JP3198672U - Multilayer electronic components - Google Patents

Abstract

A multilayer electronic component having both high Q characteristics and high SRF (self-resonant frequency) is provided. In a laminated electronic component having a substantially rectangular parallelepiped shape in which a coil conductor layer and an insulating layer are alternately laminated to form a coil inside, each coil conductor layer has a plurality of layers in the laminating direction via the insulator layer. Are formed in substantially the same coil conductor pattern, each coil conductor layer is composed of a plurality of helically wound coil conductors, and multiple substantially wound coil conductor patterns are electrically connected at least at both ends thereof. The terminal electrodes 51 are formed on the opposite end faces that are configured and that are perpendicular to the magnetic flux of the laminate produced by energization of the coil and that are not the smallest in the area of the laminate. [Selection] Figure 2

Description

  The present invention relates to a multilayer electronic component in which a coil conductor layer and an insulating layer are alternately laminated to form a coil therein, and particularly to a multilayer electronic component having both high Q characteristics and high SRF (self-resonant frequency). is there.

  In recent years, communication devices such as mobile phones and smartphones, which have been remarkably popular, use many low-priced and high-frequency multilayer electronic components.

  In order to affect the performance of communication equipment, higher frequency multilayer electronic components are required to have higher Q characteristics and higher SRF.

  A conventional multilayer electronic component having a coil formed therein is manufactured by a lamination process as shown in FIG. 3, for example, and its outer shape is as shown in FIG.

  In FIG. 3, the coil conductor layers 21, 22, and 23 and the insulator layers 11, 12, 13, and 14 are alternately stacked to obtain a laminated body in which a helically wound coil 31 is formed.

  As a multilayer electronic component for high frequency that is one of the multilayer electronic components, silver is used for the material of the coil conductor layer, and dielectric ceramic having a relative dielectric constant of 5 or less is used for the material of the insulator layer.

  In FIG. 4, terminal electrodes 51 and 52 are formed on both end faces having a minimum area on both end faces parallel to the magnetic flux direction of the laminate produced by energizing the coil 31.

  By the way, the above-described conventional configuration has the following problems.

  As shown in JP-A-2002-134322, Q can be improved by using multiple winding.

  As shown in Japanese Patent Application Laid-Open No. 2006-310844, the SRF can be improved by changing the position of the terminal electrode.

  An object of the present invention is to provide a multilayer electronic component having a high Q characteristic and a high SRF and having a coil formed therein.

  In order to achieve the above object, a multilayer electronic component according to claim 1 of the present application is a multilayer electronic component having a substantially rectangular parallelepiped shape in which a coil conductor layer and an insulating layer are alternately stacked to form a coil therein. Each coil conductor layer is formed in a substantially identical coil conductor pattern in the stacking direction via the insulator layer in the previous period, and a plurality of helically wound coil conductors are formed in each coil conductor layer. The coil conductor patterns are electrically connected at least at both ends thereof to form a multiple winding, and the area of the laminate is minimum on both end faces perpendicular to the magnetic flux of the laminate produced by energizing the coil. The terminal electrodes are formed on both opposing end faces.

  The multilayer electronic component according to claim 2 of the present application is characterized in that, in claim 1, the insulating layer is a dielectric ceramic.

  The multilayer electronic component according to claim 3 of the present application is characterized in that, in claim 1, the insulating layer is a magnetic ceramic.

  The best mode for carrying out a multilayer electronic component according to the present invention will be described below with reference to the drawings.

  A first embodiment of a multilayer electronic component for high frequency according to the present invention will be described with reference to FIGS.

  1A shows a substantially rectangular first insulator layer 11, FIG. 1B shows a first coil conductor layer 21 formed on the first insulator layer, and FIG. The second insulator layer 12 laminated thereon is shown in FIG. 4D, the second coil conductor layer 22 laminated thereon, and the third coil conductor layer 22 laminated thereon is shown in FIG. FIG. 4F shows the third coil conductor layer 23 formed thereon, and FIG. 5G shows the fourth insulator layer 14 formed thereon. (H) shows the fourth coil conductor layer 24 formed thereon, and FIG. 11 (I) shows the fifth insulator layer 15 formed thereon.

  As a material for forming the first to fourth coil conductor layers, low resistance silver is desirable in order to improve the Q characteristic.

  As a material for forming the first to fifth insulator layers, a dielectric ceramic having a low dielectric constant, specifically a relative dielectric constant of 5 or less, is used in order to reduce parasitic capacitance and increase Q characteristics and SRF. desirable.

  The first to fourth coil conductor layers 21, 22, 23, 24 are partially insulated by the second to fourth dielectric layers 12, 13, 14 to form a helically wound coil 31 as a whole. Yes.

  FIG. 2 is a perspective view of the laminate formed as shown in FIG.

  A via hole 41 is provided in the insulator layer 11 of FIG. 1A, and the terminal electrode 51 formed on the outer surface of the laminate as shown in FIG. 2 and one end of the coil 31 are connected through this via hole 41. The

  Also, via holes 42 are provided in the insulator layer 15 of FIG. 1 (I), through which terminal electrodes 52 and the other end of the coil 31 formed on the outer surface of the laminate as shown in FIG. Is connected.

  As can be seen from FIG. 2, the coil 31 is a longitudinally wound helical coil, and the positional relationship between the coil 31 and the terminal electrodes 51 and 52 at both ends is perpendicular to the direction of magnetic flux generated by energization of the coil 31. The terminal electrodes 51 and 52 are arranged on the surface.

  As shown in FIG. 2, the laminate has a substantially rectangular parallelepiped shape, and terminal electrodes 51 and 52 are formed on opposite end surfaces that are not the smallest in area.

  The coil conductor layers 21 and 22 have the same pattern, and are electrically connected at both ends to form a so-called double winding (multiple winding).

  The coil conductor layers 23 and 24 have the same pattern, and are electrically connected at both ends to form a so-called double winding (multiple winding).

  Therefore, the coil as a whole is double wound (multiple winding), and the Q of the coil can be improved. (JP 2002-134322)

  In general, the larger the core area of the coil, the higher the Q. Therefore, as shown in FIG. 2, the positional relationship between the terminal electrode and the coil is formed on both end faces perpendicular to the magnetic flux direction and on both end faces of a rectangular parallelepiped with a minimum area. Therefore, the core area can be maximized and a high Q can be obtained.

  Further, by setting the positional relationship between the terminal electrode and the coil to both end faces perpendicular to the magnetic flux direction, the parasitic capacitance of the coil can be reduced and the SRF can be increased. (JP 2006-310844)

  Therefore, according to the present invention, the Q characteristic and SRF can be made higher than before by changing the position of the terminal electrode by using multiple windings of the coil.

  In the present embodiment, the coil is wound twice. However, as long as the dimensions allow, a single winding, a double winding, a triple winding,...

  Further, the area of the terminal electrodes 51 and 52 can be made as small as the bending strength allows, and the SRF can be made high.

  Note that the multilayer electronic component finally composed of the multilayer body has a width (W) longer than a length (L), which is opposite to a normal chip component, and is an L / W inversion type.

  Although the best mode for carrying out the present invention has been described above, the present invention is not limited to this, and it is obvious to those skilled in the art that various modifications and changes can be made within the scope of the claims. I will.

Effect of device

  According to the first aspect, by changing the position of the terminal electrode by multiple winding, it is possible to realize a multilayer electronic component having higher Q characteristics and SRF than the conventional one.

  According to the second aspect, by using the dielectric ceramic, the inductance can be reduced, and in addition to the effect of the first aspect, a low-inductance multilayer electronic component for high frequency can be realized.

  According to the third aspect, the inductance can be increased by using the magnetic ceramic, and in addition to the effect of the first aspect, a high-frequency low-frequency multilayer electronic component can be realized.

  Further, the impedance can be increased, and in addition to the effect of claim 1 (in place of high Q and high SRF, low Rdc broadband), a high impedance multilayer chip bead inductor can also be realized.

It is a figure which shows the lamination process of the multilayer electronic component by the 1st Embodiment of this invention. 1 is a perspective view of a multilayer electronic component according to a first embodiment of the present invention. It is a figure which shows the lamination process of the conventional multilayer electronic component. It is a perspective view of the conventional multilayer electronic component.

11, 12, 13, 14, 15 Insulator layer 21, 22, 23, 24 Coil conductor layer 31 Coil 41, 42 Via hole 51, 52 Terminal electrode

Claims (3)

  In a multilayered electronic component having a substantially rectangular parallelepiped shape in which a coil conductor layer and an insulating layer are alternately laminated to form a coil therein, each coil conductor layer has a plurality of layers substantially the same in the stacking direction via the previous insulator layer. It is formed in a coil conductor pattern, and a plurality of helically wound coil conductors are formed in each coil conductor layer, and multiple windings are configured by electrically connecting at least both ends of substantially the same coil conductor pattern in the previous period, A laminated electronic component, wherein terminal electrodes are formed on opposite end faces of the laminated body that are perpendicular to the magnetic flux of the laminated body generated by energization of the coil, and are opposed to each other with a minimum area.   The multilayer electronic component according to claim 1, wherein the insulating layer is a dielectric ceramic.   The multilayer electronic component according to claim 1, wherein the insulating layer is a magnetic ceramic.

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