JP3129160B2 - LED printer head - Google Patents
LED printer headInfo
- Publication number
- JP3129160B2 JP3129160B2 JP18796995A JP18796995A JP3129160B2 JP 3129160 B2 JP3129160 B2 JP 3129160B2 JP 18796995 A JP18796995 A JP 18796995A JP 18796995 A JP18796995 A JP 18796995A JP 3129160 B2 JP3129160 B2 JP 3129160B2
- Authority
- JP
- Japan
- Prior art keywords
- lens cover
- heat sink
- insulating substrate
- printer head
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Facsimile Heads (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、複数のLEDアレイが
実装された絶縁基板を放熱板上に配設すると共に、この
放熱板上に前記絶縁基板を覆うようにレンズカバーを配
設するLEDプリントヘッドに関し、特に前記レンズカ
バーと前記放熱板との封止構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED in which an insulating substrate on which a plurality of LED arrays are mounted is provided on a heat sink and a lens cover is provided on the heat sink so as to cover the insulating substrate. The present invention relates to a print head, and more particularly, to a sealing structure between the lens cover and the heat sink.
【0002】[0002]
【従来の技術】従来のLEDプリンタヘッドAは、図
5,図6に示すようなものがあり、複数のLEDチップ
が連なるLEDアレイ1及びLEDアレイ1を駆動させ
るための駆動ドライバIC2が所定の配線パターン(図
示しない)が施され、例えばセラミック材料等からなる
絶縁基板3の導体上に直線状に実装されており(LED
アレイ1及び駆動ドライバIC2は、金線等からなる接
続部材によりワイヤボンディングされている)、この絶
縁基板3は、絶縁基板3上に実装されたLEDアレイ1
による発熱を考慮し、断面形状が略コの字状のアルミ等
の材料からなる放熱板4上にシリコン樹脂等からなる熱
伝導体(図示しない)を介し配設されている。また、放
熱板4上には、絶縁基板3上に実装された複数のLED
アレイ1から発せられる光を集光させて図示しない感光
ドラムに照射させるための集光レンズ群5を備えたアル
ミ材料等からなるレンズカバー6がLEDアレイ1の真
上に集光レンズ群5が位置し、かつ絶縁基板3を覆うよ
うに配設されており、放熱板4とレンズカバー6とはビ
ス7により固定されている。2. Description of the Related Art Conventional LED printer heads A include those shown in FIGS. 5 and 6, in which an LED array 1 in which a plurality of LED chips are connected and a drive driver IC 2 for driving the LED array 1 are provided in a predetermined manner. A wiring pattern (not shown) is provided, and is linearly mounted on a conductor of an insulating substrate 3 made of, for example, a ceramic material (LED).
The array 1 and the driver IC 2 are wire-bonded by a connection member made of a gold wire or the like.) The insulating substrate 3 is an LED array 1 mounted on the insulating substrate 3.
In consideration of the heat generated by the heat sink, a heat conductor (not shown) made of silicon resin or the like is provided on the heat sink 4 made of a material such as aluminum having a substantially U-shaped cross section. A plurality of LEDs mounted on the insulating substrate 3 are disposed on the heat sink 4.
A lens cover 6 made of an aluminum material or the like having a condenser lens group 5 for condensing light emitted from the array 1 and irradiating the light to a photosensitive drum (not shown) is provided directly above the LED array 1. The heat radiating plate 4 and the lens cover 6 are fixed by screws 7 so as to cover the insulating substrate 3.
【0003】かかる構成のプリンヘッドAは、プリンタ
トナーの進入防止,図示しない帯電器から発生するオゾ
ンの進入による半導体の劣化防止、湿気の進入防止等を
考慮して、放熱板4もしくはレンズカバー6のどちらか
一方の接合面4a,6aにシリコン樹脂等からなるゲル
状の封止剤8を塗布し、その後、前述したように放熱板
4とレンズカバー6とをビス7により固定することで、
放熱板4とレンズカバー6との間の絶縁基板3が配設さ
れる空間部aを外部から気密的に封止する封止剤8が放
熱板4とレンズカバー6との各接合面4a,6aに平坦
状に形成されるものである。The pudding head A having such a configuration is provided with a heat radiating plate 4 or a lens cover 6 in consideration of prevention of printer toner from entering, prevention of deterioration of semiconductor due to entry of ozone generated from a charger (not shown), prevention of moisture entry, and the like. By applying a gel-like sealing agent 8 made of a silicone resin or the like to one of the joining surfaces 4a, 6a, and then fixing the heat sink 4 and the lens cover 6 with screws 7 as described above,
A sealant 8 for hermetically sealing a space a in which the insulating substrate 3 is provided between the heat sink 4 and the lens cover 6 from the outside is hermetically sealed. 6a is formed flat.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、レンズ
カバー6に備えられた集光レンズ群5の取付け位置は、
予め定められたLEDアレイ1から感光ドラムまでの距
離の中心となるように取付けられた後、放熱板4上に配
設されるものであるが、前述したように放熱板4とレン
ズカバー6との各接合面4a,6aに平坦状の封止剤8
が介在することになるため(数ミクロン程度)、LED
アレイ1から集光レンズ群5までの距離が変わってしま
い(膜厚分だけ集光レンズ群5が上方に位置することに
なる)、そのため、LEDアレイ1から発せられる光を
集光レンズ群5を介し感光ドラムに照射される際、集光
する光の焦点位置がくるってしまうため印字品質を低下
させてしまうと言った問題点があった。However, the mounting position of the condenser lens group 5 provided on the lens cover 6 is
After being mounted so as to be at the center of a predetermined distance from the LED array 1 to the photosensitive drum, it is disposed on the heat radiating plate 4. A flat sealant 8 on each of the joining surfaces 4a and 6a.
LED (between several microns)
The distance from the array 1 to the condenser lens group 5 changes (the condenser lens group 5 is positioned above by the film thickness), so that the light emitted from the LED array 1 is transmitted to the condenser lens group 5. However, there is a problem that when irradiating the photosensitive drum through the optical disc, the focal position of the condensed light is shifted, thereby deteriorating the print quality.
【0005】このような問題点を解決するため、予め封
止剤8の膜厚を考慮した位置に集光レンズ群5を取り付
けることが考えられるが、封止剤8の膜厚は数ミクロン
程度であり、この膜厚分を考慮した集光レンズ群5の取
り付け作業は非常に煩雑で、生産性の向上が図れないと
いった問題点があり、完全なる解決手段とはなっていな
い。In order to solve such a problem, it is conceivable to mount the condenser lens group 5 at a position in consideration of the film thickness of the sealant 8 in advance. However, the work of attaching the condenser lens group 5 in consideration of the film thickness is very complicated, and there is a problem that productivity cannot be improved, and it is not a complete solution.
【0006】また、塗布量が多い場合などは、放熱板4
とレンズカバー6との接合面4a,6aの略全域に封止
剤8が塗布されることになるため、放熱板4とレンズカ
バー6との密着性が強く、レンズカバー6を取外してプ
リンタヘッドAをメンテナンスする場合(例えば、LE
Dアレイ1や駆動ドライバ2等を交換する)、放熱板4
やレンズカバー6等の変形,破損等を考慮しなければな
らないために修繕作業が非常に厄介であった。When the amount of application is large, the heat sink 4
Since the sealant 8 is applied to substantially the entire area of the joint surfaces 4a, 6a between the lens cover 6 and the lens cover 6, the adhesion between the heat radiating plate 4 and the lens cover 6 is strong. A maintenance (for example, LE
D array 1 and drive driver 2 are replaced), heat sink 4
The repair work was very troublesome because the deformation and breakage of the lens and the lens cover 6 had to be considered.
【0007】そこで、集光レンズ群を介して集光される
光の焦点位置を変えることなく、放熱板とレンズカバー
との間の絶縁基板を配設する空間部を良好に気密封止
し、かつメンテナンスも容易に行えるLEDプリンタヘ
ッドの封止構造を提供するものである。Therefore, without changing the focal position of the light condensed through the condenser lens group, the space for disposing the insulating substrate between the heat radiating plate and the lens cover is airtightly sealed, Another object of the present invention is to provide an LED printer head sealing structure that can be easily maintained.
【0008】[0008]
【課題を解決するための手段】本発明は、前記課題を解
決するため、複数のLEDアレイを直線状に配設する絶
縁基板と、前記絶縁基板を配設する放熱板と、前記LE
Dアレイから発せられる光を感光ドラムに照射させるた
めの集光レンズ群を設け、前記絶縁基板を覆うように前
記放熱板上に配設されるレンズカバーとを備えたLED
プリンタヘッドにおいて、前記放熱板と前記レンズカバ
ーとの接合部外周に、前記放熱板と前記レンズカバーと
の少なくとも一方の周縁端部にテーパ部もしくは段差部
を形成することで得られる封止溝を設け、前記封止溝に
封止剤を充填してなることを特徴とするものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has an advantage in that a plurality of LED arrays are linearly arranged.
An edge substrate, a heat sink on which the insulating substrate is provided, and the LE
The light emitted from the D array is applied to the photosensitive drum.
A condensing lens group is provided to cover the insulating substrate.
LED with lens cover disposed on heat sink
In the printer head, the heat radiating plate and the lens cover are provided around an outer periphery of a joint between the heat radiating plate and the lens cover.
Taper or step at least one peripheral edge
Forming a sealing groove obtained by forming
It is characterized by being filled with a sealant .
【0009】[0009]
【0010】[0010]
【作用】放熱板とレンズカバーとの接合部に封止剤によ
り封止する封止溝を形成することで、集光レンズ群を介
して集光される光の焦点位置を変えることなく(LED
アレイから集光レンズ群までの距離を考慮しなくともよ
い)、前記放熱板と前記レンズカバーとの間の前記絶縁
基板を配設する空間部を外部から気密的に封止する。By forming a sealing groove for sealing with a sealant at the joint between the heat radiating plate and the lens cover, it is possible to change the focal position of the light condensed through the condenser lens group (LED
It is not necessary to consider the distance from the array to the condenser lens group), and the space between the heatsink and the lens cover where the insulating substrate is provided is hermetically sealed from the outside.
【0011】前記封止溝を前記放熱板と前記レンズカバ
ーとの少なくとも一方の周縁端部にテーパ部もしくは段
差部を形成してなることで、ディスペンサー等により封
止剤を充填する場合、前記封止溝をガイドとして充填す
ることができるため、製造工程における封止工程の作業
性が軽減され、封止剤の充填量管理もしやすい。また、
前記放熱板と前記レンズカバーとの各接合面の一部に封
止剤が充填されることから従来に比べ密着性が弱く、L
EDプリンタヘッドをメンテナンスする場合において、
前記放熱板や前記レンズカバー等の変形,破損等を考慮
する必要がなく、修繕作業を軽減させることができる。When the sealing groove is formed by forming a tapered portion or a stepped portion on at least one peripheral edge of the heat radiating plate and the lens cover, when the sealing agent is filled with a dispenser or the like, the sealing groove is formed. Since the groove can be filled as a guide, the workability of the sealing step in the manufacturing process is reduced, and the filling amount of the sealing agent can be easily controlled. Also,
Since a part of each joint surface between the heat sink and the lens cover is filled with a sealant, the adhesion is weaker than in the past, and
When maintaining the ED printer head,
It is not necessary to consider deformation, breakage, and the like of the heat radiating plate and the lens cover, and the repair work can be reduced.
【0012】[0012]
【実施例】以下、本発明を添付図面に記載した実施例に
基づき説明するが、前記従来例と同一若しくは相当個所
には同一符号を付してその詳細な説明は省く。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the embodiments shown in the accompanying drawings, but the same or corresponding parts as those in the conventional example will be denoted by the same reference numerals and detailed description thereof will be omitted.
【0013】図1は第1実施例のLEDプリンタヘッド
の要部断面図、図2は第1実施例のLEDプリンタヘッ
ドの斜視図、図3は第2実施例を示す要部拡大断面図,
図4は第3実施例を示す要部拡大断面図である。FIG. 1 is a sectional view of an essential part of an LED printer head of a first embodiment, FIG. 2 is a perspective view of an LED printer head of a first embodiment, FIG. 3 is an enlarged sectional view of an essential part showing a second embodiment,
FIG. 4 is an enlarged sectional view of a main part showing a third embodiment.
【0014】図1,図2を用いて第1実施例を説明する
と、LEDプリンタヘッドBは、LEDアレイ1及び駆
動ドライバIC2等の電子部品を実装した絶縁基板3を
シリコン樹脂等からなる熱伝導体(図示しない)を介し
後で詳述する放熱板9上に配設し、この放熱板9上に
は、集光レンズ群5を備えたレンズカバー6がLEDア
レイ1の真上に集光レンズ群5が位置し、絶縁基板3を
覆うように配設され、放熱板9とレンズカバー6とはビ
ス7により固定されている。The first embodiment will be described with reference to FIGS. 1 and 2. In the LED printer head B, an insulating substrate 3 on which electronic components such as an LED array 1 and a driver IC 2 are mounted is made of a heat conductive material made of silicon resin or the like. A lens cover 6 having a condenser lens group 5 is disposed on a heat radiating plate 9 described later in detail via a body (not shown). The lens group 5 is located so as to cover the insulating substrate 3, and the heat sink 9 and the lens cover 6 are fixed by screws 7.
【0015】放熱板9は、レンズカバー6との接合面9
aの周縁端部にテイパー部9bを形成するもので、即ち
このテーパ部9bは、レンズカバー6と放熱板9との各
接合面(接合部)6a,9aの周縁端部に封止剤8を充
填する封止溝10を構成するものである。従って、放熱
板9とレンズカバー6とをビス7により固定した後、前
述した封止溝10に封止剤8をディスペンサー等により
充填することにより放熱板9とレンズカバー6との間の
絶縁基板3を配設する空間部aを外部から気密的に封止
するものである。The heat radiating plate 9 has a joint surface 9 with the lens cover 6.
a taper portion 9b is formed at the peripheral edge of the lens cover 6a, that is, the taper portion 9b is formed at the peripheral edge of each of the joining surfaces (joining portions) 6a, 9a between the lens cover 6 and the heat radiating plate 9. To form a sealing groove 10 for filling. Therefore, after fixing the heat radiating plate 9 and the lens cover 6 with the screw 7, the sealing groove 8 is filled with the sealing agent 8 by a dispenser or the like, so that the insulating substrate between the heat radiating plate 9 and the lens cover 6 is formed. 3 is to hermetically seal the space a where the 3 is disposed from the outside.
【0016】次に図3,図4を用いて放熱板とレンズカ
バーとの接合面に形成する封止溝の第2,第3実施例に
ついて説明する。Next, second and third embodiments of the sealing groove formed on the joint surface between the heat sink and the lens cover will be described with reference to FIGS.
【0017】図3を用いて第2実施例を説明すると、レ
ンズカバー11と放熱板12との各接合面11a,12
aの周縁端部に各テーパ部11b,12bを形成し、各
接合面11a,12aの周縁端部に封止剤8を充填する
封止溝13を構成するものである。The second embodiment will be described with reference to FIG. 3. The joint surfaces 11a and 12a of the lens cover 11 and the heat sink 12 will be described.
Each of the tapered portions 11b and 12b is formed at the peripheral edge of a, and a sealing groove 13 for filling the sealing agent 8 at the peripheral edge of each of the joint surfaces 11a and 12a.
【0018】図4を用いて第3実施例を説明すると、放
熱板14はレンズカバー6との接合面14aの周縁端部
に段差部14bを形成することでレンズカバー6と放熱
板14との各接合面6a,14aの周縁端部に封止剤8
を充填する封止溝15を構成するものである。Referring to FIG. 4, the third embodiment will be described. The heat radiating plate 14 has a stepped portion 14b formed at the peripheral edge of the joint surface 14a with the lens cover 6 to allow the lens cover 6 and the heat radiating plate 14 to be connected to each other. A sealant 8 is provided on the peripheral edge of each joint surface 6a, 14a.
To form a sealing groove 15 for filling.
【0019】かかるLEDプリンタヘッドBは、レンズ
カバー6(11)と放熱板9(12,14)との各接合
面の周縁端部にテーパ部9b(11b,12b)もしく
は段差部14bを形成することにより、封止剤8を充填
する封止溝10(13,15)を構成するもので、従来
のように封止剤8が各接合面間に介在しないことから、
集光レンズ群を介して集光される光の焦点位置を変える
ことなくレンズカバー6(11)と放熱板9(12,1
4)との間の絶縁基板3を配設する空間部aを外部から
気密的に封止することがでる。また、封止溝10(1
3,15)を構成することで、レンズカバー6(11)
と放熱板9(12,14)とをビス7により固定した
後、ディスペンサー等を用い封止溝10(13,15)
をガイドとして封止剤10を充填することができるた
め、製造工程において封止作業が軽減され、かつ充填量
の管理がしやすくなる。また、放熱板9(12,14)
とレンズカバー6(11)との接合面の一部(封止溝)
に封止剤8を充填させるだけあり、放熱板9(12,1
4)とレンズカバー6(11)との密着性も従来に比べ
弱く(各接合面間での密着ではなくなるため)、レンズ
カバー6(11)を取外してメンテナンスを行う場合で
も放熱板9(12,14)やレンズカバー6(11)等
の変形,破損等の心配がなく、容易に修繕作業に行える
といった利点を有するものである。In the LED printer head B, a tapered portion 9b (11b, 12b) or a step 14b is formed at the peripheral edge of each joint surface between the lens cover 6 (11) and the heat radiating plate 9 (12, 14). This constitutes the sealing groove 10 (13, 15) for filling the sealing agent 8, and since the sealing agent 8 does not intervene between the joining surfaces as in the related art,
The lens cover 6 (11) and the heat radiating plate 9 (12, 1) are kept without changing the focal position of the light condensed through the condenser lens group.
4), the space a in which the insulating substrate 3 is disposed can be hermetically sealed from the outside. In addition, the sealing groove 10 (1
By configuring (3, 15), the lens cover 6 (11)
After fixing the heat radiation plate 9 (12, 14) with the screw 7, the sealing groove 10 (13, 15) is formed by using a dispenser or the like.
Can be used as a guide to fill the sealing agent 10, so that the sealing operation in the manufacturing process is reduced, and the filling amount can be easily managed. Also, the heat sink 9 (12, 14)
Of the joint surface between the lens and the lens cover 6 (11) (sealing groove)
Only the sealant 8 is filled in the heat sink 9 (12, 1).
4) and the lens cover 6 (11) have weaker adhesion than before (because there is no close contact between the joining surfaces), and even when the lens cover 6 (11) is detached and maintenance is performed, the heat radiating plate 9 (12) is removed. , 14) and the lens cover 6 (11), etc., without the fear of deformation, breakage, etc., and can be easily repaired.
【0020】尚、請求項1に記載の本発明は、前記実施
例で説明した封止溝形状に限定されるものではなく、例
えば、放熱板とレンズカバーとの各接合面の周縁端部に
図4で示すような段差部を形成し封止溝としても良い。The present invention according to claim 1 is not limited to the shape of the sealing groove described in the above embodiment. For example, the present invention may be applied to the peripheral edge of each joint surface between the heat sink and the lens cover. A step may be formed as shown in FIG. 4 to form a sealing groove.
【0021】[0021]
【発明の効果】本発明は、複数のLEDアレイを直線状
に配設する絶縁基板と、前記絶縁基板を配設する放熱板
と、前記LEDアレイから発せられる光を感光ドラムに
照射させるための集光レンズ群を設け、前記絶縁基板を
覆うように前記放熱板上に配設されるレンズカバーとを
備えたLEDプリンタヘッドにおいて、前記放熱板と前
記レンズカバーとの接合部外周に、前記放熱板と前記レ
ンズカバーとの少なくとも一方の周縁端部にテーパ部も
しくは段差部を形成することで得られる封止溝を設け、
前記封止溝に封止剤を充填してなるものであり、集光レ
ンズ群を介して集光される光の焦点位置を変えることな
く、前記放熱板と前記レンズカバーとで形成される空間
部を外部から気密的に封止することができるものであ
る。According to the present invention, a plurality of LED arrays are linearly arranged.
Insulating substrate to be disposed on a heat sink
And the light emitted from the LED array is applied to the photosensitive drum.
A condenser lens group for irradiation is provided, and the insulating substrate is
And a lens cover disposed on the heat sink to cover the lens cover.
In the LED printer head provided , the heat radiating plate and the laser
At least one peripheral edge with the lens cover
Or a sealing groove obtained by forming a step portion,
A space formed by the heat radiating plate and the lens cover without changing a focal position of light condensed through a condenser lens group, wherein the sealing groove is filled with a sealing agent. The part can be hermetically sealed from the outside.
【0022】また、前記封止溝は前記放熱板と前記レン
ズカバーとの少なくとも一方の周縁端部にテーパ部もし
くは段差部を形成してなることから、前記レンズカバー
と前記放熱板とをビス等により固定した後、ディスペン
サー等を用い前記封止溝をガイドとして前記封止剤を充
填できるため、製造工程における封止工程の作業性が軽
減され、かつ充填量の管理がしやすくなる。また、前記
放熱板と前記レンズカバーとの各接合面の一部(封止
溝)に前記封止剤が充填させているだけで両部材間の密
着性も弱く、前記レンズカバーを取外してメンテナンス
を行う場合でも、前記放熱板や前記レンズカバー等の変
形,破損等の心配がなく、容易に修繕作業を行えるとい
った効果を奏するものである。[0022] The sealing groove from that obtained by forming a tapered portion or a step portion on at least one perimeter edge of the lens cover and the radiator plate, screws or the like and the lens cover and the heat radiating plate After fixing, the sealing agent can be filled using the sealing groove as a guide using a dispenser or the like, so that the workability of the sealing step in the manufacturing process is reduced and the filling amount is easily managed. In addition, since only a part (sealing groove) of each joint surface between the heat radiating plate and the lens cover is filled with the sealing agent, the adhesion between the two members is weak, and the lens cover is removed for maintenance. In this case, there is an effect that the repair work can be easily performed without worrying about deformation, breakage, and the like of the heat sink and the lens cover.
【図1】本発明の第1実施例のLEDプリンタヘッドを
示す要部断面図。FIG. 1 is an essential part cross-sectional view showing an LED printer head according to a first embodiment of the present invention.
【図2】同上第1実施例のLEDプリンタヘッドを示す
斜視図。FIG. 2 is a perspective view showing the LED printer head of the first embodiment.
【図3】本発明の第2実施例を示す要部拡大断面図。FIG. 3 is an enlarged sectional view of a main part showing a second embodiment of the present invention.
【図4】本発明の第3実施例を示す要部拡大断面図。FIG. 4 is an enlarged sectional view of a main part showing a third embodiment of the present invention.
【図5】従来のLEDプリンタヘッドを示す要部断面
図。FIG. 5 is a sectional view of a main part showing a conventional LED printer head.
【図6】同上従来のLEDプリンタヘッドを示す斜視
図。FIG. 6 is a perspective view showing a conventional LED printer head.
1 LEDアレイ 3 絶縁基板 9,12,14 放熱板 9a,12a,14a 接合面(接合部) 5 集光レンズ群 6,11 レンズカバー 6a,11a 接合面(接合部) 10,13,15 封止溝 a 空間部 B LEDプリンタヘッド DESCRIPTION OF SYMBOLS 1 LED array 3 Insulating board 9, 12, 14 Heat sink 9a, 12a, 14a Joining surface (joining part) 5 Condensing lens group 6, 11 Lens cover 6a, 11a Joining surface (joining part) 10, 13, 15 Sealing Groove a Space B LED printer head
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B41J 2/44 B41J 2/45 B41J 2/455 H04N 1/036 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) B41J 2/44 B41J 2/45 B41J 2/455 H04N 1/036
Claims (1)
絶縁基板と、前記絶縁基板を配設する放熱板と、前記L
EDアレイから発せられる光を感光ドラムに照射させる
ための集光レンズ群を設け、前記絶縁基板を覆うように
前記放熱板上に配設されるレンズカバーとを備えたLE
Dプリンタヘッドにおいて、 前記放熱板と前記レンズカバーとの接合部外周に、前記
放熱板と前記レンズカバーとの少なくとも一方の周縁端
部にテーパ部もしくは段差部を形成することで得られる
封止溝を設け、前記封止溝に封止剤を充填してなること
を特徴とするLEDプリンタヘッド。1. A plurality of LED arrays are arranged in a straight line.
An insulating substrate; a heat sink on which the insulating substrate is disposed;
Irradiate light emitted from ED array to photosensitive drum
And a condenser lens group for covering the insulating substrate.
LE having a lens cover disposed on the heat sink
In D the printer head, the junction periphery of the lens cover and the radiator plate, wherein
At least one peripheral edge of the heat sink and the lens cover
Obtained by forming a tapered part or a step part in the part
Providing a sealing groove and filling the sealing groove with a sealing agent
LED printer head according to claim.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18796995A JP3129160B2 (en) | 1995-06-30 | 1995-06-30 | LED printer head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18796995A JP3129160B2 (en) | 1995-06-30 | 1995-06-30 | LED printer head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0911539A JPH0911539A (en) | 1997-01-14 |
JP3129160B2 true JP3129160B2 (en) | 2001-01-29 |
Family
ID=16215323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18796995A Expired - Fee Related JP3129160B2 (en) | 1995-06-30 | 1995-06-30 | LED printer head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3129160B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4211710B2 (en) * | 2004-08-04 | 2009-01-21 | セイコーエプソン株式会社 | Line head module and image forming apparatus |
JP5206753B2 (en) * | 2010-09-01 | 2013-06-12 | 富士ゼロックス株式会社 | Exposure apparatus and image forming apparatus |
JP6374739B2 (en) * | 2014-09-19 | 2018-08-15 | 株式会社沖データ | Exposure apparatus and image forming apparatus |
-
1995
- 1995-06-30 JP JP18796995A patent/JP3129160B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0911539A (en) | 1997-01-14 |
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