JP3128339U - Fiber radial heat sink - Google Patents

Abstract

An object of the present invention is to provide a fiber radial heat sink characterized in that the industrial utility value is improved because the chip and the high thermal energy unit are cooled quickly by sucking heat.
A fiber radial heat sink provided by the present invention has an infinite number of 0.05 to 0.2 mm high-conductivity heat-dissipating material fiber bodies fitted in a bundle ring of the heat sinks, and each fiber body is kept at an appropriate distance in the upward direction. Stretched and radiate, and the fiber body can be made into a heat dissipating net knitted according to the demands of various environments. When it is stretched outside the main electronic (PC) machine, the surface area of the heat dissipating space doubles. The effect of accelerating the heat absorption of the surrounding gas is achieved, and the integrated fiber type highly conductive heat-dissipating surface structure improves the industrial utility value of quickly cooling the chip and the high thermal energy unit by heat absorption. .
[Selection] Figure 1

Description

  The present invention proposes a fiber radial heat sink that can quickly absorb heat to cool the chip and the high thermal energy unit and improve the industrial utility value.

  Current general electronic products are generally composed of basic units such as resistors, capacitors, LEDs, chips, interface cards, and CPUs. After being controlled by the CPU operation unit, they are sent to the layer management operation of each chip. However, as CPUs and chips are increasingly complicating advanced software operations day by day, they generate considerably larger heat energy than other parts, and if these heats are not discharged, In addition to reducing the service life of the product itself, it also leads to combustion, and accelerates the wear and tear of peripheral equipment. Therefore, the heat dissipating device of the publicly known technology absorbs heat by the aluminum press type heat sink structure, but the heat dissipating surface area of the aluminum product is small and the cooling efficiency is poor, and it cannot meet the heat dissipating demand of the current high-speed CPU. In the cooler industry, expectations for breakthroughs are very high.

  In particular, the fiber radial heat sink of the present invention has an infinite number of high-conductivity heat-dissipating fiber bodies fitted in the bundle of heat sinks, and each fiber is radially extended at an appropriate interval in the upward direction. The main object is to provide a fiber radial heat sink characterized by doubling the surface area of the substrate and accelerating the thermal suction effect of the surrounding gas.

  Another object of the present invention is to provide a fiber radial heat sink characterized in that the fiber body of the highly conductive heat dissipating material is a knitted heat dissipating net according to various environmental demands.

According to the first aspect of the present invention, the fiber radial heat sink has a fiber body made of a high-conductivity heat-dissipating material fitted and fixed in a bundle ring, and the lower ends of the fiber bodies are polished and flattened so as to be integrally attached to the chip surface to be dissipated. In addition, each fiber body has a radial shape extending at an appropriate interval in the upward direction, and the heat of the surrounding gas is quickly sucked by the fiber body space distribution of each highly conductive heat dissipating material to achieve the chip cooling heat dissipating effect. This is a fiber radial heat sink.
The invention of claim 2 accelerates the removal of heat from the fiber body by wind from outside by providing a support frame outside the bundle ring of the heat sink and attaching a fan to the fiber radial heat sink according to claim 1. The fiber radial heat sink is characterized by the following.
The invention of claim 3 is a fiber radial heat sink according to claim 1 or 2, wherein each fiber body has a structure of a heat dissipating net knitted by stretching.

  The fiber radial heat sink according to the present invention is characterized in that heat can be quickly sucked to cool the chip and the high thermal energy unit, thereby improving industrial utility value.

  As shown in FIGS. 1 to 3, the fiber radial heat sink of the present invention has a fiber body 1 made of 0.05 to 0.2 mm of high-conductivity heat-dissipating material inserted into the bundle ring 2 and clamped and fixed, and the lower end of each fiber body 1 is polished. Then, it is flattened and adhered integrally to the chip surface to be dissipated, and the fibrous bodies 1 are stretched at an appropriate distance in the upward direction and are radial, which is a feature of the main structure of the present proposal.

  The implementation of the present invention is applied to a general heat dissipation chip and directly adheres to the chip surface. By the distribution of fiber bodies 1 of each highly conductive heat dissipation material, the heat of the surrounding gas is quickly sucked and the chip cooling heat dissipation effect is achieved. To achieve. In addition, when used in a high heat energy unit of a special CPU, as shown in FIG. 1, the heat of the fiber body 1 is increased by the wind from outside by adding a support frame 3 to the heat sink bundle ring 2 and adding a fan 5. Accelerates removal and doubles the thermal suction of ambient gas to achieve a quick cooling effect. In Fig. 5, the fiber body 1 is a heat dissipating net that is stretched and knitted according to the demands of various environments, and shows the application change characteristics with increased heat dissipating space surface area, greatly improving the industrial utility value of this proposal I am letting.

1 is a preferred embodiment of the present invention. It is a component exploded view of the present invention. It is a component assembly drawing of the present invention. It is another structure sectional drawing of this invention. It is a display figure of the heat dissipation net which knitted and extended the fiber of the present invention.

Explanation of symbols

1 Fiber body 2 Bundle ring 3 Support frame 5 Fan

Claims (3)

  The fiber radial heat sink is a fiber body made of a highly conductive heat dissipating material that is fitted and fixed in a bundle ring. The lower end of each fiber body is polished and flattened, and is integrally attached to the chip surface to be dissipated. Fiber radial, characterized by a radial shape extending at an appropriate interval in the upward direction, and by rapidly absorbing the heat of the surrounding gas by the fiber space distribution of each highly conductive heat dissipation material to achieve the chip cooling heat dissipation effect heatsink.   2. The fiber radial heat sink according to claim 1, wherein a support frame is provided outside the bundle of heat sinks and a fan is attached to accelerate removal of heat of the fiber body by wind from the outside. .   3. The fiber radial heat sink according to claim 1 or 2, wherein each fiber body has a structure of a heat dissipating net knitted by stretching.

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