JP3183676U - Probe pin for semiconductor inspection - Google Patents

Abstract

A probe pin for semiconductor inspection that can stably and reliably conduct to a circuit board to be inspected.
A probe pin that is disposed in a connector 31 of an inspection apparatus and conducts an inspection circuit board 40 and a circuit board 40 to be inspected.
It consists of a probe 100, a spring 200 and a conducting wire 300,
The probe 100 includes a blanker 120 having a tip 121 that is in electrical contact with the circuit board to be inspected 40 and a barrel 110 on the side of the inspection circuit board 40. One end of the spring 200 is connected to the barrel 110 of the probe 100, the other end is connected to the inspection circuit board 40, and one end of the conductor 300 is electrically connected to the probe 100, and the other end is an inspection circuit of the inspection circuit board. Is connected to the circuit board 40 and pressed against the circuit board 40 to be inspected via a spring, thereby ensuring electrical conduction.
[Selection] Figure 3

Description

  The present invention relates to a semiconductor inspection probe pin, and more particularly to a semiconductor inspection probe pin for inspecting a circuit board.

  In semiconductor manufacturing, a connector is a circuit board inspection device often used, but a plurality of probe pins are accommodated in the connector. The arrangement positions of the probe pins correspond to the circuit pattern on the circuit board to be inspected by the connector. In many cases, the connector is disposed on an inspection machine base, and a circuit board to be inspected sandwiched by a jig is pressed onto probe pins. As a result, the probe pin is electrically connected to the circuit board to be inspected, and the circuit on the circuit board to be inspected is inspected for normal operation.

  Conventional probe pins often include a cylinder. The cylinder has two electrodes and a spring connected between the two electrodes. One electrode is fixed on the inspection machine table and is electrically connected to the inspection machine table. The other electrode is arranged so as to be movable in the cylinder and is used to conduct to the solder bump electrode on the circuit board to be inspected. When the circuit board to be inspected comes into contact with the probe pin, the spring is compressed and the movable electrode is pressed, so that the movable electrode and the circuit board to be inspected are pressed and come into contact with each other. In addition to the above method, there is also a method in which only one movable electrode is provided and a spring directly connects the electrode and the inspection machine base.

  Since the probe pin is a very small device and has a complicated structure, it is difficult to manufacture and assemble parts. In the conventional probe pin, the spring is used as a conduction device. However, an error during the manufacturing process appears as a contact failure of the probe pin, and there is a problem that the circuit board to be inspected and the inspection machine base cannot be conducted.

JP 2000-304824 A

An object of the present invention is to provide a probe pin for semiconductor inspection with stable conduction.

In order to achieve the above-described object, the present invention provides a probe pin for semiconductor inspection that solves these problems. The probe pin for semiconductor inspection according to the present invention is disposed in an inspection apparatus, used for conducting an inspection apparatus and a circuit board to be inspected, and includes a probe, a spring, and a conductor. The probe is a blanker that is used to connect both ends to the barrel and the circuit board under test, respectively. The spring has one end connected to the probe barrel and the other end connected to the test circuit board. The conducting wire is disposed along the spring and is used to electrically connect one end to the probe and to connect the other end to the test circuit board.

In the probe pin for semiconductor inspection of the present invention, the conducting stability of the spring can be enhanced by the conducting wire connecting the probe and the inspection circuit board. Therefore, unlike the prior art, since the probability of contact failure is low and the conduction stability is high, the disadvantages of the prior art can be effectively improved. The probe pin for semiconductor inspection according to the present invention has a simple structure and is easy to manufacture and assemble.

1 is an exploded perspective view showing a semiconductor inspection probe pin according to a first embodiment of the present invention. It is a perspective view which shows the probe pin for semiconductor inspection by the 1st Embodiment of this invention. It is sectional drawing which shows the arrangement | positioning state of the probe pin for semiconductor inspection by the 1st Embodiment of this invention. It is sectional drawing which shows the use condition of the probe pin for semiconductor inspection by the 1st Embodiment of this invention. It is sectional drawing which shows the probe pin for semiconductor inspection by the 2nd Embodiment of this invention.

Embodiments of the present invention will be described below with reference to the drawings.

Please refer to FIG. 1 and FIG. FIG. 1 is an exploded perspective view showing a semiconductor inspection probe pin according to a first embodiment of the present invention. FIG. 2 is a perspective view showing a probe pin for semiconductor inspection according to the first embodiment of the present invention. As shown in FIGS. 1 and 2, the semiconductor inspection probe pin of the present invention includes a probe 100, a spring 200, and a conductor 300.

The probe 100 is preferably made of metal. Both ends of the probe 100 are a barrel 110 and a blanker 120, respectively. Barrel 110 is used to connect spring 200. Blanker 12
0 has a distal end 121 used for electrical connection to the circuit board 40 to be inspected at the end. The tip 121 may be crown-cut or R-cut, but is not limited thereto. The probe 100 further includes a stopper 130 between the barrel 110 and the blanker 120. The stopper 130 is enlarged from the middle stage of the probe 100 to the outside from the side wall to form a step, but it is preferable that the diameter of the stopper 130 is increased in a ring shape to form a columnar shape. In the present embodiment, the stopper 130 is closer to the barrel 110, but is not limited thereto.

The spring 200 connects the probe 100 and the inspection circuit board 20. The spring 200 is preferably a coil spring in which a metal wire extends in an annular shape. Both ends of the spring 200 are a free end 210 and a fixed end 220, respectively. The outer diameter of the spring 200 is preferably smaller than the outer diameter of the free end 210. The fixed end 220 is gradually reduced in diameter so as to exhibit a conical shape. The free end 210 is fitted to the barrel 110 of the probe 100, but is preferably fitted to the side of the stopper 130 of the probe 100 closer to the probe 100.

The conducting wire 300 is preferably made of metal. The conducting wire 300 is provided in the extending direction along the spring 200. One end of the conducting wire 300 is disposed inside the free end 210 of the spring 200, passes through the spring 200, is connected to the stopper 130 of the probe 100, and is electrically connected to the probe 100. The other end of the conductive wire 300 extends along the inside of the spring 200 to the fixed end 220 of the spring 200.

Please refer to FIG. FIG. 3 is a cross-sectional view showing the arrangement state of the probe pins for semiconductor inspection according to the first embodiment of the present invention. As shown in FIG. 3, the probe pin for semiconductor inspection of the present invention is arranged in the inspection apparatus 10 in order to inspect the circuit board 40 to be inspected. A solder bump electrode 41 is provided on the circuit board 40 to be inspected. The inspection apparatus 10 includes an inspection circuit board 20 and probe pins 30 connected to the inspection circuit board 20. The inspection circuit board 20 is provided with an inspection circuit (not shown). A plurality of connectors 31 are arranged in a matrix in the probe pin 30 and drilled. One opening of the connector 31 is connected to the inspection circuit board 20 and corresponds to the inspection circuit. The semiconductor inspection probe pin of the present invention is housed in the connector 31. The opposite side of the barrel 110 is in contact with the inner edge of the connector 31 on the stopper 130 of the probe 100, and the fixed end 220 is in contact with the test circuit board 20. Thereby, the probe pin for semiconductor inspection of the present invention is fixed in the connector 31. In addition, since the conductive wire 300 solders the inspection circuit board 20 to one end of the fixed end 220 of the spring 200, the inspection circuit board 20 and the probe 100 are electrically connected.

Please refer to FIG. FIG. 4 is a sectional view showing a usage state of the semiconductor inspection probe pin according to the first embodiment of the present invention. As shown in FIG. 4, when inspecting the circuit board 40 to be inspected by the inspection apparatus 10, the circuit board 40 to be inspected moves toward the inspection apparatus 10, and the solder bump electrodes 41 on the circuit board 40 to be inspected are probed. Contact 100 blankers 120. It is preferable that the solder bump electrode 41 enters the front end portion 121 of the blanker 120, and the blanker 120 and the solder bump electrode 41 are reliably brought into contact with each other to be conducted. The pressing force between the circuit board under test 40 presses the blanker 120 against the circuit board under test 40, the probe 100 is pressed, and the blanker 120 is retracted into the connector 31. When the probe 100 is retracted, the stopper 130 presses the spring 200 and the spring 200 is compressed. As a result, the circuit board 40 to be inspected is reliably electrically connected to the inspection circuit, and the conduction state of the circuit board 40 to be inspected is inspected by the inspection circuit.

Please refer to FIG. FIG. 5 is a cross-sectional view illustrating a semiconductor inspection probe pin according to a second embodiment of the present invention. As shown in FIG. 5, the probe pin for semiconductor inspection of this embodiment includes a probe 100, a spring 200, and a conducting wire 300. However, since the structure is substantially the same as that of the first embodiment, only different parts will be described. To do. It is preferable that one end portion of the conducting wire 300 is connected to the free end 210 of the spring 200 in the axial direction. The other end of the conducting wire 300 extends to the fixed end 220 along the inside of the spring 200.

The probe pin for semiconductor inspection of the present invention has a simple structure and is easy to manufacture and assemble. Since the conducting wire 300 is surely conducted to the probe 100 and the inspection circuit board 20, the conduction stability of the spring is high. Since the electrical resistance of the conducting wire 300 is much smaller than that of the spring, it is possible to reduce the attenuation of signal transmission during inspection. As described above, unlike the conventional technique, the probe pin for semiconductor inspection according to the present invention is less likely to cause contact failure and has high conduction stability, so that the disadvantages of the conventional technique can be effectively improved.

  Although the present invention discloses preferred embodiments as described above, these are not intended to limit the present invention in any way, and anyone skilled in the art is within the spirit and scope of the present invention. Various changes and modifications can be made. Therefore, the scope of protection of the present invention is based on the contents specified in the claims of the utility model.

DESCRIPTION OF SYMBOLS 10 Inspection apparatus 20 Inspection circuit board 30 Probe pin 31 Connector 40 Circuit board to be inspected 41 Solder 100 Probe 110 Barrel 120 Blanker 121 Tip part 130 Stopper 200 Spring 210 Free end 220 Fixed end 300 Conductor

Claims (8)

A probe pin for semiconductor inspection which is disposed in an inspection apparatus including an inspection circuit board and is used for conducting the inspection apparatus and the circuit board to be inspected.
Both ends are barrels, and probes that are blankers that are electrically connected to the circuit board to be inspected at the time of inspection, and
A spring having one end connected to the barrel of the probe and the other end connected to the test circuit board;
A conductor disposed along the spring and having one end electrically connected to the probe and the other end conducting to the test circuit board;
A probe pin for semiconductor inspection, comprising: The probe pin for semiconductor inspection according to claim 1, wherein the conducting wire is disposed inside the spring. The both ends of the spring are a free end and a fixed end, respectively, the free end is connected to the barrel of the probe, and the fixed end is pressed and connected to the inspection circuit board. The probe pin for semiconductor inspection according to 1. The probe pin for semiconductor inspection according to claim 3, wherein the spring has an outer diameter of the fixed end smaller than an outer diameter of the free end. The probe pin for semiconductor inspection according to claim 3, wherein the spring has a reduced diameter at the fixed end. The probe pin for semiconductor inspection according to claim 3, wherein the free end of the spring is fitted into the barrel of the probe. The probe pin for semiconductor inspection according to claim 1, wherein the blanker has a tip portion used for electrical conduction to a circuit board to be inspected. The probe pin for semiconductor inspection according to claim 1, wherein the conducting wire is connected to the barrel of the probe.

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