JP2008051885A - Thermocompression bonding label and resin container with ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermocompression bonding label for which the thermocompression bonding label containing an IC tag is surely bonded to a resin container without damaging an IC chip, and a resin container with an IC tag. <P>SOLUTION: The resin container with IC tag has the thermocompression bonding label 3 bonded to a container 5 made of thermosoftening resin in a tightly sealed manner. The thermocompression bonding label comprises an IC chip 12 for storing electronic information, a base material 14 whereon an antenna pattern electrically connected to the IC chip is formed, and a thermocompression layer 18 made of substantially the same material as the container made of thermosoftening resin, and they are laminated in the order of IC chip, base material, and thermocompression layer. A recessed part 56 processed to have a shape capable of housing at least the IC chip is formed on the container made of thermosoftening resin. By applying, in the state wherein at least the IC chip is housed in the recessed part, heat and pressure to the thermocompression layer in the outer part beyond the peripheral part of the base material, the thermocompression label is bonded in a tightly sealed manner to the container made of thermosoftening resin. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a thermocompression label including an IC tag in which electronic information relating to an article or the like is stored, and a resin container with an IC tag to which the thermocompression label is attached.

  It is attached to a plastic return box or a container made of resin, such as a container or cardboard, to manage the distribution history of the article, or to manage the inventory or the entry / exit status of the article. IC tags storing electronic information are widely used. For the attachment of the IC tag to the resin container, a technique such as sticking with an adhesive or heat welding using a thermal activation type adhesive or hot melt is used.

  Since resin containers are excellent in durability, they are repeatedly used after being subjected to a cleaning treatment rather than being used only once. In the mounting method using an adhesive, since the adhesive strength between the resin container and the IC tag is not sufficient, when the resin container with an IC tag is subjected to a cleaning process, the adhesive is attacked by a cleaning liquid or the like. There is a problem that the IC chip is damaged when the cleaning liquid or the like penetrates into the IC tag.

  In the conventional attachment method by attaching, the IC tag is attached to the resin container via an adhesive or the like, and therefore, the IC tag can be easily peeled off from the resin container. There is also a problem that the stored electronic information may be falsified.

  Furthermore, since the IC tag is only attached to the surface of the resin container, the IC tag is raised from the surface of the resin container by an amount corresponding to the thickness of the IC tag. Such protrusion not only impairs the appearance of the resin container, but also causes a problem that when a hard object hits the IC tag, the impact causes damage to the IC chip.

  Furthermore, a label is affixed on the IC tag, and the IC tag is obscured by the affixed label. However, the label is peeled off by repeated cleaning treatment or the label deteriorates with time. There is also a problem that the display on the label becomes unclear.

  Further, in the conventional attachment method by thermal welding, since the resin material different from both the resin container and the IC tag is thermally welded, sufficient adhesive strength cannot be obtained. Furthermore, since the welding temperature is low in hot melt, the hot melt agent is softened and the adhesive strength is lowered when it comes into contact with warm water during washing. Therefore, the conventional heat welding method has a problem in that sufficient adhesive strength is not obtained because the heat welding resin material which is completely different from both the resin container and the IC tag is used.

  As a conventional attachment method by heat welding, a resin layer having heat welding properties is interposed between an IC tag and a packaging material, and the resin layer is joined to the packaging material by heating and softening the resin layer. (For example, see Patent Document 1). In the method of Patent Document 1, since a pair of heated heat welding jigs abut against the IC tag as a whole and high heat and pressing force are applied, the IC chip of the IC tag is considerably damaged. Therefore, there is a problem that the IC chip is damaged.

  Further, as a conventional attachment method by thermocompression bonding, there is a method in which thermocompression bonding is performed with an IC tag sandwiched between a thermoplastic resin sheet and a thermoplastic resin sheet (film) (see, for example, Patent Document 2). . In the method of Patent Document 2, as in the method of Patent Document 1, since the thermocompression bonding member is entirely in contact with the IC tag and high heat and pressing force are applied, the IC chip of the IC tag has a considerable amount. There is a problem that the IC chip is damaged and causes damage to the IC chip.

JP 2002-236896 A JP 2005-263288 A

  Therefore, a technical problem to be solved by the present invention is that a thermocompression label including an IC tag is securely fixed to a resin container without damaging the IC chip and a resin product with an IC tag. Is to provide a container.

Means for solving the problems and their actions and effects

  In order to solve the above technical problem, the thermocompression-bonding label and the resin container with an IC tag according to the present invention have the following characteristics.

That is, the thermocompression bonding label according to the present invention is
An IC chip storing electronic information;
A substrate on which an antenna pattern to which the IC chip is electrically connected is formed, and a thermocompression bonding label hermetically fixed to a thermosoftening resin container,
A thermocompression bonding layer composed of substantially the same material as the thermosoftening resin container is laminated in the order of an IC chip, a substrate and a thermocompression bonding layer,
It is characterized in that it is hermetically fixed to a thermosoftening resin container by applying heat and pressure to the thermocompression bonding layer on the outer part of the outer part of the substrate.

  According to the thermocompression-bonding label having the above-described configuration, the thermocompression-bonding layer composed of substantially the same material as the thermosoftening resin container is provided on the outer side portion of the outer portion of the base material of the IC tag, Heat and pressure are applied to the part and hermetically fixed to the thermosoftening resin container. Although heat welding is performed by a so-called heat sealing method, since the materials of substantially the same material are thermally welded together, the bonding strength is extremely excellent, and in addition, the portion to be thermally welded is the base of the IC tag. Since it is a place away from the IC chip, that is, the outer part of the material, it is possible to prevent the IC chip from being thermally damaged.

  As described above, the thermocompression bonding layer can be directly sealed and fixed to the resin container. However, since the thermocompression bonding layer part is protrusive, a heat resistant transparent resin film is formed on the thermocompression bonding layer. Furthermore, it is preferable that they are laminated.

  In order to impart display characteristics as a label to the thermocompression bonding label, it is preferable to have a display portion between the thermocompression bonding layer and the heat resistant transparent resin film.

  The thermocompression-bonding label is a shallow-drawn tray pack type that is held by a resin tray together with a display medium having a display unit, and the shallow-drawn tray pack portion is housed in a recess of a resin container. With this configuration, it is possible to ensure a stable operation of the IC chip without causing impact or damage to the IC chip.

  The thermocompression-bonding label is a skin pack type that is held by a heat-shrinkable resin film together with a display medium having a display portion, and the skin pack portion is housed in a concave portion of a resin container. With this configuration, the operation of the IC chip can be stably maintained without giving an impact or damage to the IC chip.

  The thermocompression bonding label is a blister pack type that is held by a blister resin sheet together with a display medium having a display portion, and the blister pack portion is accommodated in a recess of a resin container. With this configuration, the operation of the IC chip can be stably maintained without giving an impact or damage to the IC chip.

  As resin containers such as resin returnable boxes, containers and cardboard, olefinic, especially polypropylene-based ones are often used, so that the thermosoftening resin container and the thermocompression bonding layer are made of polypropylene. Yes.

  Below, the thermocompression bonding label 3 with the IC tag 10 which concerns on 1st embodiment of this invention is demonstrated in detail, referring FIG.

  As shown in FIG. 1, the thermocompression bonding label 3 with an IC tag 10 according to the present invention has a configuration in which an IC chip 12 made of a silicon chip is mounted on a substrate 10. The IC chip 12 includes information (for example, manufacturer identification information, production management information, product number information, product characteristic information) related to articles stored in resin containers such as returnable boxes, containers, and cardboard, and information related to containers (for example, Electronic information such as material information, information on the cleaning method and the number of times of cleaning, and delivery destination information. Such an IC chip 12 is an IC chip which is a semiconductor integrated circuit or an LSI chip with a higher degree of integration.

  The base material 14 is made of a material having flexibility or flexibility, for example, a resin material such as polyethylene, polypropylene, polyester, polyamide, or paper.

  An antenna pattern (not shown) is formed on the front surface of the base material 14. The connection terminals of the IC chip 12 are electrically connected to the center side electrode terminals of the antenna pattern. Various antenna patterns can be used depending on the wavelength of the radio wave used. The antenna pattern is formed by printing or transfer using a low-resistance paste containing a conductive filler having conductivity close to that of a conventionally used copper foil.

  A film-like thermocompression bonding layer 18 is attached to the opposite surface (back surface) of the substrate 14 on which the IC chip 12 is mounted, that is, the antenna pattern is formed, via an adhesive. The thermocompression bonding layer 18 as a heat seal is sized and configured to be larger than the base material 14. Therefore, a blank portion 19 of the thermocompression bonding layer 18 exists around the outer portion of the base material 14 attached to the thermocompression bonding layer 18, that is, an outer portion. The blank portion 19 is used for thermocompression bonding with the thermosoftening resin container 5 as a heat sealing allowance.

  The film-like thermocompression bonding layer 18 is made of substantially the same material as the thermosoftening resin container 5 to which the thermocompression bonding label 3 is fixed. As the heat-softening resin container 5 such as a returnable box, a container, or a corrugated cardboard, an olefin type, particularly a polypropylene type one is often used, so that the thermocompression bonding layer 18 is made of polypropylene. The thermosoftening resin container 5 may be made of polyethylene, polystyrene, or polycarbonate. In that case, the thermocompression bonding layer 18 is made of polyethylene, polystyrene, or polycarbonate, respectively, depending on the material of the thermosoftening resin container 5.

  Next, the thermocompression bonding label 3 with the IC tag 10 according to the second embodiment of the present invention will be described in detail with reference to FIG. The difference from the thermocompression bonding label 3 with the IC tag 10 of the first embodiment described above will be mainly described.

  As shown in FIG. 2, in the thermocompression bonding label 3 with the IC tag 10 according to the second embodiment, a heat resistant transparent resin film 22 is attached to the back surface of the thermocompression bonding label 3 with the IC tag 10 of the first embodiment. Has been.

  The heat-resistant transparent resin film 22 is a tough transparent heat-resistant film that has been stretched. For example, polyethylene terephthalate (PET), polypropylene (PP), polycarbonate resin, polyethylene naphthalate (PEN), polyamide resin, hard chloride Made of vinyl. A desired display portion (logo mark or owner display) is formed by the printing ink 24 on the front surface of the heat-resistant transparent film 22 (the surface on the IC tag 10 side). The heat-resistant transparent film 22 having a display part is affixed to the back surface of the thermocompression bonding label 3 via a urethane-based dry laminating adhesive. For example, an unstretched polypropylene (CPP) film with a thickness of 40 microns is dried via PET (polyethylene terephthalate) with a thickness of 36 microns via a urethane two-component adhesive or an isocyanate anchor. Laminated. Moreover, a release layer having a peelable property can be formed on the back surface of the heat-resistant transparent film 22 so that an adhesive display label used at the time of physical distribution can be repeatedly stuck or peeled off.

  Next, the thermocompression bonding label 3 with the IC tag 10 according to the third embodiment of the present invention will be described in detail with reference to FIG. The difference from the thermocompression bonding label 3 with the IC tag 10 of the second embodiment described above will be mainly described.

  As shown in FIG. 3, the thermocompression bonding label 3 with the IC tag 10 according to the third embodiment is compared with the thermocompression bonding label 3 with the IC tag 10 according to the second embodiment. The printing paper 36 is interposed between them and the shallowly drawn tray pack 38 is fixed to the thermocompression bonding layer 18.

  Printing ink 34 is printed by offset printing or gravure printing on the back side of printing paper 36 such as coated paper (for example, Mitsubishi Pearl Coat 62.5 Kg), and a desired pattern, gradation photograph, logo mark, etc. are displayed on the display unit. Formed as.

  Further, a thermocompression bonding adhesive (HS agent) is applied on the back surface of the printed printing paper 36. As a thermocompression bonding adhesive (HS agent), for example, Seikadine (containing chlorinated PP and EVA as resin components and hydrocarbon and alcohol as solvent components) manufactured by Dainichi Seika Co., Ltd. can be used. Of course, a general adhesive can be used.

  A PET (polyethylene terephthalate) film on which a release layer having a release property is formed and an unstretched polypropylene (CPP) film as the thermocompression bonding layer 18 are dry-laminated via an urethane-based dry laminating adhesive. Thus, a label base material is constructed. Then, the printing paper 36 and the thermocompression bonding layer 18 of the label base material are partially laminated by hot pressing through a thermocompression bonding adhesive (HS agent).

  The shallowly drawn tray pack 38 is made of a resin sheet such as polypropylene and is formed in a concave shape so as to accommodate at least the printing paper 36 and the IC tag 10. The outer edge portion of the tray pack 38 is thermocompression bonded to the thermocompression bonding layer 18 of the label base material in a state where the IC tag 10 is tightly held between the front surface of the printing paper 36 by the tray pack 38. . As a result, the IC tag 10 is positioned on the printing paper 36 without using an adhesive. Therefore, as shown in FIG. 3, the thermocompression bonding label 3 with the IC tag 10 in which the IC tag 10 and the printing paper 36 are covered with the tray pack 38 is produced.

  Next, the thermocompression bonding label 3 with the IC tag 10 according to the fourth embodiment of the present invention will be described in detail with reference to FIG. The difference from the thermocompression bonding label 3 with the IC tag 10 of the third embodiment described above will be mainly described.

  As shown in FIG. 4, the thermocompression bonding label 3 with the IC tag 10 according to the fourth embodiment is compared with the thermocompression bonding label 3 with the IC tag 10 according to the third embodiment, and the IC tag 10 and the printing by the skin pack method. The difference is that the paper 36 is integrated.

  As the heat-shrinkable resin film 42, a resin film such as polyethylene of about 100 microns is used. With the IC tag 10 placed on the printing paper 36 covered with the heat-shrinkable resin film 42, the heat-shrinkable resin film 42 is contracted by being heated while being evacuated, and the heat-shrinkable resin film 42 is printed. The sheet 36 and the IC tag 10 are fixed in close contact with each other. As a result, the printing paper 36 and the IC tag 10 are positioned.

  Furthermore, although not shown, as the thermocompression bonding label 3 with the IC tag 10 according to the fifth embodiment of the present invention, the IC tag 10 or the like can be stored in a blister pack.

  That is, the blister pack is a package integrally formed by putting the IC tag 10 in a pocket portion of a clear cover formed by molding a resin sheet into a concave shape and press-bonding with a base portion. For the resin sheet of the blister pack, polyethylene terephthalate (PET), vinyl chloride, polystyrene or the like is used, and for the base part as a display medium, paper or the same material as the resin sheet is used. Therefore, with the blister pack, the IC tag 10 is positioned on the base part without using an adhesive in a state where the IC tag 10 is tightly held between the base part. The blister pack including the IC tag 10 is attached to the film-like thermocompression bonding layer 18 via an adhesive.

  Next, referring to FIGS. 5 and 6, a resin container 1 with an IC tag in which the thermocompression bonding label 3 including the IC tag 10 described above is fixed to a thermosoftening resin container 5, and the fixing method. explain.

  The heat-softening resin container 5 such as a returnable box, a container, or a cardboard has a rectangular parallelepiped shape, and an olefin type, particularly a polypropylene type is often used, and polyethylene, polystyrene, or polycarbonate is also used. As described above, the material of the thermocompression bonding layer 18 is selected according to the material of the thermosoftening resin container 5 and is substantially the same material as the material of the thermosoftening resin container 5.

  A recess 56 capable of accommodating at least the IC chip 12 is provided on the wall surface of the thermosoftening resin container 5. In the case of the thermocompression bonding label 3 with the IC tag 10 according to the first embodiment and the second embodiment, a recessed portion 56 formed to have a size and depth that can accommodate the IC chip 12 is provided. In the case of the thermocompression bonding label 3 with the IC tag 10 according to the third to fifth embodiments, the tray pack portion 38, the skin pack portion 42, and the blister pack portion including the IC chip 12 can be stored, respectively. A recess 56 formed in size and depth is provided. Moreover, when the thermocompression bonding label 3 provides a display function as a label, as shown in FIG. On the contrary, when the thermocompression bonding label 3 does not provide a display function as a label, it is fixed at various places, that is, inside and outside of the side wall surface and the bottom wall surface.

  The concave portion 56 provided on the wall surface of the thermosoftening resin container 5 is formed by a method called counterbore by hot pressing after half-cutting or machining in order to prevent the concave portion 56 from rising. Using a hot blade or a Thomson blade (big blade) of a size suitable for the recess 56, half-cut to half the depth of the recess 56 and then hot-press the half-cut portion. As a result, it is possible to form a concave portion 56 that does not rise around the periphery.

  FIG. 6 shows a state where the thermocompression bonding label 3 with the IC tag 10 according to the second embodiment is fixed to the recess 56 on the outer wall surface of the thermosoftening resin container 5. The side wall surface of the thermosoftening resin container 5 includes an outer wall 52 and an inner wall 54, and both are connected by a connecting portion 55. On the outer wall 52 of the side wall surface, a concave portion 56 having a size and a depth capable of accommodating the IC chip 12 of the thermocompression bonding label 3 with the IC tag 10 is formed by the method described above. The concave portion 56 is formed according to the IC tag 10 to be stored and the pack portions 38 and 42, and can have a rectangular parallelepiped shape, a hemispherical shape, or the like.

After positioning so that the IC chip 12 of the thermocompression-bonding label 3 with the IC tag 10 is accommodated in the recess 56, the blank portion 19 of the thermocompression-bonding layer 18 provided as a heat seal allowance and the outer wall of the thermosoftening resin container 5 52 is locally thermocompression bonded. A thermocompression bonding head (not shown) for locally thermocompression bonding has, for example, a flange shape in which a central portion is recessed in a concave shape, and the temperature is controlled with high accuracy by a heater and a thermocouple. The thermocompression bonding conditions vary depending on the materials of the thermocompression bonding layer 18 and the thermosoftening resin container 5, but when they are made of polypropylene, for example, the temperature-controlled thermocompression bonding head temperature is 180 ° C. Thermocompression bonding is performed under the conditions of a pressure of 2 kg / cm ² and a contact time of 3 seconds. As a result, a resin-made container 1 with an IC tag in which the thermocompression-bonding label 3 including the IC tag 10 is hermetically fixed to the thermosoftening resin-made container 5 is produced.

  In the resin container 1 with an IC tag manufactured in this way, the IC chip 12 and the pack portions 38 and 42 are flush with each other without protruding from the outer wall 52 of the thermosoftening resin container 5. Even if an external force or an impact is applied to the side wall surface of the thermosoftening resin container 5, damage to the IC chip 12 can be prevented.

  The material of the thermocompression bonding layer 18 and the material of the thermosoftening resin container 5 are substantially the same, and since the same material is thermally welded (heat-sealed), the bonding strength is very excellent. Therefore, the thermocompression-bonding label 3 with the IC tag 10 and the thermosoftening resin container 5 are firmly sealed and fixed by heat welding, so that the IC chip 12 is not damaged due to infiltration of the cleaning liquid or the like during the cleaning process. Can be prevented. Therefore, since the resin container 5 can be repeatedly washed and used in a returnable manner, the economy of the resin container 5 is improved.

  Since the portion to be heat-welded is the blank portion 19 outside the outer portion of the base material 14 of the IC tag 10, it is possible to prevent the IC chip 12 from being thermally damaged during the heat-welding. High information retention in the tag 10 can be ensured.

  In addition, since a peelable release layer is formed on the surface of the heat-resistant transparent film 22, even if the adhesive label used for distribution is repeatedly applied, a part of the label remains. Thus, the surface of the heat resistant transparent film 22 is not contaminated.

  In the present invention, thermal welding is not limited to melting and bonding the resin by applying heat and pressure from the heater, and the heating method is friction generated by ultrasonic waves. It is a broad concept that includes the use of heat.

It is sectional drawing of the thermocompression bonding label which concerns on 1st embodiment of this invention. It is sectional drawing of the thermocompression bonding label which concerns on 2nd embodiment of this invention. It is sectional drawing of the thermocompression bonding label which concerns on 3rd embodiment of this invention. It is sectional drawing of the thermocompression bonding label which concerns on 4th embodiment of this invention. It is a perspective view of a resin container with an IC tag according to the present invention. It is sectional drawing which illustrates typically the resin-made containers with an IC tag shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin container with IC tag 3 Thermocompression bonding label 5 Thermosoftening resin container 10 IC tag 12 IC chip 14 Base material 18 Thermocompression bonding layer (sealant layer)
19 Margin part 22 Heat-resistant transparent resin film 24 Ink layer (display part)
32 Adhesive layer 34 Ink layer (display part)
36 Printing paper 38 Tray pack (tray pack part)
42 Heat shrink resin film (skin pack part)
52 Outer wall 54 Inner wall 55 Connecting portion 56 Recess

Claims (14)

An IC chip storing electronic information;
A substrate on which an antenna pattern to which the IC chip is electrically connected is formed, and a thermocompression bonding label hermetically fixed to a thermosoftening resin container,
A thermocompression bonding layer composed of substantially the same material as the thermosoftening resin container is laminated in the order of an IC chip, a substrate and a thermocompression bonding layer,
A thermocompression-bonding label characterized in that it is hermetically fixed to a thermosoftening resin container by applying heat and pressure to a thermocompression-bonding layer on an outer portion of the outer portion of the substrate.   The thermocompression bonding label according to claim 1, wherein a heat resistant transparent resin film is further laminated on the thermocompression bonding layer.   The thermocompression-bonding label according to claim 2, further comprising a display portion between the thermocompression-bonding layer and the heat-resistant transparent resin film.   The thermocompression-bonding label according to claim 1, wherein the thermocompression-bonding label is a shallow-drawn tray pack type that is held by a resin tray together with a display medium having a display unit.   The thermocompression-bonding label according to claim 1, wherein the thermocompression-bonding label is a skin pack type held by a heat-shrinkable resin film together with a display medium having a display unit.   The thermocompression-bonding label according to claim 1, wherein the thermocompression-bonding label is a blister pack type held by a blister resin sheet together with a display medium having a display unit.   The thermocompression bonding label according to claim 1, wherein the thermosoftening resin container and the thermocompression bonding layer are polypropylene. A thermocompression bonding label is a resin container with an IC tag that is hermetically fixed to a thermosoftening resin container,
The thermocompression bonding label is
An IC chip storing electronic information;
A substrate on which an antenna pattern to which the IC chip is electrically connected is formed, and
A thermocompression bonding layer composed of substantially the same material as the thermosoftening resin container is laminated in the order of an IC chip, a substrate and a thermocompression bonding layer,
A recess processed into a shape capable of storing at least an IC chip is formed in the thermosoftening resin container,
By applying heat and pressure to the thermocompression bonding layer on the outer side of the outer part of the substrate with at least the IC chip housed in the recess, the thermocompression label is hermetically fixed to the thermosoftening resin container. A resin container with an IC tag, which is characterized by being made.   9. The resin-made container with an IC tag according to claim 8, wherein a heat-resistant transparent resin film is further laminated on the thermocompression bonding layer.   The resin container with an IC tag according to claim 9, further comprising a display portion between the thermocompression bonding layer and the heat resistant transparent resin film.   The thermocompression-bonding label is a shallow-drawn tray pack type that is held by a resin tray together with a display medium having a display unit, and the shallow-drawn tray pack portion is stored in a recess of a resin container. The resin-made container with an IC tag according to claim 8.   The thermocompression-bonding label is a skin pack type that is held by a heat-shrinkable resin film together with a display medium having a display unit, and the skin pack part is housed in a recess of a resin container. 8. A resin container with an IC tag according to 8.   The said thermocompression-bonding label is a blister pack type held by a blister resin sheet together with a display medium having a display section, and the blister pack portion is housed in a recess of a resin container. The resin container with an IC tag as described. The resin container with an IC tag according to claim 8, wherein the thermosoftening resin container and the thermocompression bonding layer are polypropylene.

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