JP3149676B2 - Ultrasonic bonding equipment - Google Patents

Ultrasonic bonding equipment

Info

Publication number
JP3149676B2
JP3149676B2 JP8152994A JP8152994A JP3149676B2 JP 3149676 B2 JP3149676 B2 JP 3149676B2 JP 8152994 A JP8152994 A JP 8152994A JP 8152994 A JP8152994 A JP 8152994A JP 3149676 B2 JP3149676 B2 JP 3149676B2
Authority
JP
Japan
Prior art keywords
impedance
bonding
ultrasonic
piezoelectric element
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8152994A
Other languages
Japanese (ja)
Other versions
JPH07297239A (en
Inventor
潔 有田
幸一 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP8152994A priority Critical patent/JP3149676B2/en
Publication of JPH07297239A publication Critical patent/JPH07297239A/en
Application granted granted Critical
Publication of JP3149676B2 publication Critical patent/JP3149676B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、ボンディングツールを
超音波振動させながらワークに押し付けてワークを対象
物にボンディングする超音波ボンディング装置に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic bonding apparatus which presses a bonding tool against a work while ultrasonically oscillating a bonding tool to bond the work to an object.

【０００２】[0002]

【従来の技術】例えば特開平２−２０６１４３などに記
載されたワイヤボンディング装置は、超音波発振器によ
り圧電素子に電圧を印加してホーンを超音波（ＵＳ）振
動させながら、ホーンの先端部に保持されたキャピラリ
ツールによりワイヤをチップの電極や基板の電極に押し
付けてボンディングするようになっている。また特開平
４−１９９７２５などに記載されたインナーリードボン
ディング装置も、同様にホーンを超音波振動させながら
ホーンの先端部に保持された押圧子をリードに押し付け
てリードをチップの電極にボンディングするようになっ
ている。2. Description of the Related Art For example, a wire bonding apparatus described in Japanese Patent Application Laid-Open No. Hei 2-206143 holds a horn at the tip of a horn while applying a voltage to a piezoelectric element by an ultrasonic oscillator to ultrasonically (US) vibrate the horn. The wire is pressed against the electrode of the chip or the electrode of the substrate by the capillary tool so as to be bonded. Similarly, an inner lead bonding apparatus described in Japanese Patent Application Laid-Open No. 4-199725 also presses a pressing element held at the tip of the horn against the lead while ultrasonically oscillating the horn to bond the lead to the electrode of the chip. It has become.

【０００３】上記ホーンなどのボンディングツールの発
振出力は、ボンディングツールのインピーダンスと超音
波発振器側から圧電素子に印加される印加電圧によって
定まる。そこで従来は、ボンディングツールのインピー
ダンスは一定として、圧電素子に印加される印加電圧を
制御することによりボンディングツールの発振出力を制
御していた。[0003] The oscillation output of a bonding tool such as the horn is determined by the impedance of the bonding tool and the voltage applied to the piezoelectric element from the ultrasonic oscillator side. Therefore, conventionally, the oscillation output of the bonding tool has been controlled by controlling the voltage applied to the piezoelectric element while keeping the impedance of the bonding tool constant.

【０００４】[0004]

【発明が解決しようとする課題】ところが実際は、ボン
ディングツールのインピーダンスは一定ではなく、ホー
ンの取付部やホーンの先端部に保持されたキャピラリツ
ールなどの押圧子の保持状態や押圧子の交換などによっ
て変化することから、上記従来手段では発振出力が基準
値からずれてしまい、ボンディング不良が発生しやすい
という問題点があった。However, in practice, the impedance of the bonding tool is not constant, but depends on the holding state of the horn mounting part, the pressing element such as the capillary tool held at the tip of the horn, and the replacement of the pressing element. Due to the change, the conventional means has a problem that the oscillation output deviates from the reference value, and a bonding failure is likely to occur.

【０００５】そこで本発明は、ボンディングツールのイ
ンピーダンスの変化に応じて超音波発振器の出力を補正
することにより、安定したボンディングが行える超音波
ボンディング装置を提供することを目的とする。Accordingly, an object of the present invention is to provide an ultrasonic bonding apparatus capable of performing stable bonding by correcting the output of an ultrasonic oscillator according to a change in impedance of a bonding tool.

【０００６】[0006]

【課題を解決するための手段】このために本発明は、ワ
ークを対象物に押圧してボンディングするボンディング
ツールと、このボンディングツールを超音波振動させる
圧電素子と、超音波発振器と、この超音波発振器で発振
された高周波信号を昇圧して圧電素子に印加するトラン
スと、このトランスの電流と電圧に基づいてボンディン
グツール側のインピーダンスを演算するインピーダンス
演算部と、このインピーダンスの変動にともなって変化
する圧電素子への供給電力を補正するために超音波発振
器に印加される電圧を制御する制御部とから超音波ボン
ディング装置を構成したものである。SUMMARY OF THE INVENTION For this purpose, the present invention provides a bonding tool for pressing a workpiece against an object and bonding the same, a piezoelectric element for ultrasonically vibrating the bonding tool, an ultrasonic oscillator, and an ultrasonic oscillator. A transformer that boosts a high-frequency signal oscillated by an oscillator and applies the boosted signal to a piezoelectric element, an impedance calculator that calculates the impedance of the bonding tool based on the current and voltage of the transformer, and changes with the fluctuation of the impedance. An ultrasonic bonding apparatus comprises a control unit that controls a voltage applied to an ultrasonic oscillator to correct power supplied to a piezoelectric element.

【０００７】[0007]

【作用】上記構成によれば、ボンディングツールのイン
ピーダンスの変化を監視し、インピーダンスの変化に対
応して電圧を制御することにより、ボンディングツール
の発振出力を一定に保って安定したボンディングを行う
ことができる。According to the above configuration, by monitoring the change in the impedance of the bonding tool and controlling the voltage in accordance with the change in the impedance, the oscillation output of the bonding tool can be kept constant and stable bonding can be performed. it can.

【０００８】[0008]

【実施例】次に、図面を参照しながら本発明の一実施例
を説明する。図１は本発明の一実施例のワイヤボンディ
ング装置の側面図、図２は同ワイヤボンディング装置に
備えられた超音波発振回路のブロック図、図３は同ワイ
ヤボンディング装置に備えられた超音波発振回路の発振
出力図、図４は同ワイヤボンディング装置に備えられた
超音波発振回路の動作のフローチャート、図５は同ワイ
ヤボンディング装置に備えられた超音波発振回路の動作
のフローチャートである。図１において、１はボンディ
ングツールであって、ホーン２と、ホーン２の先端部に
保持されたキャピラリツール３と、ホーン２の後端部に
結合された圧電素子４から成っている。キャピラリツー
ル３にはワイヤ５が挿通されている。６はリードフレー
ムであり、その上面にチップ７が搭載されている。圧電
素子４に高周波の電圧を印加してホーン２をＵＳ（超音
波）振動させながら、ワイヤ５をキャピラリツール３の
下面でリードフレーム６やチップ７の上面に押し付けて
ボンディングし、リードフレーム６とチップ７をワイヤ
５で接続する。２１はリードフレーム６が載置された基
台であり、その側面にはシリンダ２２が設けられてい
る。シリンダ２２のロッド２３はマスク２４を保持して
いる。シリンダ２２のロッド２３が引き込むことによ
り、マスク２４でリードフレーム６を基台２１に押し付
けて、キャピラリツール３をＵＳ振動させながらワイヤ
ボンディングを行う最中に、リードフレーム６ががたむ
くのを防止する。Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a side view of a wire bonding apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram of an ultrasonic oscillation circuit provided in the wire bonding apparatus, and FIG. 3 is an ultrasonic oscillation provided in the wire bonding apparatus. FIG. 4 is a flowchart of the operation of the ultrasonic oscillation circuit provided in the wire bonding apparatus, and FIG. 5 is a flowchart of the operation of the ultrasonic oscillation circuit provided in the wire bonding apparatus. In FIG. 1, reference numeral 1 denotes a bonding tool, which comprises a horn 2, a capillary tool 3 held at the tip of the horn 2, and a piezoelectric element 4 coupled to a rear end of the horn 2. A wire 5 is inserted through the capillary tool 3. Reference numeral 6 denotes a lead frame on which a chip 7 is mounted. While applying a high frequency voltage to the piezoelectric element 4 to cause the horn 2 to vibrate the US (ultrasonic wave), the wire 5 is pressed against the upper surface of the lead frame 6 or the chip 7 from the lower surface of the capillary tool 3 and bonded to the lead frame 6. The chip 7 is connected with the wire 5. Reference numeral 21 denotes a base on which the lead frame 6 is mounted, and a cylinder 22 is provided on a side surface thereof. The rod 23 of the cylinder 22 holds the mask 24. When the rod 23 of the cylinder 22 is pulled in, the lead frame 6 is pressed against the base 21 by the mask 24 to prevent the lead frame 6 from sagging during wire bonding while causing the capillary tool 3 to vibrate in the US. I do.

【０００９】ホーン２の基端部はフレーム２５に支持さ
れている。フレーム２５の後端部にはカムフォロワ２
６，２７が軸着されており、カムフォロワ２６，２７は
カム２８を挾持している。モータ２９に駆動されてカム
２８が回転すると、フレーム２５はピン３０を中心に上
下方向に揺動し、ホーン２も同方向に揺動してキャピラ
リツール３はワイヤ５をチップ７の上面やリードフレー
ム６の上面に押し付けてボンディングする。３１はテー
ブル装置であって、Ｘテーブル３２とＹテーブル３３を
段積して構成されている。フレーム２５はＹテーブル３
３上の軸受３６に支持されている。Ｘテーブル３２の駆
動用モータ３４とＹテーブル３３の駆動用モータ３５が
駆動すると、フレーム２５やフレーム２５に保持された
ホーン２はＸ方向やＹ方向に水平移動し、キャピラリツ
ール３を所定のボンディング位置に位置させる。The base end of the horn 2 is supported by a frame 25. A cam follower 2 is provided at the rear end of the frame 25.
The cam followers 26 and 27 hold the cam 28 therebetween. When the cam 28 rotates by being driven by the motor 29, the frame 25 swings up and down around the pin 30, and the horn 2 also swings in the same direction. It is pressed against the upper surface of the frame 6 for bonding. Reference numeral 31 denotes a table device, which is configured by stacking an X table 32 and a Y table 33. Frame 25 is Y table 3
3 is supported by the bearing 36 above. When the drive motor 34 of the X table 32 and the drive motor 35 of the Y table 33 are driven, the frame 25 and the horn 2 held by the frame 25 move horizontally in the X direction and the Y direction, and attach the capillary tool 3 to a predetermined bonding position. Position.

【００１０】次に、図２を参照して超音波（ＵＳ）発振
回路について説明する。図２において、４０はトランス
である。トランス４０の１次側は超音波発振器４１に接
続されており、また２次側は圧電素子４に接続されてい
る。また２次側の一方の端子は第１の実効値変換回路
（以下、ＲＭＳという）４２に接続されており、他方の
端子は第２のＲＭＳ４３に接続されている。第１のＲＭ
Ｓ４２は、２次側の電圧ｖを実効値電圧Ｖに変換する。
また第２のＲＭＳ４３は、２次側の電流ｉを実効値電流
Ｉに変換する。Next, an ultrasonic (US) oscillation circuit will be described with reference to FIG. In FIG. 2, reference numeral 40 denotes a transformer. The primary side of the transformer 40 is connected to the ultrasonic oscillator 41, and the secondary side is connected to the piezoelectric element 4. One terminal on the secondary side is connected to a first effective value conversion circuit (hereinafter, referred to as RMS) 42, and the other terminal is connected to a second RMS 43. First RM
S42 converts the secondary-side voltage v into an effective value voltage V.
The second RMS 43 converts the secondary-side current i into an effective value current I.

【００１１】第１のＲＭＳ４２と第２のＲＭＳ４３はイ
ンピーダンス演算部４４に接続されており、このインピ
ーダンス演算部４４はインピーダンスＺ１＝Ｖ÷Ｉを演
算する。演算されたインピーダンスＺ１はＡ／Ｄ変換器
４５でＡ／Ｄ変換され、インターフェイス４６を通して
制御部（ＣＰＵ）４７に入力される。４８は記憶部であ
って、この記憶部４８は基準状態におけるインピーダン
スＺ０、インピーダンス演算部４４で演算されたインピ
ーダンスＺ１、基準状態における印加電圧Ｖ０などを記
憶する。制御部４７は、記憶部４８に記憶されたデータ
を読取りながら、超音波発振器４１を制御する。The first RMS 42 and the second RMS 43 are connected to an impedance calculator 44, which calculates the impedance Z1 = V ÷ I. The calculated impedance Z1 is A / D converted by an A / D converter 45 and input to a control unit (CPU) 47 through an interface 46. Reference numeral 48 denotes a storage unit which stores the impedance Z0 in the reference state, the impedance Z1 calculated by the impedance calculation unit 44, the applied voltage V0 in the reference state, and the like. The control unit 47 controls the ultrasonic oscillator 41 while reading the data stored in the storage unit 48.

【００１２】図３は超音波発振回路の発振出力図であ
る。横軸は時間ｔ、縦軸は発振出力Ｐである。実線波形
で示されるＰ０は基準状態（インピーダンスＺ０時）の
発振出力であって、（数１）のとおりである。FIG. 3 is an oscillation output diagram of the ultrasonic oscillation circuit. The horizontal axis represents time t, and the vertical axis represents oscillation output P. P0 indicated by a solid waveform is an oscillation output in a reference state (at the time of impedance Z0), as shown in (Equation 1).

【００１３】[0013]

【数１】 (Equation 1)

【００１４】また破線波形で示されるＰ１はインピーダ
ンスがＺ１のときの発振出力であって、（数２）のとお
りである。P1 indicated by a broken-line waveform is an oscillation output when the impedance is Z1, and is as shown in (Expression 2).

【００１５】[0015]

【数２】 (Equation 2)

【００１６】発振出力Ｐ１はボンディングツール１のイ
ンピーダンスの変動のために発振出力Ｐ０よりも小さく
なった場合で、この発振出力Ｐ１でボンディングツール
１を超音波振動させるとボンディング不良が生じる。そ
こでインピーダンスがＺ０からＺ１に変化しても、所定
の発振出力Ｐ０が得られるように、印加電圧をＶ０から
Ｖ１にアップし、このＶ１を補正印加電圧として印加す
ればよい。そこで補正係数Ａを（数３）で演算する。The oscillation output P1 is smaller than the oscillation output P0 due to the fluctuation of the impedance of the bonding tool 1. When the bonding tool 1 is ultrasonically oscillated with the oscillation output P1, a bonding failure occurs. Therefore, even if the impedance changes from Z0 to Z1, the applied voltage may be increased from V0 to V1 so that a predetermined oscillation output P0 is obtained, and this V1 may be applied as a corrected applied voltage. Therefore, the correction coefficient A is calculated by (Equation 3).

【００１７】[0017]

【数３】 (Equation 3)

【００１８】また補正印加電圧Ｖ１は（数４）から求め
られ（数５）のとおり発振出力Ｐ１は発振出力Ｐ０に等
しくなる。The correction applied voltage V1 is obtained from (Equation 4), and as shown in (Equation 5), the oscillation output P1 becomes equal to the oscillation output P0.

【００１９】[0019]

【数４】 (Equation 4)

【００２０】[0020]

【数５】 (Equation 5)

【００２１】したがって（数５）から明らかなように、
インピーダンスがＺ１の場合も、所定の発振出力Ｐ０が
得られる。なお上述した演算は制御部４７で行われる。Therefore, as is apparent from (Equation 5),
Even when the impedance is Z1, a predetermined oscillation output P0 is obtained. The above calculation is performed by the control unit 47.

【００２２】図４はインピーダンスＺ１の測定フローで
ある。まず超音波発振電圧指令信号Ｖ０で発振指令が制
御部４７から出され（ステップ１）、そのときのインピ
ーダンスＺ１を読み取り（ステップ２）、読み取られた
インピーダンスＺ１を記憶部２８に記憶する（ステップ
３）。FIG. 4 is a flowchart for measuring the impedance Z1. First, an oscillation command is issued from the control unit 47 with the ultrasonic oscillation voltage command signal V0 (step 1), the impedance Z1 at that time is read (step 2), and the read impedance Z1 is stored in the storage unit 28 (step 3). ).

【００２３】また図５はボンディング動作中の補正発振
フローを示している。まず超音波発振電圧指令信号Ｖ０
を読取り（ステップ１１）、補正係数Ａを演算し（ステ
ップ１２）、Ｖ１＝ＡＶ０を演算し（ステップ１３）、
補正超音波発振電圧指令信号Ｖ１を超音波発振器４１に
出力する（ステップ１４）。以上により、インピーダン
スＺ１の変化に追随して印加電圧を補正しながら、常に
所定の発振出力Ｐ０によりホーン２を振動させることが
できる。FIG. 5 shows a correction oscillation flow during the bonding operation. First, the ultrasonic oscillation voltage command signal V0
Is read (step 11), the correction coefficient A is calculated (step 12), and V1 = AV0 is calculated (step 13),
The corrected ultrasonic oscillation voltage command signal V1 is output to the ultrasonic oscillator 41 (Step 14). As described above, the horn 2 can always be vibrated by the predetermined oscillation output P0 while correcting the applied voltage following the change in the impedance Z1.

【００２４】なお、インピーダンスＺ０，Ｚ１の測定
は、ボンディングツール１を上昇させた無負荷の状態で
計測するか、もしくは実際のボンディングと同じように
押圧ツールを接地させた状態で計測する。また上記実施
例は、ワイヤボンディング装置を例にとって説明した
が、本発明はフィルムキャリヤのインナーリードをチッ
プの電極にボンディングするインナーリードボンディン
グ装置や、アウターリードを基板の電極にボンディング
するアウターリードボンディング装置などの他の超音波
ボンディング装置にも適用できる。The impedances Z0 and Z1 are measured with the bonding tool 1 raised and in a no-load state, or with the pressing tool grounded as in actual bonding. Although the above embodiments have been described with reference to a wire bonding apparatus as an example, the present invention relates to an inner lead bonding apparatus for bonding an inner lead of a film carrier to an electrode of a chip and an outer lead bonding apparatus for bonding an outer lead to an electrode of a substrate. For example, the present invention can be applied to other ultrasonic bonding apparatuses.

【００２５】[0025]

【発明の効果】以上説明したように本発明によれば、ボ
ンディングツールのインピーダンスの変化に追随して印
加電圧を補正することにより、常に一定の発振出力でボ
ンディングツールを超音波振動させることができ、した
がって安定したボンディングを行うことができる。As described above, according to the present invention, the bonding tool can be always ultrasonically vibrated with a constant oscillation output by correcting the applied voltage following the change in the impedance of the bonding tool. Therefore, stable bonding can be performed.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施例のワイヤボンディング装置の
側面図FIG. 1 is a side view of a wire bonding apparatus according to an embodiment of the present invention.

【図２】本発明の一実施例のワイヤボンディング装置に
備えられた超音波発振回路のブロック図FIG. 2 is a block diagram of an ultrasonic oscillation circuit provided in the wire bonding apparatus according to one embodiment of the present invention.

【図３】本発明の一実施例のワイヤボンディング装置に
備えられた超音波発振回路の発振出力図FIG. 3 is an oscillation output diagram of an ultrasonic oscillation circuit provided in the wire bonding apparatus according to one embodiment of the present invention.

【図４】本発明の一実施例のワイヤボンディング装置に
備えられた超音波発振回路の動作のフローチャートFIG. 4 is a flowchart of the operation of the ultrasonic oscillation circuit provided in the wire bonding apparatus according to one embodiment of the present invention;

【図５】本発明の一実施例のワイヤボンディング装置に
備えられた超音波発振回路の動作のフローチャートFIG. 5 is a flowchart of the operation of the ultrasonic oscillation circuit provided in the wire bonding apparatus according to one embodiment of the present invention;

【符号の説明】[Explanation of symbols]

１ ボンディングツール ４ 圧電素子 ４０ トランス ４１ 超音波発振器 ４４ インピーダンス演算部 ４７ 制御部 DESCRIPTION OF SYMBOLS 1 Bonding tool 4 Piezoelectric element 40 Transformer 41 Ultrasonic oscillator 44 Impedance calculation part 47 Control part

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 301 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 21/60 301

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ワークを対象物に押圧してボンディングす
るボンディングツールと、このボンディングツールを超
音波振動させる圧電素子と、超音波発振器と、この超音
波発振器で発振された高周波信号を昇圧して前記圧電素
子に印加するトランスと、このトランスの電流と電圧に
基づいて前記ボンディングツール側のインピーダンスを
演算するインピーダンス演算部と、このインピーダンス
の変動にともなって変化する前記圧電素子への供給電力
を補正するために前記超音波発振器に印加される電圧を
制御する制御部とを備えたことを特徴とする超音波ボン
ディング装置。1. A bonding tool that presses and bonds a work to an object, a piezoelectric element that ultrasonically vibrates the bonding tool, an ultrasonic oscillator, and boosts a high-frequency signal oscillated by the ultrasonic oscillator. A transformer to be applied to the piezoelectric element, an impedance calculating unit for calculating the impedance of the bonding tool based on the current and voltage of the transformer, and a correction of the power supplied to the piezoelectric element which changes with the variation of the impedance And a control unit for controlling a voltage applied to the ultrasonic oscillator to perform the ultrasonic bonding.
JP8152994A 1994-04-20 1994-04-20 Ultrasonic bonding equipment Expired - Fee Related JP3149676B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8152994A JP3149676B2 (en) 1994-04-20 1994-04-20 Ultrasonic bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8152994A JP3149676B2 (en) 1994-04-20 1994-04-20 Ultrasonic bonding equipment

Publications (2)

Publication Number Publication Date
JPH07297239A JPH07297239A (en) 1995-11-10
JP3149676B2 true JP3149676B2 (en) 2001-03-26

Family

ID=13748855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8152994A Expired - Fee Related JP3149676B2 (en) 1994-04-20 1994-04-20 Ultrasonic bonding equipment

Country Status (1)

Country Link
JP (1) JP3149676B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD804733S1 (en) 2015-10-21 2017-12-05 Two Guys And A Hat Inc. Protective headgear
US10390582B2 (en) 2014-12-05 2019-08-27 Two Guys And A Hat Inc. Protective headgear

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10390582B2 (en) 2014-12-05 2019-08-27 Two Guys And A Hat Inc. Protective headgear
USD804733S1 (en) 2015-10-21 2017-12-05 Two Guys And A Hat Inc. Protective headgear
USD804732S1 (en) 2015-10-21 2017-12-05 Two Guys And A Hat Inc. Protective headgear
USD804734S1 (en) 2015-10-21 2017-12-05 Two Guys And A Hat Inc. Protective headgear

Also Published As

Publication number Publication date
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