JP3196681U - Connection and radiator for LED module unit - Google Patents

Abstract

Connection for an LED module unit that has an accurate holding function for an LED module unit, and has sufficient insulation and creepage distance from a heat sink, which is a metal heat dissipating housing, and further improved reliability.・ Provide a radiator. SOLUTION: The thickness is 2.0 mm or less, which is excellent in workability, mechanical strength, and thermal conductivity, an opening 3 is formed at the center, and an LED module unit or the like is held outside the opening 3, A flat metal exterior made of conductive metal provided with a holding mechanism comprising a required number of recesses 4 and mounting holes 5 for fixing a heat sink as a metal heat dissipating housing disposed on the back side of the LED module unit. A flat plate made of ceramic that is made of a frame 2 and a thickness of 2.0 mm or less disposed so as to close the opening 3 and is excellent in heat dissipation and insulation, and is in contact with the heat radiating portion of the LED module unit and the heat sink. The heat dissipation plate 11 is included. [Selection] Figure 1

Description

  The present invention relates to an LED module unit connection / heat dissipator, and more specifically, includes an LED module unit and an accurate holding / connecting mechanism for a heat sink, which is a metal heat dissipating housing disposed on the back side of the LED module unit. In addition, the LED module unit (for example, COB: Chip on board) electrode section and heat sink have sufficient insulation, creepage distance is ensured, and the heat dissipation reliability is ensured by the stable heat conduction. The present invention relates to an improved connection / heat dissipator for an LED module unit.

In recent years, LED module units having a large power saving effect have been adopted in various fields. In fields such as lighting, a large luminous flux COB in which an LED element is mounted on a substrate is employed as a main light source. .
In this main LED module unit, the life of the LED module unit is guaranteed by the heat generated from the heat radiating portion to the heat sink and stably radiated for longer than the life of the LED element.
Moreover, since the protection and safety of the LED module unit are secured by the performance exceeding the insulation distance JIS standard (C8147-1), the COB electrode part and the heat sink will be used especially in the future for outdoor lighting, landscape lighting, and facility lighting. LED lighting fixtures that are used in, etc. are highly durable and require insulation by a member that has high heat dissipation and insulation properties. Improving performance is essential.

  Conventionally, in electrical equipment that requires good thermal conductivity, the LED module unit's heat dissipation part uses heat dissipation grease or heat dissipation sheets / pads to dissipate heat to the heat sink. As for lighting fixtures, LED lighting fixtures whose durability / insulation performance of the heat conducting part is uncertain due to light flux, ultraviolet rays, heat deterioration, and the like by the same method are mainly used. Insulating materials (ceramic-related) have a current state in which only special tools are used because their thermal conductivity is inferior to that of heat-dissipating grease or heat-dissipating sheets / pads due to their thickness.

  In the field of lighting fixtures such as outdoor lighting, facility lighting, road lights, high ceilings, and floodlights that require high insulation and breakdown voltage, ensure insulation that requires a lightning surge withstand voltage of 6 KV or more. For this reason, a ceramic insulating plate is used. However, since it is used while being devised so that there is no mounting structure and function, the number of parts increases and the structure becomes complicated.

  There is a case where the LED module unit (including Chip on board) itself uses a ceramic plate with a heat sink and an insulating plate, but there is a possibility of cracking when the ceramic material is used for the purpose of providing a holding function for the lighting fixture body. On the other hand, there is a problem that the required insulation cannot be ensured although it is not broken if it is a metal material.

  Next, considering the shape and accuracy of ceramic molded products, holes can be added to existing ceramic press molded products when a heat sink is manufactured. Since it is difficult and the surface accuracy is not obtained, after the thick thickness is molded and baked, post-processing such as polishing finish is required, and the molded product becomes expensive, making it difficult to commercialize.

  In addition, general-purpose ceramic substrates are commercially available because they can be easily molded with thin sheet thickness and high flatness accuracy by sheet molding method and doctor blade method, but these are holes for attaching metal parts such as connection terminals. Currently, it is difficult to machine the grooves and grooves, and is used only for the applications described above.

  Next, considering the technical field of the LED module unit further, as a base material of this kind of field in the past, in order to reduce the thermal resistance, a heat sink having a thickness of 2 mm or less was necessary. Since ceramic materials warp when a heat sink of 2 mm or less is molded and fired, once it is manufactured at 2 mm or more, a heat sink of 2 mm or less is molded while producing flatness by processing (polishing). As a result, there were problems in terms of mass productivity and cost, making mass production difficult.

  Patent Document 1 discloses a connector for holding and electrically connecting an LED module substrate, which includes a lower cover member on which the LED module substrate is placed and a power supply connection that elastically contacts a power supply pad included in the LED module substrate. An upper cover member having a terminal, and at least a portion of the lower cover member located on the bottom surface of the LED module substrate is formed of a heat conductive insulating material, and the upper cover member emits light from the LED module substrate. It is configured as a connector that is assembled by attaching the upper cover member to the lower cover member in a state in which light is irradiated to the outside and the LED module substrate is placed on the lower cover member. The connector can be fixed to the heat sink with the back surface of the lower cover member of the connector placed on the heat sink. Discloses a LED module board connector you.

  However, in the case of the connector for the LED module substrate of Patent Document 1, the heat conduction part is configured using a silicon material (silicon-based heat radiation sheet or the like) and a plastic material as the outer frame material. There is a concern that the LED light source may have a short life due to aging deterioration or heat deterioration due to the sheet or the like.

  As mentioned above, conventional ceramic materials that have insulating properties have cracking problems, cost problems, shape problems, and surface accuracy problems, so they are used as heat sinks (heat conduction plates). The current situation is not.

Japanese Patent No. 5614732

  The problem to be solved by the present invention is to have an accurate holding / connecting mechanism for the LED module unit and the heat sink, and to ensure sufficient insulation and creepage distance between the electrode part of the LED module unit and the heat sink. There is no LED module unit connection / heat dissipating body that can improve the reliability of heat dissipating by the stable heat conduction composed of the durability of the heat dissipating part.

  The present invention has a plate thickness of 2.0 mm or less, which is excellent in workability, mechanical strength and thermal conductivity. An opening is formed in the center, and a holding connection mechanism for the LED module unit and heat sink outside the opening. A flat metal outer frame made of conductive metal and a plate thickness of 2.0 mm or less arranged so as to close the opening, and has excellent heat dissipation and insulation, and the heat dissipation portion of the LED module unit and The most important feature is to have a flat ceramic heat sink that is brought into contact with the heat sink.

  According to the first aspect of the present invention, the LED module unit and the heat sink have an accurate holding function, have excellent heat dissipation and insulation properties, and are excellent in durability, ease of assembly, mass productivity, and cost. In this respect, it is possible to realize and provide an LED module unit connection / heat dissipator that is excellent in terms of the above.

  According to the invention described in claim 2, the same effect as that of the invention described in claim 1 is obtained, the LED module unit provided on the metal outer frame body is held, the optical system peripheral parts are fixed, the ceramic plate With the holding mechanism including the required number of holes and recesses for fixing and fixing the heat sink, the LED module unit can be easily held and the optical components can be easily incorporated, and the structure of the lighting fixture can be simplified. Further, it is possible to realize and provide an LED module unit connection / heat dissipating body that can prevent cracking of the heat dissipating plate at the time of assembling the appliance.

  According to the invention of claim 3, the same effect as the invention of claim 1 or 2 can be obtained, and the heat radiation portion and the heat sink in the LED module unit can be strongly pressed against the contact plane of the heat radiation plate, The heat conduction from the heat sink to the heat sink, and further the heat diffusion to the metal outer frame and the heat radiation to the heat sink improve the reliability of heat radiation by the stable heat conduction that is the durability of the heat radiating part beyond the lifetime of the LED element. As a result of maximizing the ability of the heat sink, it is possible to realize and provide an LED module unit connection / heat dissipating body with excellent heat dissipating characteristics that can be reduced in weight.

FIG. 1 is a diagram showing a front side and a back side of an LED module unit connection / heat dissipating body according to an embodiment of the present invention. FIG. 2 is a diagram showing the front side and the back side of the LED module unit connection / heat dissipating body according to the present embodiment in a state where the metal outer frame and the heat dissipating plate are separated. FIG. 3 is an explanatory view showing the relationship between the thickness of the metal outer frame body and the heat sink in the LED module unit connection / heat sink according to this embodiment. FIG. 4 is a schematic view showing a state where an LED module (COB: Chip on board) is attached to the surface side of the LED module unit connection / heat dissipating body according to the present embodiment. FIG. 5 is a schematic view showing a state in which the LED module unit is attached to the surface side of the LED module unit connection / heat dissipating body according to this example. FIG. 5A is a surface view showing a state in which the LED module unit is attached to the surface side of the LED module unit connection / heat dissipating body according to this example, and FIG. 5 (c) is a central longitudinal sectional view of FIG. 5 (a), and FIG. 5 (d) is a sectional view of the portion of FIG. 5 (a). FIG. 6 is a schematic view showing a state in which the second LED module unit is attached to the surface side of the LED module unit connection / heat dissipating body according to the present embodiment. FIG. 7 is a schematic view showing a state where a tapered cylindrical optical system component is further attached to the LED module unit shown in FIG. 5 via a connection bracket.

  The present invention has an accurate holding / connecting mechanism for the LED module unit and the heat sink, and also has sufficient insulation between the electrode portion of the LED module unit and the heat sink, and a creepage distance, and further has durability of the heat radiating portion. Thickness 2 with excellent workability, mechanical strength, and thermal conductivity for the purpose of realizing and providing an inexpensive and mass-productable connection and heat dissipation body for LED module units that can improve the reliability of heat dissipation by stable heat conduction Conductives with a plate thickness of 0.0 mm or less, an opening formed in the center, an LED module unit held outside the opening, and a holding mechanism comprising a required number of holes and recesses for electrical connection It consists of a flat metal outer frame made of metal and a plate thickness of 2.0 mm or less arranged so as to close the opening, and has excellent heat dissipation and insulation properties. A flat radiator plate made of ceramics which is brought into contact with the heat radiating portion of Tsu bets were achieved by arrangement with.

  Hereinafter, a connection / heat dissipating body for an LED module unit according to an embodiment of the present invention will be described in detail with reference to the drawings.

  As shown in FIGS. 1 to 3, the LED module unit connection / heat dissipating body 1 according to this embodiment has a thickness of 2.0 mm or less, which is excellent in workability, mechanical strength, and thermal conductivity, A flat metal outer frame 2 made of, for example, aluminum in which an opening 3 is formed in the opening, and a flat radiator plate 11 made of, for example, ceramics disposed in the opening 3.

  The metal outer frame 2 is formed in a generally quadrangular shape in plan view, with each corner rounded into an arc shape, and a rectangular opening 3 to which the heat radiating plate 11 can be attached is formed at the center. doing.

  Moreover, the recessed part 4 which exhibits the arc shape for ensuring the creeping distance with the electrode part of an LED module unit in a part of peripheral part (upper side, lower side) which defines the said opening part 3 in the said metal outer frame body 2, 4 and the lower and side pieces of the metal outer frame 2 located outside the opening 3 are connected to a first LED module unit (including Chip On board) 21A to be described later. For example, a D-shaped attachment hole 5 for a terminal is formed.

  A small hole 6 is formed in the lower piece of the metal outer frame 2 located outside the opening 3.

  Furthermore, the upper side and the lower side of the metal outer frame 2 positioned outside the opening 3 are respectively formed with recessed portions 7 and 7 for fixing the LED module unit using clips, and the upper side and the lower side piece. Protrusions 8 and 8 are respectively provided outward from the respective central portions, and circular holes 9 for inserting screws and the like are provided in the respective projecting portions 8 and 8.

  Furthermore, a circular hole 10 for inserting a screw or the like is also provided in the side piece of the metal outer frame 2 located outside the opening 3. The circular hole 10 is, for example, an eyelet hole for stopping the connector.

  The heat radiating plate 11 is made of a ceramic material having a thickness of 2.0 mm or less and having excellent performance of insulation, durability and heat resistance and a thermal conductivity of 23 W / (m · k) or more at 20 ° C. By forming it into a quadrangular shape having a size slightly smaller than the size of the opening 3, and attaching the periphery of the heat radiating plate 11 to the inner wall of the opening 3 by bonding or the like. The metal outer frame 2 and the heat radiating plate 11 are integrally configured so that the upper surfaces thereof are aligned substantially flat.

  That is, on the surface side of the metal outer frame 2 and the heat sink 11 shown in the upper column of FIG. 1, as described later, the first LED module unit 21A and the like can be attached and held as a light source, and The LED module unit support / heat dissipating body 1 that also exhibits a heat dissipating function is configured.

  More specifically, the metal outer frame 2 mechanically holds, for example, the first LED module unit 21A and exhibits an electrical conductive function, and further, the heat radiating plate 11 provides an insulating function and heat dissipation. It is configured to demonstrate its functions.

As the heat sink 11, for example, an aluminum nitride material having a high thermal conductivity (180 W / (m · k) at 20 ° C.) among various ceramics is employed. Moreover, the insulating performance of the aluminum nitride material is greater than 10 ¹⁴ (Ω · cm), and exhibits an excellent insulating function.

  According to the heat sink 11 described above, for example, by using an aluminum nitride material, this kind of base material having an insulation distance of JIS standard: (C8147-1) or more, withstand voltage performance of 6 KV or more, and creepage distance of 5 mm or more. Can be ensured, and it can contribute to the improvement of safety and reliability as an LED product having excellent insulation performance and withstand voltage performance.

  The heat radiating plate 11 is formed by, for example, using a general-purpose product (ceramic plate material having a length of about 20 cm and a width of about 5 cm) sold in the market as a ceramic plate material of 2 mm or less, and cutting it into a predetermined dimension. .

  In addition to the aluminum nitride material described above, a silicon carbide material (thermal conductivity: 200 W / (m · k) at 20 ° C.) may be employed as the heat sink 11.

  FIG. 2 shows a state in which the metal outer frame 2 and the heat radiating plate 11 in the LED module unit support / heat radiating body 1 are separated, and the upper column in FIG. 2 separates the metal outer frame 2 and the heat radiating plate 11. The lower side of FIG. 2 shows the back side of the metal outer frame 2 and the heat sink 11 respectively.

  FIG. 3 shows the relationship between the thickness of the metal outer frame 2 and the heat radiating plate 11. The thickness t1 of the metal outer frame 2 is 1.9 mm which is 2.0 mm or less, and the heat dissipation. An example in which the thickness t2 of the plate 11 is 2.0 mm is shown.

  Thereby, the upper surface of the heat radiating plate 11 is 0.1 mm higher than the upper surface of the metal outer frame body 2 and has a step that protrudes slightly above the upper surface of the heat radiating plate 11 to form a contact plane. It is said.

  With such a structure, when the first LED module unit 21A is attached to the metal outer frame 2, it can be strongly pressed against the contact flat surface of the heat radiating plate 11, and the LED shown in FIG. There is an advantage that heat generated from the module substrate 22 is conducted to the heat radiating plate 11 and further diffused to the metal outer frame 2 so that heat radiation to the heat sink 24 can be improved.

  The first LED module unit 21 </ b> A includes a known LED module substrate 22 and an LED element portion 23.

  The relationship between the thicknesses t1 and t2 is not limited to the above-described case, and the metal outer frame 2 and the heat radiating plate 11 should have an equal thickness or have a difference of 0.2 mm. Various modifications can be made.

  Next, specific usage examples of the LED module unit connection / heat dissipating body 1 according to the present embodiment will be described with reference to FIGS.

  FIG. 4 shows an LED module (COB: Chip on board) having an LED module substrate 22 and an LED element portion 23 attached to the surface side of the LED module unit connection / heat dissipating body 1 according to this embodiment. This shows the state.

  A description of the details of the mounting structure of the LED module (COB: Chip on board) to the LED module unit connection / heat dissipating body 1 is omitted.

  FIG. 5 is a schematic view showing a state in which the first LED module unit 21A is attached to the surface side of the LED module unit connection / heat dissipating body according to this example.

FIG. 5A is a surface view showing a state in which the first LED module unit 21A is attached to the surface side of the LED module unit connection / heat dissipating body according to this example, and FIG. Fig. 5 (a) is a central transverse sectional view, Fig. 5 (c) is a central longitudinal sectional view of Fig. 5 (a), and Fig. 5 (d) is a sectional view of the portion of Fig. 5 (a). is there.
Reference numeral 10a in FIG. 5 denotes a caulking pivot part, and an upper case or a lid part (not shown) pivoted by the caulking pivot part 10a on the upper surface of the first LED module unit 21A. The LED module unit 21A can be opened and closed while sliding.

  FIG. 6 shows a state in which the second LED module unit 21B is attached to the surface side of the LED module unit connection / heat dissipating body 1 according to this embodiment.

  In addition, description is abbreviate | omitted about the detail of the attachment structure with respect to the connection / radiator 1 for LED module units of the said 2nd LED module unit 21B.

  FIG. 7 shows a state where a tapered cylindrical reflector unit 26 is further added to the first LED module unit 21A shown in FIG.

  According to the LED module unit connection / heat dissipating body 1 according to the present embodiment described above, it is constituted by a combination of the metal outer frame 2 and the heat dissipating plate 11 formed of an inexpensive general-purpose ceramic material. LED module units 21A and 21B have an accurate holding function and electrical connection function, have excellent heat dissipation and insulation, and are highly durable and can easily produce LED lighting fixtures. The LED module unit connection / heat dissipating body 1 can be realized.

  Further, since the mounting hole 5 for holding and electrical connection of the first LED module unit 21A and the like, the recessed portion 7, the circular hole 9 and the like are provided on the metal outer frame body 2 side, the heat radiating plate 11 is used for ceramics. There is no need to directly support the first LED module unit 21A or the like made of a material, thereby eliminating the need to process holes or the like in the heat radiating plate 11, thereby preventing cracking of the heat radiating plate 11 and further improving durability. be able to.

  In addition, with this type of conventional product, there is a concern that the LED light source may have a short life due to aging degradation or thermal degradation due to a silicon-based heat radiation sheet or the like. The problem disappears.

  Furthermore, according to the LED module unit connection / heat dissipating body 1 of the present embodiment, the heat dissipating plate 11 can be simply manufactured using a general-purpose 2 mm or less ceramic plate material sold in the market, which greatly improves mass productivity. And cost reduction.

  According to the LED module unit connection / heat dissipating body 1 of the present embodiment, the metal outer frame 2 and the heat dissipating plate 11 are structured as described above, so that LED elements such as connectors, LED light sources, mirrors, reflectors, etc. The members and parts necessary for making the light source can be simply and easily held, and the electrical connection can be easily performed, so that the assembly of the instrument can be improved.

  According to this embodiment, for the LED module unit to realize a novel connector product that waits for an accurate holding function and electrical connection function of other electrical components that are attachment objects, and excellent insulation performance and heat dissipation performance. The connection / heat dissipating body 1 can be realized and provided.

  The LED module unit connection / heat dissipator of the present invention can be widely applied as a connector part for constructing various LED-equipped appliances, for example, indoor lamps, outdoor lamps, automobile lighting fixtures, etc. is there.

DESCRIPTION OF SYMBOLS 1 Connection / radiation body for module units 2 Metal outer frame body 3 Opening part 4 Recessed part 5 Mounting hole 6 Small hole 7 Recessed part 8 Projection part 9 Circular hole 10 Circular hole 10a Caulking pivoting part 11 Heat sink 21A LED module unit 21B LED Module unit 22 LED module substrate 23 LED element section 24 Heat sink 25 Connection bracket 26 Reflector unit

Claims (3)

It consists of a plate thickness of 2.0 mm or less that is excellent in workability, mechanical strength, and thermal conductivity. An opening is formed in the center, and the LED module unit is held outside the opening and on the back side of the LED module unit. A flat metal outer frame made of conductive metal provided with a heat sink connection mechanism, which is a metal heat dissipating housing;
It consists of a plate thickness of 2.0 mm or less arranged so as to close the opening, has excellent heat dissipation, insulation, and durability, and abuts against the heat sink of the LED module unit heat sink and metal heat sink A flat radiator plate made of ceramics,
An LED module unit connection / heat dissipator characterized by comprising: It consists of a plate thickness of 2.0 mm or less that is excellent in workability, mechanical strength, and thermal conductivity, and an opening is formed in the center and the LED module unit is held outside the opening, and the back surface of the LED module unit A flat metal outer frame made of conductive metal provided with a required number of holes for fixing a heat sink, which is a metal heat dissipating housing disposed on the side, and a holding mechanism consisting of a recess,
It consists of a plate thickness of 2.0 mm or less arranged so as to close the opening, has excellent heat dissipation, insulation, and durability, and abuts against the heat sink of the LED module unit heat sink and metal heat sink A flat radiator plate made of ceramics with high thermal conductivity,
An LED module unit connection / heat dissipator characterized by comprising:   The metal outer frame is formed with a thickness of 2.0 mm or less, and the heat sink is formed with a thickness of 2.0 mm or less and slightly thicker than the thickness of the metal outer frame. In the central portion of the metal outer frame body, the abutment plane for abutting the heat radiation portion of the LED module unit protruding upward and the heat sink that is a metal heat radiation housing disposed on the back side of the LED module unit The connection / heat dissipating body for an LED module unit according to claim 1, wherein:

Images