CN117760762A - System and method for detecting local scale multi-card effect - Google Patents
System and method for detecting local scale multi-card effect Download PDFInfo
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- CN117760762A CN117760762A CN202311689304.9A CN202311689304A CN117760762A CN 117760762 A CN117760762 A CN 117760762A CN 202311689304 A CN202311689304 A CN 202311689304A CN 117760762 A CN117760762 A CN 117760762A
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- 230000000694 effects Effects 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000523 sample Substances 0.000 claims abstract description 147
- 239000000463 material Substances 0.000 claims abstract description 62
- 230000008859 change Effects 0.000 claims abstract description 42
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 12
- 230000004044 response Effects 0.000 claims abstract description 6
- 238000012360 testing method Methods 0.000 claims description 21
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 19
- 230000005284 excitation Effects 0.000 claims description 9
- 230000005684 electric field Effects 0.000 claims description 8
- 230000001360 synchronised effect Effects 0.000 claims description 4
- VQAPWLAUGBBGJI-UHFFFAOYSA-N [B].[Fe].[Rb] Chemical compound [B].[Fe].[Rb] VQAPWLAUGBBGJI-UHFFFAOYSA-N 0.000 claims description 3
- 230000002457 bidirectional effect Effects 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000012512 characterization method Methods 0.000 abstract description 2
- 238000011160 research Methods 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 abstract 1
- 238000005057 refrigeration Methods 0.000 description 13
- 230000001276 controlling effect Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000004630 atomic force microscopy Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The application discloses a system and a method for detecting a local scale multi-card effect, wherein the system for detecting the local scale multi-card effect comprises: the device comprises a stress applying module, a pulse voltage applying module, a magnetic field applying module and a local temperature measuring module. The simultaneous loading and unloading of any single physical field and multiple physical fields is realized through the stress application module, the pulse voltage application module and the magnetic field application module, and the multi-card effect temperature change information of the material sample is monitored in real time through the thermosensitive probe in the local temperature measurement module, so that the multi-card effect response of the sample on the local scale is obtained, the direct characterization of the local scale multi-card effect is realized, and the measurement system and the method are provided for the research of the micro scale of the multi-card effect.
Description
Technical Field
The application belongs to the technical field of solid-state refrigeration, and particularly relates to a system and a method for detecting a local scale multi-card effect.
Background
The traditional compression refrigeration technology represented by air conditioner and refrigerator has the defects that the vapor compressor generates larger noise during working, the used refrigerant is easy to cause serious influence on the environment, cannot be miniaturized and the like, and cannot meet the requirements of novel refrigeration scenes, such as the requirements of the microelectronics field, so that the development of novel refrigeration technology is particularly important. The solid refrigeration technology has the advantages of environmental protection, high efficiency, miniaturization, capability of being integrated and the like, and becomes an ideal next-generation refrigeration mode.
In the solid-state refrigeration technology, the solid-state refrigeration technology based on single physical field driving is researched, but the performance and efficiency of the solid-state refrigeration of the material under the single driving field are to be improved, and the requirement of the current solid-state refrigeration technology on industrialized application cannot be met.
In multi-card materials, different types of external fields may produce different thermal responses. Under the excitation action of a plurality of external fields, the thermal response of the material is expected to be effectively improved, and the working temperature range of the material can be widened, so that the refrigerating efficiency of the material is enhanced. Therefore, the multi-card effect is expected to solve the problems of low refrigeration power and efficiency in the conventional solid-state refrigeration technology.
Although the multi-card effect has a great application potential in the refrigeration field, professional characterization equipment and a method for directly characterizing the multi-card effect are still lacking, and particularly, a technology for characterizing the multi-card effect by a local microscopic scale is lacking, which seriously hinders the understanding and research of the multi-card effect. For this reason, a system and method for detecting the multi-card effect of materials on a localized microscopic scale are highly desirable.
Disclosure of Invention
The application aims to provide a system and a method for detecting local scale multi-card effect, so as to realize local microcosmic multi-card effect detection of materials under a multi-physical field.
According to a first aspect of embodiments of the present application, there is provided a system for detecting local scale multi-card effects, the system may include:
the stress applying module is used for applying synchronous bidirectional uniaxial tensile stress to the material sample;
a pulse voltage applying module for applying a pulse voltage to the material sample;
a magnetic field application module for applying or unloading a magnetic field to the material sample;
and the local temperature measurement module is used for collecting local scale multi-card effect temperature change data of the material sample.
In some alternative embodiments of the present application, the stress application module comprises: the device comprises a stepping motor, a screw rod and a reciprocating platform;
the number of the reciprocating platforms is two, and the two ends of the screw rod are provided with reverse thread;
the stepping motor is connected with a screw rod, and the screw rod is connected with two reciprocating platforms;
the stepping motor drives the screw rod to move so as to enable the two reciprocating platforms to synchronously and reversely move.
In some alternative embodiments of the present application, the stress application module further comprises: a sample holder and a base;
the two sample clamps are arranged in a one-to-one correspondence manner with the two reciprocating platforms, each sample clamp is arranged on the corresponding reciprocating platform, and the two sample clamps cooperatively clamp the material sample, so that the motor is used for controlling the screw rod to rotate to horizontally stretch the sample.
In some alternative embodiments of the present application, the stress application module further comprises: a stepping motor control unit;
and the stepping motor control unit is used for controlling the rotating speed and the step number of the stepping motor, and further controlling the displacement distance and the delay time of the sample clamp.
In some alternative embodiments of the present application, the sample holder is a non-magnetic material.
In some alternative embodiments of the present application, the magnetic field application module includes: the device comprises a permanent magnet, a silicon steel rotating shaft, a torque stepping motor, a pole shoe and a magnetic field concentration unit;
the permanent magnet is fixed on the silicon steel rotating shaft through casting glue, the silicon steel rotating shaft is connected with the torque stepping motor through a coupler, and the torque stepping motor rotates the silicon steel rotating shaft, so that the angle between the permanent magnet on the silicon steel rotating shaft and the pole shoe is changed, and the magnetic field is rapidly applied or unloaded.
In some alternative embodiments of the present application, the permanent magnets are a pair of radially magnetized tile-shaped rubidium-iron-boron magnets;
the pole shoe is made of silicon steel material, and the pole shoe is coated with the permanent magnet to concentrate the magnetic field.
In some alternative embodiments of the present application, a pulsed voltage application module includes: a high voltage amplifier and a pulse waveform generator;
the pulse waveform generator is used for generating pulse waves;
the high voltage amplifier is connected with the pulse waveform generator and is used for generating pulse voltage based on pulse waves and loading the pulse voltage onto the material sample.
In some alternative embodiments of the present application, a local temperature measurement module includes: atomic force microscope, wheatstone bridge and thermal probe;
atomic force microscopy, wheatstone bridge and thermal probes are used to detect and collect localized temperature change data for a sample of material.
According to a second aspect of embodiments of the present application, there is provided a method of detecting a local scale multi-card effect, the method may include:
calibrating the resistance value of the thermistor in the thermal probe tip within the required test temperature range, establishing the relationship between the thermistor value and the temperature, and further obtaining the resistance-temperature coefficient of the thermistor;
applying a horizontal tensile stress to the material sample by the stress applying module;
applying an excitation of an electric field to the material sample by the pulse voltage application module;
applying a magnetic field excitation to the material sample by the magnetic field application module;
detecting the temperature change of the thermal probe material sample in real time, converting the temperature change-induced thermal probe resistance change into an electric signal through a Wheatstone bridge, and finally collecting the electric signal by a local temperature measurement module;
and combining the resistance-temperature coefficient of the thermistor to obtain a curve of time variation of temperature variation of the material sample under multiple physical fields due to the multi-card effect.
The technical scheme of the application has the following beneficial technical effects:
the device realizes simultaneous loading and unloading of any single physical field and any multiple physical fields through the stress application module, the pulse voltage application module and the magnetic field application module, and monitors the local scale temperature change information of the material sample in real time through the local temperature measurement module, so that the local scale multi-card effect response of the sample is obtained, the microcosmic representation of the multi-card effect is realized, and the application and development of the multi-card material in the microcosmic field are promoted.
Drawings
FIG. 1 is a schematic diagram of a local scale multi-card effect test system in an exemplary embodiment of the present application;
FIG. 2 is a schematic diagram of a local scale multi-card effect test system according to an embodiment of the present application;
FIG. 3 is a flow chart of a method of local scale multi-card effect testing in an exemplary embodiment of the present application;
FIG. 4 is a graph of resistance versus temperature for a thermistor calibrated for a local scale multi-card effect test system in accordance with one embodiment of the present application;
FIG. 5 is a schematic illustration of thermal effects of an atomic force microscope and a thermal probe control system test in an embodiment of the present application.
Reference numerals:
1: a magnetic field application module; 2: a stepping motor; 3: a coupling; 4: an atomic force microscope and a thermal probe controller; 5: a heat sensitive probe; 6: a sample of material; 7: a torque stepper motor; 8: a base station; 9: an optical axis; 10: a reciprocating platform and a sample holder; 11: a screw rod; 12: a pulse voltage applying module.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings. It should be understood that the description is only exemplary and is not intended to limit the scope of the present application. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the concepts of the present application.
A layer structure schematic diagram according to an embodiment of the present application is shown in the drawings. The figures are not drawn to scale, wherein certain details may be exaggerated and some details may be omitted for clarity. The shapes of the various regions, layers and relative sizes, positional relationships between them shown in the drawings are merely exemplary, may in practice deviate due to manufacturing tolerances or technical limitations, and one skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions as actually required.
It will be apparent that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In the description of the present application, it should be noted that the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In addition, the technical features described below in the different embodiments of the present application may be combined with each other as long as they do not collide with each other.
The multi-card effect test system provided by the embodiment of the application is described in detail below by means of specific embodiments and application scenarios thereof with reference to the accompanying drawings.
In a first aspect of embodiments of the present application, a system for detecting local scale multi-card effect testing is provided, the system may include:
the stress applying module is used for applying synchronous bidirectional uniaxial tensile stress to the material sample;
a pulse voltage applying module for applying a pulse voltage to the material sample;
a magnetic field application module for applying or unloading a magnetic field to the material sample;
and the local temperature measurement module is used for collecting multi-card effect temperature change data of the material sample.
The above embodiment can realize synchronous loading or unloading of various stress fields, electric fields and magnetic fields of the material sample through the cooperation of the stress application module, the pulse voltage application module, the magnetic field application module and the local temperature measurement module, and perform data acquisition and monitoring on the material sample through the local temperature measurement module, so as to test the multi-card effect of the sample; the applied magnetic field applying module can rapidly generate a strong magnetic field in a very short time, the stress applying module can provide different strain magnitudes and strain rates, and the pulse voltage applying module can output different types of voltages for different samples, including voltage magnitudes and voltage waveforms, so that the measuring range is wider and various thermal effects can be effectively combined.
Specifically, as shown in fig. 1-2, the system for detecting the local scale multi-card effect test may include a magnetic field application module 1, a stepper motor 2, a coupler 3, an atomic force microscope and a thermal probe controller 4, a thermal probe 5, a material sample 6, a torque stepper motor 7, a base 8, an optical axis 9, a reciprocating platform and a sample holder 10, a screw rod 11, and a pulse voltage application module 12.
Wherein the magnetic field application module 1 is used for applying a magnetic field to a sample; the stepping motor 2 is used for controlling the reciprocating platform and the sample clamp to move so as to apply tensile stress to the sample; the coupler 3 is used for connecting the stepping motor and the screw rod; the atomic force microscope and the thermal probe controller 4 are used for controlling the motion of the thermal probe and collecting inter-bridge voltage data caused by temperature change of the sample; the thermal probe 5 is used for monitoring the temperature change of the sample, converting the temperature change into resistance change and feeding the data back to the Wheatstone bridge; material sample 6 was used for multi-card effect testing; the torque stepping motor 7 is used for controlling a magnet on the silicon steel rotating shaft so as to control the application and the unloading of a magnetic field; the base 8 is used for installing the optical axis 9 and placing the magnetic field applying module 1, and the base 8 is placed on the atomic force microscope scanning platform; the optical axis 9 is used for fixing the reciprocating platform and the sample clamp 10 and playing a role of a guide rail; the reciprocating platform and the sample clamp 10 are used for fixing a sample and move on the optical axis 9 to stretch and recover the sample; the screw rod 11 is used for connecting the reciprocating platform and the sample clamp 10 and driving the reciprocating platform and the sample clamp to reciprocate; the pulse voltage application module 12 is used to apply an electric field to the sample.
In this embodiment, when the temperature of the material sample 6 changes due to loading or unloading of the force field, the magnetic field and the electric field, the temperature information is sensed by the thermal probe 5 and the resistance value is changed, and the resistance change information is fed back to the atomic force microscope and the thermal probe controller 4, the resistance change is converted into the inter-bridge voltage change through the wheatstone bridge therein, and finally the inter-bridge voltage change is collected by the data collecting unit in the atomic force microscope and the thermal probe controller 4, and the inter-bridge voltage change is converted into the temperature change of the material sample 6 due to the multi-card effect by combining the calibrated resistance-temperature coefficient of the thermal probe 5.
In some embodiments, the stress application module comprises: the device comprises a stepping motor, a screw rod and a reciprocating platform;
the stepping motor is connected with the screw rod, and the screw rod with the inverted thread design at the two ends is connected with the two reciprocating platforms; the stepping motor drives the screw rod to move so as to enable the two reciprocating platforms to synchronously and reversely move;
in some embodiments, the stress application module further comprises: a sample holder and a base;
the two sample clamps are positioned on the screw rod reciprocating platform and cooperatively clamp the material sample, and the two clamps and the reciprocating platform always move in unison, so that the screw rod is controlled by a motor to rotate so as to horizontally stretch the sample;
in some embodiments, the stress application module further comprises: a stepping motor control unit;
and the stepping motor control unit is used for controlling the rotating speed and the step number of the stepping motor, and further controlling the displacement distance and the delay time of the clamp.
Specifically, as shown in fig. 2, the system for detecting the local scale multi-card effect test comprises a stepping motor 2, a base 8, an optical axis 9, a reciprocating platform, a sample clamp 10, a screw rod 11 and a pulse voltage application module 12; the shuttle platform and sample holder 10 comprises: clamp tabletting and reciprocating platform; the clamp pressing sheets are two in number and are both positioned on the reciprocating platform, the two clamps cooperatively clamp the material sample, the two clamps and the reciprocating platform move consistently, and then the motor controls the screw rod 8 to rotate so as to horizontally stretch the material sample 6.
In some embodiments, the sample holder is a non-magnetic material.
In this embodiment, the sample holder, the magnet holder, and the support assembly are all made of nonmagnetic materials. The arrangement can avoid the interference of the direction and the size of the magnetic field as much as possible by adopting the nonmagnetic material.
In some embodiments, the pulsed voltage application module 12 comprises: a high voltage amplifier and a pulse waveform generator;
the pulse waveform generator is used for generating pulse waves, is connected with the high-voltage amplifier to generate pulse voltages, and is loaded on the material sample.
In this embodiment, the pulse voltage applying module 12 is configured to provide a high voltage required during loading, and the pulse voltage applying module 12 may specifically include an electrode, a waveform generator, and a high voltage amplifying power supply, where the waveform generator is connected to the high voltage amplifying power supply and is configured to apply the pulse voltage.
In some embodiments, the magnetic field application module comprises: the device comprises a permanent magnet, a silicon steel rotating shaft, a torque stepping motor, a pole shoe and a magnetic field concentration unit;
the permanent magnet is adsorbed on the silicon steel rotating shaft, the silicon steel rotating shaft is connected with the torque stepping motor through a coupler, and the torque stepping motor changes the angle of the permanent magnet and the pole shoe to apply or unload a magnetic field by rotating the silicon steel rotating shaft.
The magnetic field applying module in this embodiment is used for providing the magnetic field intensity required during loading, and the magnetic field applying module controls the torque stepping motor driver to send out pulses to rotate the permanent magnet through the PLC device, so as to change the radial direction of the permanent magnet to apply/unload the magnetic field.
In some embodiments, the permanent magnets are a pair of radially magnetized tile-shaped rubidium-iron-boron magnets.
In some embodiments, the pole pieces are silicon steel material;
the pole shoes cover the permanent magnets to concentrate the magnetic field.
In some embodiments, a local temperature measurement module includes: atomic force microscope, wheatstone bridge and thermal probe;
atomic force microscopy, wheatstone bridge and thermal probes are used to detect and collect temperature change data for a sample of material.
In the embodiment, the atomic force microscope is used for installing the thermal probe and is a support of the whole test system; the Wheatstone bridge is a part of a circuit in the test system, is connected with the atomic force microscope and the thermal probe, and can convert a thermal signal collected by the thermal probe into an electric signal; the thermal probe is used for directly collecting a thermal signal and converting the perceived temperature change of the sample into a resistance change.
As shown in fig. 3, in a second aspect of the embodiments of the present application, a method for detecting a local scale multi-card effect test is provided, which may include:
calibrating the resistance value of the thermistor in the thermal probe tip within a required test temperature range, establishing a relationship between the thermistor value and the temperature, as shown in fig. 4, and further obtaining the resistance-temperature coefficient of the thermistor;
applying a horizontal tensile stress to the sample by the stress applying module;
applying excitation of an electric field to the sample by the pulse voltage application module;
applying a magnetic field excitation to the sample by the magnetic field application module;
monitoring the temperature change condition of the material due to the multi-card effect by using a thermistor in the thermal probe tip;
converting the temperature change condition obtained by the thermistor into a collectable inter-bridge voltage signal through an atomic force microscope control system and a Wheatstone bridge to obtain a curve of the inter-bridge voltage changing along with time;
the temperature change curve of the sample multi-card effect with time is obtained by combining the resistance-temperature coefficient of the thermal probe calibrated through experiments, as shown in figure 5.
Specifically, the method comprises the following steps:
calibrating: calibrating the resistance value of the thermistor in the thermal probe tip within the required test temperature range, establishing the relationship between the thermistor value and the temperature, and further obtaining the resistance-temperature coefficient of the thermistor;
the step of applying a physical field: applying a tensile stress to the sample using the stress applying module; and/or applying an excitation of the magnetic field to the sample with the magnetic field application module; and/or applying an excitation of an electric field to the sample with the pulsed voltage application module;
the acquisition step: the method comprises the steps that a local temperature acquisition module consisting of an atomic force microscope controller, a Wheatstone bridge and a thermal probe is utilized to monitor and acquire sample temperature information in real time, and a curve of the relationship between inter-bridge voltage change and time caused by sample temperature change is obtained;
the calculation steps are as follows: and obtaining a curve of temperature change with time under the multi-card effect of the sample through conversion by combining the resistance-temperature coefficient of the thermistor calibrated by the atomic force microscope experiment.
In the process of applying the physical field, pulse signals required by the stress of the stepping motor 2 are output through the PLC control device, the step number and the speed of rotation of the stepping motor 2 through the screw rod 11 connected with the coupler 3 can be respectively controlled through setting the pulse signals, and further the strain and the speed of the stretching of the reciprocating platform connected with the screw rod 11 and the sample clamp 10 are controlled, so that the testing of different strain and the stretching speed of the sample is realized.
The magnetic field intensity of the permanent magnet in the magnetic field applying module can be adjusted in different ranges, the magnetic field intensity can be adjusted by adjusting the distance between the two magnetic field concentration devices or the radial angle of the permanent magnet, and the magnetic field applying speed can be controlled by the rotating speed of the silicon steel rotating shaft controlled by the torque stepping motor 7.
The high-voltage amplifier is connected with the atomic force microscope controller, the voltage output end of the high-voltage amplifier is connected with the reciprocating platform and the electrode plates on the sample clamp 10, and the atomic force microscope control system can provide voltages with different sizes and waveforms, so that the voltage of the high-voltage amplifier can be regulated in different ranges, and the test requirements of different samples can be met.
In the collecting step, the local temperature measuring module may include an atomic force microscope and a thermo-sensitive probe controller, a thermo-sensitive resistor probe, a wheatstone bridge box, and a variable resistance box. The atomic force microscope and the thermal probe controller 4 control the thermal probe 5 to hover at the position 2-10 mu m above the material sample 6, the atomic force microscope is connected with the control module, the thermal probe 5 can collect temperature change information generated by the material sample, at the moment, the resistance value of the thermal probe 5 can change, and the detected resistance value change signal can be converted into inter-bridge voltage signal change through the Wheatstone bridge because the thermal probe 5 is in a circuit of the Wheatstone bridge and fed back to the atomic force microscope and the thermal probe controller 4 and collected by a data collecting unit in the thermal probe.
In the calculation step, the interbridge voltage signals collected by the atomic force microscope and the thermosensitive probe controller are converted into a curve of the temperature change of the sample along with the time by combining the resistance-temperature coefficient of the thermosensitive probe 5 calibrated in the calibration step.
The system and the method for testing the local scale multi-card effect in the embodiment can measure the thermal response of the microscopic region of the material sample when the stress field, the electric field and the high magnetic field are added to the material sample singly or simultaneously, utilize different stress strain loading rates and monitor the temperature change of the sample in the process by storage, thereby researching the multi-card effect of the microscopic region of the sample under multiple physical fields.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.
Claims (10)
1. A system for detecting local scale multi-card effects, comprising:
the stress applying module is used for applying synchronous bidirectional uniaxial tensile stress to the material sample;
a pulse voltage application module for applying a pulse voltage to the material sample;
a magnetic field application module for applying or unloading a magnetic field to the material sample;
and the local temperature measurement module is used for collecting local scale multi-card effect temperature change data of the material sample.
2. The system for detecting a local scale multi-card effect of claim 1, wherein the stress application module comprises: the device comprises a stepping motor, a screw rod and a reciprocating platform;
the number of the reciprocating platforms is two, and the two ends of the screw rod are provided with reverse threads;
the stepping motor is connected with the screw rod, and the screw rod is connected with the two reciprocating platforms;
the stepping motor drives the screw rod to move so as to enable the two reciprocating platforms to synchronously and reversely move.
3. The system for detecting a local scale multi-card effect of claim 2, wherein the stress application module further comprises: a sample holder and a base;
the two sample clamps are arranged in a one-to-one correspondence manner with the two reciprocating platforms, each sample clamp is arranged on the corresponding reciprocating platform, the two sample clamps cooperatively clamp the material sample, and then the screw rod is controlled to rotate through a motor to horizontally stretch the sample.
4. The system for detecting a local scale multi-card effect of claim 3, wherein the stress application module further comprises: a stepping motor control unit;
the stepping motor control unit is used for controlling the rotating speed and the step number of the stepping motor, and further controlling the displacement distance and the delay time of the sample clamp.
5. A system for detecting localized scale multi-card effects according to claim 3, wherein said specimen holder is of non-magnetic material.
6. The system for detecting a local scale multi-card effect of claim 1, wherein the magnetic field application module comprises: the device comprises a permanent magnet, a silicon steel rotating shaft, a torque stepping motor, a pole shoe and a magnetic field concentration unit;
the permanent magnet is fixed on the silicon steel rotating shaft through casting glue, the silicon steel rotating shaft is connected with the torque stepping motor through a coupler, and the torque stepping motor rotates the silicon steel rotating shaft to change the angle of the permanent magnet on the silicon steel rotating shaft and the pole shoe so as to realize rapid application or unloading of a magnetic field.
7. The system for detecting a local scale multi-card effect of claim 6 wherein the permanent magnets are a pair of radially magnetized tile-like rubidium-iron-boron magnets;
the pole shoe is made of silicon steel material and is coated with the permanent magnet to concentrate a magnetic field.
8. The system for detecting a local scale multi-card effect of claim 1, wherein the pulsed voltage application module comprises: a high voltage amplifier and a pulse waveform generator;
the pulse waveform generator is used for generating pulse waves;
the high-voltage amplifier is connected with the pulse waveform generator and is used for generating pulse voltage based on the pulse wave and loading the pulse voltage on the material sample.
9. The system for detecting a local scale multi-card effect of claim 1, wherein the local temperature measurement module comprises: atomic force microscope, wheatstone bridge and thermal probe;
the atomic force microscope, wheatstone bridge and the thermal probe are used to detect and collect local temperature change data of a material sample.
10. A method of detecting local scale multi-card effects, comprising:
calibrating the resistance value of the thermistor in the thermal probe tip within the required test temperature range, establishing the relationship between the thermistor value and the temperature, and further obtaining the resistance-temperature coefficient of the thermistor;
applying a horizontal tensile stress to the material sample by the stress applying module;
applying an excitation of an electric field to the material sample by a pulse voltage application module;
applying an excitation of a magnetic field to the material sample by a magnetic field application module;
detecting the temperature change of the material sample in real time by utilizing the thermal probe, converting the temperature change-induced thermal probe resistance change into an electric signal by using a Wheatstone bridge, and finally collecting the electric signal by a local temperature measurement module;
and combining the resistance-temperature coefficient of the thermistor to obtain a curve of the temperature change of the material sample, which is generated due to the multi-card effect, along with the time change under the multi-physical field of the material sample, so as to realize the multi-card effect response detection of the material sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311689304.9A CN117760762A (en) | 2023-12-08 | 2023-12-08 | System and method for detecting local scale multi-card effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311689304.9A CN117760762A (en) | 2023-12-08 | 2023-12-08 | System and method for detecting local scale multi-card effect |
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| CN117760762A true CN117760762A (en) | 2024-03-26 |
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| CN202311689304.9A Pending CN117760762A (en) | 2023-12-08 | 2023-12-08 | System and method for detecting local scale multi-card effect |
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