JP3171848U - Circuit board test jig pin structure - Google Patents

Abstract

To provide a pin structure of a test jig for a circuit board that uses a contact portion to increase a contact area of a pin, thereby improving test accuracy and success rate. A pin structure of a test jig for a circuit board includes a contact part 421, a coupling part 422, an elastic member 423, and a contact part 424. The coupling portion 422 includes a column body 4221 provided on the end surface of the contact portion 421, a stopper 4222 provided on the end portion of the column body 4221, and an extending portion 4223 provided on one surface of the stopper 4222. , Provided at the end of the pin 42. The elastic member 423 has a top end to which the extending portion 4223 is fitted. The contact portion 424 is provided at the bottom end of the elastic member 423. [Selection] Figure 7

Description

  The present invention relates to a pin structure of a test jig for a circuit board, and in particular, increases the accuracy and success rate of the test by increasing the contact area of the pin using the contact portion. Concerning structure.

  As shown in FIGS. 1 to 3, the conventional circuit board test jig structure includes at least a base 6, a general-purpose density board module 7, a probe plate 8, and pins 9. On the base 6, a measuring slot 62 used for inserting a plurality of plugs of each test apparatus is provided. A conductive wire 61 is connected to each measurement slot 62. The probe plate 8 includes a probe 81 having a plurality of tops, bottoms, and both sides used for measurement points on the circuit of the circuit board 5 to be measured. The general-purpose density substrate module 7 includes a first density substrate 71, a second density substrate 72, and a third density substrate 73. A large number of holes 711, 721, 731 communicating with each other are provided on the density substrates 71, 72, 73, and the contact portions 91 of the pins 9 and springs 92 are provided in the holes 721 of the second density substrate 72. And the contact part 93 is accommodated. The spring 92 is disposed between the contact portion 91 and the contact portion 93, and each conductor 61 is connected to each contact portion 93. Each abutting portion 91 is abutted against a hole 731 provided in the third density substrate 73 and is restrained in position. The hole 731 provided in the third density substrate 73 is smaller than the hole 721 provided in the second density substrate 72. With this configuration, the circuit board 5 to be measured is electrically connected to an external test apparatus via the probe 81, the spring 92, the conducting wire 61, and the measurement slot 62.

  However, each pin 9 is brought into contact with a hole 731 provided in the third density substrate 73 and is restrained in position. Since the portion 91 and the probe 81 are limited, the contact area cannot be increased, and the accuracy and success rate of the test may be lowered.

  Therefore, there has been a demand for a pin structure of a circuit board test jig having high test accuracy and success rate.

  An object of the present invention is to provide a pin structure of a test jig for a circuit board that uses a contact portion to increase the contact area of the pins, thereby improving test accuracy and success rate.

  In order to solve the above problems, according to a first embodiment of the present invention, there is provided a pin structure of a test jig for a circuit board, wherein the pin structure includes an abutment portion, a coupling portion, an elastic member, and a contact portion. The coupling portion has a column provided on an end surface of the contact portion, a stopper provided on an end of the column, and an extending portion provided on one surface of the stopper, A circuit board provided at an end portion of a pin, wherein the elastic member has a top end to which the extending portion is fitted, and the contact portion is provided at a bottom end of the elastic member. A test jig pin structure is provided.

  Further, a base, a density substrate module, a position restriction plate, and a probe plate module are further provided, and the density substrate module is disposed on a side portion of the base and stacked on each other, and a first density substrate, a second density substrate, and the like A third density substrate; a plurality of the pins are arranged in the second density substrate and the third density substrate; and the abutment portion of the pins is movable in the third density substrate. The coupling portion, the elastic member, and the contact portion are provided in the second density substrate, and the position restricting plate is disposed between the second density substrate and the third density substrate. Arranged, moving the position restricting plate to the side, positioning the pins using the coupling part, the probe plate module being arranged on the density substrate module, and on the third density substrate Body and, with the contact portion to the extending from the respectively connected first density substrate conductor, preferably has a probe that said pin and are abutting each disposed on the plate on the body.

  In addition, it is preferable that a large number of slots respectively connected to the conductive wires are provided on the base, and the first density substrate is provided with a large number of through holes through which the conductive wires are inserted.

  The second density substrate and the third density substrate are provided with a plurality of through holes corresponding to each other, and the coupling portion of the pin, the elastic member are provided in the through holes of the second density substrate. It is preferable that a member and the contact portion are respectively disposed, and the contact portion of the pin is movably inserted in the through hole of the third density substrate.

  Moreover, it is preferable that the said position control board is provided with many perforations which position-control the said pin corresponding to the said column.

  The pin structure of the test jig of the circuit board according to the present invention can increase the accuracy and success rate of the test by increasing the contact area of the pins using the contact portion.

FIG. 1 is an exploded perspective view of the prior art. FIG. 2 is a cross-sectional view of the prior art. FIG. 3 is a partially enlarged view of a portion A in FIG. FIG. 4 is an exploded perspective view showing a pin structure of a circuit board test jig according to an embodiment of the present invention. FIG. 5 is a perspective view showing a pin structure of a circuit board test jig according to an embodiment of the present invention. FIG. 6 is a cross-sectional view showing a pin structure of a circuit board test jig according to an embodiment of the present invention. FIG. 7 is a partially enlarged view of a portion B in FIG. FIG. 8 is a cross-sectional view showing another embodiment of the position restricting plate in the circuit board test jig of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited thereby.

  Reference is made to FIGS. As shown in FIGS. 4 to 6, the pin structure of the circuit board test jig according to the embodiment of the present invention includes at least a base 1, a density substrate module 2, a position regulating plate 3, and a probe plate module 4. .

  A large number of slots 11 are provided on the base 1.

  The density substrate module 2 includes a first density substrate 21, a second density substrate 22, and a third density substrate 23 that are arranged on the side portion of the base 1 and overlap each other. The density substrates 21, 22, 23 are provided with a plurality of through holes 211, 221, 231 corresponding to each other.

  The position regulating plate 3 is disposed between the second density substrate 22 and the third density substrate 23 and has a large number of perforations 31.

The probe plate module 4 is disposed on the density substrate module 2, is disposed in the plate body 41 disposed on the third density substrate 23, and the density substrates 22 and 23, and is position-constrained by the position restriction plate 3. Pins 42, connected to the bottom surfaces of the pins 42, extended to the first density substrate 21, connected to the slots 11, and brought into contact with the pins 42 and placed on the plate body 41. And a provided probe 44.
As shown in FIG. 7, each pin 42 includes an abutting portion 421, a coupling portion 422 provided at an end portion of the pin 42, an elastic member 423 having a top end abutting against the coupling portion 422, and an elastic member. And a contact portion 424 that is in contact with the bottom end of 423. Each coupling portion 422 includes a column body 4221 provided on the end surface of the contact portion 421, a stopper 4222 provided on the end portion of the column body 4221, and an extending portion 4223 provided on one surface of the stopper 4222. . An extending portion 4223 is fitted to the top end of each elastic member 423. The bottom end of the elastic member 423 is fitted to the top end of the contact portion 424, and the bottom end of the contact portion 424 is connected to the conductor 43. Each elastic member 423 is disposed in each through hole 221 of the second density substrate 22, and the conductive wire 43 is extended from each through hole 211 of the first density substrate 21, and each pin 42 is connected to the third density substrate 22. Each of the through holes 231 of the density substrate 23 is inserted into the through hole 231. The position is restricted by the perforations 31 of the position restricting plate 3. The position of the connecting portion 422 with the column body 4221 is constrained.

  When actually assembling the pin structure of the circuit board test jig of the present embodiment, the pins 42 are respectively inserted into the through holes 231 of the third density substrate 23 and coupled to the perforations 31 of the position regulating plate 3. The position regulating plate 3 is moved to the left side after the top portion of the elastic member 423 is fitted to the extending portion 4223 of the coupling portion 422 (see FIG. 7). The plate 3 is moved to the right side (see FIG. 8), the perforation 31 and the through-hole 231 are shifted so that the side part of the perforation 31 of the position regulating plate 3 is brought into contact with the column body 4221, and the position regulating plate is used using the stopper 4222. 3 to position the pin 42.

  In actual use, the circuit board 5 to be measured is fixed on the plate body 41 of the probe plate module 4, each probe 44 is brought into contact with the part to be tested on the circuit board 5 to be measured, and each pin 42 abuts. A test circuit is configured to send a signal from the unit 421 to a test apparatus (not shown) connected to the slot 11 via each elastic member 423 and the conductive wire 43. Each pin 42 of the present embodiment is positioned by the position restricting plate 3, and the contact area between the contact portion 421 of each pin 42 and the probe 44 is large, so the accuracy and success rate of the test of the circuit board 5 to be measured is high. .

  As can be seen from the above, the pin structure of the circuit board test jig of the present invention increases the test accuracy and success rate by increasing the contact area between the pin and the probe using the contact portion. Can do.

  The preferred embodiments of the present invention have been disclosed as described above so that those skilled in the art can understand them, but these do not limit the present invention in any way. Various changes and modifications can be made without departing from the spirit and scope of the present invention. Accordingly, the scope of the utility model registration claim of the present invention should be broadly interpreted including such changes and modifications.

DESCRIPTION OF SYMBOLS 1 Base 2 Density board module 3 Position control board 4 Probe plate module 5 Circuit board to be measured 6 Base 7 General-purpose density board module 8 Probe plate 9 Pin 11 Slot 21 1st density board 22 2nd density board 23 3rd density Substrate 31 Perforation 41 Plate body 42 Pin 43 Conductor 44 Probe 61 Conductor 62 Measurement slot 71 First density substrate 72 Second density substrate 73 Third density substrate 81 Probe 91 Contact portion 92 Spring 93 Contact portion 211 Through hole 221 Through-hole 231 Through-hole 421 Contact part 422 Coupling part 423 Elastic member 424 Contact part 711 Hole part 721 Hole part 731 Hole part 4221 Column body 4222 Stopper 4223 Extending part

Claims (5)

A circuit board test jig pin structure,
The pin structure includes a contact portion, a coupling portion, an elastic member, and a contact portion,
The coupling portion includes a column provided on an end surface of the contact portion, a stopper provided on an end of the column, and an extending portion provided on one surface of the stopper, Provided at the end,
The elastic member has a top end to which the extending portion is fitted;
A pin structure for a circuit board test jig, wherein the contact portion is provided at a bottom end of the elastic member. A base, a density substrate module, a position regulating plate, and a probe plate module;
The density substrate module includes a first density substrate, a second density substrate, and a third density substrate that are disposed on a side portion of the base and stacked on each other, and the second density substrate and the third density substrate. A large number of the pins are arranged in the density substrate, and the abutting portions of the pins are movably arranged in the third density substrate, and the coupling portion and the elastic member are arranged in the second density substrate. And the contact portion is provided,
The position restricting plate is disposed between the second density substrate and the third density substrate, the position restricting plate is moved to a side portion, and the pins are respectively positioned using the coupling portion;
The probe plate module is disposed on the density substrate module, the plate body on the third density substrate, a conductive wire connected to the contact portion and extended from the first density substrate, the pin, The pin structure of the circuit board test jig according to claim 1, further comprising a probe that is in contact with each other and disposed on the plate. A number of slots each connected to the conductor are provided on the base;
3. The circuit board test jig pin structure according to claim 2, wherein the first density substrate is provided with a plurality of through holes through which the conductive wires are inserted. A plurality of through holes corresponding to each other are provided in the second density substrate and the third density substrate,
The coupling portion, the elastic member, and the contact portion of the pin are respectively disposed in the through holes of the second density substrate,
The circuit board test jig pin structure according to claim 2, wherein the contact portions of the pins are movably inserted into the through holes of the third density substrate.   The pin structure of the circuit board test jig according to claim 2, wherein the position restricting plate is provided with a plurality of perforations for restricting the position of the pins corresponding to the pillars.