JP3194523B2 - Computer heat control device, computer heat control method, and computer with heat control device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a computer heat control device for transferring heat generated on a computer substrate or the like to a predetermined position, a computer heat control method, and a computer provided with the heat control device.

[0002]

2. Description of the Related Art Heretofore, notebook personal computers have been used, and recently, wearable personal computers have also been used. These personal computers of the mobile type are used in various environments and may be used on a desk. However, they are often used on a knee or worn on a human body. .
At that time, the user may feel hot and feel uncomfortable.

In a conventional notebook-type personal computer, the knee becomes extremely hot when used on a lap or the like, and cannot be held when a PC card is pulled out, or when a keyboard is used. The user actually complained that he was warm and uncomfortable. For example, in the case of the notebook type personal computer 1 shown in FIG.
The C card 3 and the like particularly generated a large amount of heat, and often felt heat mainly from these portions.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to control the amount of heat perceived by a user even when heat is generated from a mobile personal computer so that the user does not feel uncomfortable. Aim.

[0005] It is another object of the present invention to control the moving direction of heat generated from a personal computer so that a user is not discomforted.

[0006]

SUMMARY OF THE INVENTION The gist of the computer heat control device, the computer heat control method, and the computer provided with the heat control device of the present invention are to distribute heat generated in a predetermined portion of the computer to a plurality of predetermined positions. It is in.

The gist of the computer heat control device, the computer heat control method and the computer provided with the heat control device of the present invention is that the amount of heat to be moved to a plurality of predetermined positions is changed by the control means or the conversion step. is there. In the present specification, the heat transfer means
Heat transfer between the same articles or heat transfer between different articles.

[0008] The gist of the heat control device for a computer and the computer provided with the heat control device according to the present invention is to adjust the amount of heat absorbed from the heat radiating member to the thermo-module element to thereby reduce the amount of heat transferred to a plurality of predetermined positions. To change. Here, in the present specification, a thermomodule element is an element utilizing a Peltier effect or a Thomson effect or the like, and an element in which an endothermic effect occurs in one part and an exothermic effect occurs in the other part by passing a current. To tell.

[0009] The gist of the computer provided with the heat control device of the present invention is that, in a mobile personal computer, the amount of heat generated in a predetermined portion of the computer is distributed at least to the vicinity of the top surface of the main body and the vicinity of the bottom surface of the main body. It is in. Here, in this specification, a mobile personal computer refers to a notebook personal computer, a wearable personal computer, or the like.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of a computer heat control apparatus, a computer heat control method, and a computer provided with a heat control apparatus according to the present invention.

In FIGS. 1 and 2, reference numeral 10 denotes a heat control device for a computer according to the present invention. In FIG. 1, reference numeral 12 denotes a notebook personal computer (a heat control device) provided with the heat control device according to the present invention. Computer with control device). Reference numeral 14 denotes a main body of the personal computer 12, and reference numeral 16 denotes a lid.

The heat control device 10 of the computer includes a heat pipe (heat conduction means) 24 for moving the heat generated in the MPU 18 of the computer 12 to the vicinity of the upper surface 20 and the lower surface 22 of the main body 14, and the vicinity of the upper surface 20 and the lower surface 2.
2, two heat dissipating means 28a and 28 for releasing heat
b and the Peltier element 34a are heat spreaders 32a
And a volume switch (control means) 30 for adjusting the amount of heat absorbed from the volume.

The heat pipe 24 is provided in contact with the MPU 18 fixed on the substrate 31.
It is configured to absorb the heat generated from 8 and diverge to the side near the upper surface 20 and the side near the lower surface 22 to transfer the heat to the two radiating means 28a and 28b.

The heat dissipating means 28a includes a heat spreader (heat dissipating member) 32a for dissipating heat transferred by the heat pipe 24, and a Peltier element (thermo module element) 3 for absorbing heat from the heat spreader 32a.
4a, and a heat sink (heat sink) 36a that absorbs heat from the Peltier element 34a. Further, a fan 38 is provided for discharging heat radiated from the heat radiating means 28a and 28b to the outside of the computer 12. On the other hand, the heat dissipating means 28b
b. Heat spreader 32a, 3
2b and the heat sink 36a may be a good heat conductor such as copper or aluminum.

The volume switch 30 adjusts the amount of heat transferred from the heat pipe 24 to the heat spreader 32a by adjusting the amount of heat absorbed by the Peltier element 34a from the heat spreader 32a, and controls the amount of heat transferred to the heat spreaders 32a and 32b. It is configured to be adjustable. Specifically, the Peltier device 34
If the amount of heat a absorbs from the heat spreader 32a increases, the amount of heat moving to the heat spreader 32a increases while the amount of heat moving to the heat spreader 32b decreases. Conversely, if the amount of heat absorbed by the Peltier element 34a from the heat spreader 32a is reduced, the amount of heat transferred to the heat spreader 32a is reduced while the amount of heat transferred to the heat spreader 32b is increased. As a result, the volume switch 30 functions as control means for changing the amount of heat transferred to the two heat radiating means 28a and 28b.

As shown in FIG. 3, the Peltier element 34a includes a heat-absorbing metal 40, a heat-radiating metal 42, and an n-type semiconductor 44.
When the volume switch 30 is turned on and a current flows through the heat-dissipating metal 42, the heat-sinking metal 4
0 to the heat sink 36
It is configured to radiate heat to the a side. Further, the amount of heat absorbed from the heat spreader 32a side to the heat absorbing side metal 40 is changed by changing the value of the current flowing through the heat radiating side metal 42.

Such a thermal control device 1 for a computer
The operation of the computer 12 equipped with a zero and a heat control device will be described below to describe the computer heat control method of the present invention.

When the personal computer 12 is turned on and operated, and the processing of the MPU 18 is started, the MPU 18 generates heat. In particular, when the MPU 18 operates at a high speed, the amount of heat generated from the MPU 18 increases.

Since the heat pipe 24 is provided in contact with the MPU 18, most of the heat Q1 generated by the MPU 18 moves through the heat pipe 24. The amount of heat Q1 is based on the amount of heat Q2 moving to the heat spreader 32a based on the law of conservation of energy.
a and the amount of heat Q2b moving to the heat spreader 32b side
And divided into That is, the heat quantity Q1 is 20
And the vicinity 22 of the lower surface. Most of the heat quantity Q3a of the heat quantity Q2a moves to the heat spreader 32a, and most of the heat quantity Q3b of the heat quantity Q2b moves to the heat spreader 32b. Calorific value Q of calorific value Q3a
4a radiates heat from the heat spreader 32a and generates a heat quantity Q3.
The heat quantity Q4b out of b is radiated from the heat spreader 32b. The amount of heat Q4a heats the keyboard side of the upper surface of the computer 12, and the amount of heat Q4b heats the lower surface side of the computer 12.

Here, when the temperature of the lower surface side of the computer 12 is to be reduced by the heat quantity Q4b, for example, when the computer 12 is used on the knee, the volume switch 30 is turned on and the Peltier device 34a Is activated. When the Peltier element 34a is operated, the Peltier element 34a absorbs heat from the heat spreader 32a.
5a moves to the Peltier element 34a side, and the other heat quantity Q
4a is radiated to the surroundings. Here, Q3a = Q4a + Q
5a, Q3a increases by Q5a, and Q2a
Increase. Since Q1 = Q2a + Q2b, and Q1 is considered to be substantially constant, Q2b increases and Q2b
Is less. By reducing Q2b, the temperature on the lower surface side of the computer 12 is reduced. here,
By adjusting the value of the current flowing through the Peltier element 34a by the volume switch 30, Q5a is adjusted, and the temperature on the lower surface side of the computer 12 is adjusted.

The heat quantity Q6a of the heat quantity Q5a actually moves to the heat sink 36a through the Peltier element 34a and is accumulated, and the heat quantity Q7a of the heat quantity Q6a is radiated. Q4a and Q7a are naturally released to the outside of the computer 12, but are forcibly released by the rotation of the fan 38.

As described above, normally, the volume switch 30 is turned off and Q1 is changed to the heat spreader 32a.
Side and the heat spreader 32b side,
When it is desired to lower the temperature on the lower surface side of the computer 12, the volume switch 30 is turned on, Q2a is increased, and Q2b is reduced, so that discomfort such as knees is reduced. Further, the value of the current flowing through the Peltier element 34 a is adjusted by the volume switch 30, so that the temperature on the upper surface side or the lower surface side of the computer 12 is adjusted. For this reason, the discomfort given to the user can be eliminated. In addition, the user can select a portion where heat is generated.

Although the embodiments of the present invention have been described above, the embodiments of the present invention are not limited to these embodiments.

For example, one heat radiation means may be provided on the side of the computer 12. Further, the heat radiation means on the side surface of the computer 12 may be provided with a Peltier element and a heat sink. The fan 38 may be constantly rotated while the computer 12 is operating, or may be rotated when power is supplied to the Peltier device 34a.
Further, the timing at which the fan 38 is rotationally driven may be determined based on the total internal heat generation amount. The timing at which the fan 38 is driven to rotate may be controlled by the MPU 18.

Further, the thermal control device for a computer according to the present invention comprises a thermal control device 5 for a computer as shown in FIG.
It may be 0. Thermal control device 5 for this computer
No. 0 is also provided with a Peltier element 34b and a heat sink 36b on the heat spreader 32b side. Further, two not-shown volume switches (control means) corresponding to the respective Peltier elements 34a and 34b are provided. According to the heat control device 50 of the computer, the heat spreader 3 is controlled by the Peltier device 34a.
While heat can be absorbed from 2a and Q2a can be increased to reduce Q2b, while Peltier element 34b can absorb heat from heat spreader 32b to increase Q2b and reduce Q2a. Therefore, when it is used on a desk and the temperature of the keyboard on the top surface is to be lower than the temperature on the bottom surface of the computer 12, the amount of heat moving to the upper surface side of the computer 12 can be reduced.

The thermal control device for a computer according to the present invention has a thermal control device 5 for a computer as shown in FIG.
It may be 2. Thermal control device 5 for this computer
In No. 2, a Peltier element 34b and a heat sink 36b are provided only on the heat spreader 32b side. The thermal control device 52 of this computer is the computer 1
This is preferable when priority is given to lowering the temperature of the keyboard on the upper surface rather than the lower surface of 2.

The heat control device for a computer according to the present invention has a heat control device 5 for a computer as shown in FIG.
It may be four. Thermal control device 5 for this computer
In No. 4, two Peltier elements 34a and a heat sink 36a are provided on the heat spreader 32a side, and two Peltier elements 34b and a heat sink 36b are provided on the heat spreader 32b side. In addition, four not-shown volume switches (control means) corresponding to the Peltier elements 34a and 34b are provided. Further, the heat pipe 24 is configured to absorb heat from the PC card 56. According to such a thermal control device 54 of the computer, a portion for decreasing the temperature and a portion for increasing the temperature can be selected within the range of the upper surface of the computer 12 and the range of the lower surface of the computer 12.

The thermal control device for a computer according to the present invention comprises a thermal control device 5 for a computer as shown in FIG.
It may be eight. Thermal control device 5 for this computer
8, the heat spreader 32a is connected to the computer 12;
And is configured to transfer heat generated by the MPU 18 only to the upper surface side of the computer 12. Further, the Peltier device 34a and the heat sink 3
6a are provided. According to such a thermal control device 58 of the computer, it is possible to select a portion for decreasing the temperature and a portion for increasing the temperature within the range of the upper surface of the computer 12.

The computer thermal control device according to the present invention comprises a computer thermal control device 6 as shown in FIG.
It may be 0. Thermal control device 6 for this computer
0 indicates that the heat spreader 32b is connected to the computer 12
And the heat generated by the MPU 18 is moved only to the lower surface side of the computer 12. Further, the Peltier element 34b and the heat sink 3
6b are provided. According to the heat control device 60 of the computer, a portion for lowering the temperature and a portion for increasing the temperature can be selected within the range of the lower surface of the computer 12.

Although the embodiments of the present invention have been described with reference to the drawings, the present invention is not limited to the illustrated ones.

For example, the computer heat control device and the computer heat control method of the present invention may be used for computers other than the mobile type. Further, the part that absorbs heat by the heat control device of the computer of the present invention is MP
It is not limited to a U or PC card, but may be another part or component in a computer. The configuration, shape and dimensions of the Peltier device used as the thermo module device are not particularly limited. Further, a plurality of heat pipes may be provided, and heat generated from the MPU or the like may be transferred to a plurality of heat radiating means through the plurality of heat pipes. For example, heat generated from an MPU or the like is temporarily moved to a front side and a back side of a computer by a plurality of heat pipes,
The heat may be dissipated by heat dissipating means provided near the upper surface and lower surface on the front side of the computer and by heat dissipating means provided near the upper surface and lower surface on the back side of the computer. In addition, the material of the heat sink and the heat spreader is not particularly limited as long as it has a high heat absorption or heat radiation rate, such as copper or aluminum.

In addition, the technical scope of the present invention includes various modifications, modifications, and variations based on the knowledge of those skilled in the art without departing from the spirit of the invention. In addition, an invention in which one or more invention-specifying matters are replaced with other invention-specifying matters within a range in which a similar function or effect is generated is also included.

[0033]

According to the present invention, heat generated in a predetermined portion of a computer can be distributed to a plurality of predetermined positions. For example, it can be distributed to the upper surface side and the lower surface side of the computer. Therefore, it is possible to prevent heat generated in the computer from being concentrated on one place.

According to the present invention in which the amount of heat transferred to each heat radiating means is changed, the user himself can positively select or adjust the amount of heat transferred to each heat radiating means. For example, in the case of a notebook personal computer, when used on a desk, the amount of heat dissipated to the bottom can be maximized and the amount of heat dissipated to the keyboard can be reduced. Conversely, when used on the lap, the amount of heat radiation to the bottom surface can be reduced. Further, in a wearable personal computer, the amount of heat dissipated to the side surface can be increased so as not to cause discomfort to the body.

The use of a thermo-module element enables a compact construction. For example, as a thermo-module element used in the present invention, a Peltier element having a length of about 1 cm × a width of 1 cm × a thickness of 3 mm is used.
Even if it is used individually, the function of the present invention can be achieved, and it can be configured with the size of a current notebook personal computer. Further, for example, some Peltier elements can be purchased for several hundred yen, and the cost is rarely increased even if the present invention is configured. Although the power consumption increases by using the Peltier element, the Peltier element is always mounted on the heating element by separating it, and the heat generated from the heating element is temporarily moved to a heat spreader etc. to absorb the heat, so that the power is always supplied to the Peltier element. Need to be supplied. For this reason, unlike the related art, it is not necessary to constantly supply power to the Peltier device, and the user can select to turn on the power to the Peltier device. In addition, since the future development of the battery densification technology is expected, it is possible to prevent cost increase due to power consumption.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a computer heat control device of the present invention and a computer with a heat control device of the present invention.

FIG. 2 is a configuration diagram for explaining movement of heat quantity of a heat control device of the computer shown in FIG. 1;

FIG. 3 is a front sectional view showing a Peltier element used in the thermal control device of the computer shown in FIG. 1;

FIG. 4 is a block diagram showing another embodiment of the computer thermal control device of the present invention.

FIG. 5 is a configuration diagram showing still another embodiment of the computer thermal control device of the present invention.

FIG. 6 is a configuration diagram showing still another embodiment of the heat control device of the computer of the present invention.

FIG. 7 is a configuration diagram showing still another embodiment of the computer thermal control device of the present invention.

FIG. 8 is a configuration diagram showing still another embodiment of the computer thermal control device of the present invention.

FIG. 9 is a perspective view showing a conventional notebook personal computer.

[Explanation of symbols]

10, 50, 52, 54, 58, 60: Computer thermal controller 12: Notebook type personal computer (computer with thermal controller) 14: Main body 16: Lid 18: MPU 20: Near upper surface 22: Near lower surface 24: heat pipes 28a, 28b: heat radiating means 30: volume switch (control means) 31: substrate 32a, 32b: heat spreader (heat radiating member) 34a, 34b: Peltier element (thermo module element) 36a, 36b: heat sink 38: fan

Continued on the front page (72) Inventor Toshihiko Nishio 800 Miyake, Yasu-cho, Yasu-cho, Yasu-gun, Shiga Prefecture IBM Japan, Ltd. Yasu Office (56) References JP-A-9-199882 (JP, A) JP-A-62-111798 (JP, A) JP-A-2-87597 (JP, A) JP-A-11-17373 (JP, A) JP-A-8-236972 (JP, A) JP-A-10-151835 (JP, A) JP, A) JP-A 3-57989 (JP, U) JP-A 61-61894 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 7/20 G06F 1/20 H01L 23/38 H01L 23/427

Claims (16)

(57) [Claims] And 1. A one or a plurality of heat conducting means to transfer heat generated in the predetermined portion of the computer to a plurality of predetermined positions, a plurality of heat radiating means for releasing the heat at a predetermined position of the plurality of, the respective heat dissipation means A system that changes the amount of heat transferred
A thermal control device for a computer including
Heat generated in a given part of the computer
The amount of heat to be distributed and moved to multiple predetermined positions
A computer thermal control device that changes the temperature by the control means. 2. A computer generated on a predetermined portion of the computer.
Distributing heat to the upper and lower sides of the computer
In addition, the amount of heat transferred to the upper surface side and the lower surface side is controlled by the above-described method.
2. The computer thermal control of claim 1, wherein said control is varied by means . 3. A heat dissipating member, wherein at least one of the heat dissipating means is coupled to the heat conducting means such that heat can be transferred.
3. The heat control device for a computer according to claim 1, further comprising a controllable heat sink means for absorbing heat of the heat radiating member. 4. A thermo-module element, wherein said controllable heat sink means absorbs heat from said heat radiating member;
The heat control device for a computer according to claim 3, further comprising a heat sink that absorbs heat from the thermo module element. 5. The thermal control device for a computer according to claim 4, further comprising control means for adjusting an amount of heat absorbed from said heat radiating member to said thermo module element. 6. A plurality of said heat radiating means, at least
6. The heat control device for a computer according to claim 1, wherein one heat radiation means is arranged near an upper surface of a main body of the mobile personal computer, and another heat radiation means is arranged near a bottom surface of the main body. 7. The heat control device for a computer according to claim 1, further comprising a fan for discharging heat radiated from the heat radiating means to the outside of the computer. 8. A heat transfer step of transferring heat generated in a predetermined portion of the computer to a plurality of predetermined positions, and a conversion step of changing an amount of heat transferred to each of the predetermined positions .
Dissipating heat at each predetermined position.
A method of controlling the heat of a computer
When the heat generated in a predetermined part is distributed to a plurality of predetermined positions
In addition, the amount of heat to be moved to a plurality of predetermined positions is
A method of controlling the heat of a computer that varies depending on the temperature. 9. A computer generated on a predetermined portion of the computer.
Distributing heat to the upper and lower sides of the computer
In addition, the amount of heat transferred to the upper surface side and the lower surface side is converted
The method for controlling heat of a computer according to claim 8, wherein the method is changed by a step . 10. The heat control method for a computer according to claim 8, further comprising a heat absorption step of absorbing heat transferred by the heat transfer step to at least one predetermined position. 11. The heat control method for a computer according to claim 10, wherein the heat absorbing step is a step of absorbing heat transferred in the heat transfer step via a thermo-module element. 12. One or more heat conducting means for transferring heat generated in a predetermined portion of the computer to a plurality of predetermined positions, a plurality of heat radiating means for emitting heat at the plurality of predetermined positions, and a plurality of heat radiating means. Change the amount of heat transferred
A thermal control device with a computer equipped with a thermal control device and a control means, heat a plurality of predetermined caused in a predetermined portion
And move it to multiple predetermined positions.
A computer with a heat control device that changes the amount of heat by the control means . 13. The heat generated in the predetermined portion is transferred to the upper side and the lower side.
And move to the upper and lower sides
2. The method according to claim 1 , wherein the control unit changes the amount of heat to be applied.
2. The computer with a thermal control device described in 2. 14. At least one of the heat dissipating means included in the heat control device includes a heat dissipating member coupled to the heat conducting means for heat transfer, and a controllable heat absorbing member for absorbing the heat of the heat dissipating member. 14. The computer with a thermal control device according to claim 12, further comprising a heat sink means. 15. The controllable heat sink means:
15. The computer with a thermal control device according to claim 14, comprising: a thermo module element that absorbs heat from the heat radiating member; and a heat sink that absorbs heat from the thermo module element. 16. A mobile personal computer, wherein the heat control device includes a plurality of the heat conducting means and the heat radiating means, and at least one heat radiating means is disposed near an upper surface of the main body and a bottom surface of the main body. The computer with a heat control device according to claim 12, wherein another heat radiating means is arranged near the computer.