JP3152236B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component used for various electronic devices, and more particularly to a method of manufacturing an electronic component manufactured by intaglio printing.

[0002]

2. Description of the Related Art In recent years, miniaturization of electronic devices has been progressing.
Along with this, downsizing of electronic components used in electronic devices has been progressing. Under these circumstances, a conductor pattern for the purpose of miniaturizing conductor lines (hereinafter simply referred to as lines) and lowering line resistance is also formed for a conductor pattern of an electronic component. There is a demand for an increase in the thickness of the conductive film and a stacked structure for further miniaturization.

Conventionally, a conductive pattern of an electronic component is formed by printing a conductive paste pattern such as a silver paste or a copper paste on an object (substrate) by a printing method such as screen printing or intaglio printing, and firing the pattern. It has been formed. For example, as an application of the intaglio printing method, see Japanese Patent Application Laid-Open No. H4-2407.
As disclosed in Japanese Unexamined Patent Publication No. 92-92, a conductive paste (organic metal ink) is filled in an intaglio corresponding to a conductive pattern to be formed, and the conductive paste is dried and cured. There is known a printing method in which a desired conductor pattern is formed by transferring the pattern through a curable resin.

Further, in a hybrid IC circuit, a thermal head, a transparent electrode, or the like, since the width of each line and the interval between lines in a conductor pattern become fine, a method utilizing thin film formation and etching is used. May be. In this method, a thin film of a conductive material such as gold, aluminum, or ITO is formed on a substrate, which is an object, by vapor deposition or sputtering, and a desired conductive pattern is formed by photolithography using a photosensitive resin. A mask pattern is formed, and then an etching solution and a mask pattern are used to etch the thin film of the conductive material, and finally, the photosensitive resin is removed to form a conductive pattern.

[0005]

However, the above-mentioned conventional method has the following problems.

[0006] Conventional screen printing can be performed with relatively inexpensive equipment and requires a small number of steps. However, the width of the conductor pattern line to be formed is 70 μm.
It is difficult to form the following fine conductor pattern by screen printing. Also, if the line pitch is 1
It is difficult to reduce it to 50 μm or less. Also, in screen printing, conductor patterns are printed uniformly,
A height difference (line height difference) cannot be provided in a pattern in accordance with design requirements.

In the conventional intaglio printing, the line width is 50 μm.
Although it is possible to form a fine conductor pattern having a line pitch of about 100 μm with a thickness of about m, it is difficult to form a conductor film having a thickness of 5 μm or more, and there is a limit in reducing conductor resistance.

On the other hand, in order to achieve a desired high density of an electronic component, it may not be sufficient to make the conductor pattern of each layer finer, and thus it is necessary to form a laminated structure. In such a laminated structure, the lower conductor pattern,
A sandwich structure consisting of an insulating layer and an upper conductor pattern is formed by overlapping. In this case, it is necessary to form via holes connecting the conductor patterns of the upper and lower layers. However, with the miniaturization of the conductor patterns, the miniaturization of these via holes is also required. However, Japanese Patent Application Laid-Open No.
With the conventional printing method including the method disclosed in Japanese Patent No. 40792, it is difficult to form a fine via hole having a diameter of 100 μm or less.

Furthermore, in order to obtain reliable electrical connection between the conductor patterns of the upper and lower layers, it is necessary to form an electrode (hereinafter, referred to as a via hole electrode) for connecting the upper and lower layers inside the via hole. However, in the conventional method, even if a fine via hole having a diameter of 100 μm or less can be formed, it is difficult to form an electrode inside the via hole having such a size.

In the conventional intaglio printing, an intaglio formed of a rigid material such as glass or a silicon wafer is generally used. In that case, in the process of transferring the conductor pattern onto the object to be formed such as a ceramic or a glass substrate via the curable resin, even if the intaglio and the object to be bonded are to be peeled off, the intaglio is almost deformed. Absent. As a result, the intaglio and the object to be formed must be separated from each other, and a strong peeling force is required.

Further, when a metal material is used as the intaglio, the patterning of the intaglio (the formation of grooves) is performed by wet etching. Since this etching is an isotropic etching, it is not possible to process an intaglio shape having a high aspect ratio, which is necessary for forming a conductor pattern in which the conductor film is thick (that is, the line is high) with respect to the line width. .

On the other hand, the formation of a conductor pattern using photolithography is effective when a pattern having a line width of several μm or less and a small area is formed, as is common in semiconductor technology. However, formation of a conductor pattern used in an electronic component generally requires forming a pattern having a relatively large area. In such a case, deposition of a conductive film, application of a resist, exposure, development,
A series of steps such as etching and resist removal must be performed using a large-sized apparatus. As a result, since the equipment used is expensive, the manufacturing cost tends to increase.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a via hole electrode having a thinner line width of a conductive pattern, a larger thickness of a conductive film, and a dimension substantially equal to the line width is provided. It is an object of the present invention to provide a method of manufacturing an electronic component capable of forming a fine conductor pattern including the same at low cost and with high reliability.

[0014]

In order to achieve the above object, a method for manufacturing an electronic component according to the present invention is a method for manufacturing an electronic component by transferring and forming a first conductor pattern on a substrate by intaglio printing. (A) forming a groove in the surface of the intaglio; (b) filling the groove with a conductive paste;
(C) a step of bonding the intaglio filled with the conductive paste and the substrate; and (d) a step of peeling the intaglio from the substrate and transferring the conductive paste onto the substrate to form a first conductive pattern. Forming an intaglio plate, the intaglio plate being made of a flexible resin sheet, and first conductor patterns having different heights being simultaneously transferred and formed using intaglio plates having grooves of different depths. It is assumed that.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the method for manufacturing an electronic component according to the present invention will be described with reference to the drawings.

(Embodiment 1) A first embodiment of a method of manufacturing an electronic component according to the present invention will be described below with reference to FIGS. 1 to 10 by taking a method of manufacturing a high-frequency chip inductor 1 as an example. I do. In the following drawings, the same components are denoted by the same reference numerals.

FIG. 1A is a plan view of a chip inductor 1 according to the present embodiment, and FIG.
Sectional views of the chip inductor 1 taken along the line 1B 'are shown.

The chip inductor 1 has a spiral coil conductor (line) 3 formed on a surface near the center of an insulating substrate 2 of 2 × 1.25 mm, and terminal electrodes formed on both edges of the insulating substrate 2. 4a and 4b. The outer end 3a of the coil conductor 3 is connected to one terminal electrode 4a. The inner end 3b of the coil conductor 3 is connected to the other terminal electrode 4b via the lead electrode 6 and the via hole electrode 7. The lead electrode 6 is further provided on the outermost surface of the insulating layer 5 formed on the surface of the insulating substrate 2 so as to cover the coil conductor 3 after the coil conductor 3 is formed. The via-hole electrode 7 connects the lead electrode 6 on the outermost surface of the insulating layer 5 to the coil conductor 3 on the lowermost surface of the insulating layer 5.

The chip inductor 1 is manufactured by intaglio printing. Hereinafter, the manufacturing method will be described in order. The steps 210 to 310 appearing in the following description are shown in the block diagram of FIG.

First, referring to FIG.
0 manufacturing process 210 will be described. The intaglio 20 is formed on a 125 μm thick polyimide film 15 fixed on an XY stage 16. A laser beam having a wavelength of 248 nm in the ultraviolet region emitted from the excimer laser device 11 irradiates a mask 12 having a mask pattern corresponding to a spiral pattern of a coil to be formed and a terminal electrode pattern. The laser beam after passing through the mask 12 is reflected by the mirror 13, reduced by the imaging lens 14, and irradiates the polyimide film 15. A portion of the polyimide film 15 irradiated with the laser beam is decomposed by a photochemical reaction to form a groove 21 (see FIG. 4) corresponding to the line of the conductor pattern. Thereby, an intaglio 20 corresponding to a desired pattern is formed. By repeating the above-described irradiation operation while moving the XY stage 16, typically, 100 mm × 10
On a polyimide film 15 of 0 mm, size 2 × 1.2
A total of 4000 5 mm intaglios 20 are formed.

In the processing using an excimer laser, the processing using a carbon dioxide gas laser or a YAG laser is a thermal decomposition processing using a laser beam in an infrared wavelength region, whereas the processing using a laser beam in an ultraviolet wavelength region reaching a peak power of several tens of MW. Disassembly processing. Further, since the pulse width of the laser beam is short, there is little thermal influence on the surroundings other than the processing region. As a result, in the processing by the excimer laser, fine processing with a pattern line width of 10 μm or less can be performed.

The surface of the polyimide film 15 irradiated with the laser beam has a chemically activated state in which the bonds of the molecules constituting the film are broken. Therefore, a chemical bond is likely to occur in that portion. This feature is advantageous for forming a release layer described later.

FIG. 4 shows an intaglio 20 formed by the above method.
Shows a typical cross-sectional shape of the groove 21 of FIG. By appropriately adjusting the characteristics of the optical system used in the laser processing step, such as the depth of focus of the lens, the side surface of the groove 21 can be 2 to 60 mm.
It is formed so as to have a trapezoidal cross-sectional shape having a taper angle of °. Thus, in a later step, the transfer of the conductive paste filling the inside of the groove 21 onto the workpiece can be easily performed. The shape of the laser beam used is typically a rectangle of 8 × 24 mm when emitted from the excimer laser device 11 and a rectangle of 3.2 × 9.6 mm when irradiated on the polyimide film 15. is there.

Further, by providing an appropriate protective layer on the processed surface of the polyimide film 15 which is the material of the intaglio 20, it is possible to protect the processed surface of the intaglio 20 from interaction with plasma generated when the grooves 21 are formed. it can. Thereby, deformation of the opening of the groove 21 on the surface of the intaglio 20 can be prevented. In addition, as a material of the above-mentioned protective layer, for example, polyethylene terephthalate (PET), polycarbonate (PC), and polysulfone (PSF) can be used.

Next, the mask 12 is replaced with a mask for forming the via-hole electrode 7 and a laser beam is further irradiated to place the via-hole electrode 7 at a predetermined position in the groove 21 of the conductor pattern formed in the previous step. Is formed (see FIG. 5). In forming the pits 22, fine processing can be performed similarly to the formation of the grooves 21, and the pits 22 can be formed to have a tapered shape so that the filled conductive paste can be easily transferred. . The pit 2 having a shape other than the cylindrical shape
2 can also be formed.

According to the above method, the width is 10 μm to 50 μm.
An intaglio 20 corresponding to a conductor pattern to be formed is formed, including a groove 21 having a depth of 20 μm corresponding to a line m and a pit 22 having a diameter of 60 μm corresponding to a via hole electrode having a diameter of 45 μm. The depths of the grooves 21 and the pits 22 can be arbitrarily changed in units of 0.2 μm by changing only the irradiation time of the laser beam without changing the line width (the width of the grooves 21), and have an optimum value. be able to. Further, the width of the groove 21 and the diameter of the pit 22 can be easily adjusted by changing the dimensions of the mask.
Thus, according to the method of the present embodiment, the line width of the conductor pattern can be reduced to 10 μm or less, and the size of the via hole can be reduced corresponding to such a fine line.

By using the polyimide film 15 as the material of the intaglio 20 as described above, the intaglio 20 can have flexibility (flexibility). The effect obtained by this will be described later.

Using the intaglio 20 formed by the above method,
The conductor pattern is transferred to the surface of the object. However, the polyimide film 15 used as the material of the intaglio 20 has insufficient peeling properties between the film 15 and the conductive paste filled and transferred into the grooves 21 and the pits 22. Therefore, in the transfer step, the conductive paste easily remains inside the grooves 21 and the pits 22. Particularly, in the pit 22 corresponding to the via hole electrode 7, the conductive paste remains particularly remarkably due to its deep depth. As a result, the shape of the intaglio 20 is not sufficiently transferred. Therefore, in order to realize transfer of a substantially complete intaglio shape, a step 220 of forming a release layer on the surface of the intaglio 20, particularly on the surfaces of the grooves 21 and the pits 22 is required.

In order to solve the above-mentioned problems, the inventors have intensively studied the peeling treatment for the polyimide film 15, particularly in view of the peeling force for the conductive paste and the life of the treated layer. As a result, it was confirmed that it was effective to form a release layer of a fluorocarbon monolayer by the following method.

First, the surface of the intaglio 20 is irradiated with oxygen plasma by an O ₂ asher to increase the density of oxygen existing on the surface of the intaglio 20. On the other hand, n-hexadecane (or may be toluene, xylene, dicyclohexyl)
A non-aqueous solvent such as a mixture of a substance containing a fluorocarbon group and a chlorosilane group in a mixed solution of 80%, 10% of carbon tetrachloride and 8% of chloroform, for example, CF ₃ (CF ₂ ) ₇ (C
Prepare a solution of H ₂ ) ₂ SiCl ₃ at a concentration of about 1%. The intaglio 20 subjected to the oxygen treatment as described above is immersed in this solution to form an oxide film on the surface of the intaglio 20. The surface of this oxide film contains many hydroxyl groups,
SiCl of a substance containing a fluorocarbon group and a chlorosilane group
Reacts with the group to cause a dechlorination reaction. As a result, intaglio 2
The fluorocarbon-based monomolecular film chemically adsorbed to the surface of the intaglio 20 by covalent bonds is formed over the entire surface of the intaglio 20. This monolayer effectively functions as the release layer 23 (see FIG. 5).

The portions requiring a large peeling force at the time of peeling are mainly the portions of the grooves 21 and the pits 22, and it is desirable that the peeling layer 23 is mainly formed in such a portion.
On the other hand, as described above, the portions of the polyimide film 15 forming the intaglio 20 where the grooves 21 and the pits 22 are formed by the processing using the excimer laser are in a chemically active state. As a result, the release layer 23 of the fluorocarbon-based monolayer described above is formed to be bonded more inside the grooves 21 and the pits 22 that require a large release force at the time of release. In addition, since the bond between the release layer 23 and the intaglio 20, that is, the above-mentioned monomolecular film and the polyimide film 15 is a covalent bond, the two are very strongly bonded to each other and have a durability of the release effect. Further, the thickness of the release layer 23 is 10
Because it is as thin as 0-1000 angstroms, intaglio 20
Many conductive pastes can be filled in the intaglio 20 without affecting the shape accuracy of the intaglio.

As described above, the release layer 23 formed on the surface of the intaglio 20 in the step 220 has very excellent characteristics.

Next, in step 230, an Ag paste 24 is applied as a conductive paste to the surface of the intaglio 20 on which the release layer 23 has been formed as described above. Then, by scraping the surface of the intaglio 20 after application with a squeegee 25, the excess Ag paste 24 on the surface of the intaglio 20 is removed, and the Ag paste 2 is placed in the grooves 21 and the pits 22.
4 (see FIG. 5).

According to the study on the material of the squeegee 25 used by the inventors, according to the present embodiment, the ceramic squeegee 2 is used for the following reason.
It has been found that the use of 5 is desirable. That is,
For resin or steel squeegee, use Ag paste 2
4 are easily damaged by foreign substances contained in the ink or dust existing on the surface of the intaglio 20. Therefore, the surface of the intaglio 20 is easily damaged by such flaws on the surface of the squeegee, and the life of the intaglio 20 is reduced. On the other hand, since the squeegee 25 made of ceramic is hard, the tip of the squeegee 25 is hardly damaged by foreign matter or dust. Furthermore, if the tip of the ceramic squeegee 25 is made smooth with a fine abrasive of 2000 or more, it is possible to prevent wear due to prolonged wear. As a result, the ceramic squeegee 25 scarcely damages the surface of the intaglio 20.

Next, the intaglio 2 filled with the Ag paste 24
The organic solvent in the Ag paste 24 is evaporated by drying 0 using a circulating hot air dryer (step 240). Thereby, the Ag paste 24 filled in the grooves 21 and the pits 22 of the intaglio 20 can be fitted to the shapes of the grooves 21 and the pits 22 to obtain a sharper shape. The drying means is not limited to the above.

A relatively deep groove 21 and pits 22 are formed on the surface of the intaglio 20 used in the present embodiment. In particular, the pit 22 has a maximum depth of 60 μm. Therefore, when the intaglio 20 is rapidly dried at a temperature of 100 ° C. or more in the drying step 240, the Ag paste 24 filled in the grooves 21 and the pits 22 has a diameter of 5 μm.
Pinholes of ４０40 μm tend to occur. Line width is 5
In a fine conductor pattern having a size of 0 μm or less, such a pinhole causes an open failure after pattern firing, and hinders formation of a high-quality conductor pattern.

Therefore, in the drying step 240 of the present embodiment, the intaglio 20 is dried in two stages as follows. That is, preliminary drying is performed at a temperature of 100 ° C. or less for 5 minutes, and then drying is performed at a temperature of 150 ° C. for 5 minutes. As a result, it is possible to prevent the occurrence of the pinhole as described above, and it is possible to form a conductor pattern without occurrence of an open defect after firing.

In place of the above-mentioned predrying, the same effect of suppressing the generation of pinholes can also be obtained by raising the temperature from room temperature to 150 ° C. with a gentle temperature gradient of 15 ° C./min or less. Obtainable.

When the Ag paste 24 inside the grooves 21 and the pits 22 is dried in the above step 240, the flexibility tends to be lost. As a result, when a conductor pattern having a fine line width (for example, 100 μm or less) is transferred, cracks may occur in the Ag paste 24 due to stress generated at the time of transfer, which may cause open defects after firing. is there. To prevent such inconvenience,
In the present embodiment, 0.1 to 10 wt.
% Plasticizer is added. Thereby, Ag paste 2
4 can have an appropriate flexibility even after drying, so that the occurrence of cracks in the transfer step can be prevented. As the plasticizer, a phthalate-based plasticizer such as dimethyl phthalate, diethyl phthalate, or dioctyl phthalate can be used.

When the drying step 240 described above is performed, the volume of the Ag paste 24 filled in the grooves 21 and the pits 22 is reduced by the amount corresponding to the evaporation of the organic solvent. Therefore, to make up for this decrease, Ag paste 2
Step 4 is repeated once more. The Ag paste 24 once dried by the evaporation of the organic solvent in the previous drying step 240 is softened again by this refilling. The refilling step 250 and the redrying step 260
Thereby, the shape of the filled Ag paste 24 can be further improved, and the thickness of the Ag paste 24 can be made equal to the depth of the grooves 21 and the pits 22 of the intaglio 20.

If the Ag paste 24 remains in the non-pattern portions of the intaglio 20, particularly in the portions between the respective grooves 21, a short circuit between the lines of the conductor pattern may be caused. Such Ag paste 24 remains because the Ag paste 24 is viscous and easy to thread, and the thread to be removed during the scraping of the unnecessary paste by the squeegee 25 is removed. Ag paste 24 remains. However, as described above, in the refilling step 250, when refilling is performed in a state where the dry Ag paste 24 is present inside the grooves 21 and the pits 22, the Ag paste 24 newly applied to the non-pattern portion is Is absorbed by the dry paste inside the grooves 21 and the pits 22 and remains in the non-pattern portions.
The viscosity of the g paste 24 increases. As a result, when the Ag paste 24 in the non-pattern portion is removed with a squeegee, the threading phenomenon does not occur, and the remaining paste in this portion is easily removed. Therefore, it is possible to form a conductor pattern that does not cause a short circuit between lines.

In the description of the present embodiment, the refilling step 250 and the redrying step 260 are each repeated once, but they may be repeated two or more times as necessary.

Next, a thermoplastic resin layer 28 is formed on the insulating substrate 2.
Is formed to obtain an object on which the conductor pattern is transferred. This resin layer 28 functions as an adhesive layer at the time of transfer. Then, as schematically shown in FIG.
The intaglio 20 and the insulating substrate 2 are laminated with the surface of the intaglio 20 on the side having the grooves 21 and the pits 22 filled with the paste 24 facing the thermoplastic resin 28 (step 2).
70).

As will be described later, when the thickness of the thermoplastic resin layer 28 is extremely large, a large amount of combustion gas is generated in the resin layer 28 during firing, which causes a problem that a conductor pattern is not formed well. . As a result of a study by the inventor, it has been confirmed that the thickness of the resin layer 28 is suitably 20 μm or less.

The temperature of the laminating step 270 is from a temperature 30 ° C. lower than the glass transition temperature of the resin layer 28 to be used.
It is desirable to set the temperature within a range of 100 ° C. higher.
When the laminating temperature is higher than the upper limit, the fluidity of the resin layer 28 becomes too large, and the resin layer 28 becomes thin due to the pressure at the time of laminating. It does not work well. On the other hand, when the lamination temperature is lower than the lower limit, the fluidity of the resin layer 28 is not sufficient, and the Ag paste 2
4 and the resin layer 28 become poor in adhesion, so that the transfer is not performed well.

Further, the pressure during lamination is 1 kg / cm
It is desirable to set the range from ² to a critical pressure value at which cracking of the insulating substrate 2 occurs. When the pressure value is smaller than the lower limit, when the surface of the insulating substrate 2 has undulation, the intaglio 20 and the insulating substrate 2 at the time of lamination do not completely adhere to each other, and air bubbles may enter between the two. is there. Such a phenomenon may still lead to poor transfer.

In the present embodiment, the laminating step 270 is performed under the following conditions in consideration of the above examination results.

First, a solution of butyl carbitol acetate in which polyvinyl butyral resin (hereinafter abbreviated as PVB) as a thermoplastic resin is dissolved is applied to the surface of a 100 mm square alumina insulating substrate 2 and dried. . As a result, a 10 μm thick PV
The B layer 28 is formed. Next, as shown in FIG. 6, the insulating substrate 2 having the PVB layer 28 formed thereon and the intaglio 20 filled with the Ag paste 24 are
Using No. 7, lamination is performed under the conditions of a temperature of 100 ° C., a pressure of 20 kg / cm ² and a speed of 5 cm / sec. The PVB layer 2
8 may be applied using a dipping method, a spinner method, or a coating method using a roll coaster.
In the present embodiment, the PVB layer 28 is formed only on one side of the insulating substrate 2.
Was formed, but may be formed on both surfaces.

Normally, the surface of the insulating substrate 2 is formed as shown in FIG.
Alternatively, as schematically shown in FIG.
There is about m undulations. When the intaglio 29 made of glass is used as in the prior art, as shown in FIG.
Since the rigidity of the glass intaglio 29 is too strong, the intaglio 29 cannot sufficiently follow the undulating shape of the insulating substrate 2. For this reason, the thickness of the PVB layer 28 'must be made non-uniform to about 10 to 50 [mu] m to absorb the undulation and laminate. For this reason, within the above-mentioned preferred thickness range (2
(Below 0 μm), the PVB layer 28 ′ cannot be formed.

However, according to the configuration using the intaglio 20 made of resin having high flexibility as in the present embodiment, the intaglio 20 is formed into the undulating shape of the insulating substrate 2 as shown in FIG. Can follow enough. Therefore, regardless of the undulation shape of the insulating substrate 2, a PV having a thickness of 10 μm or less
The B layer 28 can be formed on the insulating substrate 2.

Next, in the transfer step 280, the temperature of the laminated intaglio 20 and the insulating substrate 2 was lowered to room temperature, and then the intaglio 20 was peeled off from the insulating substrate 2 to form a pattern according to the conductor pattern. The transfer of the Ag paste 24 is performed.

At this time, in the configuration of this embodiment, since the intaglio 20 is rich in flexibility, the intaglio 20 can be bent at an angle of 90 ° or more as shown in FIG. As a result, separation of the intaglio 20 from the insulating substrate 2 results in separation between the surface and the line. Therefore, the required peeling force is reduced, and the intaglio 20 can be easily peeled.
On the other hand, a conventional rigid glass intaglio 29 (FIG. 7B)
8), the intaglio plate 29 cannot be bent to the angle shown in FIG. 8 and the surfaces are separated from each other, so that a large peeling force is required. If the bending angle of the intaglio 29 is too large, cracks easily occur in the intaglio 29 or the insulating substrate 2. Therefore, great care must be taken for the separation of the two, and the workability is not good, resulting in an increase in work cost and work time.

According to this embodiment, for example, the groove width 15
Even when the intaglio 20 having a pattern of 20 μm in depth and 20 μm in depth is used, the Ag paste 24 does not remain inside the groove 21, and the width and the depth of the groove 21 are substantially the same as the width of the groove 21. The conductor pattern having the same height can be transferred and formed. When the pits 22 of the intaglio 20 have a diameter of 45 μm and a depth of 60 μm, a conductive pattern having substantially completely corresponding dimensions as in the case of the groove 21 is transferred and formed with respect to the via hole electrode portion. Can be. In addition, since the conductor line and the via-hole electrode are integrally formed simultaneously in the same process, electrical connection between the two is reliably ensured.

Further, in an electronic component used in a high frequency region such as the high-frequency chip inductor 1 of the present embodiment, the surface shape of the conductor pattern is reduced in order to reduce the skin resistance and improve the electrical operation characteristics. Need to be as sharp as possible. However, wet etching which has been used for forming a conventional copper plate or glass intaglio becomes isotropic etching, so that processing with a high aspect ratio cannot be performed. Therefore, as the pattern becomes finer and the line width to be formed becomes narrower, a deep groove cannot be formed. Further, the edge of the groove is not sharp but rounded. On the other hand, if the intaglio 20 is processed by excimer laser as in the present embodiment, a pattern having sharp edges can be formed. Further, as described above, since the Ag paste 24 does not remain inside the grooves 21 and the pits 22 at the time of transfer, a pattern having a sharp shape similar to the shape of the acute intaglio 20 is transferred. Therefore, the conductor pattern formed according to the present embodiment has excellent characteristics as a high-frequency conductor.

Next, the insulating substrate 2 on which the conductor pattern has been transferred as described above is placed on a peak temperature 850 as shown in FIG.
Step 290 of baking under a temperature pattern of ° C. is performed. In the present embodiment, the insulating substrate 2 to be fired has a structure in which a conductor pattern is formed via a PVB layer (resin layer) 28. Therefore, depending on the setting of firing conditions, the PVB layer 2
Combustion gas may be generated from 8 and peeling or deformation may occur, which may lead to defective conductor patterns. In order to prevent the occurrence of such inconvenience, the temperature from 200 ° C. to 500 ° C., which corresponds to the temperature from the start of combustion of the PVB layer 28 to the end thereof,
It is desirable that the temperature gradient at the time of temperature rise between 200 ° C. and 200 ° C./hour or less.

As described above in connection with the description of the laminating step 270, the firing step 290 is performed under such conditions.
(Table 1) shows the relationship between the thickness of the PVB layer 28 and the performance of the formed conductor pattern in the case where the above is performed.

[0057]

[Table 1]

According to Table 1, the thickness of the PVB layer 28 is 20
If it is not more than μm, a desired conductor pattern can be fired without causing deterioration of the shape or peeling. But,
It can be seen that when the thickness of the PVB layer 28 is 30 μm or more, pattern shape defects and peeling occur during firing. Therefore, the thinner the thickness of the PVB layer 28 is, the better the characteristics are. 7A and 7B, the thickness of the PVB layer 28 in the polyimide intaglio 20 of the present embodiment and the conventional glass intaglio 29 are set within the above-described desirable range. The polyimide intaglio 20 of the present embodiment, which can be accommodated in the inside, can form a conductor pattern excellent in quality.

According to the method of the present embodiment as described above, the line 3 in the conductor pattern and the via-hole electrode 7
Are integrally and simultaneously formed. Thereby, a reliable electric connection between the line 3 and the via hole electrode 7 is obtained.

Next, the Ag paste 2
4 on the surface of the insulating substrate 2 on which the conductor pattern is formed.
In order to form the insulating layer 5, a pattern of a glass paste is printed and formed (Step 300). At this time, FIG.
As shown in FIG.
Printing is performed with crystallized glass having a viscosity of 200,000 cps using a screen plate of 0 μm. As a result, printing “bleeding” occurs in the portion of the via-hole electrode 7, and the thickness of the glass paste covering the periphery of the via-hole electrode 7 is smaller than in other portions. As a result, a via hole shape is formed around the via hole electrode 7.

Since the diameter of the via hole to be formed is determined by the shape of the via hole electrode, according to the present embodiment, even a small via hole having a diameter of about 40 μm, which has been difficult to form, can be easily obtained. Can be formed by printing. In addition, since a minute via hole can be formed in this manner, the number of turns of the spiral coil pattern can be increased by that much. Thereby, the obtained inductance value can be increased.

The pattern of the glass paste printed as described above is held at a peak temperature of 820 ° C. for 10 minutes and fired to form an insulating layer 5. At this time, since the crystallized glass is used, the flow during baking is small, and the printed pattern shape is kept good.

In the conventional method, in order to connect the upper and lower conductor patterns of the multilayer structure substrate to each other, an opening is formed in the insulating layer by patterning or etching by screen printing to form a via hole, and an electrode material is embedded therein. Formed a via hole electrode. However, in this method, poor connection between the lower conductor pattern and the upper conductor pattern due to insufficient electrical connection between the upper and / or lower conductor pattern and the via hole electrode due to a defect in the electrode embedding step. May occur. However, in the method according to the present embodiment, as described above, since the formation of the via hole electrode 7 is performed simultaneously and integrally with the formation of the lower conductor pattern, the above connection failure does not occur.

Further, since the shape and thickness of the via hole electrode 7 can be arbitrarily set, the upper conductor pattern and the via hole electrode 7 are formed by making the via hole electrode 7 project from the surface of the insulating layer 5 by several μm. Can be reliably connected. Further, by making the cross-sectional shape of the via-hole electrode 7 in the direction perpendicular to the surface of the substrate 2 trapezoidal, even if the via-hole electrode 7 is dimensionally fine,
The structure is such that a sufficient connection strength required in a later step can be obtained.

Finally, a step 310 of forming the lead electrode 6 on the insulating layer 5 is performed. This is formed by screen-printing the pattern of the lead electrode 6 with an Ag paste on the surface of the insulating layer 5 and firing at a peak temperature of 810 ° C. for 10 minutes. As a result, the chip inductor 1 of the present embodiment is manufactured.

In the above description, the method of manufacturing an electronic component according to the present embodiment has been described using the chip inductor 1 as an example. However, it is needless to say that the chip inductor 1 can be manufactured. For example, according to the present embodiment, it is possible to manufacture an electrode portion of another electronic component such as a chip bead, an EMI filter, a capacitor, or another electronic component having a laminated structure.

In the above description, steps 210 to 29
Step 3 after transferring and forming the conductor pattern according to Step 3.
At 00 and 310, the insulating layer 5 and the lead electrode 6 are formed. Alternatively, when a conductor pattern that does not require such a structure is formed, a desired conductor pattern can be obtained by performing steps 210 to 290.
There is no need to perform 00 and 310.

Although the Ag paste is used as the material of the conductive paste used to form the conductor pattern, the present invention is not limited to this. For example, Cu, N
Other metal pastes such as i, Al, Au, or resinate pastes can be used. In addition to a conductive paste containing an organic solvent, a conductive paste containing a resin having appropriate flexibility after being cured with an ultraviolet curable resin or a thermosetting resin can also be used.

As a material for the intaglio 20, if it has an appropriate flexibility (flexibility), in addition to the above-described polyimide film 15, PET, PSF, PC, P
Resin sheets such as EI (polyetherimide), PAR (polyacrylate), and PEEK (polyetherketone) can be used. In addition, as a material of the resin layer 28 formed on the insulating substrate 2, an ethyl cellulose-based thermoplastic resin, or an epoxy or acrylic-based thermosetting resin can be used.

Furthermore, in the above description, in the laminating step of the intaglio 20 and the insulating substrate 2, a device for thermally bonding while applying pressure using the heat rollers 26 and 27 is used. May be used.

The material of the insulating substrate 2 constituting the object to be formed by transferring and forming the conductor pattern is not limited to a specific material, but may be a commonly used material such as ceramic. Can be. Alternatively, a dielectric mainly composed of barium titanate may be used.

In particular, when forming an inductance component, it is desirable that at least one of the insulating substrate 2 and the insulating layer 5 is formed of a magnetic material such as ferrite.
This is because the inductance of the electronic component to be formed can be improved by the magnetic permeability of these magnetic materials.

Alternatively, the object can be formed from a green sheet. Since the green sheet has a property of being softened by heating, in the case of forming an object using the green sheet, in step 270, the formation of the resin layer 28 functioning as an adhesive layer during transfer is omitted. be able to.

The intaglio 20 is formed by the excimer laser device 1
Although 1 was used, another laser source such as a dye laser or a free electron laser can be used as long as it can emit a laser beam having a wavelength in the ultraviolet region. Further, any other light source than the laser source can be used as long as it can emit a beam having a required energy density equivalent to these lasers in the above wavelength region.

(Embodiment 2) A second embodiment of the method of manufacturing an electronic component according to the present invention will be described by taking a method of manufacturing a hybrid IC (hereinafter abbreviated as HIC) substrate having a laminated structure of conductor patterns as an example. , Will be described with reference to FIGS. 11 to 14, the same components are denoted by the same reference numerals.

FIG. 11A is a plan view of the HIC substrate 30.
FIG. 11B is a cut surface of the HIC substrate 30 taken along line 11B-11B ′ of FIG. 11A. Note that FIG.
The right half of (a) shows the portion where the upper conductor pattern is formed, and the left half shows the portion where the lower conductor pattern is formed. Further, FIGS. 11A and 11B
3 schematically shows the configuration of the HIC substrate 30 in a simplified manner, and therefore, the conductor pattern in the drawing does not accurately reflect the dimension values described below.

The HIC substrate 30 includes a lower conductive pattern 32 formed on an insulating substrate 31, an insulating layer 33 formed so as to cover the lower conductive pattern 32, and an upper conductive pattern 34 formed on the insulating layer 33. Has a two-layer wiring structure. The lower conductor pattern 32 is shown in FIG.
As can be seen from (b), a spiral coil conductor 32a and other conductors 32b are included. The lower conductor pattern 32 and the upper conductor pattern 34 are connected by a via hole electrode 35. A mounting portion 36 for mounting the IC chip face down is provided in a part of the upper conductor pattern 34.

In the lower conductor pattern 32, a portion corresponding to the coil conductor portion 32a is provided from the viewpoint of electrical characteristics.
For example, the pitch is 60 μm (that is, the width of each line is 30 μm).
m, and a conductor pattern having a height (that is, a thickness of the conductor film) of 35 μm with a line interval of 30 μm is formed. Also,
The via-hole electrode 35 has a height (that is, a thickness of the conductive film) so that the tip protrudes from the surface of the insulating layer 33 and the upper and lower conductive patterns 32 and 34 are reliably connected.
It is formed to 50 μm. On the other hand, the upper conductor pattern 3
4, the face-down mounting part 36 has, for example, a pitch 15
0 μm (that is, each line has a width of 75 μm and a line interval is 75 μm).

Further, the face-down mounting section 36
Requires flatness such that undulations per surface length of 5 mm are 3 μm or less due to restrictions on mounting conditions when the IC chip is face-down mounted. In this case, the height (thickness of the conductive film) of the conductive portion 32b located below the face-down mounting portion 36 in the lower conductive pattern 32 is 5 μm.
If it is more than m, the undulation of the surface of the insulating layer 33 becomes large, and face-down mounting becomes difficult. Therefore, the height of the conductor portion 32b is suppressed to 5 μm or less.

As described above, in the second embodiment of the present invention, the thickness (line height) of the conductor film at an arbitrary position in the formed conductor pattern is changed to a desired level.
A conductor pattern having a height difference is formed in the pattern. As a result, the HIC substrate 30 that enables the IC chip to be mounted face-down on a predetermined position of the uppermost conductor pattern 34 on the outermost surface is formed.

Hereinafter, a method of manufacturing the HIC substrate 30 according to the present embodiment will be described. The individual steps such as the production of intaglio in the following description are substantially equivalent to the steps corresponding to the first embodiment, except that the shape of the conductor pattern to be formed is different. Therefore, a detailed description of the features and the like will be omitted.

First, an intaglio for forming the lower conductor pattern 32 is formed in the same manner as in step 210 of the first embodiment.
Using a total of three types of masks for forming the coil conductor portion 32a and the other conductor portion 32b of the lower conductor pattern 32, and for forming the via hole electrode 35, the excimer laser is used on the polyimide film in the following order. Form. First, using a mask corresponding to the pattern of the coil conductor 32a, a pattern corresponding to the coil conductor 32a having a groove having a depth of 45 μm is formed. Next, using a mask corresponding to the pattern of the via hole electrode 35, a pattern corresponding to the via hole electrode having a groove having a depth of 65 μm is formed. Finally, using a mask corresponding to the pattern of the conductor portion 32b, a pattern corresponding to the conductor portion 32b having a groove having a depth of 10 μm is formed. The relative position of each pattern formed in each of the above steps is 5 μm
By performing positioning with an accuracy within the range, an intaglio for forming the lower conductor pattern 32 is formed.

On the intaglio plate thus formed, a release layer made of a fluorocarbon monomolecular film is formed in the same manner as in step 220 of the first embodiment. Next, in the same manner as in step 230 of the first embodiment, A
g Fill paste into each groove of the intaglio. Thereafter, as in step 240, A
g By drying the paste and evaporating the organic solvent contained therein, the paste inside the intaglio grooves is reduced by a volume equivalent to the amount of evaporation. Further, as in Steps 250 and 260, two-stage drying is performed after refilling the Ag paste. In this way, by repeating the paste filling and drying steps as in the first embodiment, the thickness of the Ag paste film can be made substantially equal to the depth of each groove.

Next, as in the step 270, a thickness of 10 μm
Is formed on the surface of the insulating substrate 31, and the intaglio and the insulating substrate 31 are pressed at a pressure of 25 kg / cm ² and a substrate temperature of 130.
Paste at ° C. Then, as in step 280, the substrate temperature is lowered to room temperature, the intaglio is peeled off, and the conductor pattern is transferred onto the insulating substrate 31. Further, similarly to step 290, the insulating substrate 31 to which the conductor pattern has been transferred is heated up to a peak temperature of 850 ° C. with a temperature gradient of 200 ° C./hour, and a baking process is performed.

Through the series of steps described above, the lower conductor pattern 32 and the via-hole electrode 35 are simultaneously formed integrally as in the first embodiment.

Next, as in the step 300, a pattern of the insulating layer 33 is formed on the insulating substrate 31 by screen printing of a glass paste. Then, the insulating layer 33 is formed by firing at a temperature of 840 ° C. At this time, by using crystallized glass as in the first embodiment, the flow of the glass paste during firing is small, and the shape formed by screen printing is maintained relatively well.

Next, after the formation of the insulating layer 33, a pattern corresponding to the upper conductor pattern 34 is formed by screen printing of an Ag paste. And a peak temperature of 810
The upper conductor pattern 34 is formed by a baking process of maintaining the temperature at 10 ° C. for 10 minutes.

As described above, by increasing the line height (thickness of the conductor film) of the portion corresponding to the spiral coil conductor 32a in the conductor pattern, the first embodiment is different from the first embodiment. A coil having similar electrical characteristics is formed. In addition, by forming the cross section of the via hole electrode 35 in a direction perpendicular to the substrate surface in a trapezoidal shape, electrical connection between the upper conductor pattern 34 and the lower conductor pattern 32 can be reliably performed. The lower conductor pattern 32
By selectively reducing the thickness of the insulating layer 33 at an arbitrary predetermined position, desired flattening can be realized at a position where the surface of the insulating layer 33 needs to be flattened. Thus, the HIC substrate 30 on which the IC chip can be mounted face-down is manufactured.

The shape of the via hole electrode 35 is shown in FIG.
The shape is not limited to the shape shown in FIG. For example, as in the case of the HIC substrate 40 shown in FIG. 12, an electrode 35 'having a shape filling only a part of the via hole can be formed. Alternatively, an electrode connecting the lower conductor pattern 32 and the upper conductor pattern 34 is formed by providing a via hole at the time of forming the insulation layer 33 so that the lower conductor pattern 32 is not completely covered by the insulation layer. It may be provided in the via hole in a step different from the step.

Further, in the above description, a description has been given by taking a two-layer wiring board as an example, but it is possible to further increase the number of layers. For example, in the HIC substrate 50 shown in FIG.
HIC shown in FIG. 11B or FIG.
Conductive patterns 51, 52 and 53 corresponding to one layer pattern of the substrates 30 and 40 are laminated on the insulating substrate 31 in three layers.

Further, according to the present embodiment, since the height difference is provided in the line of the conductor pattern, it is possible to form the HIC substrate 60 having the surface shape of the insulating layer 33 as shown in FIG. In the HIC substrate 60, a conductor portion 32a corresponding to a portion of the lower conductor pattern that does not require control of the undulation shape on the surface of the insulating layer 33 is formed by a relatively high line (thick conductor film). On the other hand, IC
A conductor portion 32b corresponding to a portion where the surface of the insulating layer 33 needs to be flat, such as a portion where the chip 61 is face-down mounted, is formed by a relatively low line (thin conductor film). As the height of the conductor 32b decreases, the conductor resistance increases. However, by increasing the width of the line of the conductor 32b as necessary, the adverse effect on the electrical characteristics can be suppressed.

As described above, according to the present embodiment, it is possible to obtain the optimum shape of the conductor pattern in consideration of the trade-off between the requirement for the surface shape of the insulating layer 33 and the requirement for the electrical characteristics of the conductor pattern. Can be.

As described above, according to the electronic component manufacturing method of the present embodiment, the groove pattern corresponding to the conductor pattern to be formed is formed on the surface of the highly flexible resin sheet by excimer laser irradiation. Formed to produce intaglio. The conductive paste filled in the groove pattern of the intaglio is substantially completely transferred onto the substrate, which is the object to be formed. Further, since the shape of the groove formed in the intaglio plate can be sharpened, the shape of the conductor pattern formed by firing after transfer also has a desired sharp rectangular shape. As a result, the electrical characteristics of the formed conductor pattern are improved.

In terms of size, it is possible to form a fine and thick conductor pattern in which the line width of the conductor pattern is 10 μm or less and the thickness of the conductor film is 5 μm or more. In addition, the thickness of the conductor film can be increased only at an arbitrary predetermined position, that is, the line of the conductor pattern can be increased. By applying these points, according to the electronic component manufacturing method of the present embodiment, it is possible to form a via hole having a width as small as substantially equivalent to the size of a fine conductive pattern. Therefore, it is possible to manufacture an electronic component having a small-sized laminated structure, which is difficult to realize by the conventional printing method, at low cost.

In the above description of the first and second embodiments, the present invention will be described by taking, as an example, an electronic component of a type in which it is necessary to form a thick portion of a conductive film in a conductive pattern. I have explained. However, the electronic component manufacturing method of the present invention can be applied to other electronic components, that is, electronic components in which it is not particularly necessary to partially change or increase the thickness of the conductive film. Is clear. Even in such a case, the use of an intaglio formed from a flexible resin sheet allows easy and reliable separation in the transfer process, and a sharp rectangular shape formed by pattern formation on the intaglio by an excimer laser. The ability to form a pattern is a sufficiently effective means of improving the characteristics of the electronic component to be manufactured.

Summarizing what has been described above, according to the first and second embodiments, the use of an intaglio made of a resin having a high flexibility allows damage to the substrate and cracks in the conductor pattern. The peeling of the intaglio and the transfer of the conductor pattern are performed without causing the generation of pinholes. In addition, even if the substrate surface has undulation, the intaglio can be deformed following the undulation shape, so that the substrate and the intaglio come into close contact with each other, and the conductive paste can be transferred well.
Further, since the transfer of the conductive paste can be completely performed, even if the pattern has a thin line width and a thick conductive film in the conductive pattern, it is formed in a good shape. Furthermore, by performing the filling and drying of the conductive paste in the intaglio a plurality of times, even if the volume of the conductive paste is reduced by the drying, the shape of the filled conductive paste can be fitted to the shape of the groove. Further, by thermally laminating the intaglio plate and the substrate, the conductor pattern can be transferred onto the opaque substrate.

Further, a multilayer structure of the conductor pattern can be easily realized. In addition, since the thickness of the conductive film at an arbitrary position in the conductive pattern can be easily controlled, optimization of electrical characteristics, the shape of the surface of the insulating layer, and the like can be achieved. For example, a portion formed high in the conductor pattern can be used as an electrode for connecting each conductor pattern having a multilayer structure. As a result, the conductor pattern and the electrode are integrally formed at the same time, so that defects such as poor connection between the two can be prevented. Alternatively, by forming the conductor pattern low, the flatness of the insulating layer surface corresponding to that portion is improved. As a result, a flat portion necessary for face-down mounting of the IC chip can be obtained.

By forming grooves on the surface of the intaglio with a laser having an oscillation frequency in the ultraviolet wavelength range, preferably an excimer laser, a fine pattern can be easily and accurately formed on the intaglio. Further, the depth of the groove can be easily changed by changing the laser irradiation time. Furthermore, since the shape of the groove formed in the intaglio can be sharpened, the shape of the conductor pattern formed by firing after transfer is also
The shape becomes the desired sharp rectangle. As a result, the electrical characteristics of the formed conductor pattern are improved.

The release layer of the fluorocarbon monolayer is easily formed on the surface of the intaglio. This release layer is durable because it is covalently bonded to the intaglio surface, and the results are sustained. In addition, since it is a monomolecular layer, the release layer is thin and does not affect the shape of the intaglio.

By adding a plasticizer to the conductor paste to make it flexible, it is possible to follow the intaglio even if it is flexibly bent. Furthermore, even after the drying step, it is possible to have an appropriate flexibility, so that it is possible to sufficiently resist the stress at the time of transfer, and to prevent the occurrence of defects in the conductive paste.

By providing the intaglio plate with a taper, the filled conductive paste can be more easily separated and transferred, and a conductive pattern having a good shape can be formed.

When an insulating substrate having a resin layer on the surface is used as the substrate, the resin layer can be used as an adhesive layer at the time of transfer of the conductive paste pattern. In particular, the thickness of the resin layer should be 20 μm or less. This suppresses the occurrence of defects in the conductor pattern due to the effect of the combustion gas generated from the resin layer itself during thermal lamination. If a dielectric material or a magnetic material is used as the insulating material, it becomes possible to impart desired characteristics to the formed electronic component. Also,
If the substrate is formed of a green sheet, the property that the green sheet is softened by heat applied during lamination can be used, and the formation of a resin layer functioning as an adhesive layer can be omitted.

Further, in the electronic component formed according to the present embodiment, a high-precision and fine conductor pattern can be easily formed, and a multilayer structure can be easily formed. In addition, electrodes for connecting the conductor patterns of each layer can be formed together with the conductor patterns, so that reliable electrical connection can be obtained.

[0104]

As described above, according to the method of manufacturing an electronic component of the present invention, the intaglio is made of a flexible resin sheet, and the first intaglio having different heights is formed by using intaglio having grooves of different depths. It is characterized in that the conductor pattern is transferred and formed at the same time, whereby the line width of the conductor pattern is made thinner, the thickness of the conductive film is made thicker, and the via hole electrode having the same size as the line width is formed. Such a fine conductor pattern can be formed with low cost and high reliability.

[Brief description of the drawings]

FIG. 1A is a schematic plan view of a chip inductor according to a first embodiment of the present invention. FIG. 1B is a cross-sectional view taken along line 1B-1B ′ in FIG.

FIG. 2 is a block diagram showing a process flow of the electronic component manufacturing method.

FIG. 3 is a schematic view schematically showing a manufacturing process of an intaglio, which is the main part.

FIG. 4 is a cross-sectional view schematically showing the shape of a groove on the surface of the intaglio, which is the main part.

FIG. 5 is a schematic diagram schematically showing a process of filling a conductive paste into the intaglio, which is the main part of the same.

FIG. 6 is a schematic view schematically showing a laminating step which is the main part.

FIG. 7A is a cross-sectional view schematically showing a laminated state of a polyimide intaglio plate and an insulating substrate, which are the main parts, and FIG. 7B is a cross-sectional view schematically showing a laminated state of a conventional glass intaglio plate and an insulating substrate.

FIG. 8 is a schematic view schematically showing a peeling step which is the main part.

FIG. 9 is a diagram showing firing temperature conditions in a firing step as a main part of the same.

FIG. 10 is a cross-sectional view schematically showing the shape of a via hole as the main part.

11A is a schematic plan view of a hybrid IC substrate according to a second embodiment of the present invention. FIG. 11B is a cross-sectional view taken along line 11B-11B ′ in FIG.

FIG. 12 is a schematic cross-sectional view of another hybrid IC substrate manufactured according to the present invention.

FIG. 13 is a schematic sectional view of still another hybrid IC substrate manufactured by the present invention.

FIG. 14 is a schematic sectional view of still another hybrid IC substrate manufactured by the present invention.

[Explanation of symbols]

 Reference Signs List 1 chip inductor 2 insulating substrate 3 coil conductor 4a, 4b terminal electrode 5 insulating layer 6 lead electrode 7 via hole electrode 11 excimer laser device 12 mask 13 mirror 14 imaging lens 15 polyimide film 16 XY stage 20 polyimide intaglio 21 groove 22 pit 23 release layer 24 Ag paste 25 Squeegee 26, 27 Heat roller 28, 28 'Resin layer (PVB layer) 29 Glass intaglio 30, 40, 50 Hybrid IC substrate 31 Insulating substrate 32 Lower conductive pattern 33 Insulating layer 34 Upper conductive pattern 35, 35' Via hole Electrode 36 Face-down mounting part 51, 52, 53 Conductive pattern 61 IC chip

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-241175 (JP, A) JP-A-4-240792 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01F 41/00-41/12 H01F 17/00-17/08 H05K 3/00 B41M 1/00

Claims (6)

(57) [Claims] 1. A method for manufacturing an electronic component, wherein a first conductor pattern is transferred and formed on a substrate by intaglio printing, comprising: (a) forming a groove on the surface of the intaglio; Filling a paste; (c) bonding an intaglio filled with the conductive paste to the substrate; and (d) peeling the intaglio from the substrate and transferring the conductive paste onto the substrate. And forming a first conductor pattern by performing the method described above, wherein the intaglio is made of a resin sheet having flexibility, and the first conductor patterns having different heights are formed by using intaglio having grooves of different depths. A method for manufacturing an electronic component, wherein the electronic component is transferred and formed at the same time. 2. After forming the first conductive pattern, (e) forming an insulating layer so as to cover at least a part of the first conductive pattern; and (f) forming a second conductive pattern on a surface of the insulating layer. And electrically connecting the first conductor pattern and the second conductor pattern using a portion of the first conductor pattern having a higher height as an electrode. A method for manufacturing an electronic component according to claim 1. 3. The electronic component according to claim 1, wherein a portion of the first conductive pattern corresponding to a portion where a flat portion is to be provided on the surface of the insulating layer is formed low. 4. The electronic component according to claim 3, further comprising an IC chip face-down mounted on the flat portion on the surface of the insulating layer. 5. The method according to claim 1, wherein a taper is formed on a side surface of the groove. 6. The method according to claim 4, wherein the angle of the taper is 2 ° to 60 °.