JP3146117U - System for testing material adhesion performance - Google Patents

Abstract

A system for testing adhesion performance of materials at various temperatures is provided.
An adhesion performance test system includes a hot / cold plate attached to the top of a thread of an adhesion / peeling tester, a thermoelectric (TE) controller, and a temperature-controllable fluid circulator. . The hot / cold plate 11 in the system allows the test temperature to be conveniently and rapidly changed.
[Selection] Figure 1

Description

  The present invention relates to a system for testing the adhesion performance of materials at various temperatures.

  Conventional pressure sensitive adhesion tests such as tack test, peel test, and slip test (or holding power test) are all performed at room temperature (constant temperature of 23 ± 2 ° C. and relative humidity of 50 ± 5% RH). However, in practice, the actual use temperature of most pressure-sensitive adhesives (PSA) varies in the range from -20 ° C to + 80 ° C. Many PSAs function at room temperature as well, but their adhesion performance and / or failure modes at low and / or high temperatures are very different. Unfortunately, until now, there was no global standard test method that could easily and precisely determine pressure-sensitive adhesive performance at various temperatures other than room temperature.

Two conventional techniques commonly used to evaluate pressure sensitive adhesive performance at various temperatures in the PSA industry are shown below.
1) A common method used in many research institutions is to use an oven or chamber attached to a peeling machine (eg, Instron). However, in a small oven, the overall effective peel length is very limited. Also, it is not so easy or fast to reach a stable and constant temperature for the test sample using either heating media or cooling media.
2) The second method is performed by triggering this tester from outside the box or room using an adhesion tester placed inside the temperature-controllable box or room. To avoid signal interference when testing adhesives inside a temperature controllable box or room, all electronics of the testing machine must be placed outside the oven or room. Only the mechanical part of the testing machine can be placed in a conditioned environment. Therefore, specially designed testing machines are required for each individual laboratory. Furthermore, in an air-conditioned room, it takes a lot of time and money to reach a consistent and stable target temperature to be tested.

  In view of the above, a more convenient and effective method and system for testing the adhesion performance of materials at various temperatures is desired.

  Accordingly, it is an object of the present invention to provide a system for testing the adhesion performance of materials at various temperatures.

The above object is achieved by a system for testing the adhesion performance of a material according to the present invention. In summary, the present invention is a system for testing the adhesion performance of materials at various temperatures,
(I) having a metal bottom plate, a metal top plate in contact with the metal bottom plate, and at least one thermoelectric module held between the top plate and the bottom plate, the bottom plate being inside thereof A gluing / peeling tester with a hot / cold plate having a fluid circulation channel attached to the top of the moving sled;
(Ii) a thermoelectric controller operably connected to the thermoelectric module in the hot / cold plate and having a feedback temperature control function;
(Iii) a temperature-controllable fluid circulator operatively connected to the fluid circulation channel within the bottom plate of the hot / cold plate;
It is the system characterized by having.

According to an embodiment of the present invention, the top plate and the bottom plate of the hot / cold plate are made of aluminum.
According to another embodiment of the present invention, the dimensions of the hot / cold plate are 200 mm × 100 mm × 40 mm.
According to another embodiment of the present invention, the hot / cold plate has three thermoelectric modules.
According to another embodiment of the present invention, the thermoelectric module has a maximum current of 12A, a maximum voltage of 15V, and a maximum power of 300W.
According to another embodiment of the present invention, the circulating fluid is water.
According to another embodiment of the present invention, the operating temperature range of the hot / cold plate is -20 ° C to 80 ° C.

  According to the present invention, any required test temperature on the top surface of the hot / cold plate can be achieved and stabilized in less than 5 minutes.

  The system of the present invention attaches a sample of test material to the top surface of a hot / cold plate attached to the top of a moving sled of an adhesion / peeling tester (tester) and bonds using the tester A material adhesion performance test characterized by performing the test can be performed.

  Other features and advantages of the present invention will become apparent from the following detailed description. However, while specific embodiments of the present invention are shown, it should be understood that the detailed description and specific examples have been presented by way of example only. This is because various changes and modifications within the spirit and scope of the present invention will be apparent to those skilled in the art from this detailed description and practice of the present invention.

  Hereinafter, a system for testing the adhesion performance of a material according to the present invention will be described in more detail with reference to the drawings.

  The foregoing summary, together with the following detailed description of the invention, will be better understood when read in conjunction with the appended drawings. For the purpose of illustrating the invention, there are shown in the drawings embodiments which are presently preferred. However, it should be understood that the invention is not limited to the precise apparatus and instrumentalities shown.

  Reference is now made to the drawings. FIG. 1 is a schematic view of an adhesion performance test system according to the present invention. Reference numeral 10 indicates the adhesion performance test system.

  As shown in FIG. 1, a hot / cold plate 11 is simultaneously connected to a thermoelectric (TE) controller 12 and a temperature-controllable fluid circulator 13. The temperature-controllable fluid circulator 13 is connected to the fluid circulation channel in the hot / cold plate 11 by two flexible tubes 131, 132. The hot / cold plate 11 is attached to the top of the moving sled of an adhesion / peeling and testing machine (not shown in FIG. 1) and has a plurality of through holes, in this example three through holes 141, Screwed at 142 and 143.

  2A and 2B are two cross-sectional views of the hot / cold plate 11 as seen from different directions. As shown in FIG. 2A, the hot / cold plate 11 includes a metal top plate 111 and a metal bottom plate 112. A thermoelectric (TE) module 113 a is held between the metal top plate 111 and the metal bottom plate 112. In order to accommodate the fluid circulation channel 114, the bottom plate 112 is generally formed thicker than the top plate 111. FIG. 2B is a cross-sectional view of the same hot / cold plate 11 viewed from a direction perpendicular to the direction of FIG. 2A. In FIG. 2B, two other thermoelectric (TE) modules 113b, 113c are shown along with the opening 130 of the fluid circulation channel 114.

  According to the present invention, the top plate and the bottom plate of the hot / cold plate are made of metal (preferably, metal having excellent thermal conductivity). In an embodiment of the invention, the hot / cold plate top and bottom plates are made of aluminum.

Thermoelectric (TE) modules, also known as Peltier devices, are small solid state devices that function as heat pumps. A “typical” unit is a few millimeters to a few centimeters square and a few millimeters thick. This is a sandwich formed of two ceramic plates with an array of small bismuth telluride (Bi ₂ Te ₃ ) cubes (“pairs”) in between. When a DC current is applied, heat is transferred from one side of the device to the other. This heat must be removed by a heat sink. The “cold” side can be used to cool electronic devices such as microprocessors or photodetectors. When the current is reversed, the electronic device is also an excellent heater.

  According to the present invention, the number of TE modules used in a hot / cold plate depends on the hot / cold plate dimensions, the required temperature range, and the required heating / cooling rate. In an embodiment of the present invention, the hot / cold plate includes three TE modules. FIG. 3 shows another example of the hot / cold plate of the present invention including three TE modules arranged on the upper surface of the bottom plate (in order to show the TE module and facilitate the understanding of the configuration of the present embodiment). The top plate has been removed).

  TE modules are commercially available. Manufacturers include (but are not limited to) Marlow (Dallas, Texas, USA), Melcor (Cleveland, Ohio, USA), and Tellurex (Traverse City, Michigan, USA). Not a thing).

  A TE controller used in the present invention is also commercially available. Preferably, the TE controller has a feedback temperature control function that can achieve a stable test temperature on the surface of the hot / cold plate. For a list of TE controller manufacturers, see www. pelleter-info. com / accessories. See html.

  Temperature-controllable fluid circulators used in the present invention are also commercially available. In general, normal laboratory water circulators are suitable for use in the present invention. Basically, the operating temperature of the hot / cold plate is in the range from 40 ° C. to 80 ° C. higher than the circulating fluid temperature. Thus, a 10 ° C. fluid can produce any test temperature between −30 ° C. and 90 ° C. However, since heat loss occurs during fluid circulation, the use of water as the circulating fluid can generally generate test temperatures between -20 ° C and 80 ° C. This wide operating temperature range over about 100 ° C. covers the most realistic temperatures for terrestrial PSA applications. If lower or higher test temperatures are required that deviate from this typical operating range, that temperature can be achieved by adding coolant to the circulating fluid or by heating the circulating fluid.

  The adhesion / peeling / testing machine used in the present invention is generally used in a test room to test the adhesion performance of PSA. In an embodiment of the present invention, the adhesion / peeling and testing machine is an Adhesion / Release Tester AR-1000 or AR-1500 manufactured by Chem Instruments (Fairfield, Ohio, USA). FIG. 4 shows an example of the hot / cold plate 11 according to the present invention fixed to the thread 101 of the Adhesion / Release Tester AR-1500, indicated by reference numeral 100.

  The invention is explained in more detail by the following examples. These examples are provided for illustrative purposes and should not be construed as limiting the scope of the invention.

  Example: 180 ° peel strength test of HMPSA

  1. Sample preparation

  In this example, three commercially available hot-melt pressure-sensitive adhesives (HMPSA) designated by adhesives A, B, and C were used. The adhesive was individually applied on a 50 μm polyester (PET) by a hot melt coater, resulting in a 25 μm adhesive film.

  2. Test system setup

  In the hot / cold plate 11 used in this embodiment, the top plate 111 and the bottom plate 112 are made of aluminum and include three TE modules 113 (maximum current = 12 A, maximum voltage = 15 V, maximum). (Power = 300W). The hot / cold plate 11 is pre-attached to the top of a sled 101 of Adhesion / Release Tester AR 1500 (Chem Instruments, Inc., Fairfield, Ohio, USA). The dimensions of the hot / cold plate 11 (200 mm × 100 mm × 40 mm) correspond to the dimensions of the thread 101. A typical temperature controllable water circulator 13 is connected by two flexible tubes (inlet and outlet) 131, 132 to a fluid circulation channel in the hot / cold plate. The hot / cold plate TE module 113 is connected to a TE controller 12 with a temperature sensor probe (not shown). The probe is inserted between the top plate 111 and the bottom plate 112 of the hot / cold plate.

  3. Exam preparation

  The water circulator and the TE controller are individually connected to a power outlet and turned on. The temperature of the water in the circulator is selected based on the following principle. The operating temperature of the hot / cold plate ranges from a temperature 40 ° C. below the temperature of the circulating fluid to a temperature 80 ° C. higher. In this embodiment, the water temperature is set to 10 ° C. When the temperature of the water in the circulator reaches the set temperature, the TE controller is set to the first test temperature. When changing to another test temperature, the TE controller is set to the next test temperature and the heating / cooling switch on the controller is switched to the requested side.

  4). Test procedure

  The test sample prepared as described above is first rolled by a rubber roller on a standard stainless steel panel. The stainless steel panel is then inserted into the slot S formed by the two plate guides G1, G2 on the surface of the hot / cold plate 11 with the test sample facing up. When the temperature of the test sample reaches the test temperature (usually it takes a few minutes to reach the test temperature, but it can be confirmed using a non-contact IR thermometer), PSTC-101 (PSTC test method) , 14th edition), a 180 ° peel force test is performed at a peel rate of 12 inches / minute. The peel adhesion and failure mode at various test temperatures are recorded.

  5. result

注：ＣＦ＝凝着（cohesion）失敗モード、ＳＳ＝スティックスリップ（stick-slip）モード。試験室接着試験は、通常、ＳＳモードが生じる温度で停止する。 The 180 ° peel forces and failure modes of adhesives A, B, C at various temperatures are listed in the table below.

Note: CF = cohesion failure mode, SS = stick-slip mode. The laboratory adhesion test usually stops at the temperature at which the SS mode occurs.

  It will be appreciated by those skilled in the art that modifications to the above embodiments can be made without departing from the broad inventive concept. Accordingly, the invention is not limited to the specific embodiments disclosed, but modifications made within the spirit and scope of the invention as defined by the appended utility model registration claims. It is understood that the object is to include.

FIG. 1 is a diagram showing an embodiment of an adhesion performance test system according to the present invention. The adhesion / peeling and testing machine is not shown. 2A and 2B are cross-sectional views illustrating one embodiment of a hot / cold plate according to the present invention. FIG. 3 is a diagram illustrating one embodiment of a hot / cold plate of the present invention that includes three thermoelectric (TE) modules aligned on the top surface of the bottom plate (for ease of understanding the top plate Has been removed). FIG. 4 shows a hot / cold plate of the present invention attached to the top of a thread of Adhesion / Release Tester AR-1500 (Chem Instruments, Inc., Fairfield, Ohio, USA), which is an adhesion / peeling tester. It is a figure which shows one Example. A thermoelectric (TE) controller is also shown to the left of the adhesion / peeling and testing machine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Adhesive performance test system 11 Hot / cold plate 12 Thermoelectric (TE) controller 13 Fluid circulator 100 Adhesion / peeling / testing machine 101 Thread 111 Metal top plate 112 Metal bottom plate 113 (113a, 113b, 113c) Thermoelectric (TE) module 114 Fluid circulation channel 131, 132 Flexible tube

Claims (7)

A system for testing the adhesion performance of materials at various temperatures,
(I) having a metal bottom plate, a metal top plate in contact with the metal bottom plate, and at least one thermoelectric module held between the top plate and the bottom plate, the bottom plate being inside thereof A gluing / peeling tester with a hot / cold plate having a fluid circulation channel attached to the top of the moving sled;
(Ii) a thermoelectric controller operably connected to the thermoelectric module in the hot / cold plate and having a feedback temperature control function;
(Iii) a temperature-controllable fluid circulator operatively connected to the fluid circulation channel within the bottom plate of the hot / cold plate;
The system characterized by having.   The system of claim 1, wherein the top plate and the bottom plate of the hot / cold plate are made of aluminum.   The system according to claim 1 or 2, characterized in that the dimensions of the hot / cold plate are 200mm x 100mm x 40mm.   The system according to claim 1, wherein the hot / cold plate has three thermoelectric modules.   5. The system of claim 4, wherein the thermoelectric module has a maximum current of 12A, a maximum voltage of 15V, and a maximum power of 300W.   The system according to claim 1, wherein the circulating fluid is water.   The system according to any one of claims 1 to 6, wherein the operating temperature range of the hot / cold plate is -20 ° C to 80 ° C.

Images