JP3126333U - Conductive antenna structure - Google Patents

Conductive antenna structure Download PDF

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JP3126333U
JP3126333U JP2006006503U JP2006006503U JP3126333U JP 3126333 U JP3126333 U JP 3126333U JP 2006006503 U JP2006006503 U JP 2006006503U JP 2006006503 U JP2006006503 U JP 2006006503U JP 3126333 U JP3126333 U JP 3126333U
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conductive antenna
conductive
film substrate
plastic film
antenna
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永順 陳
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H05K2203/097—Corona discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

【課題】導電アンテナの構造を提供する。
【解決手段】本考案導電アンテナの構造はプラスチック膜基材、導電アンテナを含み、該プラスチック膜基材はポリエチレンテレフタレート(PET)を用い製造し、該導電アンテナは導電材質を用い製造し、該プラスチック膜基材表面上に連接し、且つ該導電アンテナは予定の第一厚さを具える。ポリエチレンテレフタレート(PET)を膜基材とし、蒸着電気メッキ及び水洗方式により製造された導電アンテナは製造コストを効果的に引き下げ、生産効率を向上させることができる他、生産に融通がきく。また、導電アンテナの構造は撓み性に優れ、コンパクト且つ軽量という利点を持つ。
【選択図】図２A structure of a conductive antenna is provided.
The structure of a conductive antenna of the present invention includes a plastic film substrate and a conductive antenna, the plastic film substrate is manufactured using polyethylene terephthalate (PET), the conductive antenna is manufactured using a conductive material, and the plastic Contiguous on the surface of the membrane substrate and the conductive antenna has a predetermined first thickness. Conductive antennas manufactured using polyethylene terephthalate (PET) as a film substrate by vapor deposition electroplating and rinsing methods can effectively reduce manufacturing costs, improve production efficiency, and have flexibility in production. Further, the structure of the conductive antenna is excellent in flexibility, and has the advantages of being compact and lightweight.
[Selection] Figure 2

Description

本考案は一種のアンテナの構造に関する。特に一種のPETにより製造する基材をRFアンテナに運用する導電アンテナの構造に係る。   The present invention relates to a kind of antenna structure. In particular, the present invention relates to a structure of a conductive antenna in which a base material manufactured by a kind of PET is used as an RF antenna.

RFID(Radio Frequency Identification)は無線電波により識別データを伝送するシステムで、非常に広範に使用されており、以下の長所を有する。
１．データは更新可能：バーコードはプリントしてしまえば変更不能だが、RFIDタグは内部に保存するデータを無制限に増加、修正、削除することができる。
２．データの読み取りが便利：バーコードリーダーは近距離かつ間に阻害する物体がない状態で、走査光線をバーコード上に照射し使用する必要があるが、RFIDタグは無線電波の届く範囲であれば、信号を伝送することができる。
３．保存容量が大きい：1次元バーコードの容量は50バイトで、2次元バーコードの最大容量は2〜3000バイトであるが、RFIDタグの容量はメガバイトに達する。
４．繰返し使用が可能：バーコードは商品に従いその寿命は終わるが、RFIDタグはデータを更新可能であるため、繰返し使用することができる。
５．数個のデータを同時に読み取り可能：バーコードリーダーは一度に1つのバーコードしか読み取ることができないが、RFIDタグリーダーは同時に数個のRFIDタグを読み取ることができる。
６．安全性：RFIDタグの読み取りにはすべてバーコードの保護があり安全性が高いため、偽造や変造がされにくい。 RFID (Radio Frequency Identification) is a system that transmits identification data by radio waves, and is widely used, and has the following advantages.
1. Data can be updated: barcodes cannot be changed once they are printed, but RFID tags can add, modify and delete unlimited data stored inside.
2. Data reading is convenient: Bar code readers need to be used by irradiating a scanning beam onto the bar code with no obstructing objects in the near distance. The signal can be transmitted.
3. Large storage capacity: 1-dimensional barcode capacity is 50 bytes, 2-dimensional barcode maximum capacity is 2-3000 bytes, but RFID tag capacity reaches megabytes.
4). Can be used repeatedly: Barcodes will last their lifetime according to the product, but RFID tags can be used repeatedly because data can be updated.
5. Read several pieces of data simultaneously: A barcode reader can only read one barcode at a time, but an RFID tag reader can read several RFID tags at the same time.
6). Safety: All RFID tag readings are bar code protected and highly secure, making it difficult to counterfeit or tamper.

上記のように優れた特色があるため、世界最大の流通業者であるウォルマートは2005年1月1日よりRFIDの先導型試験を開始し、米国国防総省、Metro(独最大のスーパーマーケットチェイン)、ベストバイ（米国大手電子製品小売業者）も傘下のサプライヤに導入或いはRFID関連試験を行うよう要求している。これにより、2008年にはRFIDの市場規模は30億米ドル以上に達すると予想され、2006年は22億元以上のRFIDタグが使用されると見られている。   As mentioned above, Wal-Mart, the world's largest distributor, started RFID-leading testing on January 1, 2005. The US Department of Defense, Metro (Germany's largest supermarket chain), Best Buy (a major US electronics retailer) is also asking its affiliated suppliers to perform implementation or RFID related tests. As a result, RFID market size is expected to reach more than US $ 3 billion in 2008, and more than 2.2 billion RFID tags are expected to be used in 2006.

現時点でのRFIDが直面している問題は、タグの価格が高いことである。図１に示すように、公知のフレキシブル銅箔基板(FCLL)はポリイミド(PI)１１を基材とし、両側面にそれぞれ接着剤(Adhensive)12を塗布後、それぞれ一層の銅箔１３を接着し、さらにエッチングの方式で高コストのFCLLを製造し、該銅箔１３をエッチングし導電アンテナ形状構造を形成する。
上記製造方式は原料コストが非常に高く、加えて製造工程が煩雑であるため、単位コストが高くなってしまい、且つ迅速な大量生産には適していない。
また上記製造により生み出される廃水は環境に対して有害で、廃水処理にも莫大なコストを要する。
すなわち、製造工程、生産効率、弾力性を共に兼備えることは難しい現況で、タグコストを引き下げることが市場拡大のカギである。このため、これまでのコストが高い原料と製造工程により生産されていた銅箔版エッチングを発展させ、プリント電気メッキ水洗アンテナ技術を完成させ、コストを大幅に低下させることは、市場ニーズとトレンドに合致している。これにより高い競争力を具えたタグを製造し、またタグ製造の技術を関連産業おいて応用していくことが待たれている。 The problem facing RFID at this time is the high price of tags. As shown in FIG. 1, a known flexible copper foil substrate (FCLL) is made of polyimide (PI) 11 as a base material, and adhesive (Adhensive) 12 is applied to both sides, and then a single layer of copper foil 13 is bonded. Further, a high-cost FCLL is manufactured by an etching method, and the copper foil 13 is etched to form a conductive antenna shape structure.
The above manufacturing method has a very high raw material cost and a complicated manufacturing process. Therefore, the unit cost becomes high and is not suitable for rapid mass production.
Moreover, the wastewater produced by the above production is harmful to the environment, and enormous costs are required for wastewater treatment.
In other words, it is difficult to combine manufacturing processes, production efficiency, and elasticity, and reducing tag costs is the key to market expansion. For this reason, the development of copper foil plate etching, which has been produced by raw materials and manufacturing processes that have been costly, has been completed, and the printed electroplating washing antenna technology has been completed. It matches. As a result, it is awaited to produce highly competitive tags and to apply tag manufacturing technology in related industries.

本考案の主要な目的は、導電アンテナの構造を提供することにより、プラスチック膜を基材とし、蒸着と水洗方式でアンテナを製造し、こうして製造コストを効果的に引き下げ、生産効率を向上させることができる他、生産に融通がきく。   The main purpose of the present invention is to provide a structure of a conductive antenna, to manufacture an antenna using a plastic film as a base material by vapor deposition and water washing, thus effectively reducing the manufacturing cost and improving the production efficiency. In addition, the production is flexible.

本考案の次の目的は、導電アンテナの構造を提供し、その製造方法は工業経営に適し、自動化生産により効率を上げることができ、またこの製造工程により生産された製品は撓み性に優れ、コンパクトかつ軽量でる。   The next object of the present invention is to provide a structure of a conductive antenna, the manufacturing method thereof is suitable for industrial management, the efficiency can be increased by automated production, and the product produced by this manufacturing process is excellent in flexibility, Compact and lightweight.

本考案のもう一つの目的は、導電アンテナの構造を提供し、これにより製造された回路図形はRFID(Radio Frequency Identification)及びフレキシブルプリント基板板(Flexible Printed Circuit)等の関連電子製品に導電回路として運用される。   Another object of the present invention is to provide a structure of a conductive antenna, and a circuit pattern produced thereby is used as a conductive circuit in related electronic products such as RFID (Radio Frequency Identification) and Flexible Printed Circuit Board (Flexible Printed Circuit Board). Operated.

上述の目的を達成するため、本考案は一種導電アンテナの構造を提供する。本考案導電アンテナの構造はプラスチック膜基材、導電アンテナを含み、該プラスチック膜基材はポリエチレンテレフタレート(PET)を用い製造し、該導電アンテナは導電材質を用い製造し、該プラスチック膜基材表面上に連接し、且つ該導電アンテナは予定の第一厚さを具える。   In order to achieve the above object, the present invention provides a structure of a kind of conductive antenna. The structure of the conductive antenna of the present invention includes a plastic film substrate and a conductive antenna. The plastic film substrate is manufactured using polyethylene terephthalate (PET), and the conductive antenna is manufactured using a conductive material. The conductive antenna is connected to the top and has a predetermined first thickness.

請求項１の考案は、主にプラスチック膜基材、導電アンテナを含み、
該プラスチック膜基材はポリエチレンテレフタレート(PET)を用い製造し、
該導電アンテナは導電材質により製造し、該プラスチック膜基材の表面上に連接し、且つ該導電アンテナは予定の第一厚さを具えることを特徴とする導電アンテナの構造としている。
請求項２の考案は、請求項１記載の導電アンテナの構造において、前記プラスチック膜基材は第二厚さを具え、該第二厚さは約6〜188μmの間であることを特徴とする導電アンテナの構造としている。
請求項３の考案は、請求項１記載の導電アンテナの構造において、前記第一厚さは0.1μm以上であることを特徴とする導電アンテナの構造としている。 The device of claim 1 mainly includes a plastic film substrate and a conductive antenna,
The plastic film substrate is manufactured using polyethylene terephthalate (PET),
The conductive antenna is manufactured from a conductive material, connected to the surface of the plastic film substrate, and the conductive antenna has a predetermined first thickness.
The invention of claim 2 is the structure of the conductive antenna of claim 1, wherein the plastic film substrate has a second thickness, and the second thickness is between about 6 to 188 μm. The structure is a conductive antenna.
The invention of claim 3 is the structure of the conductive antenna according to claim 1, wherein the first thickness is 0.1 μm or more.

本考案は導電アンテナの構造を提供することにより、プラスチック膜を基材とし、蒸着と水洗方式でアンテナを製造し、こうして製造コストを効果的に引き下げ、生産効率を向上させることができる他、生産に弾力性を持たせることができる。その製造方法は工業経営に適し、自動化生産により効率を上げることができ、またこの製造工程により生産された製品は撓み性に優れ、コンパクトかつ軽量でる。これにより製造された回路図形はRFID(Radio Frequency Identification)及びフレキシブルプリント基板板(Flexible Printed Circuit)等の関連電子製品に導電回路として運用される。   The present invention provides a structure of a conductive antenna, which uses a plastic film as a base material to manufacture an antenna by vapor deposition and water washing, thus effectively reducing manufacturing costs and improving production efficiency. Can be made elastic. The manufacturing method is suitable for industrial management, and the efficiency can be increased by automated production. The product produced by this manufacturing process is excellent in flexibility, compact and lightweight. The circuit figure thus manufactured is used as a conductive circuit in related electronic products such as RFID (Radio Frequency Identification) and a flexible printed circuit board (Flexible Printed Circuit).

図２に示すように、本考案導電アンテナの構造は、プラスチック膜基材２、導電アンテナ５を含む。該プラスチック膜基材２はポリエチレンテレフタレート(PET)を用い製造する。第二厚さは約6〜188μmの間で、該導電アンテナ５は該アンテナ図案２１上に設置する導電材質により製造する該導電層４である。該導電アンテナ５は該プラスチック膜基材２表面上に連接し、該第一厚さは0.1μm以上である。   As shown in FIG. 2, the structure of the conductive antenna of the present invention includes a plastic film substrate 2 and a conductive antenna 5. The plastic film substrate 2 is manufactured using polyethylene terephthalate (PET). The second thickness is between about 6 and 188 μm, and the conductive antenna 5 is the conductive layer 4 made of a conductive material placed on the antenna design 21. The conductive antenna 5 is connected to the surface of the plastic film substrate 2 and the first thickness is 0.1 μm or more.

図３、図４に示すように、本考案導電アンテナの構造は、プラスチック膜基材２を使用する。該プラスチック膜基材２はフタル酸とエチレングリコールの化合物であるポリエチレンテレフタレート(PET)を用い製造する。PETは以下の特性を具える。1.耐用性と透明度が高い：耐熱性と絶縁性が良好で、高い透明度を具える。2.環境保護に有利：PETは環境にやさしいプラスチック材質で、安全性に対する考慮からポリビニルクロライド(PVC)に取って代っている。3.リサイクル可能：PETは化学繊維、或いは二次加工のプラスチック製品にリサイクル可能で、再生価値が最も高いプラスチックである。4.軽量で、耐衝撃性があり、破損しにくい。   As shown in FIGS. 3 and 4, the structure of the conductive antenna of the present invention uses a plastic film substrate 2. The plastic film substrate 2 is manufactured using polyethylene terephthalate (PET) which is a compound of phthalic acid and ethylene glycol. PET has the following characteristics: 1. High durability and transparency: good heat resistance and insulation, high transparency. 2.Environmental protection: PET is an environmentally friendly plastic material that has replaced polyvinyl chloride (PVC) for safety considerations. 3. Recyclable: PET is the most recyclable plastic that can be recycled into chemical fiber or secondary processed plastic products. 4. Lightweight, impact resistant and not easily damaged.

該プラスチック膜基材２は第二厚さtを具え、該第二厚さtは約6〜188ミクロンである。本考案では回路は凹版製版作業を行う。通常の凹版製版作業は3種に分けられる。1.彫刻製版：版胴深度30〜80μm(版胴銅メッキ→研磨→彫刻→クロムメッキ→研磨)。2.腐蝕製版：版胴深度15〜80μm(版胴銅メッキ→塗布→露光→腐蝕→水洗→クロムメッキ→研磨)。3.レーザー製版：版胴深度15〜80μm(版胴銅メッキ→塗布→レーザー→腐蝕→水洗→クロムメッキ→研磨。   The plastic membrane substrate 2 has a second thickness t, which is about 6 to 188 microns. In the present invention, the circuit performs intaglio plate making. Normal intaglio platemaking is divided into three types. 1. Engraving plate making: Plate cylinder depth 30-80 μm (plate cylinder copper plating → polishing → engraving → chrome plating → polishing). 2. Corrosion plate making: Plate cylinder depth 15 to 80 μm (plate cylinder copper plating → application → exposure → corrosion → water washing → chrome plating → polishing). 3. Laser plate making: Plate cylinder depth 15 ~ 80μm (plate cylinder copper plating → coating → laser → corrosion → water washing → chrome plating → polishing.

続いて図４に示すように、該プラスチック膜基材２に水洗塗料３を行いプリント、設計された回路では、該水洗塗料３は予定のアンテナ図案２１を具える。このため、該アンテナ図案２１の位置は中空状態を呈する。該水洗塗料３の厚さは約1〜3μmの間である。該水洗塗料３の該プラスチック膜基材２上における接着強度を増強するため、本考案では該水洗塗料３をプリントする前に、基材前処理剤(Primer)を該プラスチック膜基材２上に塗布する。これにより続く製造工程中の該プラスチック膜基材２上における導電層４の接着強度を同時に強化することができる。該基材前処理剤(Primer)もまた該水洗塗料３を印刷した後、再び該アンテナ図案２１及び該水洗塗料３上に塗布することができる。該水洗塗料３は水分を具えるため、該プラスチック膜基材２の乾燥を行う必要がある。さらに該水洗塗料３と該プラスチック膜基材２の溶剤水分を除去し、且つ該プラスチック膜基材２はロール状を形成する。   Subsequently, as shown in FIG. 4, in the circuit designed by printing the water-washing paint 3 on the plastic film substrate 2, the water-washing paint 3 includes a predetermined antenna design 21. For this reason, the position of the antenna design 21 exhibits a hollow state. The thickness of the water-washing paint 3 is between about 1 to 3 μm. In order to enhance the adhesive strength of the water-washing paint 3 on the plastic film substrate 2, in the present invention, before printing the water-washing paint 3, a substrate pretreatment agent (Primer) is applied on the plastic film base material 2. Apply. Thereby, the adhesive strength of the conductive layer 4 on the plastic film substrate 2 during the subsequent manufacturing process can be simultaneously enhanced. The substrate pretreatment agent (Primer) can also be applied to the antenna design 21 and the water-washing paint 3 again after the water-washing paint 3 is printed. Since the water-washing paint 3 has moisture, it is necessary to dry the plastic film substrate 2. Further, the solvent water of the water-washing paint 3 and the plastic film substrate 2 is removed, and the plastic film substrate 2 forms a roll.

次に図５に示すように、該プラスチック膜基材２に蒸着電気メッキを施し、該アンテナ図案２１と該水洗塗料３上に導電層４を設置する。該導電層４は銅材質或いはアルミ材質により製造する。本考案の最適実施例では、該導電層４の工程を実施する前に、先ず該プラスチック膜基材２にコロナ処理(Corona)処理を施し、該アンテナ図案２１と該水洗塗料３の表面に極化を生じさせる。   Next, as shown in FIG. 5, the plastic film substrate 2 is subjected to vapor deposition electroplating, and the conductive layer 4 is placed on the antenna design 21 and the water-washing paint 3. The conductive layer 4 is made of a copper material or an aluminum material. In an optimal embodiment of the present invention, before the process of the conductive layer 4 is performed, the plastic film substrate 2 is first subjected to corona treatment, and the antenna design 21 and the surface of the water-washing paint 3 are exposed to the poles. Cause

いわゆるコロナ処理とは一種の電撃処理で、これにより被プリント体の表面により高い付着性を持たせることができる。コロナ処理は高電圧高周波を利用し、それぞれアースと誘電空気ジェットにより電撃を生じる。これらの間には電流の通過がなく、電圧は3000〜5000ボルト/平方ミリにまで達する。この後、電撃分子は空気ジェットより噴出し、高いエネルギーを持つ遊離電子が正極へと加速し衝突する。電撃処理はこの密集し、かつ高いエネルギー量の噴出イオンが生み出す作用である。これらイオンは電撃と滲みこみにより被プリント体の表面に進入し、その分子構造を破壊し、処理された表面の分子を酸化し極化する。さらにイオン電撃により表面を侵蝕し、被プリント体表面の付着能力を増強する。   The so-called corona treatment is a kind of electric shock treatment, which can give higher adhesion to the surface of the printed body. Corona treatment uses high-voltage and high-frequency waves, which generate electrical shocks with ground and dielectric air jets, respectively. There is no current passing between them, and the voltage can reach 3000-5000 volts / square millimeter. Thereafter, the electric shock molecules are ejected from the air jet, and free electrons having high energy are accelerated and collide with the positive electrode. The electric shock treatment is an action produced by the dense and high energy ejected ions. These ions enter the surface of the substrate by electric shock and oozing, destroy the molecular structure, and oxidize and polarize molecules on the treated surface. Furthermore, the surface is eroded by ion bombardment, and the adhesion ability of the surface of the printed material is enhanced.

最後に図６に示すように、該プラスチック膜基材２を水洗し、該水洗塗料３と該プラスチック膜基材２を分離する。且つ該導電層４は該アンテナ図案２１上において予定の第一厚さt1を具える導電アンテナを形成する。該第一厚さt1は0.1μm以上が最適である。本考案の最適実施例中では、完成した該プラスチック膜基材２を乾燥し、該導電層４と該プラスチック膜基材２の溶剤水分を除去し、且つ該プラスチック膜基材２はロール状を形成する。   Finally, as shown in FIG. 6, the plastic film substrate 2 is washed with water, and the water-washing paint 3 and the plastic film substrate 2 are separated. The conductive layer 4 forms a conductive antenna having a predetermined first thickness t1 on the antenna design 21. The first thickness t1 is optimally 0.1 μm or more. In an optimal embodiment of the present invention, the completed plastic film substrate 2 is dried to remove the solvent moisture of the conductive layer 4 and the plastic film substrate 2, and the plastic film substrate 2 is in the form of a roll. Form.

公知のフレキシブル銅箔基板構造の側面表示図である。It is a side view of a known flexible copper foil substrate structure. 本考案の導電アンテナ装置の最適実施例の側面構造表示図である。It is a side structure display figure of the optimal Example of the conductive antenna apparatus of this invention. 本考案の導電アンテナの製造方法の最適実施例の側面構造工程表示図である。It is a side structure process display figure of the optimal Example of the manufacturing method of the electrically conductive antenna of this invention. 本考案の導電アンテナの製造方法の最適実施例の側面構造工程表示図である。It is a side structure process display figure of the optimal Example of the manufacturing method of the electrically conductive antenna of this invention. 本考案の導電アンテナの製造方法の最適実施例の側面構造工程表示図である。It is a side structure process display figure of the optimal Example of the manufacturing method of the electrically conductive antenna of this invention. 本考案の導電アンテナの製造方法の最適実施例の側面構造工程表示図である。It is a side structure process display figure of the optimal Example of the manufacturing method of the electrically conductive antenna of this invention.

符号の説明Explanation of symbols

１１ ポリイミド(PI)
１２ 接着剤
１３ 銅箔
２ プラスチック膜基材
２１ アンテナ図案
３ 水洗塗料
４ 導電層
５ 導電アンテナ
t 第二厚さ
ｔ１ 第一厚さ 11 Polyimide (PI)
12 Adhesive 13 Copper foil 2 Plastic film substrate 21 Antenna design 3 Flushing paint 4 Conductive layer 5 Conductive antenna
t Second thickness t1 First thickness

Claims (3)

主にプラスチック膜基材、導電アンテナを含み、
該プラスチック膜基材はポリエチレンテレフタレート(PET)を用い製造し、
該導電アンテナは導電材質により製造し、該プラスチック膜基材の表面上に連接し、且つ該導電アンテナは予定の第一厚さを具えることを特徴とする導電アンテナの構造。 Mainly includes plastic film substrate, conductive antenna,
The plastic film substrate is manufactured using polyethylene terephthalate (PET),
A structure of a conductive antenna, wherein the conductive antenna is made of a conductive material, is connected to the surface of the plastic film substrate, and the conductive antenna has a predetermined first thickness. 請求項１記載の導電アンテナの構造において、前記プラスチック膜基材は第二厚さを具え、該第二厚さは約6〜188μmの間であることを特徴とする導電アンテナの構造。   2. The structure of a conductive antenna according to claim 1, wherein the plastic film substrate has a second thickness, and the second thickness is between about 6 to 188 [mu] m. 請求項１記載の導電アンテナの構造において、前記第一厚さは0.1μm以上であることを特徴とする導電アンテナの構造。
2. The structure of a conductive antenna according to claim 1, wherein the first thickness is 0.1 [mu] m or more.
JP2006006503U 2006-02-27 2006-08-10 Conductive antenna structure Expired - Fee Related JP3126333U (en)

Applications Claiming Priority (1)

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TW95203283U TWM298237U (en) 2006-02-27 2006-02-27 Structure of electrically conductive antenna

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JP3126333U true JP3126333U (en) 2006-10-19

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TWM298237U (en) 2006-09-21

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