivity, has a rectangular shape for cooling water distribution. A substrate 3 in which cooling grooves 2 are formed in parallel with each other at predetermined intervals is prepared, and each cooling groove 2 of the substrate 3 is filled with a conductive material having the same shape as the cooling groove 2 and capable of being dissolved and removed. The material 4 is buried to flatten the cooling groove forming surface of the substrate 3.

Then, as shown in FIG. 9, the thermal spraying device 20 is arranged to face the flattened cooling groove forming surface 3a of the substrate 3, and the thermal spraying device 20 is moved from one end of the substrate 3 to the cooling groove forming surface. While moving parallel to the other end along 3a, molten or nearly molten metal particles of copper or a copper alloy are sprayed onto the cooling groove forming surface 3a of the substrate 3 so as to collide with the copper or copper alloy to form a copper or copper alloy. A metal material layer (coating layer) 21 made of is formed and integrated to form an electrode plate including the substrate 3 and the metal material layer 21. Then the first
Similarly to the second embodiment, the embedding material 4 embedded in the cooling groove 2 is dissolved and removed to form a large number of cooling water passages between the cooling groove 2 of the grooved copper plate 3 and the metal material layer 21 ( As shown in FIG. 3 described above and FIGS. 4 and 5, a beam extraction hole for extracting an ion beam is formed along the stacking direction between adjacent cooling water passages in an electrode plate having a large number of cooling water passages. Each can be drilled to produce an ion accelerating electrode plate.

As the thermal spraying method of this embodiment for spraying metal particles made of copper or copper alloy powder onto the cooling groove forming surface 3a of the substrate 3, various thermal spraying methods are currently in practical use. It can be mainly classified according to the characteristics of the heat source that heats and melts the sprayed material. That is, gas thermal spray using gas as a heat source includes flame spray and explosive thermal spray, while electric thermal spray using electricity as a heat source includes arc thermal spray, plasma thermal spray, and linear explosive thermal spray.

Here, in the present embodiment, as a specific example of the coating process by thermal spraying, the coating process by the plasma spraying method will be described with reference to FIG.

In the plasma spraying apparatus 20 a, the cathode side (−) of the DC power supply 25 is connected (contacted) to the cathode (cathode) 27 of the spraying torch 26, and the DC power supply 25 is connected.
The anode side (+) of the thermal spraying torch 26 contacted to the anode side (+) is contacted with the anode 28 to generate a DC arc 29 between the anode nozzle 28 and the cathode 27. A plasma gas such as an argon gas injected from 30 is heated to an extremely high temperature and is ejected from an anode nozzle 28 as a plasma jet 31.

At this time, copper or copper alloy powder is injected (supplied) to the plasma jet 31 injection side of the thermal spray torch 26 through the thermal spray material introduction port 32, and the copper or copper alloy powder is supplied to the plasma jet 31. As a result, the gas is accelerated in a state of melting or near melting, and is sprayed on the cooling groove forming surface 3a of the substrate 3 facing the anode nozzle 28 of the plasma spraying device 20a, and collides with the cooling groove forming surface 3a to be laminated.

The above-described plasma spraying process is performed while the plasma spraying apparatus 20a is moved in parallel from one end of the substrate 3 to the other end along the cooling groove forming surface 3a, thereby forming the cooling groove of the substrate 3. A metal material layer (coating layer) 21 made of copper or a copper alloy is formed on the surface 3a and integrated, and an electrode plate including the substrate 3 and the metal material layer 21 is produced.

Next, the filling material 4 embedded in the cooling groove 2 is dissolved and removed, so that the cooling groove 2 of the grooved copper plate 3 is removed.
A large number of cooling water passages 2a are formed parallel to each other and at a predetermined interval between the cooling water passage 2a and the metal material layer 21.

Then, as shown in FIGS. 4 and 5,
A beam extraction hole for extracting an ion beam is formed between adjacent cooling water passages 2a in the electrode plate in which a number of cooling water passages 2a are formed along the stacking direction, and has a cooling water passage 2a therein. And adjacent cooling water passage 2a
An ion acceleration electrode plate having a beam extraction hole between them can be produced.

The cooling groove forming surface (plasma jet sprayed surface) 3a of the substrate 3 is formed with a coating layer 21 based on the spraying before the plasma jet spraying to increase the bonding strength between the plasma jet sprayed surface 3a. The surface of the plasma jet sprayed surface 3a may be subjected to shock blasting to form the surface into an uneven surface.

That is, according to the present configuration, a coating layer is formed on the cooling groove forming surface 3a by directly spraying copper or copper alloy powder on the cooling groove forming surface 3a of the substrate 3, and the cooling water is formed therein. Since the electrode plate having the passage 2a can be generated, as in the first and second embodiments, the cooling efficiency can be improved, the production and manufacturing costs of the ion acceleration electrode plate can be reduced, and the coating operation can be simplified and The bonding strength and airtightness between the coating layer 21 and the substrate 3 can be increased. Further, the thickness of the coating layer 21 can be generated by coating by thermal spraying while adjusting the thickness according to the design of the ion acceleration electrode plate.

In this embodiment, an example of plasma spraying in the atmosphere has been described. However, as described above, there are various methods of spraying, and the same operation and effect as in this embodiment can be obtained by other spraying methods. Can be obtained. In particular, since it is a thermal spray of copper or copper alloy powder, if it is determined that thermal spraying in the air causes oxidation of the coating layer and is not preferable for the characteristics of the ion acceleration electrode plate, Oxidation of the coating layer can be avoided by employing low-pressure plasma spraying or aeroplasma spraying capable of high-speed plasma spraying.

(Fourth Embodiment) A fourth embodiment of the present invention will be described below with reference to FIGS. In the present embodiment, a case where a build-up welding process is used will be described as a specific example of the coating process in the first embodiment.

Also in this embodiment, as in the first embodiment (FIG. 1), one surface (the upper surface in the figure) of a thin plate 1 made of copper or a copper alloy, which is a metal having high thermal conductivity, has a rectangular shape for flowing cooling water. A substrate 3 in which cooling grooves 2 are formed in parallel with each other at predetermined intervals is prepared, and each cooling groove 2 of the substrate 3 is filled with a conductive material having the same shape as the cooling groove 2 and capable of being dissolved and removed. The material 4 is buried to flatten the cooling groove forming surface of the substrate 3.

A build-up welding device 35 is arranged to face the flattened cooling groove forming surface 3a of the substrate 3, and the built-up welding device 35 is moved from one end of the substrate 3 along the cooling groove forming surface 3a. The metal material layer (weld metal layer) 36 made of copper or copper alloy is adhered to the cooling groove forming surface 3a of the substrate 3 in a layered manner while moving the molten metal of copper or copper alloy in a parallel manner toward the other end. An electrode plate composed of the substrate 3 and the weld metal layer 36 is formed and integrated. Then the first
Similarly to the second embodiment, the embedding material 4 embedded in the cooling groove 2 is dissolved and removed to form a large number of cooling water passages between the cooling groove 2 of the grooved copper plate 3 and the weld metal layer 36 ( As shown in FIG. 3 described above and FIGS. 4 and 5, a beam extraction hole for extracting an ion beam is formed along the stacking direction between adjacent cooling water passages in an electrode plate having a large number of cooling water passages. Drilling is performed to produce an ion acceleration electrode plate.

As the method for directly overlaying the molten metal of copper or copper alloy on the cooling groove forming surface 3a of the substrate 3 in this embodiment, there are various methods such as arc, plasma, electron beam, and laser beam. Components for supplying the welding material include a wire-like component (welding rod) and a powder-like component (welding powder).

Here, in this embodiment, as a specific example of the coating process by overlay welding, the coating process by the plasma powder overlay welding method will be described with reference to FIGS.

In the plasma powder overlay welding apparatus 35a, the anode side (+) of a DC welding power supply (plasma arc power supply) 36 is connected to the base material 3 and the cathode side (−) of the plasma arc power supply 36. ) It is connected to a non-consumable electrode 38 disposed in the welding torch 37 (positive polarity), and in an inert gas (plasma gas) atmosphere injected from a plasma gas inlet 39 (a shield gas nozzle 40). A plasma arc column 43 is generated between the substrate 3 and the non-consumable electrode 38 in the shield gas (inert gas) 42 injected from the shield gas inlet 41.

On the other hand, copper or copper alloy powder is supplied from the powder supply device 44 into the welding torch 37 via the powder and the powder supply gas inlet 45 by the inert gas and injected into the plasma arc column 43. Then, the copper or copper alloy powder is sent to the cooling groove forming surface 3a of the substrate 3 facing the welding torch 37 by the plasma arc column 43 to form and weld a molten metal pond. The molten metal pond is shielded by the inert gas 42 in the same manner as in the case of tungsten inert gas (TIG) welding.

In this manner, while the welding torch 37 is oscillating (vibrating) in the direction perpendicular to the traveling direction, the above-mentioned copper or copper alloy powder (molten metal) is deposited on the cooling groove forming surface 3a of the substrate 3. The cooling groove forming surface 3
A weld metal 46 made of copper or a copper alloy is formed on a.

The above-described overlay welding process is performed while the overlay welding apparatus 35a is moved in parallel from one end of the substrate 3 to the other end along the cooling groove forming surface 3a, whereby the overlay welding process is performed as shown in FIG. As shown in (a), the cooling groove forming surface 3a of the substrate 3 is made of copper or a copper alloy and has a thickness of 2 to 2 for example.
A 3 mm weld metal layer 46 can be formed. In addition,
In FIG. 12, reference numeral 47 denotes a pilot arc power supply.

The welding metal layer coating side surface of the electrode plate 48 on which the welding metal layer 46 is formed by overlay welding (FIG. 13)
Since the upper surface in (a) has irregularities, the side surface of the weld metal layer coating is machined to finish the side surface of the weld metal layer coating to a predetermined thickness and surface roughness.

Next, by dissolving and removing the filling material 4 embedded in the cooling groove 2, as shown in FIG. 13B, the cooling groove 2 and the weld metal layer 46 in the electrode plate 48 are parallel to each other. Further, a large number of cooling water passages 2a are formed at predetermined intervals.

Then, as shown in FIGS. 4 and 5,
A beam extraction hole for extracting an ion beam is formed between adjacent cooling water passages 2a in the electrode plate 48 in which a large number of cooling water passages 2a are formed along the stacking direction, and the cooling water passage 2a is provided therein. In addition, an ion acceleration electrode plate having a beam extraction hole between adjacent cooling water passages 2a can be generated.

That is, according to this configuration, the weld metal layer is formed on the cooling groove forming surface 3a by directly overlaying copper or copper alloy powder on the cooling groove forming surface 3a of the substrate 3 to form an internal portion. Since the electrode plate having the cooling water passage 2a can be generated in the same manner as in the first to third embodiments, it is possible to improve the cooling efficiency and reduce the production / manufacturing cost of the ion accelerating electrode plate and reduce the coating work. It is possible to simplify the structure and increase the bonding strength and airtightness between the weld metal layer 42 and the substrate 3. It is also possible to generate the thickness of the weld metal layer 46 by coating according to the build-up welding while adjusting the thickness according to the design of the ion acceleration electrode plate. High accuracy according to board design specifications can be maintained.

(Fifth Embodiment) A fifth embodiment of the present invention will be described below with reference to FIG. In the present embodiment, a case will be described in which the coating process in the first embodiment is performed by a combination of plating, thermal spraying, and overlay welding.

In the present embodiment, the cooling groove forming surface 3a of the substrate 3 which is flattened by burying the burying material 4 is plated by the same working method as described in the second embodiment. A plating part (first coating layer 50) having a thickness of about 1 to 2 mm is formed and integrated, and then the third embodiment is applied to the coating side surface of the electrode plate on which the first coating layer 50 is generated. By performing a thermal spraying process by a construction method similar to the method described in the above, a metal material layer (second coating layer) 51 having a predetermined thickness (for example, about 5 to 10 mm) is formed and integrated, and Thus, an electrode plate 53 having a multilayer structure including a double metal material layer (coating layer) 52 having a desired thickness is generated.

Hereinafter, the embedding material 4 embedded in the cooling groove 2
Are dissolved and removed, a large number of cooling water passages 2a are formed between the cooling grooves 2 of the substrate 3 and the coating layer 52 at a predetermined interval in parallel with each other, and further a large number of cooling water passages 2a are formed. A beam extraction hole for extracting an ion beam is formed between adjacent cooling water passages 2a in the electrode plate along the laminating direction, so that a cooling water passage 2a is provided inside and a beam is formed between adjacent cooling water passages 2a. An ion accelerating electrode plate having an extraction hole can be produced.

That is, according to this configuration, the cooling groove forming surface 3a of the substrate 3 is coated directly with a metal material made of copper or a copper alloy by plating, and then overlaid by a thermal spraying process to form a layer of copper or copper alloy. By coating the metal material having the above-described structure, a coating layer 52 having a multilayer structure is formed on the cooling groove forming surface 3a to form an electrode plate having a cooling water passage 2a therein. As in the embodiment, it is possible to improve the cooling efficiency and reduce the production / production cost of the ion acceleration electrode plate.

In particular, in the present structure, the joining strength and airtightness are very high and the joining reliability is good, but the coating is made of copper or a copper alloy directly on the cooling groove forming surface 3a of the substrate 3 by a plating process that is thin. A first coating layer 50 is formed by coating a metal material, and a metal material made of copper or a copper alloy is deposited on the first coating layer 50 by a thermal spraying process which is thick and has high coating efficiency. Since the coating layer 52 is formed by coating to form the second coating layer 51 and the first coating layer 50 and the second coating layer 51 form the coating layer 52 having a multilayer structure, the ion acceleration electrode plate having higher bonding reliability is provided. Can be produced more efficiently.

In this embodiment, as the composite coating method, a double coating layer is formed by plating and thermal spraying. However, the present invention is not limited to this. The welding process may be performed in combination to form a double coating layer, or the plating, thermal spraying and welding processes may be performed in combination to form a triple coating layer.

(Sixth Embodiment) A sixth embodiment of the present invention will be described below with reference to FIGS. In the present embodiment, the electrode plate 53a having the coating layer 52 having the multilayer structure is generated by the composite coating process in which the plating, thermal spraying, and welding processes described in the fifth embodiment are combined in combination, and the cooling groove is formed. After the filling material 4 buried in 2 is dissolved and removed to form an electrode plate 53a having a large number of cooling water passages 2a, diffusion heat treatment is further performed on the electrode plate 53a.

That is, according to the present embodiment, the operator puts the electrode plate 53a into the sealed vacuum vessel 56 of the heat treatment furnace 55 for diffusion heat treatment, and mounts the electrode plate 53a at the lower center of the vacuum vessel 56. It is placed on the placement section 57. Vacuum container 5
6, a reflector 58 is provided adjacent to the side wall surface of the vacuum container 56 and reflects heat flowing toward the side wall surface toward the center of the container, and a reflector 58 is provided adjacent to the reflector 58 to increase the temperature in the container 56 by heating. A heater 59 to be provided, a radiant heat plate 60 that is provided in parallel with the heater 59 and transmits the heat reflected by the reflector 58 to the inside of the vacuum vessel 56 with a uniform distribution, and is attached to a vessel wall of the vacuum vessel 56 via a valve 61; An exhaust device 62 for exhausting the air in the vacuum vessel 56 to evacuate the atmosphere in the vacuum vessel 56 and a pressure gauge 63 for measuring the pressure in the vacuum vessel 56 are provided.

The electrode plate 53a is connected to the vacuum vessel 5 of the heat treatment furnace 55.
6, the operator opens the valve 61 and drives the exhaust device 62 to exhaust the air in the vacuum container 56. The inside atmosphere is evacuated and the valve 61 is closed.

Then, the operator drives the heater 59 to uniformly heat the inside of the furnace through the reflector 58 and the heat radiation plate 60, and sets the temperature to, for example, 500 to 500 ° C., which is higher than the recrystallization temperature of copper or copper alloy. The temperature is raised to 800 ° C. to perform a diffusion heat treatment.

At this time, mutual diffusion between the coating layer 52 made of copper (or copper alloy), which is a high thermal conductive material, and the substrate 3 is promoted, and the adhesion and bonding between the coating layer 52 and the substrate 3 are improved. Is very high.

After performing the diffusion heat treatment for a predetermined time, the operator takes out the electrode plate 53a subjected to the diffusion heat treatment from inside the vacuum vessel 56 of the heat treatment furnace 55. As a result, FIG.
And (b), the coating layer 52 and the substrate 3
Is eliminated, and an integrated electrode plate 53a is obtained from above the metal structure.

As shown in FIGS. 4 and 5, a beam extraction for extracting an ion beam along the laminating direction between adjacent cooling water passages 2a in the electrode plate 53a in which a large number of cooling water passages 2a are formed. The holes can be respectively formed to produce an ion accelerating electrode plate having a cooling water passage 2a therein and a beam extraction hole between adjacent cooling water passages 2a.

According to this configuration, the cooling groove forming surface 3 of the substrate 3
The electrode plate 53a having the cooling water passage 2a therein is formed by forming the coating layer 52 having a multilayer structure by performing at least two of the plating process, the thermal spraying process and the welding process on the electrode plate 53a. By performing diffusion heat treatment on 53a, the coating layer 52 and the substrate 3 are integrated on the metal structure by mutual diffusion, and the bonding strength and airtightness between the coating layer 52 and the substrate 3 are significantly increased. It is possible to manufacture an ion acceleration electrode plate having excellent reliability and extremely high reliability without fear of leakage of the refrigerant in the cooling water passage 2a.

In the present embodiment, the diffusion heat treatment is performed on the electrode plate 53a generated by the composite coating process and the dissolution removal process in which the plating, thermal spraying, and welding processes described in the fifth embodiment are combined. However, the present invention is not limited to this. As described in the first to fourth embodiments, a single coating process (plating process, thermal spraying process, welding process, etc.) and dissolving and removing are performed. Diffusion heat treatment may be performed on the electrode plate generated by the treatment, and the above-described bonding strength and airtightness between the coating layer and the substrate can be increased.

In the present embodiment, the diffusion heat treatment is performed by setting the atmosphere in the vacuum vessel 56 of the heat treatment furnace 55 to a vacuum. However, the present invention is not limited to this. The thermal diffusion treatment may be performed using an inert gas such as an argon gas.

(Seventh Embodiment) A seventh embodiment of the present invention will be described below with reference to FIGS. In the present embodiment, the electrode plate 53a having the coating layer 52 having the multilayer structure is generated by the composite coating process in which the plating, thermal spraying, and welding processes described in the fifth embodiment are combined in combination, and the cooling groove is formed. After the embedding material 4 buried in 2 is dissolved and removed to form an electrode plate 53a having a large number of cooling water passages 2a, the electrode plate 53a is heated to a high temperature and a high pressure using a hot isostatic pressing device. Diffusion heat treatment is further performed in a high-pressure gas atmosphere.

That is, according to the present embodiment, the operator presses the electrode plate 53a with the hot isostatic pressing device 7 for diffusion heat treatment.
0 inside the sealed pressure vessel 71 and the pressure vessel 7
1 is mounted on a mounting portion 72 installed at the lower center of the device 1.
The pressure vessel 71 includes a reflector 73 provided adjacent to each inner wall surface other than the bottom surface of the pressure vessel 71 and reflecting heat flowing toward each inner wall surface toward the center of the vessel. A heater 74 attached to a reflector 73 attached to the heater 73 for increasing the temperature in the container 71 by heating; and a radiant heat plate 75 attached to the heater 74
And a thermocouple 76 whose one end is brought into contact with the electrode plate 53a having the cooling water passage 2a and the other end of which is drawn out of the pressure vessel 71.
And a measuring device 77 for measuring the temperature on the electrode plate 53a in accordance with the amount of thermoelectric power detected by the thermocouple 76.

Further, the pressure vessel 71 is attached to the vessel wall via a valve 78 and a pipe 79, and the pressure vessel 7
1. A gas supply device 80 for supplying an inert gas such as an argon gas into the pressure vessel 1, and a pressure gauge 81 attached to a branch pipe 79a branched from the pipe 79 to measure the pressure in the pressure vessel 71.
And an exhaust device 84 attached to the container wall of the pressure vessel 71 via a valve 82 and a pipe 83 to exhaust air in the pressure vessel 71, and an exhaust device 84 attached to a branch pipe 83 a branched from the pipe 83 and inside the pressure vessel 71. Pressure gauge 85 for measuring pressure
And each is installed.

With the electrode plate 53a mounted on the mounting portion 72 of the pressure vessel 71 of the hot isostatic pressurizing apparatus 70, the operator opens the valve 83 and drives the exhaust device 84 to operate the pressure vessel. The air in 71 is exhausted, and the pressure in pressure vessel 56 is set to a negative pressure of, for example, about 5 × 10 ⁻² Torr while observing pressure gauge 85, and valve 83 is closed.

Subsequently, the operator opens the valve 78 and drives the gas supply device 80 to put an inert gas such as an argon gas into the pressure vessel 71 and observe the pressure gauge 81 while observing the pressure gauge 81.
The pressure is supplied until the pressure in 1 reaches an initial pressure of about 80 kgf / cm ^-2, and the valve 78 is closed.

When the pressure in the pressure vessel 71 reaches a predetermined initial pressure (80
When the temperature reaches about kgf / cm ^-2 ), the operator drives the heater 74. The heat generated from the heater 74 is transmitted in all directions, but the heat directed to the reflector 73 is reflected by the reflector 73 and reaches the radiant heat plate 75.
The heat radiation plate 75 spreads over the entire pressure vessel 71 with a uniform distribution.

In this way, the inert gas filling the pressure vessel 71 is heated via the heater 74, the reflector 73 and the radiant heat plate 75, and the pressure rises.

On the other hand, the operator operates the pressure gauge 81 and the thermocouple 7.
6. Observe the measurement value of the measuring device 77 through the electrode plate 53a.
The pressure and temperature above are recognized, and the pressure in the pressure vessel 71 rises and the pressure and temperature on the electrode plate 53a become the pressure and temperature suitable for diffusion heat treatment (for example, pressure: 1000
kgf / cm ² , temperature: 800 ° C.), the pressure and the temperature are kept constant, so that the coating layer 52 made of copper (or copper alloy), which is a high thermal conductive material, is formed.
Diffusion between the coating layer 52 and the substrate 3 is promoted, and the adhesion and bonding between the coating layer 52 and the substrate 3 are greatly enhanced.

As a result, as shown in FIGS. 16 (a) and 16 (b), the bonding interface 64 between the coating layer 52 and the substrate 3 disappears, and the integrated electrode plate 53a is also formed on the metal structure. can get.

Particularly, according to the present embodiment, the electrode plate 53a
18 by performing a diffusion heat treatment based on hot and high-pressure hot isostatic pressing at a temperature of 800 ° C. and a pressure of 1000 kgf / cm ² , the outer surface of the electrode plate 53a is indicated by an arrow A in FIG. An isotropic external pressure acts as shown, and an isotropic internal pressure acts as shown by an arrow B in FIG. 18 on the inside (inner peripheral surface) of each cooling water passage 2a. Therefore, in addition to causing the interdiffusion between the coating layer 52 and the substrate 3, it is possible to remove even small defects generated in the coating layer 52, the substrate and the coating layer 52. Thus, in the present configuration, the coating layer 5
Since a defect that has temporarily occurred at the bonding interface 64 between the substrate 2 and the coating layer 52 and the substrate 3 can be removed, the quality of the electrode plate 53a can be improved.

As shown in FIGS. 4 and 5, a beam extraction for extracting an ion beam is performed between adjacent cooling water passages 2a in the electrode plate 53a in which a large number of cooling water passages 2a are formed, along the stacking direction. The holes can be respectively formed to produce an ion accelerating electrode plate having a cooling water passage 2a therein and a beam extraction hole between adjacent cooling water passages 2a.

According to this configuration, the cooling groove forming surface 3 of the substrate 3
The electrode plate 53a having the cooling water passage 2a therein is formed by forming the coating layer 52 having a multilayer structure by performing at least two of the plating process, the thermal spraying process and the welding process on the electrode plate 53a. By performing diffusion heat treatment based on hot isostatic pressing on 53a, the coating layer 52 and the substrate 3 are integrated on the metal structure by mutual diffusion, and the bonding strength between the coating layer 52 and the substrate 3 and airtightness Since the performance is remarkably enhanced, it is possible to manufacture an ion accelerator electrode plate having excellent mechanical strength and extremely high reliability without fear of refrigerant leakage in the cooling water passage 2a.

In this embodiment, the diffusion heat treatment is performed on the electrode plate 53a generated by the composite coating process and the dissolution removal process in which the plating, thermal spraying, and welding processes described in the fifth embodiment are combined. However, the present invention is not limited to this. As described in the first to fourth embodiments, a single coating process (plating process, thermal spraying process, welding process, etc.) and dissolving and removing are performed. Diffusion heat treatment may be performed on the electrode plate generated by the treatment, and the above-described bonding strength and airtightness between the coating layer and the substrate can be increased.

In each of the above embodiments, a rectangular cooling groove serving as a cooling water passage is formed in a thin plate. However, the present invention is not limited to this. As shown in FIG. A circular cooling groove 2b partially missing, FIG.
As shown in FIG. 19B, the cooling water flow area is increased, such as a rectangular cooling groove 2c whose long side is parallel to the upper surface of the substrate 3 and a polygonal cooling groove 2d as shown in FIG. It is also possible to form a cooling groove having a shape that increases the cooling efficiency, and it is possible to manufacture an ion acceleration electrode plate with further improved cooling efficiency.

Further, in each of the above-described embodiments, as the material of the thin plate and the coating layer, inexpensive copper or copper alloy which is a high heat conductive metal is used. However, the present invention is not limited to this. Inexpensive metal materials having high thermal conductivity other than copper and copper alloys can also be used.

[0116]

According to the ion accelerating electrode plate and the method of manufacturing the same of the present invention, a thin plate made of an inexpensive high heat conductive metal material (for example, copper or a copper alloy) and having a plurality of cooling grooves formed on one surface is provided. A metal material equivalent to the material of the thin plate is coated by, for example, plating, thermal spraying, and overlay welding to form a metal material layer, and a plurality of cooling grooves and a plurality of cooling water passages formed by the metal material layer. Since the beam holes for extracting the ion beam are formed between adjacent cooling water passages in the plurality of cooling water passages, cooling water can be circulated through the cooling water passages to directly cool the ion accelerating electrode plate. . Therefore, cooling performance and cooling efficiency are improved as compared with the conventional ion acceleration electrode plate in which a cooling pipe is embedded. As a result, thermal deformation is small, and the life of the ion acceleration electrode plate can be extended. Further, since the cooling water passage is formed without using a cooling pipe, and the ion accelerating electrode plate can be produced and manufactured without using expensive materials such as a molybdenum plate and a tantalum plate, the production of the ion accelerating electrode plate is performed. -The manufacturing cost can be significantly reduced.

In particular, according to the ion accelerating electrode plate of the present invention, after protecting the cooling grooves of the thin plate with the filling material, a plate-like metal material layer is directly formed on the cooling groove forming surface by coating treatment. Since the electrode plate having a plurality of cooling water passages is created by dissolving and removing the filling material, the upper and lower two electrode plates and the cooling pipe are joined by conventional brazing or diffusion bonding, or the upper and lower two Compared with the case where the electrode plates are joined via the insert metal, the metal material layer and the thin plate can be joined very tightly and strongly without impairing the shape of the cooling groove by the coating material.

[Brief description of the drawings]

FIG. 1 is a view showing a manufacturing process of an ion acceleration electrode plate according to a first embodiment of the present invention, and is a perspective view showing a state in which a cooling groove is formed in a thin plate.

FIG. 2 is a perspective view showing a state in which a coating layer is formed on a thin plate (substrate) on which cooling grooves are formed.

FIG. 3 is a perspective view showing a state in which an embedding material in a cooling groove is dissolved and removed to obtain an electrode plate having a large number of cooling water passages.

FIG. 4 is a diagram showing a state in which a beam extraction hole for extracting an ion beam is formed between adjacent cooling water passages in the electrode plate to form an ion acceleration electrode plate.

FIG. 5 is a sectional view taken along the line VV of FIG. 4;

FIG. 6 is a view showing a manufacturing process of the ion accelerating electrode plate according to the second embodiment of the present invention, showing a process of performing a degreasing and cleaning process on the thin plate on which the cooling grooves are formed.

FIG. 7 is a diagram showing a step of forming a plated portion by performing plating on the cooling groove forming surface of the substrate.

8A is a cross-sectional view showing an electrode plate on which a plated portion is formed, and FIG. 8B is a cross-sectional view showing a large number of cooling plates obtained by dissolving and removing an embedding material from the electrode plate shown in FIG. 8A. Sectional drawing which shows the electrode plate which has a water passage.

FIG. 9 is a view showing a manufacturing process of the ion acceleration electrode plate according to the third embodiment of the present invention, showing a process of forming a metal material layer on a cooling groove forming surface of the substrate by a thermal spraying apparatus. .

FIG. 10 shows an example of a coating process by thermal spraying.
The figure which shows the process of forming a metal material layer with respect to the cooling groove formation surface of a board | substrate by a plasma spraying method.

FIG. 11 is a view showing a manufacturing process of an ion accelerating electrode plate according to a fourth embodiment of the present invention, in which a step of forming a weld metal layer on a cooling groove forming surface of a substrate by a build-up welding apparatus is shown. FIG.

FIG. 12 is a view showing a step of forming a weld metal layer on a cooling groove forming surface of a substrate by a plasma powder overlay welding method as an example of a coating process by overlay welding.

13 (a) is a cross-sectional view showing an electrode plate on which a weld metal layer is formed, and FIG. 13 (b) is a diagram showing a large number of electrodes obtained by dissolving and removing an embedding material from the electrode plate shown in FIG. 13 (a). Sectional drawing which shows the electrode plate which has a cooling water passage.

FIG. 14 is a view showing a manufacturing process of an ion accelerating electrode plate according to a fifth embodiment of the present invention, in which a coating process based on plating and a coating process based on thermal spraying are performed in combination to form cooling grooves on a substrate. The figure which shows the process of forming a double coating layer on a formation surface.

FIG. 15 is a view showing a manufacturing process of the ion acceleration electrode plate according to the sixth embodiment of the present invention, wherein the electrode plate has a large number of cooling water passages generated by the composite coating process and the filling material dissolving and removing process. FIG. 4 is a view showing a step of performing a diffusion heat treatment on the substrate.

16A is a diagram showing an electrode plate having a cooling water passage before performing diffusion heat treatment, and FIG. 16B is a diagram showing an electrode plate having a cooling water passage after performing diffusion heat treatment.

FIG. 17 is a view showing a manufacturing process of the ion acceleration electrode plate according to the seventh embodiment of the present invention, wherein the electrode plate has a large number of cooling water passages generated by the composite coating process and the filling material dissolving and removing process. FIG. 4 is a view showing a step of performing a diffusion heat treatment based on hot isostatic pressing on the substrate.

FIG. 18 is a diagram showing an isotropic external pressure acting on an electrode plate and an isotropic internal pressure acting on an inner peripheral surface of a cooling water passage in a diffusion heat treatment step based on hot isostatic pressing.

FIGS. 19A to 19C are diagrams showing another shape of the cooling groove formed in the substrate.

20A is a cross-sectional view showing the structure of a conventional ion acceleration electrode plate, and FIG. 20B is a partially enlarged view of FIG. 20A.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 thin plate 2, 2 b, 2 c, 2 d cooling groove 2 a cooling water passage 3 grooved thin plate (substrate) 4 embedded material 5, 21, 52 metal material layer (coating layer) 6, 17, 48, 53, 53 a electrode plate 7 beam Lead-out hole 8 Ion acceleration electrode plate 16 Plated part 20 Thermal spraying device 35 Overlay welding device 36, 46 Weld metal layer 50 First coating layer 51 Second coating layer 55 Heat treatment furnace 56 Vacuum container 58, 73 Reflector 59, 74 Heater 60, 75 Heat radiation plate 61, 78, 82 Valve 62, 84 Exhaust device 63, 81, 85 Pressure gauge 70 Hot isostatic pressurizing device 71 Pressure vessel 76 Thermocouple 77 Measuring device 80 Gas supply device

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) C23C 14/00-14/58 G21B 1/00-1/02 G21K 1/00-7/00 H01J 9 / 00-9/18 H01J 27/00-27/26 H01J 37/06-37/08 H05H 1/00-15/00

Claims (8)

(57) [Claims] An embedding material having a shape equal to the shape of the cooling groove and capable of being dissolved and buried is embedded in each cooling groove of a thin plate made of a high heat conductive metal or an alloy thereof and having a plurality of cooling grooves for cooling medium distribution on one surface. To flatten the cooling groove forming surface,
The flattened cooling groove forming surface is coated with a metal material equivalent to the thin plate in a layer form to form a plate-shaped metal material layer on the cooling groove forming surface, and the thin plate on which the metal material layer is formed Forming a plurality of cooling water passages in the plurality of cooling grooves and the metal material layer by dissolving and removing the filling material from the plurality of cooling water passages; and a beam for extracting an ion beam between adjacent cooling water passages in the plurality of cooling water passages. A method for producing an ion accelerating electrode plate, characterized by forming holes. 2. The step of coating the cooling groove forming surface of the thin plate with a metal material includes performing a degreasing and cleaning process on the thin plate, and removing the cooling groove forming surface of the thin plate that has been subjected to the degreasing and cleaning process. 2. The plating process according to claim 1, further comprising the step of: activating and plating the activated cooling groove forming surface of the thin plate with a metal material equivalent to the thin plate to a predetermined thickness to form the metal material layer. A method for manufacturing an ion acceleration electrode plate. 3. The step of coating the cooling groove forming surface of the thin plate with a metal material includes spraying molten or near-molten particles made of a metal material equivalent to the thin plate onto the cooling groove forming surface. The method for producing an ion acceleration electrode plate according to claim 1, which is a thermal spraying process of forming the metal material layer by causing the metal material layer to collide. 4. The step of coating the cooling groove forming surface of the thin plate with a metal material, wherein the molten metal made of a metal material equivalent to the thin plate is welded to the cooling groove forming surface. The method for producing an ion acceleration electrode plate according to claim 1, which is a build-up welding process step of forming a layer. 5. The step of coating the cooling groove forming surface of the thin plate with a metal material by combining at least two of the plating step, the thermal spraying step and the overlay welding step. 2. The method according to claim 1, wherein the step of forming the metal material layer has a multilayer structure by performing the steps. 6. A thin plate in which the metal material layer and the plurality of cooling water passages are formed between the step of forming the plurality of cooling water passages and the step of processing and forming the beam holes for extracting the ion beam. 2. The method for producing an ion acceleration electrode plate according to claim 1, further comprising a step of performing a diffusion heat treatment on the substrate. 7. The ion accelerating electrode according to claim 6, wherein the diffusion heat treatment step is a step of performing hot isostatic pressing on the thin plate on which the metal material layer and the plurality of cooling water passages are formed. Plate manufacturing method. 8. An embedding material having a shape equal to the shape of the cooling groove and capable of being dissolved and buried is embedded in each cooling groove of a thin plate made of a highly heat conductive metal or an alloy thereof and having a plurality of cooling grooves for cooling medium distribution formed on one surface. To flatten the cooling groove forming surface,
The flattened cooling groove forming surface is coated with a metal material equivalent to the thin plate in a layer form to form a plate-shaped metal material layer on the cooling groove forming surface, and the thin plate on which the metal material layer is formed An electrode plate formed by dissolving and removing the embedding material, a plurality of cooling water passages formed between the plurality of cooling grooves of the thin plate and the metal material layer in the electrode plate, and the plurality of cooling water passages And a beam hole for extracting an ion beam formed between adjacent cooling water passages.