JP3175854U - Heat dissipation structure - Google Patents
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- JP3175854U JP3175854U JP2012001377U JP2012001377U JP3175854U JP 3175854 U JP3175854 U JP 3175854U JP 2012001377 U JP2012001377 U JP 2012001377U JP 2012001377 U JP2012001377 U JP 2012001377U JP 3175854 U JP3175854 U JP 3175854U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/105—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being corrugated elements extending around the tubular elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
- F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【課題】熱伝導、熱対流及び熱放射のそれぞれ最大化可能な放熱体構造を提供する。
【解決手段】放熱構造体本体と発熱素子とを少なくも有する。本体が熱伝導に優れた材質からなり、連続的なS文字状に湾曲され、離間的に複数の第一放熱シートが設置され、第一放熱シートの両端に、それぞれ、第二放熱シートが連接され、第二放熱シートの両端に、それぞれ、それらの隣り合う第一放熱シートの相互に対応する端部が連接され、第二放熱シートに、それぞれ、少なくとも一つの貫通孔が形成される。本体の一端に発熱素子が連接されて、発熱素子から熱エネルギーが本体へ伝達される。
【選択図】図2Disclosed is a radiator structure capable of maximizing heat conduction, heat convection, and heat radiation.
At least a heat dissipating structure body and a heating element are provided. The main body is made of a material with excellent heat conduction, curved in a continuous S-shape, a plurality of first heat radiating sheets are installed at a distance, and the second heat radiating sheets are connected to both ends of the first heat radiating sheet, respectively. The ends of the second heat radiating sheet corresponding to each other of the adjacent first heat radiating sheets are connected to each other, and at least one through hole is formed in each of the second heat radiating sheets. A heating element is connected to one end of the main body, and heat energy is transmitted from the heating element to the main body.
[Selection] Figure 2
Description
本考案は、放熱体構造に関するものであり、さらに詳しくは、熱伝導、熱対流及び熱放射のすべてに優れた放熱構造を有する放熱体構造に関するものである。 The present invention relates to a radiator structure, and more particularly to a radiator structure having a heat dissipation structure excellent in all of heat conduction, heat convection and heat radiation.
自動車やバイク及び電子製品等は、稼動すると、高温が生じ、発生した高温が放熱されなければ、その稼動効率や安定性及び耐用寿命に悪影響を与え、温度が高ければ、その耐用寿命がより一層低下することがある。図1のように、従来の放熱構造は、放熱構造1で示すような形態であり、上記製品により生じた熱エネルギーは、熱伝導により、上記製品から上記放熱構造1へ伝導される。また、自然熱対流や熱放射により、熱エネルギーは、上記放熱構造1から、外部へ放熱されることにより、製品が、過熱による支障を防止することができる。 Automobiles, motorcycles, and electronic products generate high temperatures when they are in operation, and if the generated high temperatures are not dissipated, their operating efficiency, stability, and service life will be adversely affected. May decrease. As shown in FIG. 1, the conventional heat dissipation structure has a form as indicated by the heat dissipation structure 1, and heat energy generated by the product is conducted from the product to the heat dissipation structure 1 by heat conduction. Further, the heat energy is radiated from the heat dissipation structure 1 to the outside by natural heat convection or heat radiation, so that the product can be prevented from being troubled by overheating.
しかしながら、かかる製品を長時間使用すると、上記放熱構造1が、熱飽和になりやすく、熱エネルギーは、上記放熱構造1と製品との間に蓄積し、稼動効率や安定性及び耐用寿命に悪影響を与えるだけでなく、ユーザーが不意に製品を触るようなことがあると、火傷等を受ける恐れがある。 However, if such a product is used for a long time, the heat dissipation structure 1 is likely to be saturated with heat, and heat energy accumulates between the heat dissipation structure 1 and the product, which adversely affects operating efficiency, stability, and service life. In addition to giving, if the user touches the product unexpectedly, there is a risk of being burned.
また、一般の放熱構造1は、その熱飽和度を大きくするために、高密度且つ高熱伝達定数の金属材質を使用し、また、平面的なフィン2で、放熱面積を増加し、熱伝導性が良く、熱伝導率が高く、加工成形が容易等の利点があるが、その比重が大きくなると、電気絶縁性が悪くなり、加工過程において、汚染や生産効率が低下するという問題がある。また、放熱効果を向上させるために、上記放熱構造1に、ファン3にあわせて、強制的に熱対流を発生させることもできるが、その体積が大きくなり、コストも高くなるため、製品の競争力の低下を来たすという問題がある。
In addition, the general heat dissipation structure 1 uses a metal material having a high density and a high heat transfer constant in order to increase its thermal saturation, and the planar fin 2 increases the heat dissipation area, thereby increasing the thermal conductivity. However, when the specific gravity increases, there is a problem that the electrical insulation property is deteriorated and contamination and production efficiency are lowered in the processing process. In addition, in order to improve the heat dissipation effect, it is possible to forcibly generate heat convection in the heat dissipation structure 1 in accordance with the
従って、本考案の課題は、コストが低く、熱飽和度の高い、リスクの回避も可能であり、そして、熱伝導や熱対流及び熱放射のそれぞれ最大化可能な放熱効果が得られる放熱体構造を提供することにある。 Therefore, the problem of the present invention is a heat dissipation structure that is low in cost, has high thermal saturation, can avoid risks, and has a heat dissipation effect that can maximize heat conduction, heat convection, and heat radiation. Is to provide.
そこで本考案者は、上記の本考案の課題を解決するために鋭意検討を重ねた結果、後記の如く、高表面積化した材料を用い、熱伝導、熱対流及び熱放射をそれぞれ最大化した構成とすることにより、放熱効果を増加させ得ることに着目し、かかる知見に基づいて本考案に想到するに至った。 Therefore, as a result of intensive studies to solve the above-mentioned problems of the present invention, the present inventor has made use of a material having a high surface area as described below, and maximizes heat conduction, heat convection and heat radiation. By focusing on the fact that the heat dissipation effect can be increased, the present inventors have come up with the present invention based on such knowledge.
かくして、請求項1の考案によれば、
放熱構造本体と発熱素子とを少なくとも有する放熱体構造であって、
上記放熱構造本体が、熱伝導に優れた材質からなり、連続的なS文字状に湾曲され、離間的に複数の第一放熱シートが設置され、前記第一放熱シートの両端に、それぞれ、第二放熱シートが連接され、前記第二放熱シートの両端に、それぞれ、それらの隣り合う第一放熱シートの相互に対応する端部が連接され、前記第二放熱シートに、それぞれ、少なくとも一つの貫通孔が形成され、
上記発熱素子が、上記本体の一端に連接されて、上記発熱素子から、熱エネルギーが、上記本体へ伝達され、上記本体が外部に接触する放熱面積及び放熱距離を増加させる
ことを特徴とする放熱体構造が提供される。
Thus, according to the invention of claim 1,
A heat dissipation structure having at least a heat dissipation structure body and a heating element,
The heat dissipation structure body is made of a material excellent in heat conduction, is curved in a continuous S-shape, and a plurality of first heat dissipation sheets are spaced apart from each other. Two heat-dissipating sheets are connected to each other, and both ends of the second heat-dissipating sheet are connected to end portions corresponding to each other of the adjacent first heat-dissipating sheets. Holes are formed,
The heat generating element is connected to one end of the main body, and heat energy is transmitted from the heat generating element to the main body to increase a heat dissipating area and a heat dissipating distance with which the main body contacts the outside. A body structure is provided.
請求項2の考案によれば、上記本体の材質が、プラスチックに対し、アルミ、炭素及びセラミックから選ばれた少なくとも何れか一つが添加されるものであることを特徴とする請求項1に記載の放熱体構造が提供される。 According to the invention of claim 2, the material of the main body is one in which at least one selected from aluminum, carbon and ceramic is added to plastic. A radiator structure is provided.
請求項3の考案によれば、上記本体が、射出成形によって一体成形されることを特徴とする請求項1に記載の放熱体構造が提供される。
According to the invention of
本考案に係る放熱体構造は、上記の通りの構成からなるものであるが、熱伝導、熱対流及び熱放射がそれぞれ最大化可能となり、放熱効率及び装置の耐用寿命を向上させることができる。 The heat dissipating member structure according to the present invention is configured as described above. However, heat conduction, heat convection, and heat radiation can be maximized, and the heat dissipating efficiency and the service life of the apparatus can be improved.
以下、図面を参照しながら、本考案の特徴や技術内容について、詳しく説明するが、それらの図面等は、参考や説明のためであり、本考案は、それらによって限定されるものではない。 Hereinafter, the features and technical contents of the present invention will be described in detail with reference to the drawings. However, the drawings and the like are for reference and explanation, and the present invention is not limited thereto.
図2は、本考案の放熱体本体10であり、上記本体10は、熱伝導に優れた材質から、射出成形によって一体成形される。上記本体10の材質は、プラスチックに、アルミや炭素或いはセラミックから選ばれた少なくとも何れかの一つを添加したものである。上記本体10は、連続的なS文字状に湾曲され、上記本体10には、離間的に、複数の第一放熱シート11が設置され、また、それらの第一放熱シート11の両端に、それぞれ、第二放熱シート12が連接される。また、それらの第二放熱シート12の両端に、それぞれ、それらの隣り合う第一放熱シート11の相互に対応する端部が連接され、そして、それらの第二放熱シート12に、それぞれ、少なくとも一つの貫通孔121が形成される。
FIG. 2 shows a heat dissipating body
図3乃至図5は、本考案のより良い第一の実施態様を示すものである。まず、上記本体10と発熱素子を、接続させ、上記発熱素子に、灯具100を例とし、上記本体10の一端に設けてある第一放熱シート11で、上記灯具100の灯座101の周りを覆い、また、径方向に、離間的に、複数の第一放熱シート11が設置されている。それらの第一放熱シート11が、ほぼ同心円状になり、それらの第一放熱シート11の両端に、それぞれ、第二放熱シート12が連接される。それらの第二放熱シート12の両端に、それぞれ、それらの隣り合う第一放熱シート11の相互に対応する端部が連接され、それらの第二放熱シート12が、ほぼ同心リング状になり、上記灯具100が稼動されると、それらの灯具100により、一部の電気エネルギーを、熱エネルギーに転換する。そのため、上記灯具100の温度が、時効的に上昇し、上記灯具100による熱エネルギーが、上記本体10へ伝導され、上記によれば、有効に上記本体10と空気との接触する放熱経路や放熱面積が増大し、上記灯具100による熱エネルギーは、急速に、熱伝導や熱放射により、外部へ伝導される。
3 to 5 show a better first embodiment of the present invention. First, the
また、それらの第二放熱シート12が、リング状に、複数の貫通孔121が設けられるため、上記本体10内部にある高温の空気が、急速に、熱対流により、外部空気と交換でき、上記本体10の放熱効率が向上し、上記灯具100の温度を低下させ、上記灯具100は、過熱による支障を防止でき、また、上記灯具100耐用寿命が向上する。それから、上記本体10の放熱経路や放熱面積及び放熱効率により、ユーザーが、上記本体10のもう一端を触っても、火傷等のリスクがなく、ユーザーによる使用の安全性が向上する。また、上記本体により、上記灯具100の放熱効果が向上するため、上記灯具100の体積を低減でき、上記灯具100の使用パワーを増加できる。そして、本考案によれば、射出成形により一体成形されて、工程が簡単化でき、コストを低減でき、製品競争力を向上させることができる。
Further, since the second
図6と図7は、本考案のより良い第二の実施形態を示すものである。まず、上記本体10と発熱素子とを、接続させ、上記発熱素子に、CPU(Central Processing Unit)200を例とし、上記本体10の一端に設けてある上記第一放熱シート11を、上記CPU 200の頂面に設置する。また、縦方向に、離間的に、複数の第一放熱シート11が設置され、それらの第一放熱シート11の両端に、それぞれ、第二放熱シート12が連接され、また、それらの第二放熱シート12の両端に、それぞれ、それらの隣り合う第一放熱シート11の相互に対応する端部(相対応端)が連接され、それらの第二放熱シート12に、それぞれ、少なくとも一つの貫通孔121が形成される。上記本体10は、第一放熱シート11と第二放熱シート12により、熱エネルギーの放熱経路や放熱面積が増大し、そして、同時に、熱伝導や熱対流及び熱放射により、放熱効率が増加する。その結果、上記発熱素子の耐用寿命が向上し、また火傷等のリスクが回避される。そして、本考案によれば、射出成形により一体成形されて、工程が簡単化でき、コストを低減でき、製品競争力が向上するという効果も得ることができる。
6 and 7 show a better second embodiment of the present invention. First, the
以上は、本考案のより良い実施形態であり、本考案は、それによって限定されるものではなく、本考案に係わる実用新案登録請求の範囲や明細書の内容に基づいて行った等価の変更や修正は、全てが、本考案の範囲内に含まれる。 The above is a better embodiment of the present invention, and the present invention is not limited thereto.Equivalent changes made based on the scope of the claims of the utility model registration related to the present invention and the contents of the specification All modifications are included within the scope of the present invention.
1 放熱構造
10 本体
100 灯具
101 灯座
11 第一放熱シート
12 第二放熱シート
121 貫通孔
2 フィン
200 CPU
3 ファン
DESCRIPTION OF SYMBOLS 1
3 fans
Claims (3)
前記放熱構造本体が、熱伝導に優れた材質からなり、連続的なS文字状に湾曲され、離間的に複数の第一放熱シートが設置され、前記第一放熱シートの両端に、それぞれ、第二放熱シートが連接され、前記第二放熱シートの両端に、それぞれ、それらの隣り合う第一放熱シートの相互に対応する端部が連接され、前記第二放熱シートに、それぞれ、少なくとも一つの貫通孔が形成され、
前記発熱素子が、上記本体の一端に連接されて、上記発熱素子から、熱エネルギーが、上記本体へ伝達され、上記本体が外部に接触する放熱面積及び放熱距離を増加させる
ことを特徴とする放熱体構造。 A heat dissipation structure having at least a heat dissipation structure body and a heating element,
The heat dissipating structure body is made of a material excellent in heat conduction, is curved in a continuous S-shape, and a plurality of first heat dissipating sheets are installed in a spaced manner. Two heat-dissipating sheets are connected to each other, and both ends of the second heat-dissipating sheet are connected to end portions corresponding to each other of the adjacent first heat-dissipating sheets. Holes are formed,
The heat generating element is connected to one end of the main body, and heat energy is transmitted from the heat generating element to the main body to increase a heat dissipating area and a heat dissipating distance with which the main body contacts the outside. Body structure.
The heat dissipating member structure according to claim 1, wherein the main body is integrally formed by injection molding.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101201478U TWM431348U (en) | 2012-01-20 | 2012-01-20 | Heat dissipation body structure with thermal conduction, thermal convection and thermal radiation |
CN2012200562132U CN202632787U (en) | 2012-01-20 | 2012-02-21 | Radiator structure having functions of heat conduction, heat convection and heat radiation |
JP2012001377U JP3175854U (en) | 2012-01-20 | 2012-03-13 | Heat dissipation structure |
EP12002887.3A EP2657965A1 (en) | 2012-01-20 | 2012-04-24 | Heat disperser with heat transmission, heat convection and heat radiation function |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101201478U TWM431348U (en) | 2012-01-20 | 2012-01-20 | Heat dissipation body structure with thermal conduction, thermal convection and thermal radiation |
CN2012200562132U CN202632787U (en) | 2012-01-20 | 2012-02-21 | Radiator structure having functions of heat conduction, heat convection and heat radiation |
JP2012001377U JP3175854U (en) | 2012-01-20 | 2012-03-13 | Heat dissipation structure |
EP12002887.3A EP2657965A1 (en) | 2012-01-20 | 2012-04-24 | Heat disperser with heat transmission, heat convection and heat radiation function |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3175854U true JP3175854U (en) | 2012-06-07 |
Family
ID=67928533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012001377U Expired - Fee Related JP3175854U (en) | 2012-01-20 | 2012-03-13 | Heat dissipation structure |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2657965A1 (en) |
JP (1) | JP3175854U (en) |
CN (1) | CN202632787U (en) |
TW (1) | TWM431348U (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8780562B2 (en) * | 2012-07-20 | 2014-07-15 | Tai-Her Yang | Heat dissipater having heat conductive rib with interval forming as flow guide hole and applied in electric luminous body |
CN113554832A (en) * | 2020-04-24 | 2021-10-26 | 英研智能移动股份有限公司 | Doorbell subassembly and hanging seat |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6615910B1 (en) * | 2002-02-20 | 2003-09-09 | Delphi Technologies, Inc. | Advanced air cooled heat sink |
CN101368713B (en) * | 2007-08-17 | 2010-11-10 | 富准精密工业(深圳)有限公司 | Heat radiator |
-
2012
- 2012-01-20 TW TW101201478U patent/TWM431348U/en not_active IP Right Cessation
- 2012-02-21 CN CN2012200562132U patent/CN202632787U/en not_active Expired - Fee Related
- 2012-03-13 JP JP2012001377U patent/JP3175854U/en not_active Expired - Fee Related
- 2012-04-24 EP EP12002887.3A patent/EP2657965A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP2657965A1 (en) | 2013-10-30 |
CN202632787U (en) | 2012-12-26 |
TWM431348U (en) | 2012-06-11 |
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