JP3166701U - Light emitting diode device and heat dissipation member thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting diode device capable of rapidly lowering the temperature of the light emitting diode device and improving the service life and stability by smoothly discharging heat from the light emitting diode and a heat radiating member thereof. SOLUTION: The board has one or more boards and a heat radiating member, and a plurality of light emitting diodes 11 are installed on the bottom surface of the board, while the heat radiating member is installed on the upper surface of the board and has a base. It has a plurality of heat radiating fins, of which a plurality of insertion grooves are formed in the base, and each heat radiating fin is relative so that the upper surface is in contact with the bottom surface of the base and the lower surface is in contact with the upper surface of the board. It includes a contact portion having both edges, and a fin portion extending upward from at least one edge of the contact portion and being inserted into the insertion groove portion of the base. [Selection diagram] Fig. 1

Description

  The present invention relates to a light-emitting diode device and a heat dissipation member thereof that can be combined particularly easily and can quickly lower the temperature.

  In recent years, due to technological improvements, light emitting diodes have been used as light sources instead of fluorescent lamps and light bulbs, but when light emitting diodes are attached, heat is generated, and the temperature of such light emitting diodes is directly This affects the service life or stability of the light emitting diode. For example, when the temperature of the light emitting diode rises, the amount of light emission decreases. Therefore, a heat radiating member is installed in many of commercially available light emitting diodes.

  As shown in FIG. 8, the existing light emitting diode device and its heat radiating member are provided with an existing heat radiating member 91 on the inner surface of a base 92 on which a plurality of light emitting diodes 921 are mounted. The plurality of heat dissipating fins 912 are provided on the top surface of the bottom seat 911 at intervals, and the bottom surface 913 of the bottom seat 911 is in contact with the top surface of the base 92. Further, according to this configuration, when the light emitting diode 921 is installed and used, heat from the light emitting diode 921 is conducted to the base 92 and also conducted from the bottom surface 913 of the bottom seat 911 in contact with the base 92 to the heat radiation fin 912. Thus, heat can be released to the atmosphere through the heat radiation fins 912.

  However, the existing heat radiating member is made of an extruded aluminum material, and has a limitation on the ratio between the bottom seat 911 and the heat radiating fin 912 and the thickness of the bottom seat 911, so The heat is conducted to the base 911 having a predetermined thickness and then conducted to the plurality of heat dissipating fins 912 to release heat. However, there is a disadvantage that the heat release efficiency is low.

  In view of the drawbacks of the existing heat radiating members, a heat radiating member as shown in FIG. 9 was subsequently devised. The heat dissipating member has a structure in which a plurality of heat dissipating fins 81 are stacked, and two fixing holes 83 are formed between the upper surface of each heat dissipating fin 81 and the side surfaces 811 on both sides. Has a shape gradually narrowing from the lower part to the upper part, and two engaging parts 82 corresponding to the fixing holes 83 are extended at the bottom ends of the respective side surfaces 811. Therefore, as shown in FIG. It is not necessary to conduct heat to the heat radiating fins 81 through the bottom seat 911 and then release the heat to the outside.

  However, in the existing heat radiating member, when the two heat radiating fins 81 are combined, the first heat radiating fins 81 are first stacked on the second heat radiating fins 81 and then pressed, and the engaging portions 82 of the first heat radiating fins 81 are pressed. Is bent to the outside and is positioned in the fixing hole 83 of the second radiating fin 81 in the lower stage, and the engaging portion 82 of the first radiating fin 81 is returned to the fixing hole 83 of the second radiating fin 81. The engagement portion 82 can be engaged, and further, if this step is repeated many times, a plurality of heat radiation fins 81 can be combined. However, the combination of the heat radiation fins 81 is very complicated. There was room.

  A base and a plurality of heat dissipating fins, wherein the base has a plurality of insertion grooves, and each heat dissipating fin has a top surface in contact with the bottom surface of the base, A contact portion provided; and a fin portion that extends upward from at least one edge of the contact portion and is inserted into the insertion groove portion of the base.

  Each of the heat dissipating fins has two fin portions extending upward from both edge portions of the contact portion.

  Each of the heat dissipating fins has an L shape, and each of the fin portions has a rectangular shape.

  Each of the radiating fins has a U shape, and each of the fin portions has a rectangular shape.

  The board includes one or more boards and a heat radiating member, and a plurality of light emitting diodes 11 are installed on the bottom surface of the board, while the heat radiating member is installed on the top surface of the board, and includes a base and a plurality of heat radiating fins. A plurality of insertion grooves are formed in the base, and each of the heat dissipating fins has relative opposite edges so that the top surface is in contact with the bottom surface of the base and the bottom surface is in contact with the top surface of the board. A contact portion provided; and a fin portion that extends upward from at least one edge of the contact portion and is inserted into the insertion groove portion of the base.

  The board is attached to the bottom surface of the base via a plurality of bolts.

  A cooling sheet is installed between the board and the contact portion of the heat radiating fin.

  A heat radiation grease is installed between the board and the contact portion of the heat radiation fin.

  The light emitting diode device and the heat radiating member thereof according to the present invention solve the above-mentioned problems, and the heat from the light emitting diode can be quickly discharged by the heat radiating fins of the heat radiating member, thereby efficiently reducing the temperature of the light emitting diode device. Therefore, not only the service life can be extended but also the stability can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a light emitting diode device according to the present invention and a first embodiment of a heat dissipation member thereof. 1 is a partially exploded perspective view of a first embodiment of a light emitting diode device and a heat dissipation member thereof according to the present invention. Sectional drawing of the 1st Example of the light-emitting-diode apparatus which concerns on this invention, and its heat dissipation member. The fragmentary sectional view of the other 1st example of the light emitting diode device concerning the present invention, and its heat dissipation member. The fragmentary sectional view of further another 1st example of the light emitting diode device concerning the present invention, and its heat dissipation member. Sectional drawing of the 2nd Example of the light-emitting-diode apparatus which concerns on this invention, and its heat dissipation member. The slope view of the radiation fin of the 2nd Example of the light-emitting-diode apparatus which concerns on this invention, and its thermal radiation member. Sectional drawing of the existing heat radiating member. The partial exploded view of the other existing heat radiating member.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, the following Example is only what showed the preferred embodiment of this invention, and the technical scope of this invention is not limited to the following Example itself at all.

  As shown in FIGS. 1 and 3, the first embodiment of the light emitting diode device according to the present invention has one or more boards 10 and a heat radiating member 20, and a plurality of light emitting diodes on the bottom surface of the board 10. 11 is installed.

  The heat radiating member 20 is installed on the upper surface of the board 10 and includes a base 21 and a plurality of heat radiating fins 22, and a plurality of insertion grooves 211 are formed in the base 21. Each of the heat dissipating fins 22 is inserted into the insertion groove portion 211 of the base 21, and the upper surface of the heat dissipating fin 22 is in contact with the bottom surface of the base 21 so as to be thermally conductive, and the lower surface thereof is in contact with the upper surface of the board 10 so as to be thermally conductive. The contact portion 221 includes a fin portion 222 that extends upward from at least one longitudinal edge of the contact portion 221 and is inserted into the insertion groove 211 of the base 21.

  As shown in FIG. 2, the base 21 has a rectangular piece, and is arranged so as to be arranged at intervals in the longitudinal direction, the lateral direction, and the longitudinal direction, and parallel to the lateral direction. A plurality of insertion grooves 211 may be provided, and a plurality of screw holes 212 are formed in the base 21.

  Further, each heat radiation fin 22 in the first embodiment has the abutting portion 221 and the fin portion 222, and the corresponding contact portion 221 includes both opposite edge portions, from at least one edge portion. By extending the fin portion 222 toward the upper side, the L-shaped radiating fin 22 is configured. On the other hand, the fin portion 222 may have a rectangular shape, and is inserted into the insertion groove portion 211 from the bottom to the top of the base 21, and the upper surface of the contact portion 221 can conduct heat on the bottom surface of the base 21. It touches so that it becomes.

  In addition, the board 10 has a rectangular shape, and one or more electronic members 13 are installed on the bottom surface, and a mounting hole 14 is formed at a location corresponding to the screw hole 212 of the base 21. By passing through the mounting holes 14 and screwing into the screw holes 212, the board 10 is mounted on the bottom surface of the base 21 of the heat radiating member 20, and the top surface of the board 10 can be thermally conducted. Are brought into contact with the bottom surface of the contact portion 221 of the heat radiation fin 22.

  As shown in FIGS. 4 and 5, in the other first embodiment, the cooling sheet 15 or the heat radiation grease 16 or the cooling between the board 10 and the contact portion 221 of the heat radiation fin 22 of the heat radiation member 20 is further provided. The sheet 15 and the heat radiation grease 16 may be provided.

  As shown in FIGS. 6 and 7, the second embodiment according to the present invention is almost the same as the structure of the first embodiment, but the radiating fins 22A are different. Each radiating fin 22A in the present embodiment has an abutting portion 221A and two fin portions 222A, and the corresponding contacting portion 221A includes both opposite edge portions, while the fin portions 222A respectively correspond. By extending upward from both edges of the contact portion 221 </ b> A, the radiation fin 22 </ b> A has a U shape, and the two fin portions 222 </ b> A are respectively inserted into the insertion groove portions 211 of the base 21.

  As described above, since the heat radiation fins 22 and 22A in the heat radiation members 20 and 20A according to the present invention are thin, the fin portions 222 and 222A and the contact portions 221 and 221 are curved by bending the heat radiation fins 22 and 22A. 221A can be formed easily. According to this configuration, the light emitting diode device according to the present invention conducts the heat from the light emitting diode 11 to the heat radiating fins 22 and 22A via the board 10, so that the heat directly from the fin portions 222 and 222A. By discharging, the heat from the light emitting diode 11 can be discharged smoothly into the atmosphere, so the temperature of the light emitting diode device can be quickly lowered.

  Further, the heat dissipating members 20 and 20A according to the present invention simply insert the fin portions 222 and 222A of the heat dissipating fins 22 and 22A into the inserting groove portion 211 of the base 21, and the heat dissipating fins 22 and 22A and the base 21 As a result, the assembly is very easy.

  The present invention has the above-described configuration, and since the heat from the light emitting diode can be quickly discharged by the heat radiating fin of the heat radiating member, the temperature of the light emitting diode device can be lowered smoothly, thereby improving the service life and stability. Has an effect.

10 Board 11 Light-emitting diode 12 Bolt 13 Electronic member 14 Mounting hole 15 Heat radiation grease 16 Cooling sheet 20 Heat radiation member 21 Base 211 Insertion groove portion 212 Screw hole 22, 22A heat radiation fin 221, 221A contact portion 222, 222A fin portion 81 Heat radiation fin 811 Side surface 82 Engagement foot part 83 Fixing hole 91 Radiating member 911 Bottom seat 912 Radiating fin 913 Bottom surface 92 Base 921 Light emitting diode

Claims (11)

  A base and a plurality of heat dissipating fins, wherein the base has a plurality of insertion grooves, and each heat dissipating fin has a top surface in contact with the bottom surface of the base, A heat radiating member comprising: a contact portion provided; and a fin portion that extends upward from at least one edge portion of the contact portion and is inserted into the insertion groove portion of the base.   The heat radiating member according to claim 1, wherein each of the heat radiating fins has two fin portions extending upward from both edge portions of the contact portion.   The heat radiating member according to claim 2, wherein each of the radiating fins has an L shape and each of the fin portions has a rectangular shape.   The heat radiating member according to claim 2, wherein each of the radiating fins has a U-shape and each of the fins has a rectangular shape.   One or more boards and a heat dissipation member, and a plurality of light emitting diodes are installed on the bottom surface of the board, while the heat dissipation member is installed on the top surface of the board, a base, a plurality of heat dissipation fins, A plurality of insertion grooves are formed in the base, and each of the heat dissipating fins has relative both edges so that the upper surface is in contact with the bottom surface of the base and the lower surface is in contact with the upper surface of the board. A light emitting diode device comprising: a contact portion; and a fin portion extending upward from at least one edge portion of the contact portion and inserted into an insertion groove portion of the base.   6. The light emitting diode device according to claim 5, wherein each of the heat dissipating fins has two fin portions extending upward from both edges of the contact portion.   The light emitting diode device according to claim 6, wherein each of the heat dissipating fins has an L shape and each of the fin portions has a rectangular shape.   The light emitting diode device according to claim 6, wherein each of the heat dissipating fins has a U shape and each of the fin portions has a rectangular shape.   The light emitting diode device according to claim 5, wherein the board is attached to a bottom surface of the base via a plurality of bolts.   The light-emitting diode device according to claim 5 or 9, wherein a cooling sheet is installed between the board and a contact portion of the radiation fin. The light-emitting diode device according to claim 5 or 9, wherein heat dissipating grease is provided between the board and a contact portion of the heat dissipating fin.

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