JP3123199U - Holding mechanism for LED chip - Google Patents

Abstract

A pressing mechanism for firmly pressing an LED chip against a base is provided.
A pressing mechanism that includes pressing means and firmly presses an LED chip against a base. The pressing means has two parallel metal plates 33. The metal plate extends integrally from the top of the base and is disposed on the two sides of the LED chip. The metal plate also includes a first pin member connected to the base portion and a second pin member extending in parallel on the base portion. The separation distance between the press plate and the base is slightly smaller than the thickness of the LED chip. According to another preferred embodiment of the invention, the press plate is a press clip. The press clip has a substantially L-shaped connecting end and a substantially U-shaped floating end. According to still another preferred embodiment of the present invention, the holding mechanism has two screw members for fixing the LED chip to the base with respect to the two radial sides of the LED chip.
[Selection] Figure 1

Description

  The present invention relates to a structure of an LED lamp, and more particularly to a connection structure for an LED and a heat dissipation base thereof.

  Conventional tungsten lamps have the disadvantages of high power consumption and fast battery consumption. In addition, waste batteries are also a threat to the environment. Thus, light-emitting diodes (LEDs) that are compact in size and have low power consumption are candidates for general lighting and other illumination applications such as traffic lights, torches or advertisements.

  However, LEDs are generally operated at room temperature due to their semiconductor properties. Heat dissipation is therefore a major problem for LEDs. In conventional LED devices, the LED is typically in contact with the base, and the heat generated by the LED is heat exchanged with the outside environment via the base.

  FIG. 9 shows a conventional LED and its circuit board. The lamp stage 50P is arranged with a plurality of base portions 30P. Each of the base portions 30P is arranged with the LED chip 10P. Moreover, tin paste is applied between the base 30P and the LED chip 10P, increasing the contact area between them. Furthermore, the heat of the LED chip 10P can be dissipated via the base 30P. Two pin members 11P extend radially from the LED chip 10P. Therefore, it is possible to operate the LED chip 10P by soldering the lead wire (wire) 20P to the pin member 11P and supplying power via the lead wire 20P. Furthermore, the LED chip 10P is also soldered to the base 30P.

  LED10P which concerns on a prior art is fixed by soldering conducting wire 20P. As shown in FIG. 9, when the LED chip 10P moves or vibrates, the plurality of LED chips 10P connected by the conductive wire 20P are exposed to a tensile force (tension).

  This results in the following: 1. The LED chip 10P is detached from the base 30P, and the contact area is reduced. 2. Since the contact area between the LED chip 10P and the heat generated by the LED chip 10P cannot be completely transferred to the base 10P, the illumination efficiency of the LED chip 10P is reduced.

  The present invention has been made to solve the problems associated with the above-described prior art, and an object thereof is to provide a pressing mechanism for firmly pressing an LED chip against a base.

In order to achieve the above object, the present invention
A pressing mechanism for firmly attaching the LED chip to the heat dissipation base,
base,
An LED chip attached to the base, and
It is a pressing mechanism that is disposed on the base and has pressing means for pressing the LED chip against the base.

  According to the present invention configured as described above, it is possible to provide a pressing mechanism for firmly pressing the LED chip against the base.

  The features of the invention believed to be novel are set forth with particularity in the appended utility model registration claims. The present invention, however, will best be understood by reference to the following detailed description, which, taken in conjunction with the accompanying drawings, describes a specific example of an embodiment of the invention.

  1 is an exploded perspective view of a preferred embodiment 1 according to the present invention, FIG. 2 is a perspective view of a preferred embodiment 1 according to the present invention, FIG. 3 is a sectional view of FIG. 1, and FIG. FIG.

  The present invention discloses a pressing mechanism for firmly attaching an LED chip to a base for heat dissipation. With reference to FIGS. 1 and 2, the mounted (packaged) LED chip 10 is pressed by pressing means such as a press plate 33 and attached to the base 30. The LED chip 10 has a circular plate shape and includes two pin members 11. The pin member 11 extends radially outward and is connected to an external power source. The base 30 has a circular heat dissipation area 31 corresponding to the LED chip 10 and in contact with the LED chip 10. A finned plate or another heat dissipation unit (not shown) is provided below the base 30 to increase heat exchange efficiency.

  Referring also to FIGS. 1 and 2, two press plates 33 are arranged in parallel on the two sides of the LED chip 10. The press plate 33 is a metal plate that integrally extends from the top side of the base 30. The press plate 33 includes a first pin member 331 that is in contact with the base portion 30, and a second pin member 333 that extends above the base portion 30 and is parallel to the base portion 30. As shown in FIG. 2, the LED chip 10 can be pressed against the base 30 by the second pin member 333.

  Referring to FIGS. 3 and 4, the second pin member 333 is located on the base 30 and is parallel to the base 30, and a separation distance between the second pin member 333 and the base 30. Is h. Further, the LED chip 10 has a thickness l, and the separation distance h is slightly smaller than the thickness l. Furthermore, the press plate 33 is preferably formed from a metal having elasticity. Therefore, it is possible to increase the separation distance between the second pin member 333 and the base portion 30 by extending the press plate 33 outward. Therefore, the LED chip 10 can be disposed between the press plate 33 and the base 30.

  In other words, the LED chip 10 can be inserted into the gap between the second pin member 333 and the base 30. The elastic force of the press plate 33 is directed toward the base 30. Therefore, the LED chip 10 can be attached to the heat dissipation area 31 by the elastic force of the press plate 33.

  FIG. 5 is a perspective view of a preferred embodiment 2 according to the present invention. The first pin member 331 of the press plate 33 is disposed in the radial direction (diagonal direction) of the LED chip 10. The position and shape of the press plate 33 can vary as long as the press plate 33 can provide at least one pressing point and pressing area. As shown in FIG. 2, the contact surface 335 of the press plate 33 that is in contact with the LED chip 10 is a pressing area according to the preferred embodiment 1.

  FIG. 6 is a perspective view of a third preferred embodiment according to the present invention. In the preferred embodiment 1 shown in FIG. 1, the pressing means is a press plate 33 and is integrated with the base 30. In the preferred third embodiment shown in FIG. 6, the pressing means is a press clip 35. The press clip 35 has a substantially L-shaped connecting end 351 and a substantially U-shaped floating end 353A. The press clip 35 is coupled to the base 30 by fixing the coupling end 351 to the base 30 by a screw member 355. The floating end 353 </ b> A is disposed on the base 30 and floats on the base 30. Similarly, the press clip 35 is formed from a material having elasticity. Therefore, it is possible to have close contact with the heat dissipation area 31 by pressing the LED chip 10 against the base 30.

  FIG. 7 is a perspective view of a preferred embodiment 4 according to the present invention. The floating end portion 353B is an annular ring, and is connected to the base portion 30 with respect to two sides in the radial direction by fixing the connection end portion 351 to the base portion 30 using a screw member 355. The floating end portion 353 </ b> B and the floating end portion 353 </ b> A according to Embodiment 3 have a surface in contact with the LED chip 10. Therefore, the LED chip 10 can effectively contact the base 30 and achieve a target heat dissipation effect.

  FIG. 8 is a perspective view of a preferred embodiment 5 according to the present invention, in which two screw members 37A are used to fix two sides of the LED chip 10 in the radial direction (opposing direction). Furthermore, the base 30 has two screw holes 37B corresponding to the screw members 37A, and the LED chip 10 is fixed to the base 30 by engaging the screw members 37A with the screw holes 37B. . Therefore, the LED chip 10 can be brought into intimate contact with the base 30.

  As described above, the present invention provides a pressing mechanism for the LED chip and its base, in which the LED chip is firmly attached to the base and the problem encountered by the LED according to the prior art is encountered. It can be solved.

  The present invention also provides a contact structure with good heat dissipation for LEDs. Therefore, the heat generated by the LED chip can be quickly transferred to the base, and the rate of heat exchange can be increased. Furthermore, a pressing mechanism is provided to firmly attach the LED chip to the base.

  Therefore, the present invention provides a pressing mechanism for firmly pressing the LED chip against the base. The base has a circular heat dissipation area. The circular heat dissipation area is located in the center of the base and is in contact with the LED, and therefore transfers the heat of the LED chip to the outside. In one aspect of the present invention, the pressing mechanism is a metal press plate that integrally extends from the upper side of the base. The press plate includes a first pin member connected to the base portion and a second pin member extending on the base portion in parallel with the base portion. The separation distance between the press plate and the base is slightly smaller than the thickness of the LED chip. Therefore, the LED chip can be firmly fixed to the base.

  In another aspect of the present invention, the press plate is a press clip. The press clip has a substantially L-shaped connecting end portion and a substantially U-shaped floating end portion, and the floating end portion floats on the base portion and fixes the LED chip. In still another aspect of the present invention, the pressing mechanism has two screw members for fixing the LED chip to the base with respect to two radial sides of the LED chip.

  While the present invention has been described in terms of a preferred embodiment, it is understood that the invention is not limited to the details thereof. Various substitutions and variations have been suggested in the foregoing description and others will occur to those skilled in the art. Accordingly, all such substitutions and modifications are intended to be included within the scope of the appended utility model registration claims. That is, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims for utility model registration.

1 is an exploded perspective view of a preferred embodiment 1 according to the present invention. 1 is a perspective view of a preferred embodiment 1 according to the present invention. It is sectional drawing of FIG. FIG. 3 is a cross-sectional view of FIG. 2. It is a perspective view of preferable Embodiment 2 which concerns on this invention. It is a perspective view of preferable Embodiment 3 which concerns on this invention. It is a perspective view of preferable Embodiment 4 which concerns on this invention. It is a perspective view of preferable Embodiment 5 which concerns on this invention. It is a perspective view which shows LED which concerns on a prior art, and its circuit board.

Explanation of symbols

10. LED chip,
11. Pin member,
30 .. Base,
31 .. Heat dissipation area,
33..Press plate,
35. Press clip,
37B ... Screw hole,
37A ... Screw member,
331 .. First pin member,
333 .. second pin member,
335..Contact surface,
351..Connection end,
353A, 353B ... Floating end,
355 .. Screw member,
h.
l ... Thickness.

Claims (18)

A pressing mechanism for firmly attaching the LED chip to the heat dissipation base,
base,
An LED chip attached to the base, and
A pressing mechanism that is disposed on the base and has a pressing means for pressing the LED chip against the base.   The pressing mechanism according to claim 1, wherein the pressing means is a press plate.   The pressing mechanism according to claim 2, wherein the press plate is a plate extending upward from the base portion.   The pressing mechanism according to claim 3, wherein the press plate includes a first pin member connected to the base portion and a second pin member extending in parallel on the base portion.   The pressing mechanism according to claim 4, wherein the second pin member is substantially parallel to the base portion.   The pressing mechanism according to claim 5, wherein a distance between the press plate and the base is slightly smaller than a thickness of the LED chip.   The pressing mechanism according to claim 1, wherein the pressing means is a press clip.   The pressing mechanism according to claim 7, wherein the press clip has a connecting end portion and a floating end portion, and the connecting end portion is connected to the base portion.   The pressing mechanism according to claim 8, wherein the connecting end portion is substantially L-shaped.   The pressing mechanism according to claim 8, wherein the floating end is substantially U-shaped.   The pressing mechanism according to claim 8, wherein the floating end portion is substantially annular.   The pressing mechanism according to claim 9, wherein the connecting end portion is fixed to the base portion by a screw member.   The pressing mechanism according to claim 8, wherein the floating end portion extends in parallel on the base portion.   The pressing mechanism according to claim 1, wherein the pressing unit includes two screw members.   The pressing mechanism according to claim 14, wherein the base portion has two screw hole portions.   The pressing mechanism according to claim 15, wherein two end portions of the LED chip are fixed by the screw member, and the screw member is engaged with the screw hole portion.   2. The LED chip according to claim 1, wherein the LED chip has a circular plate shape and includes two pin members extending radially outward, and the two pin members are connected to an external power source. Holding mechanism.   The pressing mechanism according to claim 3, wherein the base has a circular heat dissipation area for contacting the LED chip and transferring heat from the LED chip to an external environment.

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