JP3158818U - LED lamp upright package structure - Google Patents

Abstract

An upright LED lamp that extends the life of an LED chip or makes the radiation of light uniform.
SOLUTION: A rectangular conductive heat dissipation substrate 1, a plurality of LED chips provided on both surfaces of the heat dissipation substrate, and a plurality of LED chips are electrically connected to form a plurality of series connections. Conductive wires, and four insulating sheets 5 and 51 provided on both sides of the heat dissipation substrate, which are attached to the respective insulating sheets and electrically connected to one end of the series connection of the LED chips. A plurality of pairs of conductive plates 6, 6A, 61, 61A that are paired with a conductive plate that is a positive electrode and a conductive plate that is electrically connected to the other end of the series connection of the LED chips and is a negative electrode; A plurality of series circuits are formed by the fluorescent layer covering the surface of the LED chip and the mold portion 8, and the conductive plate serving as the positive electrode, the conductive plate serving as the negative electrode, and the plurality of LED chips. The plurality of sets of series circuits are provided in parallel, and the plurality of series circuits are connected to a control circuit so that the series circuits can be selected to emit light alternately or simultaneously.
[Selection] Figure 5

Description

The present invention relates to an LED lamp, and more particularly to an upright LED lamp in which LED light emitting units are provided on both sides of an upright heat dissipation substrate to achieve uniform light emission.

In recent years, as technological innovations in the electronics industry have advanced, power-saving LED lamps as shown in FIG. 6 have been widely applied to various electronic products, replacing conventional tungsten light bulbs. However, in the structure in which a single LED chip with high efficiency is placed in the cup, the service life of the LED chip is shortened when the light is emitted for a long time. In addition, the circular structure is inconvenient in use because the light beam is condensed in front due to the refraction of the cup and a uniform light source cannot be obtained. There is room for improvement.

An object of the present invention is to provide an upright LED lamp capable of achieving uniform radiation of light and changing the color of light generated from an LED chip to a different color with a simple structure.

Another object of the present invention is to provide an upright LED lamp having a long service life.

Therefore, the upright package structure of the LED lamp according to the present invention consists of a heat dissipation substrate made of a rectangular conductive material, a plurality of LED chips provided on both sides of the heat dissipation substrate, and a conductive material. Four insulating sheets comprising a plurality of conductive wires that electrically connect the plurality of LED chips to form a plurality of series connection of LED chips, and an insulating material, and are provided on both surfaces of the heat dissipation substrate And a conductive plate that is made of a conductive material, is affixed on each of the insulating sheets, and is electrically connected to one end of the series connection of the LED chips to form a positive electrode, and the LED chips in series connection A plurality of pairs of conductive plates which are electrically connected to the other end of the first electrode and are paired with a conductive plate serving as a negative electrode, and a film layer containing fluorescent powder, A fluorescent layer covering the surface of the D chip, and a material having light transmission properties; the heat dissipation substrate; the plurality of LED chips; the plurality of conductive wires; the four insulating sheets; A plurality of LED chips, which are configured by a pair of conductive plates and a mold part that molds the two fluorescent layers, and are connected in series, the conductive plate that is a positive electrode, and the conductive plate that is a negative electrode A plurality of series circuits formed in parallel, and the plurality of sets of series circuits are provided in parallel, and the plurality of series circuits are connected to the control circuit and electrically connected to the series circuits. Select either the cyclic light emission mode in which light is emitted alternately for each series circuit, or all light emission modes in which all the LED circuits emit light simultaneously by energizing all the series circuits. Configure to be able to.

  The upright LED lamp according to the present invention can achieve uniform light emission, and thus can be widely applied to various lighting fixtures that require uniform illumination. Since the color of the light beam can be changed to correspond to various uses, it has the effect of being able to obtain a high degree of compatibility with industrial applications and a wide variety.

  Furthermore, the upright LED lamp according to the present invention has the advantage that the service life can be greatly extended as compared with the prior art, and an economic benefit can be obtained for the user.

It is the perspective view which showed the external appearance of the LED lamp by this invention. FIG. 2 is an exploded view of the LED lamp disclosed in FIG. 1. It is explanatory drawing which showed the structure of the positive / negative series circuit in this invention. It is the perspective view which showed the state which assembled the positive / negative series circuit disclosed in FIG. It is explanatory drawing which showed the state which the LED lamp by this invention light-emitted. It is explanatory drawing which showed the state which the LED lamp of the prior art light-emitted.

As shown in FIGS. 1 to 5, an upright LED lamp according to the present invention includes a heat dissipation substrate 1, a plurality of LED chips 2, a plurality of conductive wires 3, four insulating sheets 5, 51, 5A, 51A, a positive electrode, It includes four pairs of conductive plates 6, 61, 6 </ b> A, 61 </ b> A, 6 </ b> B, 61 </ b> B, 6 </ b> C, 61 </ b> C paired with the negative electrode, two fluorescent layers 7, 71, and a mold part 8.

The heat dissipation board 1 is made of a conductive material and is a rectangular plate material. In the embodiment, a copper plate is used. The plurality of LED chips 2 are light-emitting diode chips that are semiconductor elements, and are dispersed and fixed to the surface portion of the heat dissipation substrate 1. The plurality of conductive wires 3 are conductive wires. In the embodiment, as disclosed in FIGS. 3 and 4, both ends thereof are electrically connected to the respective LED chips 2, a plurality of LED chips 2 are connected in series, and the conductive materials located at both ends of the series are connected. One end of the wire 3 is electrically connected to the conductive plates 6, 61, 6A, 61A, 6B, 61B, 6C, and 61C, respectively, to form four sets of series connections.

The four insulating sheets 5, 51, 5A, 51A are made of an insulating material and are attached to both the front and back surfaces of the heat dissipation board. The four pairs of conductive plates 6, 61, 6A, 61A, 6B, 61B, 6C, 61C in which the positive electrode and the negative electrode are paired are plates made of a conductive material, and the insulating sheets 5, 51, 5A, 51A Each conductive plate is attached to the surface, and one conductive plate becomes a positive electrode, and the other conductive plate in a pair becomes a negative electrode. As disclosed in FIG. 4, a plurality of LED chips 2 connected in series and a positive electrode A series circuit is constituted by a conductive plate and a conductive plate serving as a negative electrode, and two sets of series circuits are formed on one surface of the heat dissipation substrate 1, and the series circuits are provided in parallel.

The two fluorescent layers 7 and 71 are film layers containing fluorescent powder, and cover the surface of each LED chip 2. Therefore, the color of the light emitted from each LED chip 2 changes as it passes through the fluorescent layers 7 and 71.

The mold portion 8 is made of a material having light transmissivity such as resin or silica gel, and includes a heat dissipation substrate 1, a plurality of LED chips 2, a plurality of conductive wires 3, four insulating sheets 5, 51, 5A, 51A, The four pairs of conductive plates 6, 61, 6 </ b> A, 61 </ b> A, 6 </ b> B, 61 </ b> B, 6 </ b> C, 61 </ b> C and the two fluorescent layers 7, 71 in which the positive electrode and the negative electrode form a pair are molded.

In other words, the upright LED lamp of the present invention in the embodiment has a total of four insulating sheets 5, 51, 5A, and 51A attached to each of one surface and the other surface of the heat dissipation substrate 1. On each insulating sheet 5, 51, 5A, 51A, four pairs of conductive plates 6, 61, 6A, 61A, 6B, 61B, 6C, 61C in which the positive electrode and the negative electrode are paired are attached. Four pairs of conductive plates 6, 61, 6 A, 61 A, 6 B, 61 B, 6 C, 61 C in which the positive electrode and the negative electrode are paired are electrically connected to the conductive wires 3 positioned at both ends of the series connection formed by the plurality of LED chips 2. The series circuit is configured with one conductive plate as a positive electrode and the other conductive plate as a negative electrode. Further, two sets of the series circuits are provided on both surfaces of the heat dissipation substrate 1, and a total of four series circuits are provided in parallel.

The four series of series circuits are electrically connected to a control circuit (not shown) such as an IC to control light emission of the plurality of LED chips 2. That is, a control circuit (not shown) is electrically connected to each of the conductive plates 6, 61, 6A, 61A, 6B, 61B, 6C, 61C paired with the positive electrode and the negative electrode, and a plurality of LED chips 2 are connected. Control light emission. In this case, under the control of the control circuit, the respective series circuits are sequentially energized, and the respective LED chips 2 electrically connected to these series circuits are alternately lit for each single series circuit. All the light emission modes in which all the circuits including the series and the parallel are energized and all the LED chips 2 emit light simultaneously can be selected.

Therefore, according to this device, the light emission time of each LED chip 2 can be shortened by causing the plurality of LED chips 2 to emit light in order, and the service life of the LED chip 2 can be extended. Uniform light irradiation can be obtained by simultaneously emitting light from all the LED chips 2. Furthermore, the light emitted from the LED chip 2 passes through the fluorescent layers 7 and 71, whereby the color of the light can be changed, and the needs of a wide variety of lighting fixtures can be met.

DESCRIPTION OF SYMBOLS 1 Heat dissipation board 2 LED chip 3 Conductive wire 5, 51, 5A, 51A Insulating sheet 6, 61, 6A, 61A, 6B, 61B, 6C, 61C Conductive plate 7, 71 Fluorescent layer 8 Mold part

Claims (1)

A heat dissipation substrate made of a rectangular conductive material;
A plurality of LED chips provided on both sides of the heat dissipation substrate;
A plurality of conductive wires made of a conductive material, electrically connecting the plurality of LED chips, and forming a plurality of series connection of LED chips;
Made of a material having insulating properties, and four insulating sheets provided on both sides of the heat dissipation substrate;
A conductive plate made of a conductive material, adhered to each of the insulating sheets, and electrically connected to one end of the series connection of the LED chips to become a positive electrode; A plurality of pairs of conductive plates electrically connected to the ends and paired with a conductive plate that is a negative electrode;
A film layer containing fluorescent powder, the fluorescent layer covering the surface of the plurality of LED chips;
The heat-radiating substrate, the plurality of LED chips, the plurality of conductive wires, the four insulating sheets, the plurality of pairs of conductive plates, and the two fluorescent plates And a mold part for molding the layer,
A plurality of series circuits are formed by the plurality of LED chips connected in series, the conductive plate serving as a positive electrode, and the conductive plate serving as a negative electrode, and the plurality of sets of series circuits are provided in parallel, and The plurality of series circuits are connected to a control circuit, and each LED chip electrically connected to the series circuit is in a cyclic light emission mode in which light is emitted alternately for each series circuit, or all the series circuits are connected to each other. An upright package structure of an LED lamp, characterized in that it can be selected in any of all emission modes in which all LED chips emit light simultaneously when energized.

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