JP3121910U - In-mold label and in-mold label container - Google Patents

Abstract

An in-mold label provided with an IC tag, which can protect the IC tag from a high-temperature and high-pressure environment during molding of a molded body.
An in-mold label 20 is inserted into a mold 60 when a molded body 10 is molded, and forms a part of the surface of the molded body to be molded. The in-mold label has a surface resin sheet 30 in which one surface 32a forms part of the surface of the molded body, an IC tag 40 disposed on the other surface side of the surface resin sheet, and the surface And a heat insulating protective sheet 50 disposed so as to sandwich the IC tag with the resin sheet. The heat insulating protective sheet 50 is a sheet that covers the IC tag and has a heat insulating function.
[Selection] Figure 1

Description

  The present invention relates to an in-mold label that is inserted into a mold at the time of molding a molded body and forms a part of the outer surface of the molded body, and more particularly includes an IC tag and the molded IC tag. The present invention relates to an in-mold label that can be protected from a high temperature and high pressure environment during molding.

  For example, manufactured parts or the like are often housed and handled in resin containers (concepts including returnable boxes, containers, pallets, etc.) within or between factories. In this case, it is convenient in handling the container if information on the parts to be stored, for example, the part name, lot number, manufacturer, and the like are displayed on the container. In recent years, it has been tried to use a non-contact IC tag that can easily perform process management, physical distribution management, inventory management, and the like attached to this container.

  However, containers used as returnable boxes or the like are usually recovered and reused after being collected and washed. For this reason, the IC tag that dislikes moisture may be damaged by being washed together with the container. In the first place, the IC tag may fall off from the container if it is simply pasted, and the possibility is remarkably increased by washing the container. For this reason, it is difficult to repeatedly use the IC tag attached to the container, and the use of the IC tag in the container has not been widely spread due to cost problems.

  Based on such points, the present inventors have found that the IC tag and the container can be reused by forming the container using the in-mold label including the IC tag. Also found that the following defects exist. That is, the in-mold label is exposed to a high-temperature and high-pressure resin, but the IC tag is damaged by the high temperature, and the electrical connection of the IC tag is impaired by the high pressure.

  The present invention has been made in consideration of these points, and is an in-mold label provided with an IC tag, which can protect the IC tag from a high-temperature and high-pressure environment during molding of a molded body. The purpose is to provide. Similarly, an object of the present invention is to provide an in-mold label container using an in-mold label provided with an IC tag.

  An in-mold label according to the present invention is an in-mold label that is inserted into a mold at the time of molding a molded body and forms a part of the surface of the molded body to be molded. It arrange | positions so that the said IC tag may be pinched | interposed between the surface resin sheet which will form a part of surface, the IC tag arrange | positioned at the other surface side of the said surface resin sheet, and the said surface resin sheet In addition, the sheet covers the IC tag, and includes a heat insulating protective sheet having a heat insulating function.

  The in-mold label according to the present invention may further include an other-side resin sheet disposed so as to sandwich the IC tag and the heat-insulating protective sheet with the surface resin sheet.

  Alternatively, the in-mold label according to the present invention further includes the other-side resin member arranged so as to sandwich the IC tag and the heat-insulating protective sheet between the surface resin sheet, and the other-side resin member includes at least A recess for accommodating the heat insulating protective sheet may be formed.

  Alternatively, the in-mold label according to the present invention further comprises a thermoplastic resin layer disposed between the surface resin sheet and the IC tag, and the thermoplastic resin layer sandwiches the IC tag between the heat insulating protective sheets. You may make it weld to.

  The in-mold label according to the present invention may further include a drying sheet that is disposed between the IC tag and the heat insulating protective sheet and has a drying function.

  Or in the in-mold label by this invention, you may make it the said heat insulation protective sheet mix the heat insulation material which has a heat insulation function in the dry sheet | seat which has a dry function. In this case, the heat insulating material may be made of at least one of spherical quartz and foamed ceramic (dopamolite).

  Or in the in-mold label by this invention, you may make it the said heat insulation protective sheet mix the drying material which has a drying function in the heat insulation sheet which has a heat insulation function.

  Furthermore, in the in-mold label according to the present invention, at least one of writing aptitude, antifouling function and peeling function may be imparted to the one surface of the top sheet.

  An in-mold label container according to the present invention includes any of the above-described in-mold labels according to the present invention, and the in-mold label forms a part of the surface.

  According to the in-mold label of the present invention, the insulative protection sheet that covers the IC tag from the high-temperature and high-pressure resin is provided. Therefore, by using the in-mold label according to the present invention, the IC tag can be integrally incorporated into the container without impairing the function. In the container thus obtained, it is possible to prevent the IC tag from dropping off and the IC tag from being damaged by washing. For this reason, it is possible to repeatedly use the container while maintaining the function of the IC tag, and thereby it becomes possible to manage the components and the like stored in the container in a multifaceted and efficient manner.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 to 5 are views showing an embodiment of an in-mold label and an in-mold label container according to the present invention.

  1 is a schematic sectional view showing an embodiment of an in-mold label according to the present invention, FIG. 2 is a top view showing the in-mold label shown in FIG. 1, and FIG. 3 is a top view showing an IC tag. FIG. 4 is a schematic sectional view showing an embodiment of the in-mold label container according to the present invention, and FIG. 5 is a view for explaining a method of manufacturing the in-mold label container shown in FIG.

  As shown in FIG. 4, the in-mold label container 10 includes an in-mold label 20 and a container body 12 welded integrally with the in-mold label 20. Such an in-mold label container 10 is used as, for example, a container for storing manufactured parts, a return box, or a container in a factory or between factories. Of these, the in-mold label 20 is inserted into the mold 60 when the in-mold label container (molded body) 10 is molded, and the surface of the in-mold label container 10 to be molded, as will be described in detail later with reference to FIG. Will become part of.

  On the other hand, as shown in FIGS. 1 to 3, the in-mold label 20 includes a surface resin sheet 30 in which one surface 32 a forms a part of the surface of the molded body 10, and the other surface resin sheet 30. A heat insulating protective sheet 50 which is disposed so as to sandwich the IC tag 40 between the IC tag 40 disposed on the side of the surface 32b and the surface resin sheet 30 and covers the IC tag 30, and has a heat insulating function. And. Further, the in-mold label 20 is disposed so that the IC tag 40 and the heat insulating protective sheet 50 are sandwiched between the printing paper 26 disposed between the surface resin sheet 30 and the IC tag 40 and the surface resin sheet 30. The other side resin sheet 36 is further provided.

  Among these, the surface resin sheet 30 and the other side resin sheet 36 have a larger outer shape than the other components in a top view. As shown in FIGS. 1 and 2, the surface resin sheet 30 and the other side resin sheet 36 are welded to each other at the welded portion 22. Thereby, the surface resin sheet 30 and the other side resin sheet 36 cover other components from the surroundings (sides). In addition, the welding method between the surface resin sheet 30 and the other side resin sheet 36 can employ | adopt well-known methods, such as a heat seal and ultrasonic bonding.

  In the present embodiment, the surface resin sheet 30 and the other side resin sheet 36 are the same as a resin (for example, polypropylene or polyethylene) supplied (injected, blown, etc.) into the mold 60 as a material forming the container body 12. Made of resin. As will be described later, at least a part of the surface portion of the surface resin sheet 30 and the other side resin sheet 36 melts and is integrated with the material forming the container body 12. Therefore, the thickness of the surface resin sheet 30 and the other side resin sheet 36 is not particularly limited as long as the integration with the material forming the container body 12 is not hindered, and can be, for example, 0.3 mm.

  Next, the printing paper 26 will be described in detail. The printing paper 26 is made of, for example, synthetic paper. On the surface of the printing paper 26 on the surface resin sheet 30 side, a printing pattern 28 such as characters, figures, symbols, and patterns is printed. In the present embodiment, as shown in FIG. 2, characters such as “component surface” and “lot number” are printed as the printed pattern 28.

  The printed pattern 28 can be visually recognized through the surface resin sheet 30. Moreover, in such embodiment, it is preferable that the one surface 32a of the surface resin sheet 30 is given writing ability. Here, “writing ability” is imparted so that, for example, the characters 24 can be easily written with a pencil or water-based ink and the written characters 24 can be easily erased.

  Next, the IC tag 40 will be described in detail. Here, the IC tag 40 can record and hold information, and information that can read the recorded and held information by communicating in a non-contact state using an external device (reader / writer or the like). It is a holding medium. In addition, there is a system in which new information can be added each time using an external device.

  As shown in FIG. 3, in the present embodiment, the IC tag 40 includes an IC chip 44 having a circuit for enabling communication with a memory for recording information and an external device, and an electrical connection between the IC chip 44 and the IC chip 44. And an antenna conductor 46 that functions as an antenna when communicating with an external device. The antenna conductor 46 is formed on a base material 42, and the base material 42 is made of a resin such as PET.

  The configuration of the IC tag 40 is not particularly limited as long as it has the above-described functions. For example, a known IC tag such as an IC tag available as “Rewritable 2.45 GHz tag” from Japan Information System Co., Ltd. is used. Can do.

  Next, the heat insulation protective sheet 50 will be described in detail. As shown in FIG. 1, the heat-insulating protective sheet 50 in the present embodiment is a sheet-like base material 52 made of a well-known heat-insulating sheet having heat insulating properties such as nipple cardboard, chip board, nonwoven fabric, and polypropylene-based sheet. And a drying material 54 having a drying function mixed in the sheet-like base material 52. The size of the heat insulating protective sheet 50 is such that it can surround the IC tag 40 as shown by a two-dot chain line in FIG. Moreover, the thickness of the heat insulation sheet 52 (heat insulation protective sheet 50) is set so that the IC tag 40 can be protected from a high temperature and high pressure environment when the in-mold label container 10 described later is formed. As such a heat insulating sheet 52, for example, a polypropylene nonwoven fabric having a thickness of 1 mm manufactured by Nippon Vilene Co., Ltd. can be used.

  On the other hand, as the dry material 54, for example, granular silica gel or the like can be used, but other known dry materials can also be used. However, the mixing of the dry material 54 is for preventing the IC tag 40 from being damaged by moisture (moisture). Therefore, the dry material 54 may be omitted if the IC tag 40 can be sufficiently isolated from moisture in the final in-mold label container 10 state.

  Next, a method of forming the in-mold label container 10 using the in-mold label 20 having such a configuration will be described mainly with reference to FIG.

  In this case, for example, as shown in FIG. 5, a mold 60 having a male mold 62 and a female mold 64 that forms a cavity 70 between the male mold 62 is used. As shown in FIG. 5, the cavity 70 has a shape corresponding to the outer shape of the molded body (in-mold label container) 10 to be molded. In the present embodiment, the female die 64 is formed with a gate 72 that communicates with the cavity 70 and supplies molten resin into the cavity 70. Further, the female mold 64 is formed with a suction hole 74 for holding the in-mold label 20 at a desired position in the cavity 70 when the in-mold label container 10 is formed. The suction hole 74 is connected to a vacuum suction machine (not shown).

  When the in-mold label container 10 is molded using such a mold 60, first, the in-mold label 20 is placed in the cavity 70. Specifically, in a state where the male mold 62 and the female mold 64 are separated from each other, the in-mold label 20 is formed so that the surface side resin sheet 30 faces the female mold 64 and the suction holes 74 of the female mold 64 are formed. Place directly above. At the same time, the vacuum suction machine is operated to hold the in-mold label 20 by suction at the position (directly above the suction hole 74). Thereafter, the male mold 62 and the female mold 64 are fitted together to form the cavity 70 between the male mold 62 and the female mold 64. Through such an operation, as shown in FIG. 5, the in-mold label 20 is in a state of being sucked and held toward the wall surface of the cavity 70 so that the surface side resin sheet 30 contacts the wall surface of the cavity. It has become.

  Next, in the state shown in FIG. 5, molten resin is poured from the gate 72 into the cavity 70, and the resin is spread into the cavity 70. At this time, the in-mold label 20 is exposed to a high temperature and high pressure environment. However, according to the in-mold label 20 in the present embodiment, the heat insulating protective sheet 50 that covers the IC tag 40 is arranged on the side where the resin of the IC tag 40 flows. Therefore, for example, even when a molten high-temperature resin of about 300 ° C. comes into contact with the in-mold label 20, the temperature transmitted to the IC tag 40 by the heat insulating function of the heat insulating protective sheet 50 is set to the allowable temperature of the IC tag 40 (for example, 200 ° C) or less. With such a heat insulating function of the heat insulating protective sheet 50, the IC tag 40 can be protected from a high temperature environment. In addition, even if a high pressure is applied to the in-mold label 20 due to the pouring of resin, a part of the applied pressure can be absorbed by the heat insulating protective sheet 50 having an appropriate thickness, and the IC tag The pressure applied to 40 can be made uniform. Therefore, it is possible to prevent the IC tag 40 from being damaged due to the loss of the electrical connection between the IC chip 44 and the antenna conductor 46 or the damage of the IC chip 44 during molding.

  On the other hand, the high-temperature and high-pressure resin melts the exposed portions of the surface resin sheet 30 of the in-mold label 20 and the cavity 70 of the other-side resin sheet 36. Then, after being cooled, the resin fed into the cavity 70 is cured together with the molten part of the surface resin sheet 30 and the other side resin sheet 36. Therefore, the container main body 12 is formed by the resin supplied into the cavity 70, and the in-mold label 20 is welded to the container main body 12. Thereby, the in-mold label container 10 in which the in-mold label 20 and the container body 12 are integrally welded is obtained. The other side resin sheet 36 may be formed of a thermoplastic resin such as a so-called heat seal layer.

  Thus, according to the in-mold label container 10 obtained by using the in-mold label 20 according to the present embodiment, the non-contact type IC tag 40 is incorporated inside the wall surface. Therefore, by using an external device that can communicate with the IC tag 40, the management of the in-mold label container 10 can be performed in a multifaceted and efficient manner.

  For example, when this in-mold label container 10 is used as a returnable box for storing parts and the like, process management of the stored parts and the like using external devices arranged at various passing positions of the in-mold label container 10; Distribution management, inventory management, etc. can be automatically performed. Further, since the IC tag 40 is integrally incorporated in the in-mold label container 10, even if the in-mold label container 10 is cleaned, the IC tag 40 is damaged by moisture, or the IC tag 40 is It is possible to prevent falling off from 12.

  Moreover, according to the in-mold label 20 by this Embodiment, the heat insulation protective sheet is formed by mixing the drying material 54 which has a drying function in the sheet-like base material 52 which consists of a heat insulation sheet which has a heat insulation function. . For this reason, the atmosphere surrounding the IC tag 40 that dislikes moisture can be kept dry. Thereby, it is possible to prevent the IC tag 40 from deteriorating due to moisture. In particular, according to the present embodiment in which the heat insulating protective sheet 50 including the dry material 54 is disposed adjacent to the IC tag 40, such an effect is more remarkably exhibited.

  Furthermore, according to the in-mold label 20 according to the present embodiment, the printing paper 26 on which the printing pattern 28 is printed is disposed adjacent to the surface resin sheet 30. Such a printed pattern 28 can provide a visual effect, and in particular, when the in-mold label container 10 including the in-mold label 20 is used as a return box, the contents from the outside of the container 10. Can also be confirmed.

  Various modifications can be made to the above-described embodiment within the scope of the gist of the present invention. Hereinafter, some modified examples will be described with reference to FIGS. However, some of the modifications described below are merely examples, not all of the modifications that can be applied to the above-described embodiments. Moreover, in the following description, the same code | symbol is attached | subjected to the part which is the same as the embodiment mentioned above, or between the following modifications, and detailed description is abbreviate | omitted.

  In the above-described embodiment, the example in which the sheet-like other side resin sheet 36 is disposed so as to sandwich the IC tag 40 and the heat insulating protective sheet 50 between the front surface resin sheet 30 is shown. Absent. For example, instead of the sheet-like other side resin sheet 36, the other side resin member 37 in which the concave portion 38 that accommodates at least the heat insulating protective sheet 50 shown in FIG. 6 is formed may be used. The other side resin member 37 is made of the same type of resin as the resin that is supplied into the cavity 70 of the mold 60 and forms the container body 12, similarly to the other side resin sheet 36. FIG. 7 shows a modification of the in-mold label 20 formed using the other side resin member 37 as described above. In the example shown in FIG. 7, all the components arranged between the other side resin member 37 and the surface resin sheet 30 are accommodated in the recess 38 of the other side resin member 37. In addition, such other side resin member 37 can be obtained easily and inexpensively by applying a shallow drawing process to a sheet-like resin (for example, the other resin sheet 36).

  Further, in the above-described embodiment, the example in which the printing paper 26 is provided adjacent to the surface resin sheet 30 and the printing pattern 28 is printed on the surface of the printing paper 26 on the surface resin sheet 30 side is shown. I can't. For example, as shown in FIG. 7, the printing paper 26 may be omitted, and a pattern 28 visible from the one surface 32 a side may be formed on the other surface 32 b of the surface resin sheet 30. Further, if necessary, the pattern 28 itself can be omitted.

  Furthermore, in the above-described embodiment, the example in which the writing ability is imparted to the one surface 32a of the surface resin sheet 30 corresponding to the pattern 28 formed on the printing paper 26 has been described, but the present invention is not limited thereto. Instead of writing aptitude or in addition to writing aptitude, an antifouling function and / or a peeling function may be imparted to one surface 32a of the surface resin sheet 30. Here, the provision of the antifouling function means that even if dirt such as oil adheres to one surface 32a, the dirt can be easily removed. On the other hand, the provision of a peeling function means that a seal or the like attached to one surface 32a can be easily peeled off from one surface 32a.

  Furthermore, in the above-described embodiment, the example in which the heat insulating protective sheet 50 is formed by mixing the drying material 54 having the drying function into the heat insulating sheet 52 having the heat insulating function is shown, but the invention is not limited thereto. In the first place, it is possible to omit the drying material 54 as described above. In addition, as shown in FIG. 7, the drying material 54 may be omitted from the heat insulating protective sheet 50 and a separate drying sheet 58 having a drying function may be provided. In the example shown in FIG. 7, the heat insulating protective sheet 50 is composed only of the heat insulating sheet 52. In the example shown in FIG. 7, the dry sheet 58 is adjacent to the IC tag 40 so that the moisture can be removed more reliably from the environment surrounding the IC tag 40. Arranged between.

  Moreover, as shown in FIG. 8, it is also possible to apply the IC tag 40 and the heat insulation protective sheet 50 with respect to the conventional in-mold label 20a. Here, as shown in FIG. 8, the conventional in-mold label 20 a is adjacent to the surface resin sheet 30 in which one surface 32 a forms part of the surface of the molded body, and the surface resin sheet 30. A laminated printing paper 26 and a thermoplastic resin layer 39 laminated adjacent to the printing paper 26 are provided. A printed pattern 28 is formed on the surface of the printing paper 26 facing the surface resin sheet 30. In addition to the conventional in-mold label 20a, the in-mold label 20 shown in FIG. 8 includes an IC tag 40 disposed on the thermoplastic resin layer 39 side of the conventional in-mold label 20a, and a thermoplastic resin layer 39. And a heat insulating protective sheet 50 disposed so as to sandwich the IC tag 40 therebetween. As shown in FIG. 8, in this example, the thermoplastic resin layer 39 is welded to the heat insulating protective sheet 50 at the welding member 22 that directly faces the thermoplastic resin layer 39 without the IC tag 40 interposed therebetween. In the in-mold label 20 using the conventional in-mold label 20a as shown in FIG. 8, when the resin forming the container body 12 has a low softening melting temperature, for example, the resin forming the container body 12 is polystyrene. Suitable for cases.

  In the in-mold label 20 shown in FIG. 8, the heat insulating protective sheet 50 is formed by mixing (mixing) a heat insulating material 57 having a heat insulating function with a dry sheet 56 having a drying function. As the dry sheet 56, a known dry sheet can be appropriately employed. The thickness of the dry sheet 56 (the heat insulating protective sheet 50) is set so that the IC tag 40 can be protected from a high temperature and high pressure environment when the in-mold label container 10 is molded. Specifically, as such a dry sheet 56, for example, an allosheet having a thickness of 1 mm manufactured by Shinagawa Kasei Co., Ltd. can be used. On the other hand, as the heat insulating material 57, for example, spherical quartz, foamed ceramic (dopamolite), or a combination of spherical quartz and foamed ceramic (dopamolite) can be used.

  Furthermore, the shape of the in-mold label container 10 manufactured using the in-mold label 20 is not limited to the shape shown in FIG. 4, and various shapes such as a tray type, a shell type, and a body lid type can be used. Can take. Further, the arrangement position of the in-mold label 20 in the in-mold label container 10 is not particularly limited. For example, the in-mold label 20 is arranged at the bottom of the in-mold label container 10 that cannot be visually recognized. May be.

  As described above, some modified examples related to the embodiment shown in FIGS. 1 to 5 have been described. However, naturally, a plurality of modified examples can be applied in combination as appropriate.

FIG. 1 is a schematic sectional view showing an embodiment of an in-mold label according to the present invention. FIG. 2 is a top view showing the in-mold label shown in FIG. FIG. 3 is a top view showing the IC tag. FIG. 4 is a schematic sectional view showing an embodiment of an in-mold label container according to the present invention. FIG. 5 is a diagram for explaining a method of manufacturing the in-mold label container shown in FIG. FIG. 6 is a perspective view showing the other side resin member used for the in-mold label. FIG. 7 is a schematic sectional view showing a modified example of the in-mold label and showing the in-mold label provided with the other side resin member of FIG. FIG. 8 is a schematic cross-sectional view showing another modification of the in-mold label.

Explanation of symbols

10 In-mold label container (molded body)
20 In-mold label 30 Surface resin sheet 32a One side 32b The other side 36 The other side resin sheet 37 The other side resin member 38 Recess 39 The thermoplastic resin layer 40 IC tag 50 Thermal insulation protective sheet 52 Thermal insulation sheet 54 Drying material 56 Drying sheet 57 Thermal insulation material 58 Dry sheet

Claims (10)

An in-mold label that is inserted into a mold at the time of molding a molded body and becomes a part of the surface of the molded body to be molded,
A surface resin sheet in which one surface forms part of the surface of the molded body;
An IC tag disposed on the other surface side of the surface resin sheet;
An in-mold label comprising: a heat-insulating protective sheet that is disposed so as to sandwich the IC tag between the surface resin sheets and covers the IC tag and has a heat-insulating function. 2. The in-mold label according to claim 1, further comprising a second side resin sheet disposed so as to sandwich the IC tag and the heat insulating protective sheet between the surface resin sheet. The other side resin member arranged so as to sandwich the IC tag and the heat insulating protective sheet between the surface resin sheet,
2. The in-mold label according to claim 1, wherein the other side resin member is formed with a recess for accommodating at least the heat insulating protective sheet. Further comprising a thermoplastic resin layer disposed between the surface resin sheet and the IC tag,
The in-mold label according to claim 1, wherein the thermoplastic resin layer is welded to the heat insulating protective sheet with the IC tag interposed therebetween. The in-mold label according to any one of claims 1 to 4, further comprising a drying sheet disposed between the IC tag and the heat insulating protective sheet and having a drying function. The in-mold label according to any one of claims 1 to 4, wherein the heat-insulating protective sheet is obtained by mixing a heat-insulating material having a heat-insulating function in a dry sheet having a function of drying. The in-mold label according to claim 6, wherein the heat insulating material is at least one of spherical quartz and foamed ceramic. The in-mold label according to any one of claims 1 to 4, wherein the heat insulating protective sheet is obtained by mixing a dry material having a drying function into a heat insulating sheet having a heat insulating function. The in-mold according to any one of claims 1 to 8, wherein at least one of writing suitability, antifouling function, and peeling function is imparted to the one surface of the topsheet. label. An in-mold label according to any one of claims 1 to 9,
The in-mold label container, wherein the in-mold label forms part of the surface.

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