KR20140078881A - Touch panel using crystalline ito and amorphous ito - Google Patents

Abstract

The present invention relates to a touch panel using a crystalline ITO and amorphous ITO. The touch panel according to an embodiment of the present invention includes: a substrate; a plurality of first sensor patterns; and a plurality of second sensor patterns. The first sensor patterns include a plurality of sensor electrodes and a first bridge connecting the adjacent first sensor electrodes in a first direction.The second sensor patterns include a plurality of second sensors and a second bridge connecting the adjacent second sensor electrodes in a second direction.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a touch panel using a crystalline ITO and an amorphous ITO (TOUCH PANEL USING CRYSTALLINE ITO AND AMORPHOUS ITO)

The present invention relates to a touch panel manufactured using crystalline ITO and amorphous ITO and a manufacturing method thereof.

Recently, smart phones, tablet computers, game machines, learning aids, and cameras are widely used due to the development of portable devices. The input methods of these portable devices are evolving from the conventional mouse or keyboard entry method to the touch input method. Since the touch input method can directly select an icon or a program on the screen while viewing the screen, the user can not only intuitively use the device, but also has advantages in downsizing and lightening the device.

A touch panel is used as a means for inputting by touch as described above. The type of the touch panel may be classified according to the input method or the recognition method. For example, the touch panel may be a resistive type, a capacitive type, an electro-magnetic type, A surface acoustic wave type (SAW type), and an infrared type (touch panel). Of these, the currently popular method is a durable capacitive touch panel that is multi-touch capable as well as being fast and responsive.

The capacitance type touch panel has a plurality of sensor electrodes formed on a substrate for touch recognition, and a lead wire is connected to the sensor electrodes to measure capacitance change. As one example of the capacitive touch panel, two kinds of sensor electrodes are formed, and one kind of sensor electrodes are connected to each other in the Y-axis direction to form a sensor pattern (first sensor pattern) (Second sensor pattern) by connecting them in the X-axis direction to measure the capacitance formed between the sensor electrodes included in the two kinds of sensor patterns to calculate the coordinates of the contact points. Such capacitive touch panels are called mutual capacitive touch panels.

The mutual capacitance type touch panel can be divided into a two-layer structure and a single-layer structure. The mutual capacitance type touch panel of the two-layer structure has a problem in that the thickness of the two types of sensor patterns is increased because the two types of sensor patterns are disposed on different planes.

On the other hand, in the mutual capacitance type touch panel having a single layer structure, the thickness of the touch panel may not increase because the two kinds of sensor patterns are disposed on the same plane. However, in order to generate mutual capacitance, it is necessary that two types of sensor patterns intersect. That is, in the mutual capacitance type touch panel of the single layer structure, the sensor electrodes arranged in the same direction among the same kind of sensor electrodes are connected to each other by a bridge to form a sensor pattern, Respectively. At this time, the two sensor patterns should not be electrically connected to each other. To this end, an insulating layer is placed between the bridges where the two sensor patterns intersect so that one bridge is below the insulation layer and the other bridge is over the insulation layer.

In order to form the bridge and the bridge, the bridge must be patterned. However, the bridge or sensor electrode formed in the patterning process may be damaged. Therefore, it is necessary to form the secondary bridge without damaging the formed bridge or sensor electrode.

Thus, in the present invention, the first bridge is formed by crystalline ITO and the second bridge is formed by amorphous ITO, thereby minimizing the damage of the first bridge already formed in the second bridge formation process.

In one example of the present invention, a substrate; A plurality of first sensor patterns formed on the substrate along a first direction; And a plurality of second sensor patterns spaced apart from the first sensor pattern and formed on the substrate along a second direction intersecting the one direction, wherein the first sensor pattern includes a plurality of first sensor electrodes, And a first bridge connecting the first sensor electrodes adjacent to each other along the first direction, wherein the second sensor pattern includes a plurality of second sensor electrodes and the second sensor electrode adjacent to the second sensor electrode along the second direction, Wherein the first sensor pattern and the second sensor pattern are spaced apart from each other at the first bridge and the second bridge, and between the first bridge and the second bridge, Wherein the first bridge is formed of crystalline ITO, and the second bridge is formed of amorphous ITO.

According to an embodiment of the present invention, the first sensor electrode and the second sensor electrode may be formed of crystalline ITO.

According to an example of the present invention, the first bridge is disposed between the substrate and the insulating layer.

According to an example of the present invention, an antireflection layer may be formed on the two bridges.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: patterning a first sensor electrode, a first bridge and a second sensor electrode on a substrate using crystalline ITO; Forming an insulating layer on the first bridge; Applying amorphous ITO on the substrate on which the insulating layer is formed; And etching the amorphous ITO to form a second bridge.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: applying amorphous ITO on a substrate on which the insulating layer is formed, and then applying a material for forming an antireflection layer on the amorphous ITO; , The amorphous ITO and the anti-reflection layer forming material may be simultaneously etched to form an anti-reflection layer on the second bridge and the second bridge.

In the touch panel according to the present invention, the first bridge is formed by crystalline ITO and the second bridge is formed by amorphous ITO, thereby minimizing the damage of the first bridge already formed in the second bridge formation process .

1 is a simplified plan view of a touch panel according to an example of the present invention.
Fig. 2 is a plan view of the portion A shown in Fig. 1, and is a partial enlarged view of the bridge portion. Fig.
3 is a partial cross-sectional view taken along line I-I 'in Fig.
4 is a partial cross-sectional view taken along line II-II 'in FIG.
5 is a partial cross-sectional view of a touch panel according to another example of the present invention.
6 is a partial cross-sectional view of a touch panel according to another example of the present invention.
7A to 7E are views showing a step-by-step method of manufacturing a touch panel according to another example of the present invention.
8A to 8C are views illustrating a manufacturing method of a touch panel according to another example of the present invention.

Hereinafter, the present invention will be described in detail with reference to the examples disclosed in the drawings. However, the scope of the present invention is not limited by the drawings or examples described below. The drawings are merely illustrative of various embodiments of the present invention which are suitable for describing the present invention.

In order to facilitate understanding, each component and its shape may be drawn or exaggerated in the drawing, and the component in the actual product may not be represented and may be omitted. In addition, in adding reference numerals to the constituent elements of the drawings, it should be noted that the constituent elements having the same function have the same number as much as possible even if they are displayed on different drawings. Also, the terms "first "," second ", and the like are used to distinguish one element from another element, and the element is not limited thereto.

It will also be understood that where a layer or element is described as being on the " top " of another layer or element, it is to be understood that not only is the layer or element disposed in direct contact with the other layer or element, To the case where the third layer is disposed interposed between the first and second layers.

1 is a plan view of a touch panel according to an example of the present invention.

1, a touch panel according to an exemplary embodiment of the present invention includes a substrate 100, a plurality of first sensor patterns 200 formed on the substrate 100 along a first direction, And a plurality of second sensor patterns 300 formed on the substrate along a second direction spaced apart from the pattern 200 and intersecting the one direction. The first sensor pattern 200 includes a first bridge 220 connecting the plurality of first sensor electrodes 210 and the first sensor electrodes 210 adjacent to each other along the first direction, The second sensor pattern 300 includes a plurality of second sensor electrodes 310 and a second bridge 320 connecting the second sensor electrodes 310 adjacent to each other along the second direction. The first sensor pattern 200 and the second sensor pattern 300 are spaced apart from each other at the first bridge 220 and the second bridge 320, An insulating layer 500 is formed between the second bridges 320. Here, the first bridge 220 is formed of crystalline ITO, and the second bridge 320 is formed of amorphous ITO.

In the example shown in FIG. 1, the first direction is the Y axis direction, and the second direction is the X axis direction. In other embodiments, the first direction and the second direction may be interchanged.

The substrate 100 provides a space in which the first sensor pattern 200 and the second sensor pattern 300 are formed. The type of the substrate 100 is not particularly limited as long as it has transparency and a supporting strength of a predetermined strength or more. As the substrate 100, for example, a transparent conductive film such as polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES) Polyimide (PI) film, polystyrene (PS), biaxially oriented polystyrene (K resin), biaxially oriented PS (BOPS), polyimide ) Or glass may be used.

The first sensor pattern 200 together with the second sensor pattern 300 generates a signal by a user's touch to recognize the touch coordinates. The first sensor pattern 200 and the second sensor pattern 300 may be formed in a plurality of lines on the substrate 100. 1, the first sensor pattern 200 is formed as five lines and the second sensor pattern 300 is formed as four lines. However, each of the first sensor pattern 200 and the second sensor pattern 300 may be formed to have about five to twenty lines, Therefore, it may be formed in 20 lines or more.

In this case, the first sensor pattern 200 and the second sensor pattern 300 are formed to intersect each other. In FIG. 1, the first sensor pattern 200 and the second sensor pattern 300 are formed on one surface of the substrate 100 so that the dies intersect each other vertically. 1, the first sensor pattern 200 is formed parallel to the Y-axis direction, and the second sensor pattern 300 is formed parallel to the X-axis direction. In another embodiment, the first sensor pattern 200 may be formed to be flat in the X-axis direction, and the second sensor pattern 300 may be formed in parallel to the Y-axis direction.

The first sensor pattern 200 includes a plurality of first sensor electrodes 210 and a first bridge 220 connecting the first sensors. Here, the first sensor electrode 210 senses a user's touch. The shape of the first sensor electrode 210 is not particularly limited. Although FIGS. 1 and 2 illustrate a rhomboid shape, the first sensor electrode 210 may be formed in a rectangular, octagonal, or circular shape.

The first sensor electrode 210 may be formed of a transparent conductive oxide (TCO). As such TCO, there are ITO, IZO, and AZO, among which ITO (Indium Thin Oxide) can be used. The first sensor electrode may be formed using a conductive polymer having excellent flexibility as well as a simple coating process as well as the TCO.

In one embodiment of the present invention, the first sensor electrode 210 is formed of crystalline ITO.

The first bridge 220 is formed at the intersection of the second bridge 320 of the second sensor pattern 300 and serves to connect the adjacent first sensor electrode 210 in the Y axis direction. In one embodiment of the present invention, the first bridge 220 is formed of crystalline ITO.

The first sensor electrode 210 and the first bridge 220 may be formed using the same material and the first sensor electrode 210 and the first bridge 220 may be simultaneously patterned .

The second sensor pattern 300 generates a signal by the touch of a user together with the first sensor pattern 200 as described above. In FIG. 1, the second sensor pattern 300 is perpendicular to the first sensor pattern 200 And is formed on one surface of the substrate 100 in the X-axis direction.

The second sensor pattern 300 includes a plurality of second sensor electrodes 310 and a second bridge 320. Here, the second sensor electrode 310 senses the user's touch. The second sensor electrode 310 may also be formed in a rhombus (see FIGS. 1 and 2), a rectangle, an octagon, or a circle in the same manner as the first sensor electrode 210, but is not limited thereto.

Like the first sensor electrode 210, the second sensor electrode 310 may be formed of TCO or a conductive polymer including ITO.

In one embodiment of the present invention, the second sensor electrode 310 is formed of crystalline ITO.

The second sensor electrode 310 may be formed of the same material as the first sensor electrode 210 and the first bridge 220. The second sensor electrode 310 may be formed of the same material as the first sensor electrode 210 And the first bridge 220 may be simultaneously patterned.

The second bridge 320 is formed at the intersection of the first bridge 220 of the first sensor pattern 200 and connects the adjacent second sensor electrodes 310 in the X axis direction. An insulating layer 500 is interposed between the second bridge 320 and the first bridge 220 to prevent the second bridge 320 from being electrically connected to the first bridge 220.

The insulating layer 500 may be any transparent material that can heat electricity. The material of the substrate 100 may be the material of the insulating layer 500. [

Generally, after forming the first bridge 220, the first bridge 220 is protected by the insulating layer 500, and then the second bridge 320 is formed. In order to form the second bridge 320, it is necessary to apply the second bridge forming material to the substrate and then pattern the same. In the patterning of the second bridge 320, the first bridge 220 The first bridge 220 may be formed of crystalline ITO and the second bridge 320 may be formed of amorphous ITO.

In the case of amorphous ITO, it is possible to form a pattern under relatively mild etching conditions. In such a mild etching condition, the crystalline ITO has no or little damage. Thus, during the formation of amorphous ITO, crystalline ITO is protected with little damage. The first bridge 220 is formed of crystalline ITO and the second bridge 320 is formed of amorphous ITO to protect the first bridge 220 in the patterning process of the second bridge 320 can do.

FIG. 2 is a partially enlarged view of the portion A in FIG. 1, in which the sensor electrodes 210 and 310 among the components included in the portion A and the bridge portions 220 and 320 disposed at the center portion are expressed. 2, the substrate 100, the first bridge 220, the insulating layer 500, and the second bridge 320 are stacked in this order.

In order to explain the structure of the bridge in more detail, FIG. 3 shows a main part of a section cut along the line I-I 'in FIG. 3, a first bridge 220 is disposed on a substrate 100, and an insulating layer 500 is disposed to cover the first bridge 220. On the insulating layer 500, A second bridge 320 is formed. As shown in the figure, the second bridge 320 is configured as a bridge to connect the two second sensor electrodes 310 separated from each other.

As shown in the drawing, the first bridge 220 is disposed between the substrate 100 and the insulating layer 500. The second bridge 320 is disposed on the opposite side of the substrate 100 with respect to the insulating layer 500.

Lead wires 410 and 420 are formed on one end of the first sensor pattern 200 and the second sensor pattern 300 to receive an electrical signal from the first sensor pattern 200 and the second sensor pattern 300. 1, lead wires 411, 412, 413, 414, and 415 extending from one end of the first sensor pattern 200 extend to the bottom of the substrate, respectively, and connection terminals are formed at the ends thereof have. Lead wires 421, 422, 423, and 424 extending from one end of the second sensor pattern 300 extend to the side of the substrate and extend to a lower portion of the substrate, and connection terminals are formed at the ends.

The lead wires 410 and 420 may be printed using a silk screen method, a gravure printing method, an inkjet printing method, or the like. As the material of the lead wires 410 and 420, a silver paste or an organic silver material having excellent electrical conductivity may be used. The lead wires 410 and 420 are not limited thereto, and conductive polymers, carbon black, TCO, metals, or low resistance metals may be used.

1, the lead wire is connected to one end of the first sensor pattern 200 and the second sensor pattern 300. However, the first sensor pattern 200 and the second sensor pattern 300, 300 may be connected to both ends.

In one example of the present invention, an anti-reflection layer 600 may be formed on the second bridge 320 to enhance the visibility of the touch panel (FIGS. 5 and 6). FIG. 5 is a view showing that the antireflection layer 600 is formed on the second bridge 320 in FIG. 3, and FIG. 6 is a view showing that the antireflection layer 600 is formed on the second bridge 320 in FIG. will be.

The anti-reflection layer 600 may include a low refractive index layer and a high refractive index layer. The low refraction layer and the high refraction layer may be formed in two to five layers crossing each other. The low refraction layer may be formed of a material including any one of MgF ₂ , NaF, SiO _2, and CaF ₂ . The high refractive index layer may be formed of a material containing any one of CeF ₃ , Al ₂ O ₃ , ZrO ₂ , TiO ₂ and Nb ₂ O _x .

Hereinafter, a method of manufacturing a touch panel according to an example of the present invention will be described. The manufacturing method of the touch panel will be described step by step with reference to the drawings.

First, the first sensor electrode 210, the first bridge 220, and the second sensor electrode 310 are patterned on the substrate 100 using crystalline ITO (FIG. 7A). For example, after the crystalline ITO is coated on the entire surface of the substrate 100, the crystalline ITO is patterned to have the shapes of the first sensor electrode 210, the first bridge 220 and the second sensor electrode 310 on the substrate 100 The first sensor electrode 210, the first bridge 220, and the second sensor electrode 310 can be patterned.

Next, an insulating layer 500 is formed on the first bridge 220 (FIG. 7B). After the insulating layer material is applied to the entire surface of the substrate on which the first sensor electrode 210, the first bridge 220 and the second sensor electrode 310 are formed, So that the insulating layer completely covers the first bridge 220 and the other part is exposed.

Amorphous ITO 321 is coated on the substrate on which the insulating layer 500 is formed (FIG. 7C). The amorphous ITO may be applied to the entire surface of the substrate.

The amorphous ITO 321 is etched to form a second bridge 320. Specifically, before the amorphous ITO is etched, amorphous ITO (321) coated on the entire surface of the substrate is selectively exposed (FIG. 7D), and development and etching are performed to form a second bridge 320 pattern 7e). The mask 701 may be used in the exposure process.

As described above, after forming the first bridge 220, the first bridge 220 is protected by the insulating layer 500, and then the second bridge 320 is formed. In order to form the second bridge 320, amorphous ITO, which is a material for forming a second bridge, is applied to a substrate and then patterned into a second bridge shape by etching. In forming the second bridge 320, The first bridge 220 is formed of crystalline ITO and the second bridge 320 is formed of amorphous ITO in order to prevent the first bridge 220 from being damaged during the etching process.

In the case of amorphous ITO, pattern formation is possible under relatively mild etching conditions. In such mild etching conditions, crystalline ITO is hardly damaged. Thus, crystalline ITO can be protected during the etching process of amorphous ITO. Accordingly, the first bridge 220 is formed of crystalline ITO and the second bridge 320 is formed of amorphous ITO to protect the first bridge 220 in the etching process of the second bridge 320 .

According to another embodiment of the present invention, the step of applying the amorphous ITO on the substrate on which the insulating layer is formed (FIG. 7C), the step of applying the anti-reflection layer forming material 601 on the amorphous ITO 321 (Fig. 8A).

In forming the second bridge, the amorphous ITO 321 and the anti-reflection layer forming material 601 are simultaneously etched to form an anti-reflection layer 600 on the second bridge 320 and the second bridge Can be formed at the same time. Specifically, before the amorphous ITO 321 and the anti-reflection layer forming material 601 are etched, the amorphous ITO 321 and the anti-reflection layer forming material 601 are selectively exposed 8b, development and etching are performed to simultaneously form the second bridge 320 pattern and the antireflection layer 600 (FIG. 8C). In the exposure process, a mask 702 may be used.

Here, the step of applying the antireflection layer forming material may include a step of applying the substance for forming the low refractive index layer all over and a step of applying the substance for forming the high refractive index layer all over. The step of applying the substance for forming the low refractive index layer all over and the step of applying the substance for forming a high refractive index layer may be performed two to five times, respectively. The material for forming the low refractive index layer may include any one of MgF ₂ , NaF, SiO _2, and CaF ₂ . In addition, the material for forming the high-refractive-index layer may include any one of CeF ₃ , Al ₂ O ₃ , ZrO ₂ , TiO _2, and Nb ₂ O _x .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the present invention. It will be apparent that modifications and improvements can be made by those skilled in the art. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: substrate 200: first sensor pattern
210: first sensor electrode 220: first bridge
221, 222: first connection pattern 300: second sensor pattern
310: second sensor electrode 320: second bridge
410, 420: lead wire 500: insulating layer

Claims (6)

Board;
A plurality of first sensor patterns formed on the substrate along a first direction; And
And a plurality of second sensor patterns spaced apart from the first sensor pattern and formed on the substrate along a second direction intersecting the one direction,
Wherein the first sensor pattern includes a first bridge connecting the plurality of first sensor electrodes and the first sensor electrodes adjacent to each other along the first direction,
Wherein the second sensor pattern includes a plurality of second sensor electrodes and a second bridge connecting the second sensor electrodes adjacent to each other along the second direction,
Wherein the first sensor pattern and the second sensor pattern are spaced apart from each other at the first bridge and the second bridge,
An insulating layer is formed between the first bridge and the second bridge,
Wherein the first bridge is formed of crystalline ITO and the second bridge is formed of amorphous ITO. The touch panel of claim 1, wherein the first sensor electrode and the second sensor electrode are formed of crystalline ITO. The touch panel of claim 1, wherein the first bridge is disposed between the substrate and the insulating layer. The touch panel according to claim 1, wherein an antireflection layer is formed on the two bridges. Patterning the first sensor electrode, the first bridge and the second sensor electrode on the substrate using crystalline ITO;
Forming an insulating layer on the first bridge;
Applying amorphous ITO on the substrate on which the insulating layer is formed;
Etching the amorphous ITO to form a second bridge;
The method comprising the steps of: 6. The method of claim 5,
Further comprising the step of applying a material for forming an antireflection layer on the amorphous ITO after the step of applying amorphous ITO on the substrate on which the insulating layer is formed,
Wherein the step of forming the second bridge simultaneously etches the amorphous ITO and the anti-reflection layer forming material to form an antireflection layer on the second bridge and the second bridge.

Images