JP3160874U - Transparent conductive plate circuit and touch panel - Google Patents

Abstract

A transparent conductive plate circuit and a touch panel that can be applied to a touch panel having a small size or a narrow side frame. A transparent conductive plate is provided with a transparent substrate, a transparent conductive film is coated on the transparent substrate, and a plurality of circuits are formed on the surface of the transparent substrate and the transparent conductive film by laser engraving. The transparent conductive plate is applied to a touch panel, particularly a small-size touch panel, and forms necessary circuits, and the pitch of each circuit is controlled within a relatively small range. [Selection] Figure 3

Description

  The present invention relates to a circuit of a transparent conductive plate, particularly applied to a touch panel, and more particularly to a circuit of a small touch panel.

Recently, touch-type man-machine interface, such as touch panel (Touch Panel), has been used in various electronic products, satellite positioning system (GPS), personal digital assistant (PDA), cellular phone and handheld PC (Handheld PC). -held PC), etc., to replace conventional input devices (eg keyboard and mouse). This significant design change not only improved the man-machine interface affinity of these electronic devices, but also eliminated the traditional input devices, created more space, and created a large display panel. It can be installed and is easy for users to browse.

In the publicly known touch control technology using a touch panel, the operation principle is different, and it is divided into multiple types such as optical, ultrasonic, infrared, capacitor, and resistive film types. ) Based touch control technology is widely applied to various terminal products. FIG. 1 shows a conventional resistive touch panel 10. This type of touch panel employs voltage detection type sensing, and is made of transparent conductive glass (ITO Glass) 11 coated with an indium tin oxide (ITO) conductive layer and an indium tin oxide (ITO) material. (ITO Film) 12 is included. Among them, the transparent conductive glass 11 and the transparent conductive film 12 adopt a screen printing technique, and a conductive silver paste is printed on each of the transparent conductive glass 11 and the transparent conductive film 12 at a neighboring edge position. Then, necessary circuits 14 and 17 are formed. Subsequently, insulating layers 15 and 18 and adhesive layers 16 and 19 are sequentially formed on each of the circuits 14 and 17, and a dot spacer 16 is formed between the transparent conductive glass 11 and the transparent conductive film 12. , Arrange multiple items at intervals. When flexible flat cables (FFC) 141 and 171 are installed on the circuits 14 and 17, the transparent conductive glass 11 and the transparent conductive film 12 are bonded together by the adhesive layers 16 and 19, and a touch panel is manufactured. The

When a user touches a certain position on the transparent conductive film 12 directly with a finger, a pen, or other tool, the transparent conductive film 12 at the position is electrically energized with the transparent conductive glass 11 and is moved to a corresponding position. In this case, a potential difference is generated. The control circuit of the circuit board calculates the coordinate value of the touched position based on the different potential difference detected by the flexible flat cables (FFC) 141 and 171 from the circuits 14 and 17, and places the cursor on the corresponding coordinate position of the touch panel. Is displayed.

In general, the conventional resistive touch panel is based on different wiring systems of the circuit, and is divided into different wiring types such as four wires, five wires, and six wires. Here, a five-line touch panel is taken as an example. As shown in FIG. 2, this touch panel has four circuits in the X and Y-axis directions that are laid in the vicinity of the transparent conductive layer of the glass substrate, and only one circuit is installed on the transparent conductive film. The voltage values of the X and Y axes are used to sample a total of five circuits. When the user touches the P point position on the touch panel with a finger or a pen, the control circuit supplies 5 volts of power to the two circuits 1 and 2 on the transparent conductive layer of the glass substrate. Circuits 4 and 5 are grounded (ie, the voltage is zero). At this time, the touch position is changed by resistance, the voltage is lowered, and the voltage value of Vpy is sampled from the circuit on the transparent conductive film. On the other hand, the control circuit supplies 5 volts to the two circuits 2 and 4 on the transparent conductive layer of the glass substrate, and the other two circuits 1 and 5 are connected to the ground (voltage). If zero), the circuit on the transparent conductive film samples the voltage value of VpX, and the voltage value of VpX and Vpy immediately after comparing the calculation of the control circuit, the coordinate position where the P point is located To inform.

The resistive touch panel signal output method can be divided into an analog type and a digital type. The analog operation principle is as described above, but the structure of the digital touch panel is a conductive model, the lower substrate is etched with ITO electrodes in the X-axis direction and Y-axis direction, and the upper and lower plates are joined. The post-formed matrix is the sensing block. The upper and lower electrodes are each provided with a plurality of X-axis and Y-axis electrode lines, and a controller is connected to these electrode lines to detect the touch signal of the conductive pattern, unlike the line layout of the analog touch panel. Simplify. In the digital method, the electrodes of each sensing block are connected, and the circuit installed on both sides becomes complicated, the side frame becomes too wide, or the line layout area is reduced by trying to narrow the side frame, and therefore the line width is reduced. Although it will be thinned, the yield rate decreases and the difficulty of processing increases.

In addition, when compared with resistive touch panels, based on the sensing principle, the structure of capacitive touch panel technology is based on surface capacitive and projected capacitive (projective)
capacitive) Divided into two types. Among them, the surface capacitor type structure uses four corner electrodes on the screen surface and forms an electric field uniformly in a plane in its action. The projected capacitance forms an X-axis and Y-axis sensing matrix by ITO processing, and determines the position of the contact point by a change in the electric field on the sensor network. Although it has many touch operation functions in this way, it requires a large number of channels and the line layout is a big problem. For example, a 12 × 18 panel has 216 traces (circuits). Necessary, and there are problems of wide width and complicated circuit processing. Furthermore, in order to respond to the market trend, many of today's mobile phones or small notebook personal computers are equipped with touch-type functions, and touch panel technologies corresponding to this technology are generally digital resistive touch panels and capacitor touch panels. In the industrial design, it is desired that the maximum display and touch space is formed in a small finite space. For this reason, the thickness of the line width and the line arrangement area of the circuit are problems that must be solved in the manufacturing process of this type of touch panel.

Regardless of whether the four-wire, five-wire, or six-wire type is adopted in the current conventional touch panel, all of these circuits perform screen printing, and conductive ink (silver paste) is transferred from the screen printing to the transparent conductive layer of the glass substrate. However, due to the limitations of the screen and ink characteristics, the following problems exist with respect to the image quality of these circuits, and the following negative effects are exerted on the performance expression and manufacturing cost of the touch panel.

The average ratio and stability of electrical resistance cannot be secured. The calculation formula for the conductor resistance is R = ρ * L / A = ρ * L / dh, where R is the conductor resistance, ρ is the resistance coefficient of the circuit material (compared to the electrical resistance), and A is the circuit. The cross-sectional area, d is the circuit width, and h is the circuit thickness. Under the condition that the material and line layout type of these circuits are fixed, these circuit resistance value parameters are affected, and the width and thickness of the circuit require a uniform circuit, which is the key to stabilizing the resistance value. Become. However, when the conductive ink (silver paste) is printed on the transparent conductive layer in the conventional screen printing process, the area where the conductive ink is applied is generally lower than 50% of the screen area due to the aperture ratio of the mesh on the screen. As a result, undulations at the mesh positions are formed on the surface of these printed circuits. In addition, problems such as dry plate or ink leakage generated in the screen printing process make it difficult to control the uniformity of the circuit thickness and the circuit collimation rate. In particular, when applied to products with high demands on touch accuracy, or small touch panels, the gap between the circuits is small, so the actual touch panel manufactured in the conventional screen printing process is actually in quality. Can't meet the demand.

Adhesive strength between conductive glass surfaces is not good. In the conventional screen printing process, after a conductive ink (silver paste) is printed on the transparent conductive layer, a baking process is performed to form a circuit, and the hardness of the circuit is tested with a standard lead pen. It can only withstand a lead pen hardness of only 4H or less with respect to the adhesion of the substrate, and if it exceeds 4H, it will break.

A high temperature firing process is required. In the conventional screen printing process, a circuit is formed by high-temperature baking. Therefore, the high temperature tends to deform the transparent conductive film, and indium tin oxide (ITO) is coated on the transparent conductive glass in a low temperature process. It will arrange and will change the whole impedance, and it will affect the electroconductivity of a touch panel.

The weather resistance and chemical resistance are not good. In the conventional screen printing process, a silver paste for a circuit is formed, and the component contains about 20% of a solvent, which makes the silver paste into a liquid form that is easy to print. In the drying process, the solvent volatilizes as the temperature rises, curing the silver paste and depositing it on the transparent conductive layer of the glass substrate. Among them, the main conductive factor silver adheres to the transparent conductive layer due to the adhesive strength of the gel. However, after the circuit formed with the silver paste is dried, it adheres to the solvent or moisture during the process or due to environmental factors. When the force decreases, the adhesive strength of the main conductive factor “silver” on the transparent conductive layer decreases as the colloidal adhesive strength decreases, and the problem of unstable quality appears.

Pollutes the environment. Since the conventional screen printing process is a wet process, an organic solvent is used in the process. The organic solvent pollutes the air when it volatilizes, and has a great influence by discharging the organic solvent.

In view of the problems of the screen printing process described above, the circuit is likely to be complicated, and the circuit is formed by a lithography process method in order to improve the drawbacks of the screen printing described above under the severe requirements of line width and pitch. . In the lithography process, the design on the photomask is transferred to the top surface of the photoresist with a UV light source emitted from the mask aligner, and the positive and negative properties of the photoresist material are different. Exactly the same or complement each other. The process is finely divided into photomask fabrication, pretreatment, bottom coating, photoresist coating, pre-baking, exposure, post-exposure baking, development, and curing baking. Although the line width and line space achieved by the lithography process are very fine, the cost of the photomask equipment and other related equipment is very high, which is a drawback.

Therefore, laser technology is applied to many semiconductors, printed circuit processes, such as laser welding, laser etching, laser direct development, laser BVH (blind via hole) processing, laser cutting molding, laser engraving technology, etc. Has been. As a known example, there is a kind of printed circuit board manufacturing method (see Patent Document 1 as an example), in which a metal is etched and a barrier layer is applied over the entire surface of the metal plating layer, and then irradiated with a laser beam to produce a conductor. The area not corresponding to the structure is selectively moved, and finally the exposed metal layer in this situation is etched to form a conductor structure.

As another known example, a kind of integrated circuit packaging technique is used to dispose a metal layer in an area that requires laser cutting. Subsequently, one end of the metal layer is connected to the surveying instrument. The instrument measures the resistance value or inductance of the metal layer, finds the resistance value or inductance line width and line space that need to be matched on the metal layer with the resistance value or inductance, and wire the metal layer with a laser. Cut to width and line space, and finally check with a surveying instrument whether this circuit matches the survey of the metal layer mentioned above, and if not, again adjust the line width of this circuit with a laser. (For example, see Patent Document 2)

So-called laser engraving is a machine in which a laser radar is applied to the surface of an object and engraves various effects based on differences in laser radar efficiency and laser radar beam density. Control. In the area of panels or touch panels, in the past, it was applied to the dot spacer (dot spacer) implantation technology of the touch panel in the laser process, or in a known example, the laser engraving technology was applied to the fine groove tank or Thin characters or designs were molded to solve the problem of LCD panel luminance imbalance (see Patent Document 3 as an example). In addition, there is a laser etching dry process, which mainly performs laser processing on ITO / Glass substrates and ITO / PET substrates, and does not require chemical etching and cleaning with chemicals and does not pollute the environment. . In the system design of the market, the user can etch and process the design based on the CAD value, so it has the features of high applicability, low cost and high industrial capacity. However, at present, the laser process technology is not applied on the circuit process of the conductive film of the touch panel.

Laser engraving has high accuracy, does not need to be touched during processing, and has low inertia, so the processing speed is increased. However, when laser irradiation is performed, the amount of heat at the processing site increases and the temperature increases. However, if the irradiation light spot is small and the beam moving speed is high, the influence due to the heat becomes small. If the laser brightness is high, the direction is good, and the light spot at the focal point is small, extremely high energy density and efficiency density are generated, and any metal can be melted and non-metals can be processed. It is particularly suitable for materials that are difficult to process by other methods of high hardness, high brittleness and high melting point.

European Union Patent Registration No. EP0062300 “Process for making a circuit board” Taiwan Patent Publication Gazette No. I259971 “Laser Cutting Technology for Thin Pitch Line Process” Taiwan Patent Publication No. M343817 "Diffusion plate and light guide plate structure using laser engraving"

    The problem to be solved is that it is expensive, pollutes the environment and cannot be controlled in a small area.

  In the present invention, a transparent substrate is installed, a transparent conductive film is coated on the transparent substrate, and a plurality of circuits are formed by laser engraving on the surface of the transparent substrate and the transparent conductive film. The transparent conductive plate is applied to a touch panel, particularly a small-sized touch panel, and forms a necessary circuit, and the main feature is that the pitch of each circuit is controlled within a relatively small range.

  The transparent conductive plate circuit and touch panel of the present invention have an advantage that they can be applied to a touch panel having a small size or a narrow side frame.

It is a structure exploded view of a well-known touch panel. It is a plane instruction | indication figure of the conductive glass of a well-known touchscreen structure, and a transparent conductive film. It is a structure three-dimensional view of the transparent conductive plate of this invention. It is a structure instruction | indication figure of the transparent conductive plate and metal mask of this invention. It is a structure exploded view of the touch panel of the present invention. It is a structural analysis figure of the touch panel of this invention. It is a structure instruction | indication figure of the touchscreen of this invention. It is an actual circuit diagram of the touch panel of this invention. It is a structure instruction | indication figure of another touch panel of this invention. It is a structure instruction | indication figure of another touch panel of this invention. FIG. 5 is a structural instruction diagram of another touch panel according to the present invention.

The main object of the present invention is to improve the circuit of a transparent conductive plate and to provide a touch panel thereof.

It is another object of the present invention to provide a transparent conductive film circuit having a fine line width and a line space of a conductive film.

It is another object of the present invention to provide a circuit applied to a touch panel having a small size or a narrow side frame.

In order to achieve the above-mentioned object, a transparent substrate is installed on the transparent conductive plate of the present invention, a transparent conductive film is coated on the transparent substrate, and a plurality of surfaces of the transparent substrate and the transparent conductive film are laser engraved by laser engraving. A circuit is formed. The transparent conductive plate is applied to a touch panel, particularly a small-sized touch panel to form a necessary circuit, and the pitch of each circuit can be controlled within a relatively small range.

    In the present invention “transparent conductive plate circuit and touch panel”, the transparent conductive plate 20 is provided with a transparent substrate 21 as shown in FIG. A transparent conductive film 22 is placed on the transparent substrate 21, and a plurality of circuits 23 are installed on the surfaces of the transparent substrate 21 and the transparent conductive film 22 by laser engraving. Among them, a shielding layer 24 is provided on the surfaces of the transparent substrate 21 and the transparent conductive film 22. As shown in FIG. 4, the shielding layer 24 is shielded without forming a circuit area, and a metal plating layer 25 (a silver metal is applied by a coating method) is provided at a location where the shielding layer 24 is not provided. Then, a plurality of circuits 23 are formed on the metal cage layer 25 by laser engraving.

The transparent substrate 21 is selected from either a glass substrate or a plastic substrate. When the transparent substrate 21 is a plastic substrate, the material is polyethylene terephthalate (PET), polycarbonate (Poly Carbonate, PC), polyethylene (Polyethylene,
PE), polyvinyl chloride (Poly VinYl Chloride, PVC), polypropylene (Poly Propylene, PP), polystyrene (Poly Styrene, PS), polymethyl methacrylate (Polymethylmethacrylate, PMMA), or a plastic polymer of a mixture thereof Etc.

The transparent conductive film 22 described above is constructed by a method in which indium tin oxide (ITO) is glued, electroplated, vapor deposited or sputtered.

In the above, a plurality of circuits 23 are formed on the metallization layer 25 by laser engraving, and the material of the metallization layer is one of gold, silver, copper, copper alloy, aluminum, aluminum alloy, tin, Or, a combination of them is selected.

The transparent conductive plate of the present invention is shown in FIG. 5 as an embodiment of the present invention in application of a touch panel. The touch panel structure is a general resistive touch panel structure, and includes at least a first transparent conductive plate 30, a second transparent conductive plate 40, and a plurality of dot spacers 50. Of which

The first transparent conductive plate 30 is provided with a first transparent substrate 31. The first transparent substrate 31 may be a glass substrate. The first transparent conductive film 32 is coated on the first transparent substrate 31, and the first transparent conductive film 32 is glued with indium tin oxide (ITO), electroplated, vapor deposited or sputtered. Build in. A plurality of first circuits 33 are formed on the surfaces of the first transparent substrate 31 and the first transparent conductive film 32 by laser engraving. A first insulating layer 34 is provided on the first circuit 33. Further, a cured coating layer 35 is constructed on the outer layer plate surface of the first transparent conductive plate 30 to prevent wrinkling of the touch panel.

The second transparent conductive plate 40 is provided with a second transparent substrate 41. The second transparent substrate 40 may be a glass substrate. The second transparent conductive film 42 is coated on the second transparent substrate 41, and the second transparent conductive film 42 is glued with indium tin oxide (ITO), electroplated, vapor deposited or sputtered. Build in. A plurality of second circuits 43 are formed on the surfaces of the second transparent substrate 41 and the second transparent conductive film 42 by laser engraving, and a second insulating layer 44 is provided on the second circuits 43.

Among them, an adhesive layer 36 is provided between the first insulating layer 34 and the second insulating layer 44. Among them, the adhesive layer 36 is installed on the peripheral edge at a position opposite to the first and second insulating layers 34 and 44 for use in bonding the lower conductive film. The adhesive layer 36 may be a double-sided adhesive layer, for example, a silicon sensitive adhesive (PSA), or a liquid adhesive. However, the present invention is not limited to the above two, and may have other double-sided adhesive functions.

The plurality of dot spacers 50 are installed between the first and second transparent conductive plates 30 and 40 and used to separate the first and second transparent conductive plates 30 and 40.

Of these, the circuits 33 and 43 are formed on the first and second transparent substrates 31 and 41 by laser engraving, and the pitch between the circuits 33 and 43 is controlled within a small range.

6, 7, and 8 are a structural analysis diagram, a structure instruction diagram, and an actual circuit diagram of another embodiment of the present invention. The structure is a digital resistive film type touch panel 60, which includes a third transparent substrate 61, and a third transparent conductive film 62 is provided on the transparent substrate. The third transparent conductive film 62 is horizontally arranged with a conductive block in which a plurality of X-axes are arranged as an example. A plurality of third circuits 63 formed by laser engraving are provided on the third transparent substrate 61. The fourth transparent substrate 64 forms a fourth transparent conductive film 65 on the transparent substrate, and the fourth transparent conductive film 65 vertically arranges a plurality of conductive blocks arranged in the Y axis. A plurality of fourth circuits 66 formed by laser engraving are provided on the fourth transparent substrate 64. The axial directions of the conductive blocks of the third conductive film 62 and the fourth conductive film 65 described above intersect perpendicularly to each other, the third conductive film 62 is arranged vertically, and the fourth conductive film 65 is arranged horizontally. Well, there are changes in actual application, and this embodiment is merely an example for explanation, and does not limit the axial direction. In addition, independent signal output units are formed at locations where the upper and lower sensing blocks in the X-axis and Y-axis directions intersect with each other. In addition, a plurality of dot spacers 67 are provided between the third transparent conductive film 62 and the fourth transparent conductive film 65 to support the third transparent conductive film 62 and the fourth transparent conductive film 65. Even if the distance is short, it will not be detected by conduction.

Further, an adhesive layer (not shown) is provided between the third circuit 63 and the fourth circuit 66. Among them, the adhesive layer is a double-sided adhesive layer, such as a silicone adhesive (Pressure
sensitive adhesive, PSA) or liquid adhesive. However, the present invention is not limited to the above two, and may have other double-sided adhesive functions.

In the present embodiment, the third transparent substrate 61 and the fourth transparent substrate 64 described above perform a circuit process by laser engraving. A good material is glass, but is not limited to this, polyethylene terephthalate (Polyethylene Terephthalate, PET), polycarbonate (Poly Carbonate, PC), polyethylene (Polyethylene,
PE), Polyvinyl chloride (Poly VinYl Chloride, PVC), Polypropylene (Poly Propylene, PP), Polystyrene (Poly Styrene, PS), Polymethylmethacrylate (Polymethylmethacrylate, PMMA), or a plastic polymer of a mixture thereof May be selected.

The plurality of third circuits 63 and the plurality of fourth circuits 66 are formed by laser engraving. In this method, a gold plating layer is deposited on a transparent substrate and a transparent conductive film, and most blocks that do not have a circuit in the middle of the conductive film are covered with a shielding layer during manufacture. Further, a metal layer is precipitated on the peripheral edge of the transparent substrate and the transparent conductive film, and then the shielding layer is removed. A plurality of circuits as shown in FIG. 8 are formed by laser engraving technology. Of these, the material of the gold layer is selected from one of gold, silver, copper, copper alloy, aluminum, aluminum alloy and tin, or a combination thereof.

Of these, the pitch between the circuits can be controlled within a relatively small range. For example, it is better to control within 20 to 100 μm, or to control within a circuit pitch of 20 to 50 μm. In addition, by controlling the line width of the circuit within 10 to 100 μm, the transparent conductive plate can be applied particularly in a touch panel with a small size and a narrow side width, the thickness is averaged, and the resistance value is It is stable and does not require high-temperature firing.

FIG. 9 is an instruction diagram of another embodiment of the present invention. The structure is a capacitor-type touch panel 70 and mainly includes a fifth transparent substrate 71. An upper transparent conductive film 72 is formed on one surface of the fifth transparent substrate 71, and the transparent conductive film is constructed by gluing indium tin oxide (ITO) and electroplating, vapor deposition plating or sputtering. In the same manner, a lower transparent conductive film 74 is formed on another surface of the fifth transparent substrate 71 opposite to the above-described surface. The upper and lower transparent conductive films 72 and 74 constitute the X-axis and Y-axis sensing electrodes of the capacitor-type touch panel. On the same surface of the upper transparent conductive film 72 of the fifth transparent substrate 71, The upper circuit layer 73 is formed by laser engraving on the peripheral edge of the material. Further, a lower circuit layer 75 is formed by laser engraving on the peripheral edge of another surface opposite to the above-described surface, and the upper and lower circuit layers 73 and 75 are electrically connected to the upper and lower transparent conductive films 72 and 74, respectively. Connected and used to drive and control the upper and lower sensing layers.

FIG. 10 is an instruction diagram of another embodiment of the present invention. The structure is a capacitor type touch panel 80 having another type of structure, and includes a sixth transparent substrate 81. An upper transparent conductive layer 82, an insulating layer 83, and a lower transparent conductive layer 84 are disposed in this order on one surface of the base material, and the upper and lower transparent conductive layers 82 and 84 are the same surface of the sixth transparent substrate 81. Install in. In the meantime, it is separated by an insulating layer 83 to prevent electrical interference with each other. A plurality of sixth circuits 85 are formed by laser engraving on the base material formed on the same surface of the transparent conductive layer, and the plurality of sixth circuits 85 are respectively formed of the upper transparent conductive layer 82 and the lower transparent layer. It is in electrical communication with the conductive layer 84. Compared with the capacitor-type touch panel having another structure described above, the structure is installed only on one surface of the base material, so that the process becomes simple.

FIG. 11 is an instruction diagram of still another embodiment of the present invention. The structure is a capacitor-type touch panel 90 and includes a seventh transparent substrate 91 and an eighth transparent substrate 94. The seventh transparent substrate 91 is provided with an X-axis transparent conductive layer 92 on the substrate, and includes a plurality of X-axis direction sensing blocks on the transparent conductive layer. In addition, a plurality of seventh circuits 93 are formed on the peripheral edge of the seventh transparent substrate 91 by laser engraving, and the seventh circuit 93 and each X-axis direction sensing block on the X-axis transparent conductive layer 92 are electrically connected. To do. Further, the Y-axis transparent conductive layer 95 is covered on the eighth transparent substrate 94, a plurality of Y-axis direction sensing blocks are provided on the transparent conductive layer, and laser engraving is provided on the peripheral edge of the eighth transparent substrate 94. A plurality of eighth circuits 96 are formed, and the Y-axis direction sensing blocks on the Y-axis transparent conductive layer 95 are electrically connected to each other, and the X-axis and Y-axis directions intersect perpendicularly. The seventh transparent substrate 91 and the eighth transparent substrate 94 are bonded to each other with an adhesive layer 97 to form a complete touch panel structure. The adhesive layer 97 is an optically clear adhesive (OCA), and the bonding method is such that the X-axis transparent conductive layer 92 and the Y-axis transparent conductive layer 95 are bonded to each other with the adhesive layer 97 facing each other. Or, the X-axis transparent conductive layer 92 and the transparent conductive layer of the eighth transparent substrate 94 are bonded to one side surface of the eighth transparent substrate 94 by the adhesive layer 97.

The fifth transparent substrate 71, the sixth transparent substrate 81, the seventh transparent substrate 91, and the eighth transparent substrate 94 described above are the circuit manufacturing method of the present invention, and it is preferable to use glass. Without limitation, its material is polyethylene terephthalate (PET), polycarbonate (Poly Carbonate, PC), polyethylene (Polyethylene,
PE), polyvinyl chloride (Poly VinYl Chloride, PVC), polypropylene (Poly Propylene, PP), polystyrene (Poly Styrene, PS), polymethyl methacrylate (Polymethylmethacrylate, PMMA), or a mixture of plastic polymers, etc. You may choose.

In addition, the upper circuit layer 73, the lower circuit layer 75 on the fifth transparent substrate 71, the sixth circuit 85 on the sixth transparent substrate 81, the seventh circuit 93 on the seventh transparent substrate 91, and the eighth transparent substrate. Each circuit of the eighth circuit 96 on 94 is formed on the substrate by laser engraving, and the pitch between each circuit can be controlled within a small range, for example, controlled within 20 to 100 μm. Alternatively, it is preferable to control the circuit pitch within 20 to 50 μm. In addition, the line width of the circuit is preferably controlled within a range of 10 to 100 μm to meet the requirements of the fine circuit and narrow side width of the product.

As described above, the present invention provides a circuit for a transparent conductive plate that can be used for a touch panel, and applies for a utility model registration based on the law. The technical contents and technical features of the present invention are as described above. However, persons skilled in this section may make replacements and modifications based on the present invention, without departing from the inventive spirit of the present invention. Therefore, the protection scope of the present invention is not limited to the embodiments, and includes replacements and modifications that do not depart from the present invention and are included in the following claims.

10 Conventional resistive touch panel 11 Transparent conductive glass 12 Transparent conductive film 13 Spacing point 14 Circuit 14
141 Flexible flat cable (FFC) 141
15 Insulating layer 15
16 Adhesive layer 16
17 Circuit 17
171 Flexible flat cable (FFC)
18 Insulating layer 19 Adhesive layer 19
20 Transparent conductive plate 20
21 Transparent substrate 21
22 Transparent conductive film 22
23 Circuit 23
24 Shielding layer 24
25 Kim Sakai 25
30 First transparent conductive plate 30
31 First transparent substrate 31
32 First transparent conductive film 32
33 First circuit 33
34 First insulating layer 34
35 Cured coating layer 35
36 Adhesive layer 36
40 Second transparent conductive plate 40
41 Second transparent substrate 41
42 Second transparent conductive film 42
43 Second circuit 43
44 Second insulating layer 44
50 dot spacer 50
60 Touch panel 60
61 Third transparent substrate 61
62 Third transparent conductive film 62
63 Third circuit 63
64 Fourth transparent substrate 64
65 Fourth transparent conductive film 65
66 Fourth circuit 66
67 dot spacer 67
70 touch panel 71 fifth transparent substrate 71
72 Upper transparent conductive film 72
73 Upper circuit layer 73
74 Lower transparent conductive film 74
75 Lower circuit layer 75
80 Touch panel 81 Sixth transparent substrate 81
82 Upper transparent conductive layer 82
83 Insulating layer 83
84 Lower transparent conductive layer 84
85 Sixth circuit 85
90 Touch Panel 91 Seventh Transparent Substrate 91
92 X-axis transparent conductive layer 92
93 Seventh circuit 93
94 Eighth transparent substrate 94
95 Y-axis transparent conductive layer 95
96 Eighth circuit 96
97 Adhesive layer 97

Claims (20)

In the circuit of the transparent conductive plate,
The transparent conductive plate comprises a transparent substrate, a transparent conductive film is coated on the transparent substrate, and a plurality of circuits are formed by laser engraving on the surface of the transparent substrate and the transparent conductive film. Board circuit.   2. The circuit of a transparent conductive plate according to claim 1, wherein the pitch of each circuit is 20 to 100 [mu] m, 20 to 50 [mu] m.   2. The circuit of a transparent conductive plate according to claim 1, wherein a line width of the circuit is 10 to 100 [mu] m. In the touch panel, at least a first transparent substrate is installed, a first transparent conductive film is coated on the first transparent substrate, and the surfaces of the first transparent substrate and the first transparent conductive film are a plurality of first by laser engraving. A first transparent conductive plate for forming a circuit;
A second transparent substrate is installed, a second transparent conductive film is coated on the second transparent substrate, and a plurality of second circuits are formed by laser engraving on the surfaces of the second transparent substrate and the second transparent conductive film. A second transparent conductive plate to be molded;
A plurality of dot spacers installed between the first and second transparent conductive plates and used to separate the first and second transparent conductive plates;
A touch panel comprising an adhesive layer disposed between the plurality of first circuits and the plurality of second circuits.   The touch panel according to claim 4, wherein the first circuit includes a first insulating layer, and the second circuit includes a second insulating layer.   The touch panel according to claim 1, wherein the pitch of each circuit is 20 to 100 μm, or 20 to 50 μm.   The touch panel according to claim 1, wherein a line width of the circuit is 10 to 100 μm. In the touch panel, at least,
A third transparent substrate is installed, the third transparent substrate is coated with a third transparent conductive film, and the surface of the third transparent substrate and the third transparent conductive film is formed by laser engraving to form a plurality of third circuits, Among them, on the third transparent conductive film, a third transparent conductive plate for installing a plurality of sensing blocks arranged in the X-axis direction,
A fourth transparent substrate is installed, the fourth transparent substrate is coated with a fourth transparent conductive film, and the fourth transparent substrate and the fourth transparent conductive film surface are formed with a plurality of fourth circuits by laser engraving. Of these, a plurality of sensing blocks arranged in the Y-axis direction are installed on the fourth transparent conductive film, the X-axis direction and the Y-axis direction intersect perpendicularly to each other, and the X-axis and Y-axis direction sensing blocks are arranged. A fourth transparent conductive plate in which an independent output unit is formed at a location intersecting with the upper and lower sides;
A touch panel comprising a plurality of dot spacers installed between the third and fourth transparent conductive plates and used to separate the third and fourth transparent conductive plates.   The touch panel as set forth in claim 8, further comprising an adhesive layer between the third and fourth transparent conductive plates.   The touch panel according to claim 8, wherein the pitch of each circuit is 20 to 100 μm, or 20 to 50 μm.   The touch panel according to claim 8, wherein a line width of the circuit is 10 to 100 μm. In the touch panel, at least,
A fifth transparent substrate;
An upper transparent conductive film formed on one surface of the fifth transparent substrate;
A lower transparent conductive film formed on another surface opposite to the surface of the fifth transparent substrate;
Laser engraving is used to form a peripheral edge on one surface of the fifth transparent substrate, the surface is the same surface as the upper transparent conductive film, and the plurality of circuits in the circuit layer and the upper transparent conductive film are electrically A connected upper circuit layer;
A plurality of circuits of the circuit layer and the lower transparent conductive film are formed by laser engraving on a peripheral edge of another surface opposite to the surface of the fifth transparent substrate, and the lower transparent conductive film includes a lower circuit layer that is electrically connected. Touch panel.   The touch panel according to claim 12, wherein the pitch of each circuit is 20 to 100 μm, or 20 to 50 μm.   13. The circuit and touch panel of a transparent conductive plate according to claim 12, wherein the line width of the circuit is 10 to 100 [mu] m. In the touch panel, at least,
A sixth transparent substrate;
An upper transparent conductive layer placed on one surface of the sixth transparent substrate;
A lower transparent conductive layer placed on the same surface of the sixth transparent substrate, and
An insulating layer installed between the upper transparent conductive layer and the lower transparent conductive layer and used to separate the two conductive layers;
The plurality of sixth circuits includes a plurality of sixth circuits electrically connected to the upper transparent conductive layer and the lower transparent conductive layer, respectively, disposed on the peripheral edge on the same surface of the sixth transparent substrate by laser engraving. A touch panel characterized by that.   The touch panel according to claim 15, wherein the pitch of each circuit is 20 to 100 μm, or 20 to 50 μm.   The touch panel according to claim 15, wherein a line width of the circuit is 10 to 100 μm. In the touch panel, at least,
A seventh transparent substrate;
An X-axis transparent conductive layer placed on one surface of the seventh transparent substrate;
A plurality of seventh circuits formed by laser engraving on a peripheral edge on the same surface of the seventh transparent substrate and electrically connected to the X-axis transparent conductive layer;
An eighth transparent substrate;
A Y-axis transparent conductive layer placed on one surface of the eighth transparent substrate;
A plurality of eighth circuits formed by laser engraving on the peripheral edge on the same surface of the eighth transparent substrate and electrically connected to the Y-axis transparent conductive layer;
A touch panel comprising an adhesive layer used to bond the seventh transparent substrate and the eighth transparent substrate together.   The touch panel as set forth in claim 18, wherein the pitch of each circuit is 20 to 100 μm and 20 to 50 μm.   The touch panel according to claim 18, wherein a line width of the circuit is 10 to 100 μm.