JP3181203B2 - Plate work method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for plating a plate-like work such as a printed circuit board.

[0002]

2. Description of the Related Art The present applicant has already proposed a clamp and power supply mechanism for transporting a plating tank by clamping the lower edge of a vertical printed circuit board (Japanese Patent Laid-Open No. 5-31953).
No. 2 or JP-A-6-118060). FIG. 3 shows a main part of the former, that is, a cross section perpendicular to the traveling direction of the printed circuit board 1 in the plating tank. The printed circuit board 1 is, for example, a copper foil laminate of glass epoxy or phenol. The printed circuit board 1 rides on steps 3, 3a of a pair of clamp belts 2, 2a (the main body is a rubber-like elastic body), and
The power supply contact tongue pieces 5, 5a are elastically abutted from the outer peripheral surfaces 4, 4a through holes opened at intervals. Titanium metal belts 6, 6a integral with the tongue pieces 5, 5a are fixed to the inner surfaces of the clamp belts 2, 2a. 7, 7a are backup rails fixed to the tank, 8, 8a are tantalum corrugated fixed power supply contact bands, 9, 9a are power supply terminals, and 10 and 10a are backup rubbers. At least one of the clamp belts 2 and 2a is driven by being wound around a driving drum (not shown). Anodes are arranged on both left and right sides of the printed circuit board 1. On the printed circuit board 1 which has passed through the plating tank in the position shown in FIG. 3, no plating is applied to the portion sandwiched by the clamp belts 2 and 2a, and the backup rails 7 immediately above the printed circuit board 1
The portion which is shaded by 7a is poorly plated, and if exaggerated, the plating layer 11 becomes as shown in FIG. 4, and the area which cannot be used increases. Reference numeral 12 denotes a mask (shielding plate).

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a uniform plating layer over the entire surface of a plate-like work such as a printed circuit board.

[0004]

According to the first aspect of the present invention, the lower edge of a vertical plate-like work is clamped and passed through a first plating tank while energizing the plate-like work. This is a plating method for a plate-like work in which the work is turned upside down, the lower edge is similarly clamped, and the plate-like work is passed through a second plating tank while energizing to make the plating thickness of the entire plate-like work uniform. .

According to a second aspect of the present invention, the first and second plating tanks which clamp the lower edge portion of the vertical plate-like work and feed it while energizing, and the plate-like work after passing through the first plating tank are vertically moved. This is a plating apparatus for a plate-like work having a reversing conveyance mechanism for reversing and supplying the reversing to a second plating tank.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference numerals 14 and 15 in FIG. 1 denote first and second plating tanks, both of which are vertically transported with a lower end belt clamp.
Seal rolls 16, 16a, 17, 1 at the entrance and exit respectively
7a, and the inlet seal roll 1 of the first plating tank 14
From 6, a printed circuit board is supplied from the pretreatment zone in the direction of arrow A. Immediately after the outlet seal roll 17, a discharge roll (group) 18 is provided. The discharge roll 18 is composed of, for example, four pairs of rolls in which the main body is made of a rubber-like elastic body and pressed against each other, is supported by a fixed frame (not shown), and the printed circuit board slides on the lower rail surface of the frame.
The four rolls on the front side are driven by a chain (not shown) so as to have a speed equal to the transport speed in the plating tank 14.

Reference numeral 19 denotes a transfer roll (group) having substantially the same structure as the discharge roll 18, but capable of fast-forwarding, incorporating a clutch (slip mechanism) in a front drive roll, and allowing the printed board 1 to be mounted on the discharge roll 18. When it is detected that the reversing roll 20 has reached the standby position shown in the drawing, the printed circuit board in the delivery roll 19 is quickly moved to the reversing roll 20.
(Arrow B).

A frame 21 of the reversing roll 20 is supported by a support leg 24 of a traverser stand 23 via a shaft 22 parallel to the arrow B, and connected to a motor 27 via gears 25 and 26. Is detected to be turned 180 ° about the shaft 22 and immediately moved by another motor 20a in the direction of arrow C (lateral direction) on the rail 28.
Sent to the position. The frame 21 may be provided with a slit through which the printed board passes, or four pairs of roll groups may be arranged on one side of the frame 21. At the position 20a, the drive roll is reversed, and the printed circuit board is rapidly fed in the direction D and supplied from the transfer roll 29 to the insertion roll 30. The printed circuit board is transferred from the reversing roll at the position 20a to the transfer roll 29.
At the same time, the reversing roll 20a is returned to the position of 20 in the reverse C direction (reversed or as it is) to be in the standby posture. The transfer roll 29 also slips according to the pull-in speed of the insertion roll 30, and the printed circuit board passes through the second plating tank 15 in an inverted posture and is supplied to the post-processing zone indicated by the arrow E. As for the traverse mechanism in the direction of arrow C, Japanese Utility Model Laid-open No. Hei 6-2738 of the present applicant can be employed. Delivery roll 29, insertion roll 3
0, the second plating tank 15 is located behind the reversing roll 20 (FIG. 1).
On the left) may be linearly arranged in the direction of arrow B.

The printed circuit board is turned over and the second plating tank 1
5, a plating layer 11b (FIG. 2) having a thickness substantially equal to that of the thick portion 11a of FIG. 4 is obtained.

[0010]

According to the present invention, a plating layer having a uniform thickness can be obtained over the entire surface of a printed circuit board, thereby eliminating waste.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of the device.

FIG. 2 is a schematic cross-sectional view of a printed circuit board after plating.

FIG. 3 is a sectional view of a printed circuit board supporting portion.

FIG. 4 is a schematic cross-sectional view of a printed circuit board during plating.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 14 1st plating tank 15 2nd plating tank 20 Reversing roll

Claims (2)

(57) [Claims] 1. A lower edge portion of a vertical plate-like work is clamped and passed through a first plating tank while energizing the plate work, and the plate-like work after passing through the first plating tank is turned upside down. A plate-like work plating method in which the plate-like work is passed through a second plating bath while clamping and energizing, so that the plating thickness of the entire surface of the plate-like work is made uniform. 2. A first and a second plating tank which clamps a lower edge portion of a vertical plate-like work and feeds it while energizing, and a plate-like work after passing through the first plating tank is turned upside down to a second plating tank. A plate-type work plating apparatus having a reversing conveyance mechanism for supplying a plating tank to a plating tank.