JP3172289U - Fixing structure of heat sink device - Google Patents

Abstract

A fixing structure of a heat sink device for preventing occurrence of a thermal resistance phenomenon is provided.
A main body 1 and a plurality of fixing members 2 are provided. The main body includes a housing 11 including a first side plate 111, a second side plate 112, and a space formed therebetween, and the housing 11 is connected to the first and second side plates and is reinforced. A plurality of supports 113 and a capillary structure layer 114 on the inner surfaces of the first and second side plates, and the working fluid 3 is filled in the housing. On the outer surface of the main body 1, a plurality of connection portions 115 are provided correspondingly to the portion where the support 113 of the housing 11 is installed, and the fixing member 2 is fixedly connected.
[Selection] Figure 3

Description

The present invention is a fixing structure of a heat sink device, and in particular, when the fixing structure is installed, the main body of the heat sink is not destroyed, and leakage of the housing of the heat sink device is prevented and the heat conduction efficiency is prevented from being affected. The present invention relates to a fixing structure for a heat sink device.

  Current electronic equipment has become a major requirement to be lighter and thinner, and all the items of each item have been reduced in size, but they are generated with the operation of electronic equipment. Heat is a major obstacle to improving the performance of electronic equipment and systems. Even if the size of the electronic device semiconductor device is constantly reduced, there is still a demand for increased performance.

  As a result of the reduction in semiconductor dimensions, the heat flow rate increases and the increase in heat flow rate can exceed the capacity of product cooling and overheat over time, leading to electronic failure or damage.

  A thin flat type heat sink is an application of heat conduction between surfaces having a relatively large area, and is applied to a place where a space is relatively small, unlike a heat conduction method between points of a heat tube.

  The thin planar heat sink has a heat receiving surface, a condensing surface, and a vacuum housing filled with a working fluid, and has a plurality of support columns and a capillary structure in the vacuum housing. The vacuum housing is supported by connecting to a heat receiving surface and a condensing surface, a thin flat heat sink is attached to a heat source via the heat receiving surface, and a condensing surface on the other side of the thin flat heat sink is another heat sink device. The heat receiving surface of the working fluid absorbs the amount of heat and evaporates the working fluid to be converted into a gas, and the gaseous working fluid is condensed and converted into a liquid at the condensing surface. The liquid working fluid circulates to the heat receiving surface through the capillary structure inside the housing, and the working fluid conducts heat by forming a gas-liquid circulation in the housing.

The conventional technology uses a thin flat type heat sink coupled to a substrate on which a heat generating device is mounted, and conducts the amount of heat of the heat generating member on the substrate through the heat sink, but the conventional technology uses the housing of the thin flat type heat sink. The parts to be avoided, that is, the copper pillars having inner threads at the four corners of the thin flat type heat sink are installed through, and the substrate has at least one hole at the position where the copper pillars are installed in the thin flat type heat sink. Further, the thin planar heat sink is fixed on the substrate by simultaneously passing through the copper pillar and the hole via a screwing member. In this fixing method, the copper pillar is installed at the four corners of the thin planar heat sink. Therefore, the distance from the heat generating member is long, and even if the thin flat heat sink is fixed, the heat generating member cannot be bonded tightly and a heat resistance phenomenon occurs. In order to improve the problem that the bonding cannot be performed tightly, a supplier installs the copper pillar directly in the vicinity of the bonding portion of the thin flat heat sink and the heat generating member. Can penetrate the part having the housing, increase the tightness at the time of assembly, and prevent the occurrence of the thermal resistance phenomenon, but if the housing of the thin flat type heat sink is subjected to the penetration failure of the copper pillar, the airtightness If the inside of the housing does not have a vacuum state and the housing is broken through by the copper pillar, the flow path of the working fluid inside the housing may be hindered to cause a decrease in heat conduction efficiency. Furthermore, there is a possibility that leakage occurs and the heat conduction effect is lost in the thin flat type heat sink. Thus, the prior art has the following disadvantages:
1.
Thermal resistance phenomenon easily occurs.
2.
Low heat conduction efficiency.

JP 2001-147084 A JP 2001-74381 A

Therefore, in order to solve the above-mentioned drawbacks of the prior art, a main object of the present invention is to provide a fixing structure for a heat sink device that can improve the tightness of the combination and prevent the occurrence of a thermal resistance phenomenon.

  Another object of the present invention is to provide a fixing structure for a heat sink device that ensures vacuum tightness without destroying the heat sink device main body when the fixing member is installed.

In order to achieve the above object, the fixing structure of the heat sink device provided by the present invention comprises a main body and a plurality of fixing members.
The main body has a housing including a first side plate, a second side plate and a space formed between the first side plate, and a plurality of reinforcing members connected to the first and second side plates in the housing. Having a support, and having a capillary structure layer on the inner surfaces of the first and second side plates, filling the housing with a working fluid;
A plurality of connection portions are recessed in the outer surface of the main body corresponding to the portion where the support of the housing is installed.
The capillary structure layer adheres completely to the housing.

The fixing structure of the heat sink device of the present invention not only improves the tight bonding effect when combining the heat sink device and the object to be radiated, and prevents the occurrence of the thermal resistance phenomenon. Since the assembly of the main body does not penetrate or destroy the housing of the main body, the housing is still vacuum tight and does not leak into the working fluid inside. Therefore, the present invention has the following advantages.
1. Good degree of bonding and no thermal resistance phenomenon;
2. No leakage occurs;
3. Long service life.

It is a three-dimensional exploded view of the first embodiment of the fixing structure of the heat sink device of the present invention. It is a three-dimensional combination diagram of the first embodiment of the fixing structure of the heat sink device of the present invention. It is AA sectional drawing of 1st Example of the fixing structure of the heat sink apparatus of this invention. It is a three-dimensional view of the second embodiment of the fixing structure of the heat sink device of the present invention. It is a three-dimensional exploded view of a third embodiment of the fixing structure of the heat sink device of the present invention. It is a three-dimensional combination diagram of the third embodiment of the fixing structure of the heat sink device of the present invention. It is a three-dimensional exploded view of the fourth embodiment of the fixing structure of the heat sink device of the present invention. It is BB sectional drawing of 4th Example of the fixing structure of the heat sink apparatus of this invention.

  The above object of the present invention and the features of the structure and function thereof will be described based on preferred embodiments with drawings.

  Refer to FIGS. These are a three-dimensional exploded view, a three-dimensional combination view, and a cross-sectional view AA of the first embodiment of the fixing structure of the heat sink device of the present invention. As shown in the figure, the fixing structure of the heat sink device of the present invention is the main body. 1 and a plurality of fixing members 2.

The main body has a first side plate 111, a second side plate 112, and a housing 11 composed of a space formed therebetween. The housing 11 is connected to the first and second side plates. A plurality of supporting bodies 113 for reinforcement, and a capillary structure layer 114 on the inner surfaces of the first and second side plates, and the working fluid 3 is filled in the housing;
On the outer surface of the main body 1, a plurality of connection portions 115 are recessed corresponding to the portion where the support 113 of the housing 11 is installed.
The capillary structure layer 114 adheres completely to the housing 11.

The fixing member 2 has a hole 21 provided with an internal thread 22, and one end is connected to the connection portion 115 of the main body 1.

   The fixing member 2 is coupled to the main body by any one of welding, edge discharge, machining and ultrasonic bonding, and the machining may be any of stamping, boring and drilling, but is not limited thereto. is not.

  Please refer to FIG. FIG. 3 is a three-dimensional view of a second embodiment of the heat sink device fixing structure according to the present invention. As shown in FIG. However, the difference between the present embodiment and the first embodiment is that at least one heat receiving area 116 is provided outside the main body 1, and the heat receiving area 116 is close to the connecting portion 115.

  Please refer to FIG. 5 and FIG. FIG. 4 is a three-dimensional exploded view and combination diagram of a third embodiment of the heat sink device fixing structure according to the present invention. As shown in FIG. Although not described again, the difference between the present embodiment and the first embodiment is that the main body 1 is bonded corresponding to the substrate 4 on which the heating element is mounted, and the main body 1 is provided with at least one heat receiving area 116. Then, it contacts with at least one heat source 41 on the substrate 4, and a plurality of holes 42 are provided on the peripheral side of the heat source 41, and the holes 42 are opposed to the fixing member 2 by at least one lock member 5. The main body 1 and the substrate 4 are fixed through the hole 42 and the fixing member 2.

  The main body 1 is connected to the heat sink 6 on the side opposite to the heat receiving area 116.

Please refer to FIG. 7 and FIG. It is a three-dimensional exploded view and a sectional view of the fourth embodiment of the fixing structure of the heat sink device of the present invention. As shown in the figure, a part of the structure of this embodiment is the same as the first embodiment. Yes, although not described again here, the difference between the present embodiment and the first embodiment is that the main body 1 is composed of a first plate body 1a and a second plate body 1b, and these are joined to each other between them. It is to form the housing 11 by forming a space.

DESCRIPTION OF SYMBOLS 1 Main body 1a 1st board 1b 2nd board 11 Housing 111 1st side board 112 2nd side board 114 Capillary structure layer 115 Connection part 116 Heat receiving part 2 Fixing member 21 Hole 22 Inner thread 3 Working fluid 4 Board | substrate 41 Heat source 5 Locking member 6 Heat sink

Claims (11)

Consists of a main body and a plurality of fixing members,
The main body has a housing including a first side plate, a second side plate and a space formed between the first side plate, and a plurality of reinforcing members connected to the first and second side plates in the housing. A support body is provided, and a capillary structure layer is provided on the inner surfaces of the first and second side plates, and the working fluid is filled in the housing.
On the outer surface of the main body, a plurality of connection portions are provided correspondingly to the portion where the support of the housing is installed,
The fixing member has a fixing hole, and has a fixing structure for a heat sink device in which one end is connected to the connection portion of the main body.   The heat sink device according to claim 1, wherein an inner screw thread is provided in the hole of the fixing member. The heat sink device according to claim 1, wherein the capillary structure layer is completely attached to the housing. The heat sink device according to claim 1, wherein the fixing member is coupled to the main body by welding. The heat sink device according to claim 1, wherein the fixing member is coupled to the main body by edge discharge. The heat sink device according to claim 1, wherein the fixing member is coupled to the main body by ultrasonic bonding. The heat sink device according to claim 1, wherein the fixing member is coupled to the main body by machining. The main body is provided with a plurality of holes corresponding to the fixing member on the heat generating body side of the main body by projecting at least one heat receiving area on a substrate on which a heat generating body serving as a heat source is mounted. The heat sink device according to claim 1, wherein the heat sink device is fixed through the hole and a heat sink is connected to the opposite side of the heat receiving area of the main body. The heat sink device according to claim 8, further comprising a lock member penetrating the hole and the fixing member to fix the main body and the substrate. The heat sink device according to claim 1, wherein at least one heat receiving region is provided outside the main body, and the heat receiving region is disposed adjacent to the connection portion. 2. The heat sink device according to claim 1, wherein the main body further includes a first plate body and a second plate body, and the housing is configured by jointing them to form a space therebetween.

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