JP3150690B2 - Chemical treatment equipment - Google Patents
Chemical treatment equipmentInfo
- Publication number
- JP3150690B2 JP3150690B2 JP32841290A JP32841290A JP3150690B2 JP 3150690 B2 JP3150690 B2 JP 3150690B2 JP 32841290 A JP32841290 A JP 32841290A JP 32841290 A JP32841290 A JP 32841290A JP 3150690 B2 JP3150690 B2 JP 3150690B2
- Authority
- JP
- Japan
- Prior art keywords
- storage container
- processing liquid
- developer
- storage
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Coating Apparatus (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は液処理方法に係り、特に半導体製造のフォト
リソグラフィー工程のレジスト塗布装置、現像処理装置
に好適に用いられる液処理方法に係わる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid processing method, and more particularly, to a liquid processing method suitably used in a resist coating apparatus and a development processing apparatus in a photolithography process in semiconductor manufacturing.
［従来の技術］ 一般に、半導体製造のフォトリソグラフィー工程では
半導体ウェハ上に積層される薄膜にパターンを形成する
のに、薄膜上にレジストを塗布し、パターンに形成され
たマスクを通して露光、現像後エッチングをして薄膜に
パターンを転写している。このようなパターン形成にお
いて、レジストあるいは現像液は高粘度の液体であるた
め、一度気体が混入すると、泡沫となって長時間滞在
し、このような泡沫の混入したレジストあるいは現像液
を半導体ウェハにスピンコートしても気泡は消えずに残
ってしまい、ピンホール、塗布むらが生じてしまった。[Prior Art] Generally, in a photolithography process of semiconductor manufacturing, a pattern is formed on a thin film laminated on a semiconductor wafer, a resist is applied on the thin film, exposure is performed through a mask formed in the pattern, and etching is performed after development. Then, the pattern is transferred to the thin film. In forming such a pattern, since the resist or the developer is a high-viscosity liquid, once the gas is mixed, the resist or the developer becomes foam and stays for a long time. Even after spin coating, air bubbles remained without disappearing, resulting in pinholes and uneven coating.
そのため、レジスト等の収納容器から送出されるレジ
ストを一度トラップに導入したり（特開昭56−161539号
公報）、あるいは配管中に障害物を配設し気泡を潰し障
害物を設けた位置の配管壁に設けた穴から脱気したり
（特開昭61−174719号公報）、あるいはエア抜きボート
を備えたフィルタを設けたり（特開昭63−110636号公
報）、空気抜きを設けたり（特開昭61−198723号公報）
していた。For this reason, the resist delivered from the storage container such as the resist is once introduced into the trap (Japanese Patent Application Laid-Open No. 56-161539), or an obstacle is arranged in the pipe to crush bubbles and to provide a position at the position where the obstacle is provided. It is possible to deaerate from a hole provided in a pipe wall (Japanese Patent Application Laid-Open No. 61-174719), to provide a filter equipped with an air release boat (Japanese Patent Application Laid-Open No. 63-110636), or to provide an air release ( JP 61-198723 A)
Was.
［発明が解決しようとする課題］ しかしながら、これらの装置を用いても脱泡は十分に
行うことができなかった。そのため、半導体ウェハ上に
形成されるレジスト薄膜や現像液の薄膜が均一に一定に
ならず、気泡の存在する部分だけ現像速度が変化してし
まい現像斑等の処理むらとなってしまった。[Problems to be Solved by the Invention] However, even with these devices, degassing could not be sufficiently performed. As a result, the resist thin film and the developer thin film formed on the semiconductor wafer are not uniformly uniform, and the developing speed is changed only in the portion where bubbles exist, resulting in uneven processing such as uneven development.
本発明は上記の欠点を解消するためになされたもので
あって、処理むらのない液処理方法を提供することを目
的とする。The present invention has been made in order to solve the above-mentioned drawbacks, and an object of the present invention is to provide a liquid processing method without processing unevenness.
［課題を解決するための手段］ 上記の目的を達成するため、本発明の液処理方法は、
処理液を収納する複数の収納容器のうち第一の収納容器
からのみ被処理体に処理液を供給する第一の工程と、第
一の収納容器内の処理液が所定量消費された後、第二の
収納容器から被処理体に処理液を供給すると同時に、第
一の収納容器へ処理液を充填し、第二の収納容器内の処
理液が所定量消費される前に、第一の収納容器内を負圧
にして収納容器内の処理液中に含有された気体を収納容
器外へ吸引して脱気を行った後放置する第二の工程とを
具備し、複数の収納容器に対して順次第二の工程と第一
の工程を反復して行うものである。[Means for Solving the Problems] To achieve the above object, the liquid treatment method of the present invention comprises:
The first step of supplying the processing liquid to the object only from the first storage container out of the plurality of storage containers that store the processing liquid, and after the processing liquid in the first storage container has been consumed by a predetermined amount, At the same time as supplying the processing liquid from the second storage container to the object to be processed, the first storage container is filled with the processing liquid, and before the processing liquid in the second storage container is consumed by the predetermined amount, the first storage container A second step in which the gas contained in the processing liquid in the storage container is suctioned to the outside of the storage container by depressurizing the inside of the storage container and then left after being degassed. On the other hand, the second step and the first step are sequentially repeated.
また本発明の液処理方法は、処理液を収納する複数の
収納容器のうち第一の収納容器に処理液を充填する充填
工程と、充填工程後、収納容器内を負圧にして処理液中
に含有された気体を収納容器外へ吸引して除去し、第一
の収納容器から被処理体に処理液を供給するまで第一の
収納容器内の処理液を放置する放置工程と、第一の収納
容器から被処理体に処理液を供給すると共に、第一の収
納容器内の処理液を所定量消費する前に、第二の収納容
器に対して充填工程及び放置工程を行う供給充填放置工
程とを備え、複数の収納容器に対して順次供給充填放置
工程を反復して行うものであり、好ましくは、収納容器
内への処理液の充填は、収納容器内の気体を除去しつつ
行うものである。Further, in the liquid treatment method of the present invention, a filling step of filling the processing liquid into the first storage container of the plurality of storage containers that store the processing liquid, and after the filling step, the inside of the storage vessel is set to a negative pressure to thereby reduce the processing liquid. Removing the gas contained in the first storage container by sucking it out of the storage container and leaving the processing liquid in the first storage container until the processing liquid is supplied from the first storage container to the object to be processed; and Supplying the processing liquid from the storage container to the object to be processed and performing the filling step and the leaving step on the second storage container before consuming a predetermined amount of the processing liquid in the first storage container. And repeatedly performing the supply filling and leaving step sequentially for a plurality of storage containers. Preferably, the processing liquid is charged into the storage container while removing the gas in the storage container. Things.
［作用］ 第一の収納容器からのみ被処理体へ処理液を供給し、
第一の収納容器内の処理液を所定量消費した後、第二の
収納容器から処理液の供給を開始すると共に、第一の収
納容器へ処理液を充填した後、収納容器内を負圧にして
処理液中に混入される気泡のみでなく処理液中に含有さ
れる気体を収納容器外へ吸引し除去を行う。その後、放
置され被処理体への供給を待機する。このため、第一の
収納容器に処理液を充填し脱気する間も、被処理体へ第
二の収納容器から処理液が供給され処理が行われる。更
に、第二の収納容器内の処理液が所定量消費されれば、
第三の収納容器から処理液の供給を開始し、第二の収納
容器へ処理液を充填し、収納容器内を負圧にして処理液
中に含有される気体を収納容器外へ吸引除去し、放置す
る。これを複数の収納容器に対して順次行うことによ
り、充分に脱気された処理液を中断することなく被処理
体に供給することができ、処理むらのないフォトリソグ
ラフィーを効率よく行い高品位な製品が得られる。[Operation] The processing liquid is supplied to the object only from the first storage container,
After a predetermined amount of the processing liquid in the first storage container is consumed, the supply of the processing liquid from the second storage container is started, and after the processing liquid is filled in the first storage container, a negative pressure is applied to the inside of the storage container. Then, not only air bubbles mixed in the processing liquid but also gases contained in the processing liquid are sucked out of the container and removed. After that, it is left to wait for supply to the object to be processed. For this reason, the processing liquid is supplied from the second storage container to the object to be processed and the processing is performed while the first storage container is filled with the processing liquid and degassed. Furthermore, if a predetermined amount of the processing liquid in the second storage container is consumed,
The supply of the processing liquid is started from the third storage container, the processing liquid is filled into the second storage container, the pressure in the storage container is reduced to a negative pressure, and the gas contained in the processing liquid is suctioned out of the storage container. ,put. By sequentially performing this process on a plurality of storage containers, a sufficiently degassed processing solution can be supplied to a processing object without interruption, and photolithography without processing unevenness can be efficiently performed to achieve high quality. The product is obtained.
［実施例］ 本発明の液処理方法を半導体製造の現像装置に適用し
た一実施例を図面を参照して説明する。[Embodiment] An embodiment in which the liquid processing method of the present invention is applied to a developing device for manufacturing a semiconductor will be described with reference to the drawings.
第１図に示す現像装置１は、真空吸着等によって被処
理体であるウェハ２を載置固定し、モータ３の回転軸に
固定される上面円板状のチャック４を備える。チャック
４の周囲にはチャック４を包囲するようにカップ５が設
けられ、回転するウェハ２の周縁から余剰の処理液であ
る現像液が周囲に飛散するのを防止している。さらにカ
ップ５の下方にはカップ５ではね返った現像液が再びウ
ェハ２上に付着するのを防止するため、カップ５の下方
に向って気体流を形成するよう図示しない排気装置に接
続される排気口等が設けられる。また、カップ５はウェ
ハ３をチャック４上に図示しない搬送機構により搬入出
する際、図の位置より下降してウェハ２の搬入出を容易
にするよう図示しない上下動機構を備える。このような
チャック４を包囲するカップ５を備えたディベロッパが
例えば３組Ａ、Ｂ、Ｃ設けられる。そしてそれぞれのチ
ャック４上のウェハ２に現像液を吐出する吐出ノズル６
を備え、吐出ノズル６が接続される吐出系７、図示しな
い工場ラインから現像液を複数の収納容器８に供給する
処理液供給系９及び収納容器８に収納される現像液に混
入される気体を除去する脱気装置10がそれぞれ収納容器
８に設けられる。The developing apparatus 1 shown in FIG. 1 has a disk-shaped chuck 4 on which a wafer 2 to be processed is placed and fixed by vacuum suction or the like, and is fixed to a rotating shaft of a motor 3. A cup 5 is provided around the chuck 4 so as to surround the chuck 4 to prevent the developing solution, which is an excess processing solution, from splashing from the periphery of the rotating wafer 2 to the periphery. Further, in order to prevent the developing solution rebounded from the cup 5 from adhering to the wafer 2 below the cup 5, exhaust gas connected to an exhaust device (not shown) is formed so as to form a gas flow toward the lower portion of the cup 5. A mouth is provided. Further, the cup 5 is provided with a vertical movement mechanism (not shown) so as to be lowered from a position shown in the figure when loading and unloading the wafer 3 onto and from the chuck 4 to facilitate loading and unloading of the wafer 2. For example, three sets of developers A, B, and C having a cup 5 surrounding the chuck 4 are provided. And a discharge nozzle 6 for discharging the developing solution to the wafer 2 on each chuck 4
, A discharge system 7 to which a discharge nozzle 6 is connected, a processing liquid supply system 9 for supplying a developer from a factory line (not shown) to a plurality of storage containers 8, and a gas mixed in the developer stored in the storage container 8. Are respectively provided in the storage containers 8.
このような吐出系７、処理液供給系９及び脱気装置10
を第２図の構成図に示す。図示しない工場ラインに接続
される処理液供給系９は収納容器８−１、８−２、８−
３にそれぞれ供給バルブ91、92及び93を介して配管11に
より接続される。収納容器８−１、８−２及び８−３に
はそれぞれ流量検出計81、82及び83が設けられ、処理液
供給系９から収納容器に供給される現像液12がオーバー
フローした場合を検知してオーバーフロータンク20に排
出できる機構を備える。例えば収納容器８−１に現像液
12が過剰に供給されると配管22と配管15を連結させる３
方弁17を開き、フィルタ18、バルブ19を介してオーバー
フロータンク20に連結させ、余剰の現像液を流出させ
る。収納容器８−２及び８−３についても同様に配管21
または13を３方弁16によりどちらかを配管14に接続し、
それぞれオーバーフロータンク20に接続するようになっ
ている。オーバーフロータンク20にはオーバーフローセ
ンサ23が設けられ、バルブ24を介して工場排水に接続さ
れるようになっている。Such a discharge system 7, a processing liquid supply system 9, and a deaerator 10
Is shown in the configuration diagram of FIG. The processing liquid supply system 9 connected to a factory line (not shown) includes storage containers 8-1, 8-2, 8-
3 is connected to the pipe 3 via supply valves 91, 92 and 93, respectively. The storage containers 8-1, 8-2, and 8-3 are provided with flow rate detectors 81, 82, and 83, respectively, to detect when the developing solution 12 supplied from the processing liquid supply system 9 to the storage container overflows. And a mechanism capable of discharging to the overflow tank 20. For example, the developer is stored in the storage container 8-1.
When 12 is supplied in excess, connect pipe 22 and pipe 15 3
The direction valve 17 is opened, connected to the overflow tank 20 via the filter 18 and the valve 19, and the excess developer is allowed to flow out. Similarly, for the storage containers 8-2 and 8-3, the piping 21
Or 13 is connected to piping 14 by a three-way valve 16,
Each is connected to the overflow tank 20. The overflow tank 20 is provided with an overflow sensor 23, which is connected to a factory drain through a valve 24.
また、収納容器８−１、８−２及び８−３にはそれぞ
れ配管25、26、27に設けられた逆止弁28及びフィルタ29
を介してそれぞれパージバルブ30、31及び32からフロー
メータ33を介してレギュレータ34から窒素ガス供給系35
が接続される。The storage containers 8-1, 8-2, and 8-3 have check valves 28 and filters 29 provided on pipes 25, 26, and 27, respectively.
From the purge valves 30, 31 and 32 through the flow meter 33 and the regulator 34 through the nitrogen gas supply system 35, respectively.
Is connected.
一方、脱気装置10は例えば配管36を介してエア供給体
37に接続されるエジェクタであって、配管36には逆止弁
38、脱気ソレノイド39、レギュレータ40等が設けられ
る。エジェクタ10には配管47を介して脱気３方弁41、4
2、43に接続された配管44、45、46にそれぞれ連結され
る収納容器８−１、８−２及び８−３が接続される。さ
らにエジェクタ10には配管71が接続され、配管36から配
管71に空気流が生じると、配管47が負圧になり配管71に
向って配管47の気体が吸引されるようになっている。そ
のため、脱気３方弁41、42、43の操作により配管47に連
結される収納容器の何れかを負圧にし、収納容器内に収
納される現像液中に含有される気体が吸引されるように
なっている。脱気３方弁41、42、43には工場排気に接続
される配管48が接続され、収納容器８−１、８−２、８
−３がそれぞれ工場排気あるいはエジェクタ10に接続で
きるよう切換可能となっている。エジェクタ10はトラッ
プタンク49からオーバーフロータンク20に接続される。On the other hand, the deaerator 10 is, for example, an air supply
An ejector connected to 37, and a check valve in piping 36
38, a deaeration solenoid 39, a regulator 40 and the like are provided. The ejector 10 is connected to the degassing three-way valves 41 and 4 via a pipe 47.
Storage containers 8-1, 8-2, and 8-3 connected to pipes 44, 45, and 46 connected to 2, 43, respectively, are connected. Further, a pipe 71 is connected to the ejector 10, and when an air flow is generated from the pipe 36 to the pipe 71, the pressure of the pipe 47 becomes negative and the gas in the pipe 47 is sucked toward the pipe 71. Therefore, by operating the degassing three-way valves 41, 42, and 43, one of the storage containers connected to the pipe 47 is set to a negative pressure, and the gas contained in the developer stored in the storage container is sucked. It has become. A piping 48 connected to the factory exhaust is connected to the deaeration three-way valves 41, 42, 43, and the storage containers 8-1, 8-2, 8
-3 can be switched so that they can be connected to the factory exhaust or the ejector 10, respectively. The ejector 10 is connected from the trap tank 49 to the overflow tank 20.
また、吐出系７は、デベロッパＡ、ＢあるいはＣに現
像液を供給する配管50、51、52を備え、この配管50、5
1、52と連結される収納容器を収納容器８−３から収納
容器８−２へ切換えるための吐出３方弁53、54、55及び
収納容器８−１と切換えるための吐出３方弁56、57、58
が設けられる。さらに吐出３方弁56、57、58とデベロッ
パＡ、Ｂ、Ｃ間にはそれぞれベローズポンプ59、60、61
が設けられ、ベローズポンプ59、60、61を駆動させるた
めのエアを供給するため、ベローズポンプ59、60、61の
それぞれとエア供給体37を接続するエア供給弁62、63、
64がレギュレータ65を介して接続される。さらにベロー
ズポンプ59、60、61の作動開始時に動きを滑らかにする
ための始動を行う間に現像液がデベロッパＡ、Ｂ、Ｃに
吐出されないよう循環用３方弁66、67、68がそれぞれベ
ローズポンプ59、60、61とデベロッパＡ、Ｂ、Ｃ間に備
えられ、循環用３方弁66、67、68をそれぞれ切換えるこ
とにより、ベローズポンプ59、60、61が逆止弁69、ニー
ドルバルブ70を介して所望の収納容器に接続されるよう
３方弁16、17を切換えて所望の収納容器に現像液を戻す
ようになっている。さらに、吐出系７には吐出ノズル６
からウェハ２上に現像液滴下後に吐出ノズル６に残存す
る現像液の液だれを防止するため、残存する現像液を吸
引するためのサックバックや配管50、51及び52を適温に
暖めるための温度調整用のウォータジャケット等（図示
せず）が設けられる。Further, the discharge system 7 includes pipes 50, 51, and 52 for supplying a developer to the developers A, B, or C.
A discharge three-way valve 53, 54, 55 for switching the storage container connected to 1, 52 from the storage container 8-3 to the storage container 8-2 and a discharge three-way valve 56 for switching to the storage container 8-1, 57, 58
Is provided. Further, bellows pumps 59, 60, 61 are provided between the discharge three-way valves 56, 57, 58 and the developers A, B, C, respectively.
Is provided, to supply air for driving the bellows pumps 59, 60, 61, air supply valves 62, 63, which connect each of the bellows pumps 59, 60, 61 and the air supply body 37,
64 is connected via the regulator 65. Further, the three-way circulation valves 66, 67, 68 are respectively provided with bellows so that the developer is not discharged to the developers A, B, C during the start for smoothing the movement at the start of the operation of the bellows pumps 59, 60, 61. The bellows pumps 59, 60, 61 are provided between the pumps 59, 60, 61 and the developers A, B, C by switching the three-way circulation valves 66, 67, 68, respectively. The three-way valves 16 and 17 are switched so that the developer is connected to the desired storage container via the port, and the developer is returned to the desired storage container. Further, the discharge system 7 includes a discharge nozzle 6.
In order to prevent dripping of the developing solution remaining in the discharge nozzle 6 after the developing liquid drops fall on the wafer 2, a suck-back for sucking the remaining developing solution and a temperature for warming the pipes 50, 51 and 52 to an appropriate temperature. An adjustment water jacket or the like (not shown) is provided.
このような構成の現像装置の動作を説明する。 The operation of the developing device having such a configuration will be described.
まず処理液供給系９から収納容器に現像液12を充填す
る方法を説明する。例えば収納容器８−１に現像液12を
充填するのは供給バルブ92及び93を閉成し、供給バルブ
91を開成する。そして脱気３方弁41を操作して工場排気
に接続される配管48と配管44を連結させる。これにより
収納容器８−１内の気体が除去され、処理液供給系９か
ら現像液12が収納容器81内に充填される。この時、収納
容器８−１の中の液面がハイレベルとなり、現像液が過
剰に供給されたことを液量検出計81が検知すると３方弁
17を操作して配管22と配管15を連結させ、バルブ19を開
成し、さらにパージバルブ30を開いて窒素ガス供給系35
から収納容器８−１に窒素ガスを圧送することにより余
剰の現像液をオーバーフロータンク20に排出させる。オ
ーバーフロータンク20の液面の高さが高くなったことを
オーバーフローセンサ23が検出するとバルブ24を開いて
排出させる。このように収納容器８−２、８−３につい
ても供給バルブ92あるいは93及び脱気３方弁42あるいは
43を操作して同様に現像液の供給を行うことができる。First, a method for filling the developer from the processing liquid supply system 9 into the container will be described. For example, to fill the container 8-1 with the developer 12, the supply valves 92 and 93 are closed and the supply valve is closed.
Open 91. Then, the degassing three-way valve 41 is operated to connect the pipe 48 and the pipe 44 connected to the factory exhaust. Thus, the gas in the storage container 8-1 is removed, and the developing solution 12 is filled in the storage container 81 from the processing liquid supply system 9. At this time, when the liquid level in the storage container 8-1 becomes high level and the liquid amount detector 81 detects that the developer is excessively supplied, the three-way valve is used.
Operate the pipe 17 to connect the pipe 22 to the pipe 15, open the valve 19, and open the purge valve 30 to open the nitrogen gas supply system 35.
The excess developer is discharged to the overflow tank 20 by feeding nitrogen gas into the storage container 8-1 under pressure. When the overflow sensor 23 detects that the liquid level in the overflow tank 20 has increased, the valve 24 is opened and discharged. Thus, the supply valves 92 or 93 and the deaeration three-way valve 42 or the storage containers 8-2 and 8-3 are also provided.
By operating the button 43, the developer can be supplied in the same manner.
次に収納容器内の現像液に混入した気体を脱気する方
法を説明する。収納容器８−１から脱気をするにはパー
ジバルブ30を閉じて窒素ガス供給系35からの窒素ガス供
給を停止させる。その後脱気ソレノイド39を開いて配管
36からエジェクタ10にエアを送風し配管71に空気流を生
じさせ配管47を負圧にする。この時脱気３方弁41を操作
して配管44と配管47を接続させ、収納容器８−１から脱
気を行う。収納容器８−１から霧状となって吸引される
現像液はトラップタンク49に集められ、オーバーフロー
タンク20に送られる。エジェクタ10により積極的に脱気
された現像液はしばらく放置されてさらに脱気を行う。
この時収納容器８−１には窒素ガス供給系35からパージ
バルブ30を開くことにより、配管44から脱気３方弁41を
通り配管48に接続して工場排気系に排気するよう窒素ガ
スを吹きつけ、現像液が空気に接触しないようにする。Next, a method for degassing the gas mixed in the developer in the storage container will be described. To deaerate the storage container 8-1, the purge valve 30 is closed and the supply of nitrogen gas from the nitrogen gas supply system 35 is stopped. Then open the degassing solenoid 39 and connect the piping
Air is blown from the 36 to the ejector 10 to generate an air flow in the pipe 71 to make the pipe 47 a negative pressure. At this time, the pipe 44 and the pipe 47 are connected by operating the degassing three-way valve 41 to degas from the storage container 8-1. The developer sucked in the form of a mist from the storage container 8-1 is collected in the trap tank 49 and sent to the overflow tank 20. The developing solution positively degassed by the ejector 10 is left for a while to further degas.
At this time, by opening the purge valve 30 from the nitrogen gas supply system 35 to the storage container 8-1, the nitrogen gas is blown from the pipe 44 through the deaeration three-way valve 41 to the pipe 48 so as to be exhausted to the factory exhaust system. So that the developer does not come into contact with air.
収納容器中の脱気が終了した現像液をデベロッパに吐
出する第一の工程を行う。まず、収納容器８−１、８−
２、８−３のいずれかから吐出するか第一の収納容器を
選択し、例えば収納容器８−１から供給するのであれば
吐出３方弁56、57、58を開き収納容器８−１と配管50、
51、52を接続する。この時吐出３方弁53、54、55は閉成
し収納容器８−２、８−３からの供給は停止させる。そ
して、エア供給体37からのエアをベローズポンプ59、6
0、61に供給し、ベローズポンプ59、60、61を選択的に
駆動させるためエア供給弁62、63、64を開閉させる。エ
ア供給弁62、63、64を所望のタイミングで開閉するよう
にすれば、配管50、51、52からデベロッパＡ、Ｂ、Ｃに
所望のタイミングで所定量の現像液が供給される。この
時ベローズポンプ59、60、61の作動開始時にベローズポ
ンプ59、60、61の動作が滑らかになるまでの約２秒間程
はデベロッパＡ、Ｂ、Ｃに現像液が送出されないよう循
環３方弁66、67、68を切換え、３方弁17を収納容器８−
１に接続して収納容器８−１に現像液を戻すようにす
る。同様に第二の収納容器８−２についても吐出３方弁
53、54、55を操作してデベロッパＡ、Ｂ、Ｃに吐出する
ことができ、収納容器８−２の現像液が消費されると、
収納容器８−３についても同様に行うことができる。収
納容器８−１、収納容器８−３から現像液をデベロッパ
Ａ、Ｂ、Ｃに供給する際の各弁の開閉のタイミングチャ
ートをそれぞれ第３図及び第４図に示す。The first step of discharging the deaerated developer in the storage container to the developer is performed. First, the storage containers 8-1, 8-
2 or 8-3, or select the first storage container. For example, if the supply is to be performed from the storage container 8-1, the discharge three-way valves 56, 57, and 58 are opened to open the storage container 8-1. Piping 50,
Connect 51 and 52. At this time, the discharge three-way valves 53, 54, 55 are closed, and the supply from the storage containers 8-2, 8-3 is stopped. Then, the air from the air supply body 37 is supplied to the bellows pumps 59 and 6.
The air supply valves 62, 63, and 64 are opened and closed to selectively drive the bellows pumps 59, 60, and 61. If the air supply valves 62, 63 and 64 are opened and closed at desired timings, a predetermined amount of developer is supplied to the developers A, B and C from the pipes 50, 51 and 52 at desired timings. At this time, at the start of the operation of the bellows pumps 59, 60, and 61, the circulation three-way valve is used to prevent the developer from being sent to the developers A, B, and C for about two seconds until the operation of the bellows pumps 59, 60, and 61 becomes smooth. Switch between 66, 67 and 68, and store the 3-way valve 17 in the storage container 8-
1 to return the developer to the storage container 8-1. Similarly, a discharge three-way valve is also provided for the second storage container 8-2.
The developer can be discharged to the developers A, B and C by operating 53, 54 and 55, and when the developer in the storage container 8-2 is consumed,
The same applies to the storage container 8-3. FIGS. 3 and 4 show timing charts for opening and closing the valves when the developer is supplied from the storage containers 8-1 and 8-3 to the developers A, B, and C, respectively.
このような収納容器８−１内の現像液の供給を行う第
一の工程が終了すると、第５図に示すように、収納容器
８−２内の現像液の供給を行うと同時に収納容器８−１
へ現像後の充填及び脱気、脱気後放置する第二の工程が
行われ、順次収納容器に収納される現像液により処理が
行われ、収納容器からデベロッパへの吐出は３つの収納
容器について行えばデベロッパへの吐出を滞ることなく
行うことができる。When the first step of supplying the developer in the storage container 8-1 is completed, as shown in FIG. 5, the developer in the storage container 8-2 is supplied and simultaneously the supply of the developer is performed. -1
The second step of filling and degassing after development and leaving after degassing is performed, processing is sequentially performed with the developer stored in the storage container, and discharge from the storage container to the developer is performed for three storage containers. If it is performed, the discharge to the developer can be performed without delay.
以上の説明は現像装置に適用した実施例について述べ
たが、処理液の塗布であればレジスト液でも、磁性材料
でも何れの塗布に適用できる。The above description has been given of the embodiment applied to the developing device. However, as long as the processing liquid is applied, either the resist liquid or the magnetic material can be applied to any application.
［発明の効果］ 以上の説明からも明らかなように、本発明の液処理方
法は、収納容器に充填された処理液に混入された気泡を
除去するのみでなく、処理液中に含有される気体を収納
容器外へ吸引して除去して処理むらを防止できる。収納
容器への処理液供給と、収納容器中の処理液に混入され
た気体の脱気と、吐出系への吐出が順次弁を操作するこ
とにより休止することなく行なわれ効率のよい製造を行
うことができる。そのため得られる製品も低価でしかも
高品位なものとすることができる。[Effects of the Invention] As is clear from the above description, the liquid processing method of the present invention not only removes air bubbles mixed in the processing liquid filled in the storage container, but also contains the processing liquid. Gas can be sucked out of the storage container and removed to prevent processing unevenness. The supply of the processing liquid to the storage container, the degassing of the gas mixed in the processing liquid in the storage container, and the discharge to the discharge system are performed without stopping by sequentially operating the valves, thereby performing efficient production. be able to. Therefore, the obtained product can be made inexpensive and high quality.
第１図は本発明の液処理方法を適用した一実施例の構成
図、第２図は第１図に示す一実施例の要部を示す図、第
３図及び第４図は第１図に示す一実施例の駆動のタイミ
ングチャート、第５図は第１図に示す一実施例のシーケ
ンスを示す図である。 １……現像装置（液処理装置） ２……ウェハ（被処理体） ７……吐出系 ８−１、８−２、８−３……収納容器 ９……処理液供給系 10……脱気装置FIG. 1 is a block diagram of an embodiment to which the liquid processing method of the present invention is applied, FIG. 2 is a diagram showing a main part of the embodiment shown in FIG. 1, and FIGS. 3 and 4 are FIG. 5 is a timing chart of the driving of the embodiment shown in FIG. 5, and FIG. 5 is a diagram showing a sequence of the embodiment shown in FIG. DESCRIPTION OF SYMBOLS 1 ... Developing apparatus (liquid processing apparatus) 2 ... Wafer (object to be processed) 7 ... Discharge system 8-1, 8-2, 8-3 ... Storage container 9 ... Processing liquid supply system 10 ... Removal Qi device
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０１Ｌ 21/30 ５６９Ａ (72)発明者 村上 浩一 熊本県菊池郡菊陽町津久礼2655番地 東 京エレクトロン九州株式会社内 (56)参考文献 特開 昭63−97222（ＪＰ，Ａ) 実開 昭62−37923（ＪＰ，Ｕ)──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification code FI H01L 21/30 569A (72) Inventor Koichi Murakami 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Co., Ltd. (56) References JP-A-63-97222 (JP, A) JP-A-62-37923 (JP, U)
Claims (3)
一の前記収納容器からのみ被処理体に前記処理液を供給
する第一の工程と、 前記第一の収納容器内の前記処理液が所定量消費された
後、第二の前記収納容器から前記被処理体に前記処理液
を供給すると同時に、前記第一の収納容器へ前記処理液
を充填し、前記第二の収納容器内の前記処理液が所定量
消費される前に、前記第一の収納容器内を負圧にして前
記収納容器内の前記処理液中に含有された気体を前記収
納容器外へ吸引して脱気を行った後放置する第二の工程
とを具備し、 複数の前記収納容器に対して順次前記第二の工程と前記
第一の工程を反復して行うことを特徴とする液処理方
法。A first step of supplying the processing liquid to the object only from the first one of the plurality of storage containers storing the processing liquid; and the processing in the first storage container. After a predetermined amount of the liquid is consumed, the processing liquid is supplied from the second storage container to the object to be processed, and at the same time, the processing liquid is filled in the first storage container and the second storage container is filled with the processing liquid. Before the processing liquid is consumed by a predetermined amount, the inside of the first storage container is depressurized by drawing a gas contained in the processing liquid in the storage container to the outside of the storage container by depressurizing the inside of the first storage container. And a second step of allowing the container to stand after performing the step, wherein the second step and the first step are sequentially and repeatedly performed on a plurality of the storage containers.
一の前記収納容器に前記処理液を充填する充填工程と、 前記充填工程後、前記収納容器内を負圧にして前記処理
液中に含有された気体を前記収納容器外へ吸引して除去
し、前記第一の収納容器から被処理体に前記処理液を供
給するまで前記第一の収納容器内の処理液を放置する放
置工程と、 前記第一の収納容器から前記被処理体に前記処理液を供
給すると共に、前記第一の収納容器内の前記処理液を所
定量消費する前に、第二の前記収納容器に対して前記充
填工程及び前記放置工程を行う供給充填放置工程とを備
え、 複数の前記収納容器に対して順次前記供給充填放置工程
を反復して行うことを特徴とする液処理方法。2. A filling step of filling the first storage container with the processing liquid among a plurality of storage containers for storing the processing liquid; and after the filling step, reducing the pressure inside the storage container to a negative pressure with the processing liquid. The gas contained therein is removed by suction to the outside of the storage container, and the processing liquid in the first storage container is left until the processing liquid is supplied from the first storage container to the object to be processed. And supplying the processing liquid from the first storage container to the object to be processed, and before consuming a predetermined amount of the processing liquid in the first storage container, with respect to the second storage container. And a supply-filling and leaving step of performing the filling step and the leaving step, wherein the supply-filling and leaving step is sequentially and repeatedly performed on a plurality of the storage containers.
前記収納容器内の気体を除去しつつ行うことを特徴とす
る請求項１または２記載の液処理方法。3. The method according to claim 1, wherein the processing solution is charged into the storage container.
The method according to claim 1, wherein the method is performed while removing gas from the storage container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32841290A JP3150690B2 (en) | 1990-11-28 | 1990-11-28 | Chemical treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32841290A JP3150690B2 (en) | 1990-11-28 | 1990-11-28 | Chemical treatment equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14119099A Division JP3206745B2 (en) | 1999-05-21 | 1999-05-21 | Liquid supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04197434A JPH04197434A (en) | 1992-07-17 |
| JP3150690B2 true JP3150690B2 (en) | 2001-03-26 |
Family
ID=18209977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32841290A Expired - Fee Related JP3150690B2 (en) | 1990-11-28 | 1990-11-28 | Chemical treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3150690B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW382749B (en) * | 1996-12-24 | 2000-02-21 | Tokyo Electron Ltd | Liquid supplying device |
| JP2001032081A (en) * | 1999-07-19 | 2001-02-06 | Electroplating Eng Of Japan Co | Additive feeding device |
| JP5451515B2 (en) * | 2010-05-06 | 2014-03-26 | 東京エレクトロン株式会社 | Chemical supply system, substrate processing apparatus including the same, and coating and developing system including the substrate processing apparatus |
| JP5999073B2 (en) * | 2013-11-20 | 2016-09-28 | 東京エレクトロン株式会社 | Treatment liquid supply apparatus, treatment liquid supply method, and storage medium |
-
1990
- 1990-11-28 JP JP32841290A patent/JP3150690B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04197434A (en) | 1992-07-17 |
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