JP3124077B2 - Electronic component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component at a predetermined position on a circuit board by sucking the electronic component with a suction nozzle.

[0002]

2. Description of the Related Art An example of a conventional electronic component mounting apparatus will be described with reference to FIG. In FIG. 6, reference numeral 31 denotes a rotary table which is intermittently rotatable. A plurality of rods 32 are arranged around the rotary table at equal intervals at an intermittent rotation pitch so as to be able to move up and down. Is provided. On the turntable 31, a mechanical valve 34 for turning on / off a vacuum circuit for each suction nozzle 33 is provided. In addition, a component supply unit 35 is provided, in which a plurality of component supply means 36 are provided, and a desired electronic component in the component supply means 36 is supplied to a component suction position by the suction nozzle 33. On the other hand, a circuit board 37 on which electronic components are to be mounted is fixed on an XY table 38, and a predetermined electronic component mounting position on the circuit board 37 is set to a component mounting position by the suction nozzle 33 on the XY table 38. It is configured to correspond.

[0003]

In recent years, the mounting of minute electronic components has been increasing. In this case, since the opening of the suction nozzle 33 is small, clogging occurs due to dust or an adhesive. In the electronic component mounting apparatus configured as described above, the mounting operation is interrupted and the suction nozzle 33 is stopped.
Cleaning frequency has been increasing, and there has been a problem that the operating rate of mounting is reduced. Although a cleaning device is installed in order to solve such a conventional problem, a further problem has arisen that a liquid or the like in the cleaning device is scattered due to vibration during supply of electronic components.

In view of the above problems, the present invention does not cause clogging of a suction nozzle even when a minute electronic component is mounted, ensures a high operation rate, and is not affected by vibration during supply of the electronic component. The purpose is to provide.

[0005]

An electronic component mounting apparatus according to the present invention is provided.
The unit is installed on a movable table different from the movable table in the parts supply section.
Can be driven to the component supply position independently of the component supply unit
The nozzle is provided with an efficient nozzle cleaning device.

[0006]

According to the electronic component mounting apparatus of the present invention, the cleaning liquid can be driven to the component supply position independently of the component supply section.
Since the nozzle cleaning device is located,
The suction nozzle can be cleaned dynamically, and
Can reduce the number of stoppages when mounting small electronic components.
The operating rate of the equipment can be greatly improved, and
Scattering of the cleaning liquid due to the influence of vibration during supply can be reduced, and the load can be reduced.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component mounting apparatus according to one embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a partial sectional view of a main part of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a schematic diagram of the electronic component mounting apparatus of the present invention, and FIG. FIG. 4 is a perspective view of a movable device.
Is an enlarged view of a main part of another movable device of the movable base of the present invention, and FIG. 5 is a sectional view of the ultrasonic cleaning device of the present invention.

In the figure, reference numeral 1 denotes a rotary table, which is intermittently driven by an index unit 2. A plurality of mounting heads 3 are arranged around the rotary table 1 at equal intervals at an intermittent rotation pitch. A suction nozzle 4 for sucking an electronic component is provided at a lower end of the mounting head 3. Each mounting head 3 is supported by an elevating guide 5 so as to be able to move up and down, and is engaged with a cylindrical cam 6 via a cam follower 7, so that the vertical position of the mounting head 3 is regulated according to each rotation position of the turntable 1. I have. The portion of the cylindrical cam 6 shown in FIG. 2 corresponding to the electronic component suction position A and the electronic component mounting position B is constituted by a vertically movable slider 8.
Is engaged with the elevating cam lever mechanism 9, and the mounting head 3 is moved up and down when the electronic component is sucked and mounted.

Reference numeral 10 denotes a component supply unit, and reference numeral 11 denotes an XY table which can arbitrarily position the circuit board 12. Parts supply unit
In 10, a large number of component supply means 15 are installed on one of at least two or more movable tables 14 that can move along the guide rail 13 and be positioned at an arbitrary position. In addition, movable table 14
A nozzle cleaning device 16 including an ultrasonic cleaning device 16a and a drying device 16b is installed on the other movable table 14b.
Each of the movable tables 14a and 14b is provided with a nut 18 screwed to the guide rail 13. A pinion 19 is fitted and fixed to the outer periphery of the nut 18, and a drive gear 20 meshing with the pinion 19 is attached to an output shaft of a drive motor 21 so as to be driven to rotate.

As shown in FIG. 4, when a drive motor 22 having a rotor 23 composed of a hollow shaft is used, and a nut 18 is fixed to the inner periphery of the rotor 23, a compact and drive system can be obtained. Inertia can be reduced.

The nozzle cleaning device will be described with reference to FIG. When the electronic component mounting device is performing the mounting operation, the cleaning liquid is not contained in the ultrasonic cleaning tank 24. When the electronic component mounting device switches from the mounting operation to the cleaning operation, the nozzle cleaning device 16 moves to the electronic component suction position. After confirming that the cleaning liquid has moved to the predetermined position, the cleaning liquid is supplied from the cleaning liquid tank 25 to the ultrasonic cleaning tank 24 using the supply pump 26. that time,
It is confirmed by the liquid level sensor 27 whether or not the constant supply amount has been reached. The ultrasonic cleaning tank 24 can be moved up and down by an elevating device 28, and at the time of cleaning, an ultrasonic generator 29 is activated and cleaning is started.

Next, the operation will be described. The rotary table 1 rotates and the mounting head 3 stops at the electronic component suction position A.
The electronic component is sucked by the suction nozzle 4, and the suction nozzle 4 is lowered at a predetermined position, and is mounted on the positioned circuit board 12.

In the process of mounting such electronic components,
The ultrasonic cleaning device 16a is moved to the electronic component suction position A every suitable number of times of mounting or every time a suitable number of microelectronic components are mounted, and the mounting head 3 is lowered similarly to the suction operation.
At this time, the air of the suction nozzle 4 is stopped, and the component supply unit 10 is evacuated. When the suction nozzle 4 moves down, the ultrasonic cleaning tank 24 also moves up. After checking with the liquid level sensor 27 whether a predetermined amount of the cleaning liquid has been supplied, ultrasonic cleaning is started. After the cleaning, the suction nozzle 4 is lifted, and a strong blow is performed so as to blow off dust or cleaning liquid that could not be removed. After cleaning all or corresponding nozzles, each nozzle is dried. After confirming the completion of the cleaning, the cleaning liquid is discharged from the ultrasonic cleaning tank 24.

With the above, the cleaning operation is completed, the component supply unit returns to the origin, and the mounting operation is restarted.

As described above, the electronic component mounting apparatus of the present invention
According to this, the component supply means attached to the movable base
A component supply unit that supplies components by positioning them at a supply position;
Place the circuit board that receives the product in the horizontal plane according to the mounting position
Attach to XY table and rotary table to move with
Take out the part at the part supply position of the part supply section
A part on the circuit board positioned by the XY table
Electronic component mounting device consisting of a suction nozzle for mounting components
And the part is installed on a movable base different from the movable base and
A part that can be driven to the component supply position independently of the
A slush cleaning device (16) is provided to clean the suction nozzle.
Supply the nozzle cleaning device with the parts when needed
To the cleaning liquid in the cleaning tank of the nozzle cleaning device.
By cleaning the suction nozzle with
It is possible to reduce the scattering of the cleaning liquid held by the
Clean the suction nozzle with the nozzle cleaning device at the right time
This can prevent the clogging of the suction nozzle from occurring,
Stoppage of the equipment due to clogging can be reduced, and nozzle cleaning
Since the cleaning device can be driven independently of the parts supply unit,
Lightweight, easy to drive, when mounting small electronic components
Can significantly improve the operation rate of the device.

[Brief description of the drawings]

FIG. 1 is a partial sectional view of a main part of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view of an electronic component mounting apparatus according to the present invention.

FIG. 3 is a perspective view of a movable device of a movable base of the electronic component mounting device of the present invention.

FIG. 4 is an enlarged view of a main part of another movable device of the movable base of the present invention.

FIG. 5 is a sectional view of the ultrasonic cleaning apparatus of the present invention.

FIG. 6 is an overall perspective view of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 4 Suction nozzle 10 Component supply unit 12 Circuit board 14 Moving table 15 Component supply means 16a Ultrasonic cleaning device 16b Drying device 16 Nozzle cleaning device

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naomi Nishi 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-34999 (JP, A) JP-A-2- 170600 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (1)

(57) [Claims] 1. A component supply means mounted on a movable base.
Component supply unit that supplies components by positioning them at the component supply position
And the circuit board that receives the components
The XY table to be moved in the plane and the rotary table
The part at the part supply position of the part supply
And the circuit board positioned by the XY table
Electronic component mounting consisting of a suction nozzle that mounts components on a board
An apparatus, which is installed on a movable table different from the movable table.
Can be driven to the component supply position independently of the component supply unit
Equipped with an efficient nozzle cleaning device, it is necessary to clean the suction nozzle.
When it becomes necessary, the nozzle cleaning device is
The cleaning liquid in the cleaning tank of the nozzle cleaning device.
Electronic component mounting configured to clean the suction nozzle
apparatus.