TWM298237U - Structure of electrically conductive antenna - Google Patents

Structure of electrically conductive antenna Download PDF

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Publication number
TWM298237U
TWM298237U TW95203283U TW95203283U TWM298237U TW M298237 U TWM298237 U TW M298237U TW 95203283 U TW95203283 U TW 95203283U TW 95203283 U TW95203283 U TW 95203283U TW M298237 U TWM298237 U TW M298237U
Authority
TW
Taiwan
Prior art keywords
conductive antenna
plastic film
thickness
conductive
antenna
Prior art date
Application number
TW95203283U
Other languages
Chinese (zh)
Inventor
Yung-Shun Chen
Original Assignee
Taiwan Lamination Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Lamination Ind Inc filed Critical Taiwan Lamination Ind Inc
Priority to TW95203283U priority Critical patent/TWM298237U/en
Priority to JP2006006503U priority patent/JP3126333U/en
Publication of TWM298237U publication Critical patent/TWM298237U/en
Priority to DE200620016626 priority patent/DE202006016626U1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H05K2203/097Corona discharge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)

Description

M298237 八、新型說明: 【新型所屬之技術領域】 、本創作有關在一種天線結構,特別是指一種以聚酯材料(PET)所製 成基材運用在無線軸⑽)天線的可導電天線結構。 【先前技術】M298237 VIII. New description: [New technical field] This creation relates to an antenna structure, especially a conductive antenna structure used in a wireless shaft (10) antenna made of polyester (PET) substrate. . [Prior Art]

Radio Frequency Identifica^ionimD)^^#^ 無線電f來傳賴別資料的系統,其應用非常廣泛,其具有下列優點: L貝料可更新:條碼印刷之後就無法更改,处仍TAG則可不限制 •次數地新增、修改、刪除RFID TAG内儲存的資料。 /方便資料辨讀:條碼閱讀器需在近距離而且沒有物體阻播下, 使㈣光賴射在條碼上才能_。处仍mG只要在絲電波的範 圍内,即可傳遞訊號。 —旦3·儲存資料的容量大:一維條碼的容量是遍卿;二維條碼最大的 容量可儲存2至3_字元;RpID TAG最大量可達數㈣卿如。 、4·可重覆性使用·條碼常隨著商品的壽命結束而結束;胞d 因為本身資料可更新,因此可以重覆不斷地使用。 ❿· 5·可同時讀取數個資料:條碼閱讀器—次只能讀取單一條碼資 料,RFID TAG的辨識器可同時間辨識讀取數個处1〇 TAG。 6·安全性· RFID TAG讀取方面皆有密碼保護,高度第一厚度安全 性的保護措施使之不易被偽造及變造。 因此王世界最大的零售業龍頭沃爾瑪(Wal-Mart)從2005年1月 1曰開始,正式啟動無線辨識系統_〇)先導型試驗;美國國防部、 Metro (德國最大連鎖超市)、Bestbuy (美國電子產品零售巨擎),也 紛紛要求旗下供應商導人或進行RFID相關試驗,也預估到誦年 RFID可達30億美元以上規模,到2〇〇6年將會使用價值22億美元以 5 M298237 上的標籤。 #而現階段無線辨識系統(RFiD)所面臨到的瓶頸,#中一項即是桿 藏不下’請參㈣1 _示,其縣f知軟性銅縣板 CL)、、.。構側視示意圖。習知軟性銅縣板係以聚酿亞胺p咖麻 (pi)匕為基材,二側面分別塗佈有接著劑(她_) 12後,各貼上一 層銅^ 13 ’再以姓刻方式製作傳統高成本之軟性銅絲板(Μα), 夺銅^ 13細丨形成可導電天線形狀結構。而上述製作方式由於原料成 本偏高加上製程手續繁雜使得單位成本偏高,且不適於快速大量生 產;另外職生的廢水也㈣觀造雜大危#,喊理廢水也會花 費相當士的成本。_製程成本、產能效率及彈性錄無法兼顧,在 降低=成本以拓展市場接受度的議題主導下,取代傳統原料及製程 成本昂貴之侧銅箱基版所發展之印刷真空電鑛水洗天線技術,能大 幅降低成本且符合市場需求與趨勢,這將是取得解優勢的方法之 -。亚且希望藉由製作標籤天線的技術能更延伸至其他蝴 。 【新型内容】 本創作^要目的’在提供—種可導電天線結構,其係以塑料膜 鲁為基材加上級以及水洗方式所製作的天線,除製程成本可以有效降 低、產能效率提昇外,更具生產彈性。 本創作的次要目的,在提供—種可導電天線結構,其製程適合於 工業經營扣自動化生產、效率高’且可導電天線結構具有繞曲性佳、、 輕、薄、短、小。 本創作的另一目的,在提供一種可導電天線結構,其所製造出的 電路圖形’可運用於無線射頻如伽加啊卿卿)及柔性印刷電路板 Flexile Printed Circuit(FPC)等相關電子產品傳導電路。 為達上述的目的,本創作提供一種可導電天線結構,包括有:一 6 M298237 塑料膜基材以及-導電天線,該塑料難材為聚§旨材料(pET)所製成, 而導電天線為導電材質所製成,連接於該塑料膜基材表面上,且該導 電天線具有預定之一第一厚度。 為使貴審查委員能對本創作的特徵、目的及功能有更進一步的 認知與瞭解,茲配合圖式詳細說明如後: 【實施方式】 、請再參閱第2圖’其係為本創作的可導電天線結構較佳實施例侧 視結構不意圖,該可導電天線結構包括有:—塑料膜基材2以及一導 電天線5,該塑料膜基材2為聚醋材料(pET)所製成,第二厚度約在6 微米至188微米_至188_之間,而導電天線5為該天線圖案21 上》又有導電材質所製成之該導電層4,該導電天線$連接於該塑料膜 基材表面上,第一厚度在(U微米(01μιη)以上。 、 凊參閱第3Α圖至第犯圖所示,係為本創作可導電天線製造方法 ^佳實施麵視結顧㈣意圖。如第3A目,本_可導電天線的 j方法’魏提供-麵膜基材2,該塑料膜基材2其係為聚醋材 科 Polyethylene Terephthalate(PET)所製成, ;输的聚合物。由_ PET塑膠具有以下特性,因此選用作一為 .而、用隨透明度⑧:耐紐及絕緣性良好,同時具有高透明度。2 塑PET細獅㈣,取代安全性上職的pvc(聚氯乙烯) / .可回收再彻:PET瓣可以回收加工製成人造纖維,或二 的塑膝製品,是塑膠中最具再生價值的。4.質輕、耐衝擊、不 188 ^料膜,材2具有—第:厚度1 ’該第二厚度1約在6微米至 微未(6叫至188㈣之間。本創作較佳者,會再設計出一電路進 7 M298237 行凹版製版作業,而常用凹版製版作業,方法分為三種:丨·雕刻製版, 版胴深度30μιη至80μιη (版胴鐘銅―研磨—雕刻—錄|夂—研磨)2 腐蚀製版,版胴深度15μιη至80μιη (版胴鑛銅->塗佈4曝光〜^腐餘 水洗—鍍鉻—研磨)。3·雷射製版,版胴深度i5um ? r μιη芏^)μηι (版胴鍍 銅_>塗佈—雷射4腐蝕―水洗4鍍鉻研磨)。 接著如第3B圖,將該塑料膜基材2進行水洗塗料3印刷出設計 出之電路’而使水洗塗料3具有預定之一天線圖案21,因此會使今天 線圖案21之位置呈現為鏤空狀態’該水洗塗料3之厚度約略^丨^米 鲁至3微米(Ιμιη至3哗)之間。當然為增加水洗塗料3位於該塑料膜基 材2上之接著強度,本創作在印製水洗塗料3前,可先將一基材前處 理劑(Prime擔佈於職料絲材2上,目此可同萌強町^ = 導電層4接著於該腿膜基材2上之接著強度,由此#顏基^前處 理劑恤啦可咏卩刷水洗塗料3後,再加峨佈在該天線圖案 21,水洗塗料3上。由於該水洗塗料3係具有液分,因此需將該塑料 膜基材2進行乾燥,加以去除水洗塗料3及該塑料膜基材2之 分,且會使該塑料膜基材2形成收卷。 再如第3C圖,將該塑料膜基材Radio Frequency Identifica^ionimD)^^#^ The system that transmits the data to the radio f is very widely used. It has the following advantages: L beaker can be updated: the bar code cannot be changed after printing, and the TAG is not limited. Add, modify, and delete data stored in the RFID TAG. / Convenient data reading: The bar code reader needs to be at a close distance and there is no object to block, so that (4) light can be shot on the bar code. At still mG, as long as it is within the range of the wire wave, the signal can be transmitted. - 3) The capacity of the stored data is large: the capacity of the 1D barcode is ubiquitous; the maximum capacity of the 2D barcode can be stored 2 to 3 characters; the maximum amount of the RpID TAG is up to (4) Qingru. 4, Reusable use · Bar code often ends with the end of the life of the product; cell d can be used repeatedly because its data can be updated. ❿· 5· can read several data at the same time: bar code reader—only one bar code can be read at a time, and the RFID TAG recognizer can recognize and read 1 〇 TAG at the same time. 6. Security • RFID TAG reading is password-protected, and the first-thickness security protection measures make it difficult to forge and change. Therefore, Wal-Mart, the world's largest retail leader, started the wireless identification system _〇 pilot test from January 1, 2005; the US Department of Defense, Metro (Germany's largest supermarket chain), Bestbuy (USA) Electronic product retail giants have also asked their suppliers to lead or conduct RFID-related experiments. It is also estimated that RFID will reach more than US$3 billion in the next year, and will use US$2.2 billion in 2-6 years. 5 Label on the M298237. ############################################################################################################ A schematic view of the side view. The well-known soft copper plate system is based on poly-i-imine p pi (pi) enamel, and the two sides are coated with an adhesive (her _) 12, each of which is coated with a layer of copper ^ 13 ' The method produces a traditional high-cost soft copper wire plate (Μα), and the copper wire is formed into a conductive antenna shape structure. However, due to the high cost of raw materials and the complicated process procedures, the unit cost is high, and it is not suitable for rapid mass production. In addition, the wastewater of the vocational students also (4) Guan Zao Zao Danger #, shouting wastewater will also cost a considerable amount of cost. _Process cost, capacity efficiency and flexibility record can not be balanced, under the theme of reducing = cost to expand market acceptance, replacing the printing vacuum electric mine washing antenna technology developed by the traditional raw materials and the side copper box substrate with expensive manufacturing process, It can significantly reduce costs and meet market demand and trends, which will be the way to achieve advantages. And I hope that the technology of making tag antennas can be extended to other butterflies. [New content] The purpose of this creation is to provide a kind of conductive antenna structure, which is made of plastic film Lu as the substrate plus grade and water washing method, in addition to the process cost can be effectively reduced, the productivity efficiency is improved, More production flexibility. The secondary purpose of this creation is to provide a conductive antenna structure, which is suitable for industrial automation and high efficiency, and the conductive antenna structure has good flexibility, light, thin, short and small. Another object of the present invention is to provide a conductive antenna structure, which can be used for a circuit pattern 'which can be applied to a radio frequency such as Gaga, and a flexible printed circuit board such as Flexile Printed Circuit (FPC). Conduction circuit. In order to achieve the above purpose, the present invention provides a conductive antenna structure comprising: a 6 M298237 plastic film substrate and a conductive antenna, the plastic difficult material is made of poly materials (pET), and the conductive antenna is The conductive material is made to be connected to the surface of the plastic film substrate, and the conductive antenna has a predetermined first thickness. In order to enable your review committee to have a further understanding and understanding of the features, purposes and functions of this creation, please follow the detailed description of the drawings as follows: [Implementation] Please refer to Figure 2 Conductive Antenna Structure Preferred Embodiment The side view structure is not intended to be: the conductive antenna structure includes: a plastic film substrate 2 and a conductive antenna 5, the plastic film substrate 2 is made of a polyacetate material (pET). The second thickness is between about 6 micrometers and 188 micrometers to about 188 mm, and the conductive antenna 5 is the conductive layer 4 made of a conductive material on the antenna pattern 21, and the conductive antenna is connected to the plastic film. On the surface of the substrate, the first thickness is above (U micron (01 μm)). 凊 Refer to Figure 3 to the first figure, which is the intention of the creation of a conductive antenna. Item 3A, the method of the present invention, the method of the present invention, is to provide a mask substrate 2, which is made of Polyethylene Terephthalate (PET). _ PET plastic has the following characteristics, so it is selected as one. With transparency 8: good resistance and good insulation, and high transparency. 2 plastic PET lion (four), replace the safety of the predecessor of pvc (polyvinyl chloride) /. Recyclable and complete: PET flap can be recycled processing Man-made fiber, or two plastic knee products, is the most regenerative value in plastic. 4. Light weight, impact resistance, no 188 ^ film, material 2 has - the thickness: 1 'the second thickness 1 about 6 Micron to micro (6 to 188 (four). This is a better design, will design a circuit into the 7 M298237 gravure plate making operation, and commonly used gravure plate making operations, the method is divided into three types: 丨 · engraving plate, version 胴Depth 30μιη to 80μιη (Version 铜钟铜-磨磨-Engraving_录|夂-磨磨) 2 Corrosion plate making, plate 胴 depth 15μιη to 80μιη (plate 胴 胴 copper-> Coating 4 exposure ~ ^ 腐余洗洗 - chrome plating - Grinding). 3. Laser plate making, plate depth i5um ? r μιη芏^) μηι (plate copper plating _ > coating - laser 4 etching - washing 4 chrome grinding). Then as shown in Figure 3B, The plastic film substrate 2 is subjected to a water-washing paint 3 to print a designed circuit' 3 has a predetermined one of the antenna patterns 21, so that the position of the line pattern 21 is presented as a hollow state. The thickness of the water-washed paint 3 is approximately between 丨^ 米 鲁 and 3 micrometers (Ιμιη to 3 哗). Of course, an increase The subsequent strength of the water-washing paint 3 on the plastic film substrate 2, before the printing of the water-washing paint 3, a substrate pre-treatment agent (Prime is carried on the wire 2, which can be the same)萌强町^ = the subsequent strength of the conductive layer 4 on the leg film substrate 2, whereby the #颜基^ pretreatment agent can be brushed and washed, and then added to the antenna pattern 21 , wash the paint on the 3rd. Since the water-washable paint 3 has a liquid component, the plastic film substrate 2 needs to be dried to remove the water-washable paint 3 and the plastic film base material 2, and the plastic film base material 2 is formed into a roll. The plastic film substrate is further as shown in FIG. 3C.

_汾有电殿,便琢天線圖案 製成太:/上汉有一導電層4 ’該導電層4為銅材質或紹材質所 ^ ί佳實施射,欲進行上該導電層4前,先將該塑料膜 L祕進仃•處理(C纖a) ’使該天線_ 21及水洗塗料3表面產 t 處理是_種「電擊」處理,它造成被印體的表面具 與誘電空氣噴嘴產生電擊,它們 ::皮刀,地 -〇-〇〇〇 子加速衝向正極,電晕.處理就是由這密集且高能量 、 的作用。廷些離子藉由電擊和滲透進入被印體的表面 8 M298237 破壞其分子結構,進而將被處理的表面分 擊侵,表面,以至於增加被印體表面_著能力。° ° b ’藉著離子電 最後如第3D圖,將該塑料膜基材2進 該塑料膜基材2相分離,且該導電層4位於該天線 f塗料3與 預定之-第-厚度tl之導電天線,其中較佳者^第一厚度=具= ^米|^1μΙΏ)1 上。本創作較佳實施例中,再將完成之該塑ΐ膜美材2 料騎4縣轉麟材之溶嫩分,且該^膜 圍利用較佳實施例詳細說明本創作,而非限制本創作的範 在’林麟本_騎神和細。綜上所 ^ 越性,誠已符合專概帽規__利要/ …月貝審查委員惠予審視,並賜准專利為禱。 【圖式簡單說明】 ^囷八係為餐知軟性銅箔基板結構側視示意圖。 • ^圖為本創作的可導電天線結構較佳實施例側視結構示意圖。 弟圖至第圖係為本創作可導電天線製造方法較佳實施例側視結 構流程示意圖。 【主要元件符號說明】 11〜聚酿亞胺 12〜接著劑 13〜銅箔 2〜塑料膜基材 21〜天線圖案 9 M298237 3〜水洗塗料 4〜導電層 5〜導電天線 t〜第二厚度 tl〜第一厚度_ 汾 电 电 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The plastic film L is secretly processed and processed (C fiber a) 'The surface of the antenna _ 21 and the wash paint 3 is treated by a kind of "shock" treatment, which causes the surface of the printed body to be electrically shocked with the electric air nozzle. They:: Knife, ground-〇-〇〇〇子 accelerates toward the positive pole, corona. Treatment is caused by this dense and high energy. Some of the ions are destroyed by electric shock and penetration into the surface of the substrate. 8 M298237 destroys its molecular structure, thereby invading the surface to be treated, so as to increase the surface of the printed body. ° ° b 'by ionization, finally as shown in Figure 3D, the plastic film substrate 2 is phase-separated into the plastic film substrate 2, and the conductive layer 4 is located in the antenna f coating 3 and a predetermined - first thickness tl The conductive antenna, wherein the preferred one is the first thickness = ^ = ^ m | ^ 1 μ ΙΏ) 1 . In the preferred embodiment of the present invention, the finished plastic film material material 2 is used to ride the melting and tendering points of the four counties, and the film surround uses the preferred embodiment to explain the creation in detail, instead of limiting the present invention. The fan of creation is in 'Lin Lin Ben _ riding the god and fine. In summary, the more the sex, the Cheng has been in line with the general hat rules __ 利要 / ... the monthly review committee to give a review, and grant the patent as a prayer. [Simple description of the figure] ^囷八系 is a side view of the structure of the flexible copper foil substrate. • Figure is a schematic side view of a preferred embodiment of a conductive antenna structure. The figure to the figure is a schematic diagram of the side view structure of the preferred embodiment of the method for manufacturing a conductive antenna. [Description of main components] 11~ Polyimine 12~Adhesive 13~ Copper foil 2~Plastic film substrate 21~Antenna pattern 9 M298237 3~Washing paint 4~ Conductive layer 5~ Conductive antenna t~Second thickness tl ~ first thickness

Claims (1)

M298237 九、申請專利範圍: 1. 一種可導電天線結構,其係包括有: 一塑料膜基材’其係為雜材料(PET)所製成;以及 導電天線’其係為導電材f所製成,連接於該㈣膜基材表面 上,且該導電天線具有預定之一第一厚度。 丨.如申請專利範圍第丨項所述之可導電天線結構,其巾該塑料膜基材 具有一第二厚度,該第二厚度約在6微米至188微米 188/zm)之間。 L如申请專利乾圍第1項所述之可導電天線結構,其中該第一厚 0.1 微米(0.1/zm)以上。M298237 Nine, the scope of application for patents: 1. A conductive antenna structure, comprising: a plastic film substrate 'made of a hetero-material (PET); and a conductive antenna 'made by a conductive material f And connected to the surface of the (four) film substrate, and the conductive antenna has a predetermined first thickness. The conductive antenna structure of claim 2, wherein the plastic film substrate has a second thickness, the second thickness being between about 6 microns and 188 microns and 188/zm. L. The electrically conductive antenna structure of claim 1, wherein the first thickness is 0.1 micron (0.1/zm) or more.
TW95203283U 2006-02-27 2006-02-27 Structure of electrically conductive antenna TWM298237U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW95203283U TWM298237U (en) 2006-02-27 2006-02-27 Structure of electrically conductive antenna
JP2006006503U JP3126333U (en) 2006-02-27 2006-08-10 Conductive antenna structure
DE200620016626 DE202006016626U1 (en) 2006-02-27 2006-10-30 Conducting antenna arrangement used as a radio frequency antenna comprises a plastic film substrate made from polyethylene terephthalate and a conducting antenna made from a conducting material and applied to the surface of the substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95203283U TWM298237U (en) 2006-02-27 2006-02-27 Structure of electrically conductive antenna

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TWM298237U true TWM298237U (en) 2006-09-21

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Country Link
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JP3126333U (en) 2006-10-19
DE202006016626U1 (en) 2007-02-08

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