JP3137359B2 - Wrapping actuator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lapping operation body used for lapping, which is precision polishing.

[0002]

2. Description of the Related Art In order to perform precision finishing, abrasive grains are interposed between an object to be polished and a lapping member (sometimes simply referred to as a wrap), and a relative gap is formed between the object and the lapping member. A lapping process of polishing an object to be polished by abrasive grains interposed by a dry method or a wet method using a working liquid while performing a motion and applying an appropriate pressing force between the two is well known. . In this lapping process, the abrasive grains are provided with a degree of freedom, and the abrasive grains are simply interposed between the workpiece and the lapping working body, and the abrasive grains are formed on the polishing working surface of the lapping working body by plating or the like. A method of fixing the adhesive (for example, Japanese Utility Model Application Laid-Open No. 61-20262, Japanese Utility Model Application Laid-Open No. 61-661, and Japanese Utility Model Application Laid-Open No. 61-19)
1864).

In the former method, a mirror-finished surface with high accuracy can be easily obtained as long as the supply and dispersion of the abrasive grains are performed uniformly. However, the lapping operation body itself is also shaved by the abrasive grains. There is a problem that dimensional changes occur on the polishing operation surface of the body, which adversely affects the finishing accuracy of the object to be polished. The latter method has a problem in that polishing irregularities are likely to occur because the abrasive particles are fixedly held by the lapping member, though it depends on the particle size distribution of the abrasive particles.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to focus on such a problem in the conventional lapping process.
Provided is a lapping operation body that can easily obtain a high-precision polished surface that can minimize the abrasion of the lapping operation body even if the degree of freedom is given without fixing the abrasive grains, and that can prevent the occurrence of uneven polishing. Is to do.

[0005]

SUMMARY OF THE INVENTION The wrapping operation of the present invention along this purpose, the abrasive grains are interposed between the object to be polished by remembering freedom of abrasive grains by a relative movement with respect to the polished In a lapping operation body for polishing an object to be polished by intervening abrasive grains, at least a polishing operation surface of the lapping operation body is formed of a polyamideimide resin or a polyimide resin , and the polishing operation surface is formed on a grindstone.
It is formed on the surface on which the fluff is formed by the polishing .

[0006] The shape of the wrapping operation body in the present invention is not particularly limited, and can take various shapes such as a ring shape, a square shape, and a rod shape. At least one surface of the lapping member is formed on a polishing operation surface, and at least the polishing operation surface is formed of a polyamideimide resin or a polyimide resin.

In the present invention, the polyamide-imide resin is a resin represented by the following general formula (1). Using this polyamide-imide resin, a lapping working body is directly formed by an extruder, or a block or sheet is formed, and after post-curing, a punching press is used to form the lapping working body or its polishing working surface. It can be stamped and manufactured. Further, it can also be manufactured by injection molding using a polyamideimide resin to form a lapping member or a polishing surface thereof and then post-curing.

[0008]

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In the present invention, the polyimide resin refers to, for example, a polyaminobismaleimide resin represented by the following general formula. The polyimide-based polymer is used as a normal thermosetting resin molding method.It can be manufactured by molding on the lapping body or its polishing surface by a molding method such as compression molding or transfer molding, and then post-curing. it can.

[0010]

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The abrasive grains for lapping using the lapping member of the present invention are not particularly limited in grain size, material and the like. The particle size may be selected according to the degree of finishing. For example, for rough finishing, about # 200-400,
Fine particles of about # 400 to 800 can be used for medium finishing and # 1000 or more fine particles can be used for final finishing. The material may be selected according to the object to be polished and the degree of finishing.
For example, various materials such as diamond, alumina, glass, boron carbide, silicon carbide, cerium oxide, and chromium oxide can be used.

The object to be polished is not particularly limited.
It can be applied to a wide range such as cemented carbide, silicon, glass, germanium, and ceramic. In particular, the lapping operation body of the present invention is suitable for polishing a silicon wafer, which is required to have higher precision in recent years.

The above-described wrapping operating body of the present invention is manufactured and used, for example, as follows. A polyamide-imide resin or a polyimide-based resin is molded into a predetermined lapping body or a polishing operation surface thereof using an extruder. Since resin molding is used, the formed polishing operation surface is usually formed in a highly accurate mirror surface state. Although it is possible to use the mirror surface state as it is, in the present invention, the polishing operation surface is polished with, for example, a grindstone made of a composite material of ceramic long fibers and a thermosetting resin, and the surface is microscopically polished by the polishing. Make it fluffy. Abrasive grains having a grain size and a material suitable for the above-mentioned application are attached to the polishing operation surface of the lapping operation body thus formed. At this time,
By polishing with a specific grindstone as described above, the abrasive grains can be held with a degree of freedom in a state where the abrasive grains are floating in the fine fluff on the surface.

[0014] In this way, in a state where the abrasive grains are interposed between the object to be polished and the lapping member, the two members are relatively pressed while giving an appropriate pressing force between the object to be polished and the lapping member. By moving (relatively sliding), the polished surface of the object to be polished is polished by the intervening abrasive grains. Polyamide-imide resin or polyimide-based resin has extremely high abrasion resistance. Therefore, even if the abrasive grains have a certain degree of freedom, the object to be polished is polished to a predetermined degree, but the lapping member itself is hardly ground. I can't. Therefore, there is no dimensional change that causes a problem on the polishing operation surface of the lapping operation body. In addition, because the resin itself has good elasticity, even if there is some particle size distribution in the abrasive grains, large abrasive grains sink to the resin side, and the abrasive grains with a large grinding force are moderately buffered on the resin side. , Very soft polishing becomes possible. In particular, by polishing with a grindstone as described above to fluff and holding the abrasive grains in a state of floating in the fluff , softer polishing becomes possible. As a result, the occurrence of uneven polishing is prevented, and mirror finishing with extremely high precision is enabled. As a polishing method, any of a dry method and a wet method can be used.

[0015]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of a lapping member according to the present invention. 1 to 3
Shows a typical example of the shape of the lapping operation body of the present invention. The lapping body is formed of a polyamide-imide resin or a polyimide-based resin, for example, in the shape of a ring body 1 having an outer peripheral surface formed on a polishing operation surface 1a or a square body 2 having a lower surface formed on a polishing operation surface 2a. Alternatively, it is formed in another rod shape (not shown). In addition to forming the entire lapping bodies 1 and 2 from the above resin, as shown in FIG. 3, the base 3 is formed from another material (for example, a metal or another resin), and the polishing operation surface 4 is formed. Only the portion 5 to be formed may be a lapping body 6 formed of the above resin.

By polishing the polishing surface of the lapping member thus formed with a grindstone made of a composite material of ceramic long fibers and a thermosetting resin, for example, as shown in FIG. Is molded. When the abrasive grains 8 are attached to the polishing operation surface 1a, the abrasive grains 8 are held in a state of floating in the fluff 7 while having a degree of freedom. An abrasive grain 8 is interposed between the polishing objects 9 to apply an appropriate predetermined pressing force 1.
By causing relative movement between the object 9 and the lapping body 1 while pressing at 0, the polishing surface 9a of the object 9 is polished.

[0017]

According to the lapping member of the present invention, since at least the polishing surface is made of a polyamide-imide resin or a polyimide resin having extremely excellent wear resistance, the lapping member can be used even when the abrasive grains are not fixed. Can be suppressed, and the dimensional change can be suppressed, so that the object to be polished can be polished with high precision.

Further, by the appropriate elasticity of the resin forming the polishing operation surface, the polishing force applied to the abrasive grains can be appropriately buffered, and soft polishing can be achieved to prevent the occurrence of uneven polishing. . Particularly in the present invention, since the polishing operation surface was so that I fluffed the polished fine after resin molding grindstone,
More soft polishing can be realized.

[Brief description of the drawings]

FIG. 1 is a perspective view of a lapping operation body according to an embodiment of the present invention.

FIG. 2 is a perspective view of a lapping operation body according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view of a lapping operation body according to still another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a state where polishing is performed using the lapping operating body according to the present invention.

[Explanation of symbols]

 1, 2, 6 Lapping actuator 1a, 2a, 4 Polishing operation surface 3 Substrate 7 Fluff 8 Abrasive grain 9 Object to be polished 9a Polished surface

Claims (1)

(57) [Claims] 1. A is interposed the abrasive grains between the abrasive grains in degree of freedom imparted to the object to be polished by relative movement with respect to the polished, the abrasive grains interposed in wrapping operation body for polishing a polishing object Forming at least a polishing operation surface of the lapping member with a polyamide-imide resin or a polyimide resin , and polishing the polishing operation surface with a grindstone;
A lapping operation body formed on a surface on which fluff is formed by polishing .