JP3165648U - Multiple parallel automatic chip sorter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plurality of parallel automatic chip classifiers capable of reducing costs, reducing the area used in a factory, and improving production efficiency. SOLUTION: A plurality of classification units 30, a wafer case 10 for storing a wafer 11, and a classification tray case 20 for storing a classification tray 21 are provided. Further, a shuttle mechanism 40 is provided which reciprocates between the plurality of sorting units 30, the wafer case 10 and the sorting tray case 20 to move the plurality of wafers 11 and the plurality of sorting trays 21 in and out. [Selection diagram] Fig. 3

Description

  The present invention relates to a chip sorter, and more particularly to a multiple parallel automatic chip sorter.

  After the wafer is cut into a plurality of chips (die or chip) by dicing, it is necessary to classify the wafers according to quality, performance and product characteristics, and different grades of chips are used in different fields. Light emitting diodes (Light Emitted Diodes, LEDs), in particular, are manufactured on the same wafer even if the brightness, wavelength, color temperature, operating voltage, etc. of the diodes are produced on the same wafer due to differences in manufacturing process conditions. Some differences occur. The classification of light emitting diodes is gradually required to be subdivided, and now it is divided into 150 types. FIG. 1 is a perspective view showing a single semi-automatic sorter which is a prior art. The arm 1 picks up a plurality of classification waiting chips 3 on the wafer 2 and packs them on the classification tray 4. In FIG. 1, there are twelve classification trays 4, and a plurality of classification waiting chips 3 are divided into twelve types. When the classification of the plurality of classification waiting chips 3 on the wafer 2 is completed, it is manually replaced with another wafer 2 and the classification is continued.

  FIG. 2 is a perspective view showing a single automatic classifier as a prior art. The main structure is similar to the single semi-automatic sorter shown in FIG. 1, and the number of wafer cases 6 and sort tray cases 7 is increased, the exchange of wafers 2 is automated, and the optimum sort tray 4 is selected by the arm 5 and The exchange is automated. However, the multiple replacement of the classification tray 4 is not only time consuming, but not all the classification trays 4 are filled with the same quality chips 3, so that at the end of the operation the classification tray of each machine. It is necessary to perform the work of grouping the four items of the same type, which is a waste of time. Furthermore, since a plurality of single automatic classifiers occupy a factory location, it is a common goal of those skilled in the art how to speed up the classification function in a limited space.

  The main object of the present invention is to solve the problem that the sorting speed of the chip sorter decreases due to the scattering of the sorting tray.

  A further object of the present invention is to solve the problem that the factory occupation area of a plurality of chip sorters is too large.

  To achieve the above object, the present invention provides a multiple parallel automatic chip sorter. The present invention includes a wafer case, a classification tray case, a plurality of classification units, and a shuttle mechanism. The wafer case can store a plurality of wafers. Sorting waiting chips are installed on the plurality of wafers. The classification tray case can store a plurality of classification trays. The plurality of classification trays can store a plurality of classified chips. Each of the plurality of classification units includes a classification waiting work table on which the wafer is set, a classified work table on which the classification tray is set, and an arm. The arm picks up the classification waiting chip on the wafer on the classification work table and packs it on the classification tray on the classified work table. The shuttle mechanism reciprocates between the plurality of classification units, the wafer case, and the classification tray case, and takes in and out the plurality of wafers and the plurality of classification trays.

  In the present invention, by installing a sorter, a plurality of sorting units share a wafer case and a sorting tray case, thereby saving the amount of use of the case and reducing the cost. The present invention can also reduce the use area of the factory by arranging the sorters. The method of sharing the classification tray can avoid the work of grouping the classification trays of different classification machines with the same type, thereby improving the production efficiency.

It is a perspective view which shows the single-piece | unit semi-automatic classification machine of a prior art. It is a perspective view which shows a prior art simplex automatic sorter. It is a perspective view which shows the three-dimensional structure of the Example of this invention. It is a perspective view which shows the three-dimensional structure of another Example of this invention. It is explanatory drawing which shows the sort structure of the Example of this invention.

  Hereinafter, detailed description and technical contents of the present invention will be described with reference to the drawings.

  FIG. 3 is a perspective view showing a three-dimensional structure of an embodiment of the present invention. The present invention is a multiple parallel automatic chip sorter, which includes a wafer case 10, a sort tray case 20, a plurality of sort units 30, and a shuttle mechanism 40. The wafer case 10 stores a plurality of wafers 11, and a plurality of classification waiting chips 50 are placed on the plurality of wafers 11. The classification tray case 20 stores a plurality of classification trays 21, and a plurality of classified chips 50 are placed on the plurality of classification trays 21. Each of the plurality of classification units 30 includes a classification waiting work table 31 for installing the wafer 11, a classified work table 32 for installing the classification tray 21, and an arm, and the arm is located on the classification waiting work table 31. The upper classification waiting chips 50 are picked up and packed on the classification tray 21 in the classified work table 32. The shuttle mechanism 40 reciprocates between the wafer case 10, the classification tray case 20, and the plurality of classification units 30, and takes in and out the plurality of wafers 11 and the plurality of classification trays 21. In FIG. 3, there are eight sorting units 30, and four are set as one set on both sides of the wafer case 10 and the sorting tray case 20.

  In the present embodiment, the plurality of wafers 11 are installed on the wafer case 10 and the classification waiting work table 31 perpendicular to the ground, and the plurality of classification trays 21 are arranged on the classification tray case 20 and the classified work table 32 perpendicular to the ground. Installed. The classification waiting work table 31 and the classified work table 32 are similarly installed on the plurality of classification units 30 perpendicular to the ground. The shuttle mechanism 40 includes an on-axis moving part. In FIG. 3, the on-axis moving parts in the three-axis directions put in and out the plurality of wafers 11 and the plurality of classification trays 21. In order to align the on-axis moving parts with the vertically placed wafer case 10 and the sorting tray case 20, the shuttle mechanism 40 is placed above the plurality of sorting units 30, the wafer case 10 and the sorting tray case 20, and moves vertically. A plurality of wafers 11 and a plurality of sorting trays 21 are put in and out according to the method. FIG. 3 shows an outline of the movement of the shuttle mechanism 40 on three axes, not the shuttle mechanism 40 actually used.

  The process of the embodiment of the present invention is divided into the following steps.

  Step 1 Installation of wafer 11 and classification tray 21: The shuttle mechanism 40 waits for classification on a plurality of classification units 30 on a plurality of wafers 11 in the wafer case 10 and a plurality of classification trays 21 in the classification tray case 20, respectively. It is installed on the work table 31 and the classified work table 32.

  Step 2 / Classification: A plurality of classification units 30 perform classification work. A plurality of classification waiting chips 50 on the wafer 11 are picked up and packed in the classification tray 21. In this embodiment, since the chips 50 are classified into 150 types, there are 150 types of classification trays 21, and there is only one classification tray 21 of the same type. Therefore, the classification trays 21 in the plurality of classification units 30 are all different types of classification trays 21.

  Step 3-Replacement of the classification trays 21: After the classification operation in the plurality of classification units 30 is completed, the shuttle mechanism 40 replaces the classification trays 21 in the different classification units 30. After the replacement, the plurality of classification units 30 can perform the next classification operation. It should be particularly explained that since the number of classification waiting chips 50 on the wafer 11 is indeterminate, the classification unit 30 transmits a wafer status signal and a classification tray status signal to the schedule sort unit 60 as shown in FIG. The sort unit 60 controls the shuttle mechanism 40 in the order in which the different classification units 30 complete the selection, and exchanges the classification tray 21.

  Step 4 Exchange of wafer 11 and classification tray 21: When the classification waiting chips 50 on the wafer 11 are classified, the empty wafer 11 is taken, a new wafer 11 is installed, and classification is continued. If the sorting tray 21 is filled with the same type of chips 50, it is replaced with a new sorting tray 21.

  Step 5 / Classification completed: After the classification of the chip 50 for one set is completed, all the classification trays 21 are taken out. Different classification trays 21 have different types of chips 50, and the number of classified chips 50 is different, so the number of classified classification trays 21 is not necessarily one.

  Different designs are possible depending on the method used, such as the method of replacing the classification tray 21 described above, the method of fixing the classification tray 21 and exchanging the wafers 11, and the method of exchanging the classification tray 21 and the wafers 11 at the same time. .

  FIG. 4 is a perspective view showing a three-dimensional structure of another embodiment of the present invention. As shown in FIG. 4, in addition to the vertical structure, the present invention can also use a horizontal structure. More specifically, the plurality of wafers 11 are placed on the wafer case 10 and the sorting waiting work table 31 horizontally with the ground, and the plurality of sorting trays 21 are placed on the sorting tray case 20 and the sorted work table 32 with the ground. Is done. The shuttle mechanism 40 is installed on one side of the plurality of classification units 30, the wafer case 10 and the classification tray case 20, and the shuttle mechanism 40 includes at least one axial movement part (two axial directions in the drawing) and moves horizontally. The plurality of wafers 11 and the plurality of classification trays 21 are taken in and out by the above method.

  FIG. 5 is an explanatory diagram showing the sort structure of the embodiment of the present invention. In FIG. 5, the present invention further includes a schedule sort unit 60 for controlling the loading / unloading time of the wafer 11 and the sorting tray 21, and is electrically connected to the sorting unit 30 and the shuttle mechanism 40. The classification unit 30 transmits the wafer status signal and the classification tray status signal to the schedule sort unit 60, and the schedule sort unit 60 controls the shuttle mechanism 40 along the wafer status signal and the classification tray status signal, and controls the plurality of wafers 11 and the plurality of wafers. The sorting tray 21 is taken in and out. In order to increase work efficiency, each of the plurality of classification units 30 includes a preliminary work table 70 on which the wafer 11 or the classification tray 21 can be installed. The provision of the preliminary workbench 70 gives an interval to the shuttle mechanism 40, and the classification unit removes the classification tray 21 or the sorted wafers 11 filled with the chips 50 by the shuttle mechanism 40, and the new classification tray 21 or new The problem that the operation cannot be continued without waiting for the wafer 11 to be placed can be avoided.

  As described above, according to the present invention, by installing the sorter, a plurality of sorting units 30 share the wafer case 10 and the sorting tray case 20, thereby saving the amount of use of the case and reducing the cost. Moreover, this invention can reduce the use area of a factory by arranging a sorter. Further, by sharing the classification tray 21, it is possible to avoid the work of grouping the classification trays 21 of different classification units 30 with the same type, thereby improving the production efficiency. Further, by utilizing the structure of the preliminary workbench 70, the waiting time that the classification unit 30 is wasted while taking the shuttle 40 is avoided.

  Although the present invention has been described in detail, the above description only gives the best embodiments of the present invention, and these embodiments do not limit the present invention. All changes that do not depart from the gist are included in the scope of the claims for utility model registration of the present invention.

  The present invention can be applied to a chip sorter.

1 Arm 2 Wafer 3 Chip 4 Sorting tray 5 Arm 6 Wafer case 7 Sorting tray case 10 Wafer case 11 Wafer 20 Sorting tray case 21 Sorting tray 30 Sorting unit 31 Sorting work table 32 Sorted work table 40 Shuttle mechanism 50 Chip 60 Schedule Sort unit 70 Preliminary workbench

Claims (3)

A multiple parallel automatic chip sorter,
A wafer (11) on which a plurality of classification waiting chips (50) are installed;
A wafer case (10) for accommodating a plurality of the wafers (11);
A classification tray (21) on which a plurality of classified chips (50) are installed;
A classification tray case (20) for storing a plurality of the classification trays (21);
Sorting work table (31) for placing the wafer (11), sorted work table (32) for placing the classification tray (21), and the wafer (11) on the sorting work table (31) A sorting unit (30) comprising an arm for picking up the sorting waiting chip (50) on the sorting tray (21) on the sorted workbench (32);
A shuttle that reciprocates between the wafer case (10), the classification tray case (20), and the plurality of classification units (30), and takes in and out the plurality of wafers (11) and the plurality of classification trays (21). A mechanism (40);
A multi-parallel automatic chip sorter comprising: The multiple parallel automatic chip sorter according to claim 1,
And a schedule sort unit (60) that is electrically connected to the sorting unit (30) and the shuttle mechanism (40) and controls a time for taking in and out the wafer (11) and the sorting tray (21). Features multiple parallel automatic chip sorter. The multiple parallel automatic chip sorter according to claim 1,
The plurality of sorting units (30) are each provided with a preliminary work table (70) for the wafer (11) or the sorting tray (21), and a plurality of parallel automatic chip sorting machines.

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