JP3163848U - Proximity sensor package structure - Google Patents

Abstract

Provided is a proximity sensor package structure in which a sensor chip is not directly subjected to interference from a light source by using two independent spaces that do not interfere with each other. A proximity sensor package structure includes a package body, which includes first and second inner spaces 24 and 26 and first and second openings 28 and 30 which are independent from each other. The second opening communicates with the first and second internal spaces and the external environment, respectively. The light emitting diode chip 20 is provided in the first internal space 24, and the light emitting diode chip is installed corresponding to the first opening, located below the first opening, and emits light through the first opening. To do. On the other hand, the light source sensor chip 22 is provided in the second internal space 26, and the light source sensor chip is installed corresponding to the second opening and is located above or below the second opening. The above-mentioned light beam is received through. [Selection] Figure 2

Description

  The present invention relates to a package structure, and more particularly to a proximity sensor package structure.

  Sensing and control are the most important basic electronic functions, and in order to perform sensing, a signal is required and this signal usually appears in the form of light. This light signal is sent to the object to be sensed, reflected and sent back to the sensor. The signal containing this information is read immediately and applied further. In order to optimize the performance of the device due to the difference in the physical characteristics of the device, the light source chip 10 and the sensor chip 12 are usually manufactured and packaged separately as shown in FIG. Connect to. This allows it to be used to sense the sensed object 16.

  For example, a sensor used for distance sensing includes two independent chips, one of which is a light emitting diode (LED) chip and the other is a light receiving light source sensor chip. Since the two chips are independently manufactured and then combined, the manufacturing cost is high, the required manufacturing process is more time-consuming, and the assembly procedure is complicated. In addition, the volume of the package structure after completion becomes large. This type of structure has only one sensor chip, and the distance that can be sensed is quite limited, so it cannot be applied universally to general consumer electronic products, causing consumer difficulties. become.

  In view of these points, the present invention proposes a proximity sensor package structure to address the deficiencies of the above known techniques and overcome the problems.

  The main object of the present invention is to provide two independent internal spaces, each with a light emitting diode chip and a light source sensor chip, so that not only the package structure can be reduced in volume but also the sensor chip can be Providing a proximity sensor package structure that can avoid direct interference and improve the function of the product.

  To achieve the above object, the proximity sensor package structure proposed by the present invention includes a package body, a light emitting diode chip, and a light source sensor chip. The package body includes a first, a second internal space, a first, A second opening is provided, and the first and second openings communicate with the first and second internal spaces and the external environment, respectively. The light emitting diode chip is provided in the first internal space, is installed corresponding to the first opening, is positioned below the first opening, and emits a light beam through the first opening. The light source sensor chip is provided in the second internal space, is installed corresponding to the second opening, is positioned above or below the second opening, and receives the above-described light beam through the second opening.

  The present invention is effective not only for reducing the volume, but also for improving the sensing effect of the product because the sensor chip can avoid the direct interference of the emission light source.

Sectional drawing of the package structure of a prior art. 1 is a structural cross-sectional view of a first embodiment of the present invention. The structure top view of the 1st example of the present invention. The structure sectional view of the second example of the present invention. The structure top view of 2nd Example of this invention.

  In order to further understand and recognize the structural features and achievement effects of the present invention, preferred embodiments will be described below with reference to the drawings.

  The first embodiment of the present invention is introduced below. 2 and 3, the present invention mainly includes a package body 18, a light emitting diode chip 20, and a light source sensor chip 22. The package body 18 includes a first internal space 24, a second internal space 26, a first opening 28, and a second opening 30 that are mutually independent. Among them, the first opening 28 and the second opening 30 communicate with the first internal space 24 and the second internal space 26 and the external environment, respectively. The second opening 30 is a light receiving focal hole, and a specific light wave and Only light rays having a specific reflection angle are received, and the light source sensor chip 22 is prevented from receiving noise interference. A monopolar smooth condensing reflection layer 32 is further provided on the inner surface of the first inner space 24. The light emitting diode chip 20 is provided in the first internal space 24, is installed corresponding to the first opening 28, is positioned below the first opening 28, and the condensing reflection layer 32 is emitted from the light emitting diode chip 20. The scattered light is collected into one light beam, and the object to be sensed is irradiated from the first aperture 28. The light source sensor chip 22 is provided in the second internal space 26, is installed corresponding to the second opening 30, and is positioned below the second opening 30. The light source sensor chip 22 receives the light beam reflected through the second opening 30 via the above-mentioned sensing object.

  In order to protect the chip, a translucent plate 34 is provided above the first opening 28 and the second opening 30 to shield the first opening 28 and the second opening 30. In addition, the first internal space 24 and the second internal space 26 are filled with a transparent colloid 36 made of a plastic material, and the light emitting diode chip 20 and the light source sensor chip 22 are respectively covered. The package body 18 is provided with a plurality of input / output pins (I / O pins) 38 around the bottom according to the design.

  Depending on the design, the installation of the elements of the translucent plate 34 and the transparent colloid 36 may be omitted.

  In the present invention, the light emitting diode chip 20 and the light source sensor chip 22 are installed in the same package body 18, thereby reducing the cost and reducing the volume of the package. The package body 18 further includes a base 40 and a partition wall 42. The base 40 may be a metal lead frame or a substrate, and the partition wall material may be plastic. An input / output pin 38 is provided at the bottom of the base 40, and the partition wall 42 is vertically connected to four sides of the base 40, and forms a concave groove together with the base 40. In the manufacturing method, the partition wall 42 and the base 40 can be simultaneously formed by injection molding or deposition bonding. A lid plate 44 is provided on the upper part of the partition wall 42 to seal the groove. The lid plate 44 includes a first opening 28 and a second opening 30, and the base 40 and the partition wall 42 form a storage space. In this accommodating space, a separator 46 is provided, and the first aperture 28 and the second aperture 30 are located on different sides of the separator 46, and the separator 46 is vertically connected to the base 40 and the cover plate 44 for accommodating. The space is divided into a first internal space 24 and a second internal space 26. The condensing reflection layer 32 is provided on the base 40, the partition wall 42, and the separator 46 in the first internal space 24. The light emitting diode chip 20 is located above the base 40 of the first internal space 24 and below the first opening 28. The light source sensor chip 22 is located above the base 40 of the second internal space 26 and below the second opening 30. Since the first internal space 24 and the second internal space 26 are independent, the light source sensor chip 22 can be prevented from directly receiving the interference of the light emitting diode chip 20, and the function of the product is improved. The two transparent colloids 36 are filled in the first internal space 24 and the second internal space 26, respectively, and cover the light emitting diode chip 20 and the light source sensor chip 22, respectively.

  The diffused light emitted by the light emitting diode chip 20 first reaches the upper part of the converging / reflecting layer 32, and the condensing / reflecting layer 32 reflects the above-mentioned diffused light and collects it in the first aperture 28 via the transparent colloid 36. The object to be sensed is irradiated through the one aperture 28 and the translucent plate 34. Thereafter, the object to be sensed is reflected again, passes through the light transmitting plate 34, the second aperture 30, and the transparent colloid 36, and is irradiated onto the light source sensor chip 22 to be received.

  In the first embodiment, the light source reflection and the sensing path are on the same side, but may be on the opposite side. 4 and 5 show a second embodiment.

  The second embodiment includes a package body 18, a light emitting diode chip 20, and a light source sensor chip 22. The package body 18 includes a first internal space 24, a second internal space 26, a first opening 28, and a second opening 30 that are independent from each other, and the first opening 28 and the second opening 30 are respectively the first opening 28 and the second opening 30. The internal space 24, the second internal space 26 and the external environment communicate with each other, and the second aperture 30 receives only a specific light wave and a light beam having a specific reflection angle, and the light source sensor chip 22 is prevented from receiving noise interference. To do. A monopolar smooth condensing reflection layer 32 is further provided on the inner surface of the first inner space 24. The light emitting diode chip 20 is provided in the first internal space 24, is installed corresponding to the first opening 28, is positioned below the first opening 28, and the condensing reflection layer 32 is emitted from the light emitting diode chip 20. The scattered light is collected into one light beam, and the object to be sensed is irradiated from the first opening 28. The light source sensor chip 22 is provided in the second internal space 26, is installed corresponding to the second opening 30, and is positioned above the second opening 30. The light source sensor chip 22 receives the light beam reflected through the second opening 30 via the above-mentioned sensing object.

  In order to protect the chip, a translucent plate 34 is provided above the first opening 28 and the second opening 30 to shield the first opening 28 and the second opening 30. In addition, the first internal space 24 and the second internal space 26 are filled with a transparent colloid 36 made of a plastic material, and the light emitting diode chip 20 and the light source sensor chip 22 are respectively covered. The package body 18 is provided with a plurality of input / output pins (I / O pins) 38 around the bottom according to the design.

  Similarly, depending on the design, installation of the elements of the translucent plate 34 and the transparent colloid 36 may be omitted.

  In order to reduce the cost and reduce the volume of the package, the light emitting diode chip 20 and the light source sensor chip 22 are installed in the same package body 18 in the second embodiment. The package body 18 further includes a base 40 and a partition wall 42. The base 40 may be a metal lead frame or a substrate, and the partition wall material may be plastic. The base 40 includes a second opening 30, an input / output pin 38 is provided at the bottom of the base 40, and the partition wall 42 is vertically connected to four sides of the base 40, and forms a concave groove together with the base 40. In the manufacturing method, the partition wall 42 and the base 40 can be simultaneously formed by injection molding or deposition bonding. A lid plate 44 is provided on the upper part of the partition wall 42 to seal the groove. The lid plate 44 includes a first opening 28 and the base 40 and the partition wall 42 form an accommodation space. In this accommodation space, a separator 46 is provided, and the first opening 28 and the second opening 30 are located on different sides of the separator 46, and the separator 46 is vertically connected to the base 40 and the cover plate 44 for accommodation. The space is divided into a first internal space 24 and a second internal space 26. The condensing reflection layer 32 is provided on the base 40, the partition wall 42, and the separator 46 in the first internal space 24. The light emitting diode chip 20 is located above the base 40 of the first internal space 24 and below the first opening 28. The light source sensor chip 22 is located above the base 40 of the second internal space 26 and above the second opening 30. Since the first internal space 24 and the second internal space 26 are independent, the light source sensor chip 22 can be prevented from directly receiving the interference of the light emitting diode chip 20, and the function of the product is improved. The two transparent colloids 36 are filled in the first internal space 24 and the second internal space 26, respectively, and cover the light emitting diode chip 20 and the light source sensor chip 22, respectively.

  Since the light beam emission and light receiving method of the second embodiment are the same as those of the first embodiment, description thereof is omitted here.

  From the above, it can be said that the present invention is effective not only for reducing the volume but also for improving the sensing effect of the product because the sensor chip can avoid the direct interference of the emission light source.

  The above description merely discloses a preferred embodiment of the present invention, and does not limit the scope of the present invention. Therefore, all the various changes and color changes such as shapes, structures, and features added within the spirit and scope of the present invention are included in the scope of the utility model registration request of the present invention.

DESCRIPTION OF SYMBOLS 10 Light source chip 12 Sensor chip 14 Printed circuit board 16 Object to be sensed 18 Package body 20 Light emitting diode chip 22 Light source sensor chip 24 1st internal space 26 2nd internal space 28 1st opening 30 2nd opening 32 Condensing reflective layer 34 Translucent plate 36 Transparent colloid 38 Input / output pin 40 Base 42 Partition 44 Lid plate 46 Separator

Claims (10)

A package comprising first and second internal spaces and first and second openings that are independent of each other, wherein the first and second openings communicate with the first and second internal spaces and the external environment, respectively. Body,
A light-emitting diode chip provided in the first internal space, installed corresponding to the first opening, and emitting a light beam through the first opening;
A light source sensor chip provided in the second internal space, installed corresponding to the second aperture, and receiving the light beam through the second aperture;
A proximity sensor package structure comprising:   The light-reflecting layer is further provided on the inner surface of the first internal space, and the diffused light emitted by the light-emitting diode chip is collected into the light beam and emitted from the first aperture. Proximity sensor package structure as described in 1.   The method according to claim 1, further comprising two transparent colloids filled in the first and second internal spaces, respectively, and covering the light emitting diode chip and the light source sensor chip, respectively. Proximity sensor package structure.   The proximity sensor package structure according to claim 3, wherein the material of the two transparent colloids is plastic.   The proximity sensor package structure according to claim 1, further comprising a plurality of input / output pins (I / O pins) around the bottom surface of the package body.   2. The proximity sensor package structure according to claim 1, wherein a translucent plate is provided on each of the first and second openings to shield the first and second openings. The package body is
Base and
A partition wall that is vertically connected to four sides of the base and forms a groove with the base;
A lid plate provided on the partition wall, sealing the concave groove, forming a housing space with the base and the partition wall, and having the first and second apertures;
A separator located in the housing space, wherein the first and second openings are located on different sides of the separator, the separator is vertically connected to the base and the cover plate, and the housing space is disposed in the first space The light emitting diode chip is located above the base in the first internal space and below the first opening, and the light source sensor chip is located in the base in the second internal space. A separator located above and below the second aperture;
The proximity sensor package structure according to claim 1, comprising: The package body is
A base comprising the second aperture;
A partition wall that is vertically connected to four sides of the base and forms a groove with the base;
A lid plate provided on the partition wall, sealing the concave groove, forming a housing space with the base and the partition wall, and having the first opening;
A separator located in the housing space, wherein the first and second openings are located on different sides of the separator, the separator is vertically connected to the base and the cover plate, and the housing space is disposed in the first space The light emitting diode chip is located above the base of the first internal space and below the first opening, and the light source sensor chip is the lid of the second internal space. A separator located on the plate and above the second aperture;
The proximity sensor package structure according to claim 1, comprising:   9. The proximity sensor package structure according to claim 7, wherein the base is a metal lead frame or a substrate.   The proximity sensor package structure according to claim 7 or 8, wherein a material of the partition wall is plastic.

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