JP3169771U - Jet housing - Google Patents
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- JP3169771U JP3169771U JP2011002481U JP2011002481U JP3169771U JP 3169771 U JP3169771 U JP 3169771U JP 2011002481 U JP2011002481 U JP 2011002481U JP 2011002481 U JP2011002481 U JP 2011002481U JP 3169771 U JP3169771 U JP 3169771U
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- jet
- transport tank
- electroplating
- anode plate
- jet housing
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Abstract
【課題】不溶性陽極板を噴流ハウジングに内設することによって、噴流ハウジングからスプレーする電気メッキ液体は、不溶性陽極板に阻害されることなく、電気メッキ液体を電気メッキの工作物表面へ均一にスプレーできるほか、電気メッキの工作物が不溶性陽極板に接触して短絡することを避けることができる噴流ハウジングを提供する。【解決手段】輸送槽２と不溶性陽極板３とを備える。輸送槽の片側に噴流ハウジング２６を設け、噴流ハウジングの表面は、複数の固定部２６１を凸設し、かつ隣接する固定部の間に固定空間が形成していて、各固定部の表面は、電気メッキ液体を噴射する噴流口が設けられている。不溶性陽極板にフレーム３１を設置し、フレームは輸送槽の片側に固定していて、かつ陽極をフレームに内設し、陽極は、噴流ハウジングの固定空間内部に位置する。【選択図】図３By disposing an insoluble anode plate in a jet housing, the electroplating liquid sprayed from the jet housing is sprayed uniformly on the surface of the electroplating workpiece without being obstructed by the insoluble anode plate. In addition, a jet housing is provided in which the electroplated workpiece can be prevented from contacting and shorting the insoluble anode plate. A transport tank 2 and an insoluble anode plate 3 are provided. A jet housing 26 is provided on one side of the transport tank, the surface of the jet housing has a plurality of fixing portions 261 protruding, and a fixing space is formed between adjacent fixing portions, and the surface of each fixing portion is A jet is provided for injecting the electroplating liquid. A frame 31 is installed on the insoluble anode plate, the frame is fixed to one side of the transport tank, and the anode is installed in the frame. The anode is located inside the fixed space of the jet housing. [Selection] Figure 3
Description
本考案は噴流ハウジングに関し、特に電気メッキ設備に適用すれば、電気メッキを均一にスプレーすることができる、短絡問題を防止できる噴流ハウジングに関する。 The present invention relates to a jet housing, and more particularly to a jet housing that can spray electroplating uniformly and can prevent a short circuit problem when applied to an electroplating facility.
通常の電気メッキ槽は、不溶性陽極板によって電気メッキ反応を引き起し、電気メッキの工作物は、電気メッキ槽に設置した２つの輸送槽の間を通過したとき、電気メッキの工作物は、輸送槽からスプレーする電気メッキ液体を利用し、並びに電気メッキの工作物と輸送槽との間に設置する不溶性陽極板によって反応作用を引き起し、電気メッキの工作物の表面にメッキ層が得られる。 A normal electroplating tank causes an electroplating reaction by an insoluble anode plate, and when the electroplating workpiece passes between two transport tanks installed in the electroplating tank, the electroplating workpiece is The electroplating liquid sprayed from the transport tank is used, and the reaction action is caused by the insoluble anode plate installed between the electroplating workpiece and the transport tank, and a plating layer is obtained on the surface of the electroplating workpiece. It is done.
しかし、輸送槽からスプレーした電気メッキ液体は、不溶性陽極板を介して、電気メッキの工作物表面にスプレーされる。よって、不溶性陽極板は、スプレーする電気メッキ液体は輸送槽に阻害されて、電気メッキ液体は電気メッキの工作物表面へ均一にスプレーすることはできなく、メッキ層がはっきりしないまたは焼付けが引き起こしやすい。さらに、電気メッキの工作物は、電気メッキ液体がスプレーすると揺れが発生し、不溶性陽極板に接触して短絡を引き起し、電気メッキ作業を順調に行うことはできない。 However, the electroplating liquid sprayed from the transport tank is sprayed onto the surface of the electroplating workpiece via the insoluble anode plate. Therefore, the insoluble anode plate is obstructed by the transport tank for the electroplating liquid to be sprayed, and the electroplating liquid cannot be uniformly sprayed on the surface of the electroplating workpiece, and the plating layer is not clear or is likely to cause baking. . Furthermore, electroplating workpieces sway when the electroplating liquid is sprayed, contact the insoluble anode plate and cause a short circuit, and the electroplating operation cannot be performed smoothly.
本考案の主な目的は、不溶性陽極板を噴流ハウジングに内設することによって、噴流ハウジングからスプレーする電気メッキ液体は、不溶性陽極板に阻害されることなく、電気メッキ液体を電気メッキの工作物表面へ均一にスプレーできるほか、電気メッキの工作物が不溶性陽極板に接触して短絡することを避けることができる。 The main object of the present invention is to install the insoluble anode plate in the jet housing, so that the electroplating liquid sprayed from the jet housing is not obstructed by the insoluble anode plate, and the electroplating liquid is electroplated workpiece. In addition to being able to spray evenly on the surface, it is possible to avoid shorting the electroplated work piece against the insoluble anode plate.
前記目的を達成するため、本考案は、輸送槽と不溶性陽極板とを備える。輸送槽の片側に噴流ハウジングを設け、噴流ハウジングの表面は、複数の固定部を凸設し、かつ隣接する固定部の間に固定空間が形成していて、各固定部の表面は、電気メッキ液体を噴射する噴流口が設けられている。不溶性陽極板にフレームを設置し、フレームは、輸送槽の片側に固定していて、かつフレームに陽極を内設し、陽極は、噴流ハウジングの固定空間内部に位置する。 In order to achieve the above object, the present invention includes a transport tank and an insoluble anode plate. A jet housing is provided on one side of the transport tank, and the surface of the jet housing has a plurality of fixing portions projecting, and a fixing space is formed between adjacent fixing portions, and the surface of each fixing portion is electroplated. A jet port for ejecting liquid is provided. A frame is installed on the insoluble anode plate, the frame is fixed to one side of the transport tank, and the anode is installed in the frame. The anode is located inside the fixed space of the jet housing.
以下、添付図面を参照して本考案の実施の形態を詳細に説明する。 Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
図１ないし７を参照する。本考案は、輸送槽２と不溶性陽極板３と、を備える。そのうち、 Reference is made to FIGS. The present invention includes a transport tank 2 and an insoluble anode plate 3. Of which
輸送槽２の中間部は、複数の隣接する噴流溝２３が間隔を置き設けられている。さらに、輸送槽２の片側は、管路２１を輸送槽２の底部に延設し、管継ぎ手２２に連絡する。各噴流溝２３の壁面は、輸送槽２外部の溢流管２５と連絡する溢流穴２４を設け、輸送槽２の他端は、噴流ハウジング２６を設ける。噴流ハウジング２６の表面は、複数の固定部２６１を凸設していて、かつ隣接する固定部２６１の間は、固定空間２６２を形成し、固定部２６１の表面に噴流口２６３を設ける。噴流口２６３は、噴流溝２３に連絡する。噴流溝２３と管路２１との間は、噴流溝２３と管路２１に連絡する絞り穴２７を設ける。絞り穴２７は、対向する場所にねじ込み穴２８を設け、ねじ込み穴２８は、輸送槽２の外側に穿設し、絞り栓２９によって、ねじ込み接続して置き、絞り栓２９の一端に備える当て駒２９１を利用し、絞り穴２７との間の開度を調節する。 The intermediate part of the transport tank 2 is provided with a plurality of adjacent jet grooves 23 at intervals. Further, on one side of the transport tank 2, a pipe line 21 extends to the bottom of the transport tank 2 and communicates with the pipe joint 22. The wall surface of each jet groove 23 is provided with an overflow hole 24 communicating with the overflow pipe 25 outside the transport tank 2, and a jet housing 26 is provided at the other end of the transport tank 2. The surface of the jet housing 26 has a plurality of fixed portions 261 projecting, and a fixed space 262 is formed between adjacent fixed portions 261, and a jet port 263 is provided on the surface of the fixed portion 261. The jet port 263 communicates with the jet groove 23. A throttle hole 27 that communicates with the jet groove 23 and the pipe 21 is provided between the jet groove 23 and the pipe 21. The throttle hole 27 is provided with a screw hole 28 at an opposite position. The screw hole 28 is formed outside the transport tank 2 and is screwed and connected by a throttle plug 29 and is provided at one end of the throttle plug 29. 291 is used to adjust the opening degree between the throttle hole 27.
不溶性陽極板３は、フレーム３１を設けられている。フレーム３１は、輸送槽２の片側に固定していて、かつフレーム３１に正極３２を設けられており、正極３２は、噴流ハウジング２６の固定空間２６２内部に位置する。 The insoluble anode plate 3 is provided with a frame 31. The frame 31 is fixed to one side of the transport tank 2, and the positive electrode 32 is provided on the frame 31, and the positive electrode 32 is located inside the fixed space 262 of the jet housing 26.
引き続き図４，５及び図７ないし９を参照する。図からわかるように、本考案を使用するとき、輸送槽２を電気メッキ槽１の両側（図９に示す）設置して置き、電気メッキの工作物４は、固定具５によって挟み込み、電気メッキ槽１に備える２つの輸送槽２の間に取り付けて置き、電気メッキ作業で使用する電気メッキ液体は、管継ぎ手２２によって管路２１に連絡し、かつ絞り穴２７を介して各噴流溝２３の内部に進入し、噴流溝２３に引き続き進入する電気メッキ液体の圧力を利用し、噴流口２６３より噴出することによって、電気メッキの工作物４の表面に最大、かつ均一なスプレー圧力が得られ、電気メッキ面積の不均衡により、電気メッキの工作物４の焼付けを避けることができる。さらに、本考案の輸送槽２は直立態様で設置し、管路２１の下部から上部へ流れる電気メッキ液体は、各噴流溝２３間に不均衡な圧力差を引き起こす。このときは、絞り栓２９の当て駒２９１を利用し、絞り穴２７との開度を調節し流量を制御する。各噴流溝２３の内圧をそれぞれ調節し、スプレーの流量を制御する。そこで、噴流溝２３の電気メッキ液体の圧力が所定の臨界値に等しくまたは超えるとき、噴流溝２３にある電気メッキ液体は、溢流穴２４を経由し、溢流管２５を介して外部の一時保存タンク（図示しない）に保存するとともに、消費された金属イオンを適時に補充し、電気メッキ液体の濃度を維持する。 Continuing to refer to FIGS. As can be seen, when using the present invention, the transport tank 2 is placed on both sides of the electroplating tank 1 (shown in FIG. 9) and the electroplating workpiece 4 is sandwiched by the fixture 5 and electroplated. The electroplating liquid that is attached between the two transport tanks 2 provided in the tank 1 and used in the electroplating operation is connected to the pipe line 21 by the pipe joint 22 and is formed in each jet groove 23 through the throttle hole 27. The maximum and uniform spray pressure is obtained on the surface of the electroplating workpiece 4 by using the pressure of the electroplating liquid that enters the inside and continues to enter the jet groove 23 and is ejected from the jet port 263. Due to the imbalance of the electroplating area, baking of the electroplated workpiece 4 can be avoided. Furthermore, the transport tank 2 of the present invention is installed in an upright manner, and the electroplating liquid flowing from the lower part to the upper part of the pipe line 21 causes an unbalanced pressure difference between the jet grooves 23. At this time, the contact piece 291 of the throttle plug 29 is used to adjust the opening with the throttle hole 27 to control the flow rate. The internal pressure of each jet groove 23 is adjusted to control the flow rate of the spray. Therefore, when the pressure of the electroplating liquid in the jet groove 23 is equal to or exceeds a predetermined critical value, the electroplating liquid in the jet groove 23 passes through the overflow hole 24 and passes through the overflow pipe 25 to the outside temporarily. While being stored in a storage tank (not shown), the consumed metal ions are replenished in a timely manner to maintain the concentration of the electroplating liquid.
よって、本考案は、公知技術の不足と欠点を解決できる主な技術は、本考案は噴流ハウジング２６の表面に複数の固定部２６１を凸設していて、隣接する固定部２６１の間に固定空間２６２を形成し、不溶性陽極板３の正極３２は、固定部２６１の表面に露出することなく、を固定空間２６２に固定することができる。従って、噴流ハウジング２６の噴流口２６３は、電気メッキ液体をスプレーするとき、正極３２に阻害を受けないため、より均一に電気メッキの工作物４にスプレーすることができる。さらに、正極３２は固定部２６１の表面から露出しないため、電気メッキの工作物４が正極３２に接触することによる短絡問題を発生しない、電気メッキ作業の順調をより確保できる。 Therefore, the present invention can solve the shortcomings and disadvantages of the known technology. The present invention has a plurality of fixing portions 261 provided on the surface of the jet housing 26 and is fixed between the adjacent fixing portions 261. The space 262 is formed, and the positive electrode 32 of the insoluble anode plate 3 can be fixed to the fixed space 262 without being exposed to the surface of the fixing portion 261. Accordingly, the jet port 263 of the jet housing 26 is not obstructed by the positive electrode 32 when spraying the electroplating liquid, so that the electroplating workpiece 4 can be sprayed more uniformly. Furthermore, since the positive electrode 32 is not exposed from the surface of the fixing portion 261, the electroplating work can be more smoothly performed without causing a short circuit problem due to the electroplating workpiece 4 coming into contact with the positive electrode 32.
１ 電気メッキ槽
２ 輸送槽
２１ 管路
２２ 管継ぎ手
２３ 噴流溝
２４ 溢流穴
２５ 溢流管
２６ 噴流ハウジング
２６１ 固定部
２６２ 固定空間
２６３ 噴流口
２７ 絞り穴
２８ ねじ込み穴
２９ 絞り栓
２９１ 当て駒
３ 不溶性陽極板
３１ フレーム
３２ 正極
４ メッキ工作物
５ 固定具
DESCRIPTION OF SYMBOLS 1 Electroplating tank 2 Transport tank 21 Pipe line 22 Pipe joint 23 Jet groove 24 Overflow hole 25 Overflow pipe 26 Jet housing 261 Fixed part 262 Fixed space 263 Jet port 27 Restriction hole 28 Screw hole 29 Restriction plug 291 Applying piece 3 Insoluble Anode plate 31 Frame 32 Positive electrode 4 Plating work 5 Fixing tool
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011002481U JP3169771U (en) | 2011-05-06 | 2011-05-06 | Jet housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011002481U JP3169771U (en) | 2011-05-06 | 2011-05-06 | Jet housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3169771U true JP3169771U (en) | 2011-08-18 |
Family
ID=54880579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011002481U Expired - Fee Related JP3169771U (en) | 2011-05-06 | 2011-05-06 | Jet housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3169771U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150104823A (en) * | 2014-03-06 | 2015-09-16 | 삼성전기주식회사 | Plating apparatus |
-
2011
- 2011-05-06 JP JP2011002481U patent/JP3169771U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150104823A (en) * | 2014-03-06 | 2015-09-16 | 삼성전기주식회사 | Plating apparatus |
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