JP3148491B2 - How to energize the titanium case - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for energizing a titanium case used for surface treatment such as copper plating and nickel plating.

[0002]

2. Description of the Related Art As an anode for copper sulfate plating or nickel plating, for example, a copper case or a nickel chip stored as an anode chip in a titanium case which is not dissolved in a plating bath is sometimes used. In this case, it is usual to energize the anode by suspending the titanium case from a copper pipe or a copper pipe with titanium clad on the surface, or to energize the anode by bolting a tin-plated crimp terminal to the titanium case. It is.

However, as described above, the surface is made of titanium, copper,
When current is applied by contacting the current-carrying member made of either tin and the titanium case, a passivation film is formed on the surface of titanium, which gradually increases the current-carrying resistance of the contact portion and generates heat or poor current-carrying. In some cases. Therefore, as shown in FIG.
Attempts have been made to eliminate conduction failure by connecting the lead wire 3 to a current-carrying member 2 such as a copper pipe. However, in this case, a passivation film is still formed between the lead wire 3 and the titanium surface. It was formed and was not a fundamental solution.

[0004]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems and provides a titanium case capable of conducting electricity to a titanium case without causing heat generation or conduction failure in a current-carrying portion due to a passive film. The purpose of the present invention is to provide an energizing method.

[0005]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is directed to a method of manufacturing a semiconductor device by interposing a thin platinum plate at a contact portion between a conductive member made of any one of titanium, copper and tin and a titanium case. It is characterized by being energized. The platinum thin plate preferably has a thickness of at least about 0.1 mm, and may be an independent thin plate-shaped member or a member clad on the surface of another member.

[0006]

According to the present invention, platinum interposed in the contact portion between the current-carrying member made of any of titanium, copper, and tin and the titanium case prevents the formation of a passive film on the titanium surface. Although the reason is not clear, it is assumed that platinum acts as a negative catalyst. As a result, it is possible to conduct electricity from the conducting member to the titanium case without generating a passivation film on the titanium surface as shown in the later examples, and it is possible to prevent heat generation and conduction failure of the conducting part. .

[0007]

【Example】

[Embodiment 1] FIGS. 1 and 2 show a first embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a titanium case, and 4 denotes an anode chip housed therein. The titanium case 1 has a titanium frame 1a and a titanium lath net 1b.
The structure is such that electricity is supplied by hooking a hook portion 1c on the upper part of the hook portion 1c to the electricity supply member 2 shown in FIG. In the embodiment, the current-carrying member 2 is a copper pipe clad with titanium 2a on the surface.
2b, but may not have titanium cladding. In this embodiment, a platinum thin plate 5 having a thickness of about 0.2 mm is adhered to the inner surface of a hook portion 1c serving as a contact portion between the titanium case 1 and the conductive member 2. The case 1 is energized.

For example, when a copper chip is housed inside the above-mentioned titanium case 1 to form an anode, which is immersed in a copper sulfate plating bath and subjected to copper plating, the titanium surface of the current-carrying part is maintained even after several months. No generation of a passive film was observed, and heat generation in the current-carrying part was hardly observed. On the other hand, when copper plating was performed under the same conditions by the conventional method without the platinum thin plate 5, the formation of a passivation film on the titanium surface of the current-carrying part was recognized within several hours, and the temperature of the current-carrying part was reduced to 50 ° C. The degree has risen.

[Embodiment 2] FIGS. 3 and 4 show a second embodiment of the present invention, in which an energizing member 2 is directly bolted to a titanium case 1. FIG. In this embodiment, the current-carrying member 2 is a crimp terminal whose surface is plated with tin and is fixed to the titanium case 1 by bolts 6 and nuts 7. The washer-shaped platinum thin plate 5 having a thickness of 0.3 mm is used. Is interposed between the conducting member 2 and the titanium case 1.

When a nickel chip is housed in the inside of the titanium case 1 to form an anode, which is immersed in a nickel plating bath and subjected to nickel plating, a passivation film is formed on the titanium surface of the current-carrying part even after several months. No occurrence was observed. On the other hand, when the nickel thin plate 5 was omitted and nickel plating was performed under the same conditions, a passivation film was observed on the titanium surface of the current-carrying part within several hours.

[0011]

As described above, according to the method for energizing the titanium case of the present invention, the formation of the passive film on the titanium surface is prevented by the action of the platinum thin plate interposed in the energizing portion. Thus, it is possible to reliably prevent troubles such as heat generation and poor energization. Further, it is not necessary to attach a lead wire as shown in FIG. Therefore, the present invention is a method for energizing a titanium case suitable for surface treatment using a titanium case containing an anode chip,
The contribution to the industry is enormous.

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view showing a first embodiment.

FIG. 2 is a partially cutaway side view showing a main part of the first embodiment.

FIG. 3 is a partially cutaway front view showing a second embodiment.

FIG. 4 is a perspective view showing a main part of the second embodiment.

FIG. 5 is a side view of a main part showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Titanium case 2 Current-carrying member 5 Platinum thin plate

Claims (1)

(57) [Claims] 1. A platinum thin plate is provided at a contact portion between a conducting member (2) made of any of titanium, copper, and tin and a titanium case (1).
(5) A method for energizing a titanium case, wherein the energization is performed with an interposition of (5).