JP3168746B2 - Component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method in a chip component mounting machine.

[0002]

2. Description of the Related Art Conventionally, when a component having a large number of cassettes is allocated to a facility based on printed circuit board information, the number of parts run out per day is large, and the operating rate of the facility is reduced.

[0003]

In such a conventional method, when a component having a large number of cassettes is allocated to the equipment based on the printed circuit board information, the operation rate of the equipment is reduced because the number of parts exhausted per day is increased. Had a point.

The present invention solves such a problem, and provides a component mounting method for reducing the number of daily component setups by providing a separate cassette for a component having a large number of members.

[0005]

According to a component mounting method of the present invention, a plurality of cassettes accommodating components are mounted, and each cassette is mounted.
A component supply unit for supplying a desired type of component by
Component mounting for mounting the supplied component on a printed circuit board
The component mounting method in the machine, parts off each component type
If the number of repetitions is larger than a preset value,
Parts are divided into a plurality of cassettes and set.
The number of cassettes to be divided
Set the number of times to be less than the preset value
It is provided with a process for reducing the number of parts cuts .

[0006]

According to the component mounting method of the present invention, the number of cassettes into which the component is divided can be easily set by the above-described configuration so that the number of component cuts falls within an allowable range that does not result in production loss. Therefore, highly efficient mounting production can be realized.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting method according to an embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a process for fetching component arrangement information of each facility, reference numeral 2 denotes a process for fetching the planned number of printed circuit boards to be produced in one day, and reference numeral 3 denotes a number of components used for each component in a day. 4 is a process for calculating the number of times of daily parts of each component, 5 is a process for capturing the maximum value of the number of times of daily components, 6 is a process for reducing the number of times for component setup, 7 Consists of processing for outputting component arrangement information so as to reduce the number of component setups for each facility. FIG. 2 is a configuration diagram showing component arrangement information of each facility. The component arrangement information includes a facility name 8, a component name 9, a number of members 10 and a cassette arrangement number 11. FIG. 3 is a configuration diagram showing daily production plan information. The production plan information includes a planned production date 12, a facility name 13, a board part number 14, and a planned production number 15
It is composed of FIG. 4 is a configuration diagram showing reel information to be set for each component.
Reel NO. 18 and the like.

FIG. 1 will be described in detail for each process. Process 1: This is a process of taking in component arrangement information of each facility.

Process 2: This is a process for taking in the production number of printed circuit boards for one day. Process 3: As shown in FIG. 5, this is a process of calculating the number of parts used in one day from the number of parts and the planned number of productions per day.

Process 4: This is a process for calculating the number of parts exhausted per day from the number of components used in one day and the number of components on one reel, which are also obtained from process 3 in FIG.

Process 5 is a process for taking in the maximum value of the number of parts exhaustion per day. Process 6: The flowchart of FIG. 7 is to calculate the number of parts out of a day for each part and compare it with the maximum value of the number of parts out of a day. This is a process for reducing the number of parts to be prepared by providing them.

Process 7: This is a process for outputting component arrangement information so as to reduce the number of component setups for each facility.

As described above, according to this embodiment, the component mounting method uses a chip component mounting machine in which various types of components are accommodated in a cassette and mounted in a component supply unit, and a component having a large number of components is mounted. , By providing a separate cassette,
This makes it possible to reduce the number of daily parts setups.

[0015]

As described above, according to the present invention, a separate cassette is provided for a component having a large number of members by using a chip component mounting machine in which various types of components are accommodated in a cassette and mounted in a component supply unit. Accordingly, the operation rate of the equipment is improved in order to reduce the number of parts set-ups per day.

[Brief description of the drawings]

FIG. 1 is a flowchart of a component mounting method according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing component arrangement information.

FIG. 3 is an explanatory diagram showing daily production plan information.

FIG. 4 is an explanatory diagram showing reel information set for each component.

FIG. 5 is an explanatory diagram showing the number of parts used in one day.

FIG. 6 is an explanatory diagram showing the number of parts exhaustion per day.

FIGS. 7A and 7B are flowcharts showing a method for reducing the number of times the parts are set up.

Continuation of the front page (72) Inventor Hideki Yoshihara 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-12999 (JP, A) JP-A-1-283604 (JP JP-A-1-211998 (JP, A) JP-A-60-80299 (JP, A) JP-A-3-253909 (JP, A) JP-A-4-346500 (JP, A) 62-216400 (JP, A) JP-A-4-345094 (JP, A) JP-A-53-85372 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/02

Claims (5)

(57) [Claims] A plurality of cassettes accommodating parts are mounted;
Parts supply to supply desired types of parts by each cassette
And mounting the supplied component on a printed circuit board.
A component mounting method for a component mounter, wherein the number of cut-outs of each component type is larger than a preset value.
If necessary, split that type of component into
The number of cassettes to be set
The number of parts cuts for one unit is below the value set in advance.
A component mounting method including a component cut-out frequency reduction process set to be as follows . 2. A plurality of cassettes containing parts are mounted,
Parts supply to supply desired types of parts by each cassette
And mounting the supplied component on a printed circuit board.
The number of components used for each type of component used in each cassette.
Based on the number of parts contained in the cassette,
Number of times of component count calculating step of calculating the number of times the component has been broken , and a component of each component type calculated in the number of times of component count calculation step
If the number of cuts is larger than the preset value, the type
Parts are set in multiple cassettes,
The number of cassettes to be loaded is the number of parts for one divided cassette.
Set the number of cuts so that it is less than the preset value.
A component mounting method comprising the steps of: 3. The component mounting method according to claim 2, wherein the number of components used for each component type in the component outage count calculation step is calculated based on the number of employees for each component type and the planned number of printed circuit boards to be produced. 4. The number of parts used for each part type in the part count calculation step is determined by using part arrangement information including the part type and the number of parts, and production plan information including the printed circuit board part number and the planned production number. The component mounting method according to claim 3, wherein the component mounting and calculation are performed. 5. The component number-of-cuts reducing step includes, if the number of component cuts of each component type is greater than a preset value, a number of cassettes determined based on a quotient obtained by dividing the component count by the preset value. 5. The component mounting method according to claim 1, wherein the component of the type is divided.