JP3169368U - Heat dissipation device - Google Patents

Abstract

Disclosed is a heat dissipation device that is installed on a heat dissipation target and absorbs heat from the heat dissipation target, and further increases the heat dissipation efficiency. A heat dissipation device having a refrigerant circulation circuit, wherein the circulation circuit directly communicates with a pair of upper and lower refrigerant tanks formed in a straight pipe shape and the pair of upper and lower refrigerant tanks; A heat exchange unit comprising a plurality of heat radiation pipes extending obliquely in the vertical direction and a plurality of heat radiation fins attached to the plurality of heat radiation pipes, and an upper refrigerant disposed above the pair of upper and lower refrigerant tanks A heat absorption pipe that extends from the tank to a lower refrigerant tank disposed below to communicate the two refrigerant tanks and that extends at least partially obliquely in the vertical direction, Provided is a heat dissipation device. [Selection] Figure 3

Description

 The present invention relates to a heat radiating device, and more particularly, to a heat radiating device that is installed on a heat radiating target and absorbs heat generated by the heat radiating target to diverge.

 FIG. 1 is a perspective view of an example of a conventional heat radiating device disclosed in Patent Document 1.

 As shown in the drawing, the heat radiating device includes a pair of refrigerant tanks 10 that are formed in a straight pipe shape and arranged vertically, and the pair of refrigerant tanks 10 arranged between the pair of refrigerant tanks 10. 10 and a heat exchange unit comprising a plurality of heat radiation pipes 11 extending horizontally and a plurality of heat radiation fins 12 attached to the plurality of heat radiation pipes 11, and one of the heat exchange units The heat exchange unit extends on the side so as to be parallel to the plurality of heat radiating pipes 11, and both ends are bent to communicate with either one of the pair of refrigerant tanks 10. The outer surface on the opposite side has a heat absorption pipe 21 that is a heat absorption surface 20 that contacts the heat dissipation object 100. Thereby, the circulation circuit 2 which can guide the refrigerant | coolant which does not usually have a fixed flow direction is comprised.

 However, in this conventional heat dissipating device, the heat dissipating pipe 11 and the heat absorbing pipe 21 occupying most of the refrigerant circulation circuit 2 are all extending horizontally, and the vaporized refrigerant can rise by absorbing heat from the heat dissipating object 100. There is only the refrigerant tank 10, and the configuration for guiding the flow of the refrigerant is insufficient.

Taiwan New Patent No. M379748 Specification

 In view of the above problems, an object of the present invention is to provide a heat dissipating device that further enhances heat dissipating efficiency by smoothly guiding the flow of refrigerant.

 In order to achieve the above object, the present invention is a heat dissipation device having a refrigerant circulation circuit, wherein the circulation circuit directly connects a pair of upper and lower refrigerant tanks formed in a straight pipe shape and the pair of upper and lower refrigerant tanks. Between the heat exchange unit consisting of a plurality of heat radiation pipes extending in a vertical direction and a plurality of heat radiation fins attached to the plurality of heat radiation pipes, and the pair of upper and lower refrigerant tanks. An endothermic pipe extending from an upper refrigerant tank disposed above to a lower refrigerant tank disposed below to communicate the two refrigerant tanks and at least a portion extending obliquely in the vertical direction; A heat dissipating device is provided.

 In the heat dissipation device, it is preferable that the lower refrigerant tank is arranged so as to extend along a vertical direction, and the upper refrigerant tank is arranged obliquely so that an upper end is inclined toward the lower refrigerant tank. .

 In the above heat dissipating device, the heat absorbing pipe has a plurality of endothermic pipes, and the endothermic pipes are arranged along the vertical direction, and at least a part of each endothermic pipe has an elongated hollow cross section on the outer surface. It is preferable that an endothermic surface that can be brought into contact with the heat dissipation target is formed.

 The heat dissipating device has a first pipe part and a second pipe part that communicate with each other, and each first pipe part communicates with the upper refrigerant tank, and The second pipe portion communicates with the lower refrigerant tank, extends along the horizontal direction, has an elongated hollow cross section, and is subject to heat radiation on the outer surface. An endothermic surface that can be brought into contact with the substrate is formed.

 The heat dissipating device has a first tube portion, a second tube portion, and a third tube portion in which each of the heat absorption pipes communicates with each other, and each first tube portion has one end thereof. The second pipe portion communicates with the upper refrigerant tank and extends obliquely in the vertical direction. One end of each second pipe portion communicates with the lower refrigerant tank and is parallel to the first pipe portion in a horizontal plane. And a heat absorbing surface that has an elongated hollow cross section and can be brought into contact with the heat dissipation object on the outer surface, and each third tube portion has both ends at each end. It can also comprise so that the other end of the said 1st pipe part and the other end of the said 2nd pipe part may be connected.

 Further, the heat dissipation device has a first tube portion, a second tube portion, and a third tube portion in which each of the heat absorption pipes is in communication with each other. One end communicates with the upper refrigerant tank and extends obliquely in the up-down direction, and each second pipe portion communicates with the lower refrigerant tank at one end and is separated from the upper refrigerant tank along the horizontal direction. Each third pipe portion extends horizontally from the other end of the first pipe portion so as to pass through the vicinity of the lower refrigerant tank, and then is folded back to the second pipe portion. It is also possible to have a heat absorbing surface that is connected to the other end of the tube portion and that has an elongated hollow cross section and can be brought into contact with the heat dissipation object on the outer surface.

 In the heat dissipation device, each of the first, second, and third tube portions of each of the heat absorption pipes has an elongated hollow cross section, and the third tube portion of the second tube portion. It is preferable that a plurality of heat dissipating fins are installed on the outer surface opposite to the side facing the heat dissipating member, and a heat dissipating fan is further installed adjacent to the heat dissipating fins.

 With the above configuration, the heat dissipating device of the present invention guides the flow direction of the refrigerant by constructing at least a part of the plurality of heat dissipating pipes and heat absorbing pipes in the heat exchanging unit obliquely in the vertical direction. Can also provide a heat dissipation device with improved heat dissipation efficiency.

It is a perspective view in which an example of the conventional heat radiating device is shown. 1 is a top view of a first preferred embodiment of a heat dissipation device of the present invention. 1 is a front view of a first preferred embodiment of a heat dissipation device of the present invention. 1 is a rear view of a first preferred embodiment of a heat dissipation device of the present invention. It is a top view of 2nd preferable embodiment of the thermal radiation apparatus of this invention. It is a top view of 3rd preferable embodiment of the thermal radiation apparatus of this invention. It is a top view of 4th preferable embodiment of the thermal radiation apparatus of this invention.

 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

 2 to 4 show the configuration of a first preferred embodiment of the heat dissipation device of the present invention, FIG. 2 is a top view thereof, FIG. 3 is a front view thereof, and FIG. 4 is a rear view thereof. is there.

 As shown in the figure, the heat dissipating device 3 of the present invention is disposed above a pair of upper and lower refrigerant tanks 31a, 31b, a heat exchange unit 32 that directly communicates the pair of upper and lower refrigerant tanks 31a, 31b. A refrigerant circulation circuit that includes a plurality of heat absorption pipes 33 that extend from the upper refrigerant tank 31a to the lower refrigerant tank 31b disposed below to communicate the two refrigerant tanks 31a and 31b. is doing.

 The upper refrigerant tank 31a is disposed obliquely so that the upper end is inclined toward the lower refrigerant tank 31b.

 The heat exchange unit 32 includes a plurality of heat radiation pipes 321 extending obliquely in the vertical direction and a plurality of heat radiation fins 322 attached to the plurality of heat radiation pipes 321.

 Each of the heat absorption pipes 33 is arranged so as to be lined up in the vertical direction, has an elongated hollow cross section, and is formed with a heat absorption surface 334 that can be brought into contact with (attached to) the heat radiation object on the outer surface. In accordance with the positional relationship between the pair of upper and lower refrigerant tanks 31a, 31b, a part thereof is formed to extend obliquely in the vertical direction.

 In the first embodiment, each endothermic pipe 33 has a first pipe part 331 and a second pipe part 332 that are in communication with each other. Each first pipe portion 331 communicates with the upper refrigerant tank 31a and extends obliquely in the vertical direction. Each second pipe portion 332 communicates with the lower refrigerant tank 31b, extends along the horizontal direction, and is arranged and configured so that the outer surface thereof is a main heat absorbing surface 334.

 With this configuration, the heat dissipating device 3 of the present invention is configured such that the plurality of heat dissipating pipes 321 in the heat exchange unit 32 and the first pipe portion 331 in the heat absorbing pipe 33 are configured to extend obliquely in the vertical direction. The refrigerant that has absorbed and vaporized heat in the second pipe portion 332 of 33 enters the heat exchange unit 32 via the lower refrigerant tank 31b, as indicated by the circulating arrows in the figure, By exchanging heat with the plurality of heat dissipating fins 322 while moving up along the heat dissipating pipe 321, the heat is condensed and guided to enter the upper refrigerant tank 31a. And the flow direction of the refrigerant is guided so that the refrigerant that has returned to the liquid flows into the second pipe part 332 again through the first pipe part 331 and absorbs heat, and the heat dissipation efficiency higher than the conventional one is obtained. Can be realized.

 FIG. 5 is a top view of a second preferred embodiment of the heat dissipation device of the present invention. As shown in the drawing, the second preferred embodiment of the heat dissipation device of the present invention has a configuration similar to that of the first embodiment. Therefore, only the difference, that is, the shape of the heat absorption pipe 33 will be described below. To do.

 As shown in the drawing, the second preferred embodiment of the heat dissipation device of the present invention is such that the shape of each heat absorption pipe 33 is such that the first pipe part 331 and the second pipe part 332 communicate with each other. A third pipe section 333.

 Each first pipe portion 331 has one end communicating with the upper refrigerant tank 31a and extending obliquely in the vertical direction.

 Each of the second pipe parts 332 communicates with the lower refrigerant tank 31b at one end, and extends in the horizontal direction so as to be parallel to the first pipe part 331 in the projection view on the horizontal plane. An endothermic surface 334 that can be brought into contact with a heat dissipation target is formed on the outer surface.

 Each third tube portion 333 has both ends communicating with the other end of the first tube portion 331 and the other end of the second tube portion 332, and the outer surface thereof is each second tube portion 332. In the same manner as described above, it can be used as the heat absorption surface 334 in contact with the heat dissipation target.

 Thus, each heat absorption pipe 33 in the second preferred embodiment of the heat dissipation device of the present invention is formed in a substantially U shape in the projection view on the horizontal plane, and thus has two heat absorption surfaces 334. In addition, the two heat absorbing surfaces 334 can be brought into contact with two heat dissipating objects to dissipate heat, and the heat dissipating effect equivalent to that of the first embodiment can be provided.

 FIG. 6 is a top view of a third preferred embodiment of the heat dissipation device of the present invention. As shown in the drawing, the third preferred embodiment of the heat dissipating device of the present invention has a configuration similar to that of the first embodiment. Therefore, only the difference, that is, the shape of the heat absorbing pipe 33 will be described below. To do.

 As shown in the figure, in the third preferred embodiment of the heat dissipation device of the present invention, the shape of the heat absorption pipe 33 is such that the first pipe part 331, the second pipe part 332, and the second pipe part 332 communicate with each other. 3 pipe parts 333.

 Each first pipe portion 331 has one end communicating with the upper refrigerant tank 31a and extending obliquely in the vertical direction.

 One end of each second pipe portion 332 communicates with the lower refrigerant tank 31b and extends in a direction away from the upper refrigerant tank 31a along the horizontal direction.

 Each third pipe part 333 is bent from the other end of the first pipe part 331 and then horizontally extended so as to pass in the vicinity of the lower refrigerant tank 31b, and then folded back to form the second pipe part 332. An endothermic surface 334 that has an elongated hollow cross section and can be brought into contact with a heat dissipation object is formed on the outer surface.

 In the third preferred embodiment, the outer surface of the second tube portion 332 can also be used as the heat absorbing surface 334 in contact with the heat dissipation object.

 As described above, the third preferred embodiment of the heat dissipating device of the present invention has two heat absorbing surfaces 334 as in the second preferred embodiment, and the two heat absorbing surfaces 334 are in contact with two heat dissipating objects. While being able to dissipate heat, it is possible to deal with heat dissipating objects with different positional relationships. That is, the heat radiating device of the present invention means that the shape of the heat absorbing pipe 33 can be freely changed according to the positional relationship of the heat radiating target to be radiated.

 FIG. 7 is a top view of a fourth preferred embodiment of the heat dissipation device of the present invention. As shown in the drawing, the fourth preferred embodiment of the heat dissipation device of the present invention has a configuration similar to that of the third embodiment. Therefore, the difference will be described below, namely, the added heat dissipation fin 34 and the heat dissipation. Only the fan 35 will be described.

 As shown in the drawing, in this embodiment, the plurality of radiating fins 34 protrude on the outer surface of each endothermic pipe 33 opposite to the side of the second tube portion 332 facing the third tube portion 333. A heat radiating fan 35 is further installed next to the plurality of heat radiating fins 34. As understood from the positional relationship shown in FIG. 7, the effect of promoting the air flow of the heat radiating fan 35 extends to the heat exchanging unit 32 and is heated around the heat radiating fins 34 and the heat radiating fins 322. By quickly removing the air, the heat dissipation efficiency of the heat dissipation device of the present invention can be further increased.

 Incidentally, the positions of the radiating fins 34 and the radiating fan 35 are not limited to those shown in the drawings, and it is of course possible to install them at appropriate positions as necessary.

 With the above configuration, the heat dissipating device of the present invention guides the flow direction of the refrigerant and dissipates heat by constructing at least a part of the plurality of heat dissipating pipes and heat absorbing pipes in the heat exchange unit obliquely in the vertical direction. It is possible to provide a heat dissipation device with further improved efficiency.

3 Heat Dissipation Device 31 Refrigerant Tank 31a Upper Refrigerant Tank 31b Lower Refrigerant Tank 32 Heat Exchange Unit 321 Heat Dissipation Pipe 322 Heat Dissipation Fin 33 Heat Absorption Pipe 331 First Pipe Part 332 Second Pipe Part 333 Third Pipe Part 334 Heat Absorption Surface 34 Heat Dissipation Fin 35 heat dissipation fan

Claims (7)

A heat dissipation device having a refrigerant circulation circuit,
The circulation circuit is
A pair of upper and lower refrigerant tanks formed in a straight pipe shape;
A heat exchange unit comprising a plurality of heat radiation pipes that are in direct communication with the pair of upper and lower refrigerant tanks and that extend obliquely in the vertical direction and a plurality of heat radiation fins attached to the plurality of heat radiation pipes;
Between the pair of upper and lower refrigerant tanks, the upper refrigerant tank arranged at the upper side extends to the lower refrigerant tank arranged at the lower side to communicate the two refrigerant tanks, and at least a part of the refrigerant tank extends in the vertical direction. A heat dissipating device comprising a heat absorbing pipe extending obliquely.  The heat radiating device according to claim 1, wherein the upper refrigerant tank is disposed obliquely so that an upper end of the upper refrigerant tank is inclined toward the lower refrigerant tank.  There are a plurality of the endothermic pipes, and each endothermic pipe is arranged along the vertical direction, and at least a part of each endothermic pipe has an elongated hollow cross section, and contacts the heat dissipation target on the outer surface. The heat sink according to claim 2, wherein a heat absorbing surface that can be made is formed. Each of the endothermic pipes has a first pipe part and a second pipe part communicating with each other,
Each first pipe portion communicates with the upper refrigerant tank and extends obliquely in the vertical direction,
Each second pipe portion communicates with the lower refrigerant tank, extends along the horizontal direction, has an elongated hollow cross section, and is formed with an endothermic surface that can be brought into contact with an object to be radiated on the outer surface. The heat dissipating device according to claim 2, wherein the heat dissipating device is provided. Each of the endothermic pipes has a first pipe part, a second pipe part, and a third pipe part that communicate with each other,
Each first pipe portion has one end communicating with the upper refrigerant tank and extending obliquely in the vertical direction,
Each of the second pipe portions communicates with the lower refrigerant tank at one end, extends in the horizontal direction so as to be parallel to the first pipe portion in a horizontal plane, and has an elongated hollow cross section. The heat absorption surface that can be brought into contact with the heat dissipation target is formed on the outer surface.
4. The heat radiating device according to claim 3, wherein each of the third tube portions has a both end communicating with the other end of the first tube portion and the other end of the second tube portion. Each of the endothermic pipes has a first pipe part, a second pipe part, and a third pipe part that communicate with each other,
Each first pipe portion has one end communicating with the upper refrigerant tank and extending obliquely in the vertical direction,
Each of the second pipe portions communicates with the lower refrigerant tank at one end, and extends in a direction away from the upper refrigerant tank along the horizontal direction.
Each third pipe portion extends horizontally from the other end of the first pipe portion so as to pass through the vicinity of the lower refrigerant tank, and then is folded back to the other end of the second pipe portion. The heat radiating device according to claim 3, wherein the heat radiating device is connected and has an elongated hollow cross section, and a heat absorbing surface that can be brought into contact with a heat radiating object is formed on the outer surface. Each of the first, second, and third pipe portions of each of the endothermic pipes has an elongated hollow cross section,
In addition, on the outer surface of the second tube portion opposite to the side facing the third tube portion, a plurality of heat radiating fins are installed so as to protrude,
The heat dissipating device according to claim 5 or 6, wherein a heat dissipating fan is further installed next to the plurality of heat dissipating fins.

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