JP3120044U - Compact image sensor module - Google Patents

Compact image sensor module Download PDF

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JP3120044U
JP3120044U JP2005010940U JP2005010940U JP3120044U JP 3120044 U JP3120044 U JP 3120044U JP 2005010940 U JP2005010940 U JP 2005010940U JP 2005010940 U JP2005010940 U JP 2005010940U JP 3120044 U JP3120044 U JP 3120044U
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substrate
adhesive
chip
electrode
sensor module
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修文 杜
鎮濱 彭
孟南 何
尚鋒 謝
宗憲 辛
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勝開科技股▲ふん▼有限公司
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Abstract

【課題】良品率を向上し、生産コストを削減できるコンパクト画像センサーモジュールの提供。
【解決手段】コンパクト画像センサーモジュールに関わるもので、主に基板の上に、上表面と下表面を設け、上表面に第１電極を形成し、下表面に第２電極に対応する第１電極と電気接続し、チップを基板の上表面に設け、その上に検出区域と半田パッドを形成する。複数本の導線はチップの半田パッドにより基板の第１電極に電気接続する。接着剤は基板の上表面に塗布し、鏡台にメスねじを設け、接着剤により基板の上表面に接着し、チップを囲む。接着剤は鏡台に押しつぶされ、導線に被せる。鏡台の側壁および鏡台の基板を切断する。鏡円筒にオスねじを設け、鏡台のメスねじに締めつける。
【選択図】図２[PROBLEMS] To provide a compact image sensor module capable of improving the yield rate and reducing the production cost.
The present invention relates to a compact image sensor module. An upper surface and a lower surface are mainly provided on a substrate, a first electrode is formed on the upper surface, and a first electrode corresponding to the second electrode is formed on the lower surface. The chip is provided on the upper surface of the substrate, and the detection area and the solder pad are formed thereon. The plurality of conductive wires are electrically connected to the first electrode of the substrate by chip solder pads. The adhesive is applied to the upper surface of the substrate, and a female screw is provided on the table, and the adhesive is adhered to the upper surface of the substrate with the adhesive to surround the chip. The adhesive is crushed by the mirror and put on the conductor. Cut the side wall of the table and the substrate of the table. Install the male screw on the mirror cylinder and tighten it to the female screw on the head.
[Selection] Figure 2

Description

本考案はコンパクト画像センサーモジュールおよびその製造方法に関わるもので、特に一種の良品率の向上、製品をより軽薄短小が有効に実現できる。   The present invention relates to a compact image sensor module and a manufacturing method thereof, and in particular, can improve a kind of non-defective product rate, and can effectively realize a lighter, thinner and smaller product.

図１に示すものは、一種の画像センサーモジュール構造の断面図である。基板に上表面と下表面を設け、上表面に第１電極を形成し、下表面に第２電極に対応する第１電極と電気接続する。チップを基板の上表面に設け、その上に検出区域と半田パッドを形成する。複数本の導線はチップの半田パッドにより基板の第１電極に電気接続する。接着剤、基板の上表面に塗布する。鏡台にメスねじを設け、接着剤により基板の上表面に接着し、チップを囲む。鏡円筒にオスねじを設け、鏡台のメスねじに締めつける。   FIG. 1 is a cross-sectional view of a kind of image sensor module structure. An upper surface and a lower surface are provided on the substrate, a first electrode is formed on the upper surface, and a first electrode corresponding to the second electrode is electrically connected to the lower surface. A chip is provided on the upper surface of the substrate, and a detection area and a solder pad are formed thereon. The plurality of conductive wires are electrically connected to the first electrode of the substrate by chip solder pads. Apply adhesive to the top surface of the substrate. A female screw is provided on the table, and it adheres to the upper surface of the substrate with an adhesive to surround the chip. Install the male screw on the mirror cylinder and tighten it to the female screw on the head.

ただし、前記の画像センサーモジュールは接着剤を塗布するとき、接着剤量の管理がうまくいかないとき、接着剤が鏡台より露出し、仕上げたモジュールの大きさがまちまちになり、サイズの大きいモジュールを廃棄することなり、極めて浪費である。   However, when applying the adhesive to the above image sensor module, if the amount of adhesive cannot be managed properly, the adhesive will be exposed from the table, the size of the finished module will vary, and the large module will be discarded It is very wasteful.

本考案の主な目的は、一種のコンパクト画像センサーモジュールおよびその製造方法を提供し、良品率を向上し、生産コストを削減できる。   The main object of the present invention is to provide a kind of compact image sensor module and a manufacturing method thereof, which can improve the yield rate and reduce the production cost.

本考案のもう一つの目的は、一種のコンパクト画像センサーモジュールおよびその製造方法を提供し、製品体積を小さくすることにより、軽薄短小を実現する。   Another object of the present invention is to provide a kind of compact image sensor module and a method for manufacturing the same, and to reduce the volume of the product, thereby realizing lightness and smallness.

本考案は基板に上表面と下表面を設け、上表面に第１電極を形成し、下表面に第２電極を設けて、第１電極に対応する。チップを基板の上表面に設け、その上に検出区域と半田パッドを形成する。複数本の導線はチップの半田パッドにより基板の第１電極に電気接続する。接着剤、基板の上表面に塗布する。鏡台にメスねじを設け、接着剤により基板の上表面に接着し、チップを囲む。鏡円筒にオスねじを設け、鏡台のメスねじに締めつける。   In the present invention, an upper surface and a lower surface are provided on a substrate, a first electrode is formed on the upper surface, and a second electrode is provided on the lower surface to correspond to the first electrode. A chip is provided on the upper surface of the substrate, and a detection area and a solder pad are formed thereon. The plurality of conductive wires are electrically connected to the first electrode of the substrate by chip solder pads. Apply adhesive to the top surface of the substrate. A female screw is provided on the table, and it adheres to the upper surface of the substrate with an adhesive to surround the chip. Install the male screw on the mirror cylinder and tighten it to the female screw on the head.

請求項１の考案は、一種のコンパクト画像センサーモジュール構造において、基板、チップ、複数本の導線、接着剤、鏡台及び鏡円筒を包含し、
基板に上表面と下表面を設け、上表面に第１電極を形成し、下表面に第２電極を設けて、第１電極に対応し、
チップを基板の上表面に設け、その上に検出区域と半田パッドを形成し、
複数本の導線はチップの半田パッドにより基板の第１電極に電気接続し、
接着剤は基板の上表面に塗布し、
鏡台に側壁およびメスねじを設け、側壁は接着剤により基板の上表面に接着し、チップを囲み、
接着剤は鏡台に押しつぶされ、導線に被せ、
鏡円筒はオスねじを設け、鏡台のメスねじに締めつけることを特徴とする、コンパクト画像センサーモジュールとしている。
請求項２の考案は、請求項１記載のコンパクト画像センサーモジュールにおいて、基板の上表面にフランジ層を設け、接着剤はこのフランジ層に塗布し、鏡台の側壁は接着剤によりフランジ層に設けることを特徴とする、コンパクト画像センサーモジュールとしている。
請求項３の考案は、請求項１記載のコンパクト画像センサーモジュールにおいて、鏡台一部分の側壁とこの鏡台に粘着する基板を切除し、小さい寸法のモジュールにすることを特徴とする、コンパクト画像センサーモジュールとしている。
請求項４の考案は、請求項１記載のコンパクト画像センサーモジュールにおいて、接着剤はチップを覆い、チップの検出区域のみを露出することを特徴とする、コンパクト画像センサーモジュールとしている。 The invention of claim 1 is a kind of compact image sensor module structure, and includes a substrate, a chip, a plurality of conductors, an adhesive, a mirror base and a mirror cylinder,
An upper surface and a lower surface are provided on the substrate, a first electrode is formed on the upper surface, a second electrode is provided on the lower surface, and corresponds to the first electrode,
A chip is provided on the upper surface of the substrate, on which a detection area and a solder pad are formed,
The plurality of conductive wires are electrically connected to the first electrode of the substrate by the solder pads of the chip,
Adhesive is applied to the upper surface of the substrate,
A side wall and a female screw are provided on the table, and the side wall is adhered to the upper surface of the substrate with an adhesive, enclosing the chip,
The adhesive is crushed by the table and put on the conductor,
The mirror cylinder is provided with a male screw, and is a compact image sensor module characterized in that it is fastened to a female screw on the mirror base.
The invention of claim 2 is the compact image sensor module according to claim 1, wherein a flange layer is provided on the upper surface of the substrate, an adhesive is applied to the flange layer, and a side wall of the table is provided on the flange layer by an adhesive. It is a compact image sensor module characterized by
According to a third aspect of the present invention, there is provided a compact image sensor module according to the first aspect, wherein a side wall of a part of the lens mount and a substrate adhering to the lens mount are cut to form a small-sized module. Yes.
The invention of claim 4 is the compact image sensor module according to claim 1, wherein the adhesive covers the chip and only the detection area of the chip is exposed.

本考案は鏡台の側壁を切除することにより、モジュールの体積を小さくできるほか、製品寸法の一致性が取れる。接着剤は導線およびチップに覆うため、より丈夫な構造である。   In the present invention, the volume of the module can be reduced by cutting the side wall of the lens mount, and the product dimensions can be matched. Since the adhesive covers the conductive wire and the chip, it has a stronger structure.

図２に示すものは、本考案のコンパクト画像センサーモジュールの概略図である。基板４０、チップ４２、複数本の導線４４、接着剤４６、鏡台４８、および鏡円筒５０より構成する。
基板４０に上表面５２と下表面５４を設け、上表面５２に第１電極５６を設け、下表面５４に、第２電極５８に対応する第１電極５６と電気接続する。 FIG. 2 is a schematic view of the compact image sensor module of the present invention. A substrate 40, a chip 42, a plurality of conductive wires 44, an adhesive 46, a mirror base 48, and a mirror cylinder 50 are included.
An upper surface 52 and a lower surface 54 are provided on the substrate 40, a first electrode 56 is provided on the upper surface 52, and the first electrode 56 corresponding to the second electrode 58 is electrically connected to the lower surface 54.

チップ４２、基板４０の上表面５２に設け、その上に検出区域６０と半田パッド６２を設ける。
複数本の導線４４は、チップ４２の半田パッド６２により、基板４０の第１電極５６に電気接続する。
接着剤４６は粘性グルーであり、基板４０の上表面５２に塗布し、第１電極５６の周りに導線４４で覆う。 A chip 42 and an upper surface 52 of the substrate 40 are provided, and a detection area 60 and a solder pad 62 are provided thereon.
The plurality of conductive wires 44 are electrically connected to the first electrode 56 of the substrate 40 by the solder pads 62 of the chip 42.
The adhesive 46 is a viscous glue, which is applied to the upper surface 52 of the substrate 40 and covered with a conductive wire 44 around the first electrode 56.

鏡台４８に側壁４９およびメスねじ６４を設け、側壁４９は接着剤４６により、基板４０の上表面５２に接着し、チップ４２を囲む。鏡台４８一部の側壁４９および鏡台４８に粘着する基板４０を切断し、小さい寸法のモジュールにする。
鏡円筒５０にオスねじ６６を設け、鏡台４８のメスねじ６４に締めつける。 A side wall 49 and a female screw 64 are provided on the table 48, and the side wall 49 is bonded to the upper surface 52 of the substrate 40 by an adhesive 46 and surrounds the chip 42. The side wall 49 of a part of the table 48 and the substrate 40 that adheres to the table 48 are cut into small modules.
A male screw 66 is provided in the mirror cylinder 50, and is fastened to a female screw 64 of the table 48.

図３に示すものは、本考案のコンパクト画像センサーモジュールのもう一つの実施図式である。基板４０、チップ４２、フランジ層４３、複数本の導線４４、接着剤４６、鏡台４８および鏡円筒５０より構成する。
基板４０に上表面５２と下表面５４を設け、上表面５２に第１電極５６を設け、下表面５４に、下第２電極５８を設けて、第１電極５６に対応する。 FIG. 3 shows another embodiment of the compact image sensor module of the present invention. A substrate 40, a chip 42, a flange layer 43, a plurality of conductive wires 44, an adhesive 46, a table 48 and a mirror cylinder 50 are included.
An upper surface 52 and a lower surface 54 are provided on the substrate 40, a first electrode 56 is provided on the upper surface 52, and a lower second electrode 58 is provided on the lower surface 54 to correspond to the first electrode 56.

フランジ層４３は基板４０の上表面５２に接着して、基板４０と溝４５を形成する。
チップ４２は基板４０の上表面５２の溝４５に設け、その上部に検出区域６０と半田パッド６２を設ける。
複数本の導線４４は、チップ４２の半田パッド６２により、基板４０の第１電極５６に電気接続する。
接着剤４６は粘性グルーであり、フランジ層４３に塗布する。 The flange layer 43 is bonded to the upper surface 52 of the substrate 40 to form the substrate 40 and the groove 45.
The chip 42 is provided in the groove 45 on the upper surface 52 of the substrate 40, and the detection area 60 and the solder pad 62 are provided thereon.
The plurality of conductive wires 44 are electrically connected to the first electrode 56 of the substrate 40 by the solder pads 62 of the chip 42.
The adhesive 46 is a viscous glue and is applied to the flange layer 43.

鏡台４８は側壁４９およびメスねじ６４を設け、接着剤４４により、フランジ層４３に接着し、チップ４２を囲む。接着剤４６は鏡台４８に押しつぶされた後、導線４４およびチップ４０の半田パッド６２に覆う。鏡台４８一部の側壁４９、鏡台４８に接着するフランジ層４３と基板４０の一部を切断し、小さい寸法のモジュールにする。
鏡円筒５０にオスねじ６６を設け、鏡台４８のメスねじ６４に締めつける。 The table 48 is provided with a side wall 49 and a female screw 64, and is adhered to the flange layer 43 with an adhesive 44 to surround the chip 42. The adhesive 46 is crushed by the table 48 and then covered with the lead wire 44 and the solder pad 62 of the chip 40. A part of the side wall 49 of the lens mount 48, the flange layer 43 bonded to the lens mount 48, and a part of the substrate 40 are cut into a module having a small size.
A male screw 66 is provided in the mirror cylinder 50, and is fastened to a female screw 64 of the table 48.

公知技術の画像センサーモジュールを示す図である。It is a figure which shows the image sensor module of a well-known technique. 本考案のコンパクト画像センサーモジュールを示す図である。It is a figure which shows the compact image sensor module of this invention. 本考案のコンパクト画像センサーモジュールのもう一つの実施例である。It is another Example of the compact image sensor module of this invention.

符号の説明Explanation of symbols

４０ 基板
４２ チップ
４３ フランジ層
４４ 複数本の導線
４５ 溝
４６ 接着剤
４８ 鏡台
５０ 鏡円筒
５２ 上表面
５４ 下表面
５６ 第１電極
５８ 第２電極
６０ 検出区域
６２ 半田パッド
６４ メスねじ
６６ オスねじ 40 Substrate 42 Chip 43 Flange layer 44 Multiple conductors 45 Groove 46 Adhesive 48 Table 48 mirror cylinder 52 upper surface 54 lower surface 56 first electrode 58 second electrode 60 detection area 62 solder pad 64 female screw 66 male screw

Claims (4)

一種のコンパクト画像センサーモジュール構造において、基板、チップ、複数本の導線、接着剤、鏡台及び鏡円筒を包含し、
基板に上表面と下表面を設け、上表面に第１電極を形成し、下表面に第２電極を設けて、第１電極に対応し、
チップを基板の上表面に設け、その上に検出区域と半田パッドを形成し、
複数本の導線はチップの半田パッドにより基板の第１電極に電気接続し、
接着剤は基板の上表面に塗布し、
鏡台に側壁およびメスねじを設け、側壁は接着剤により基板の上表面に接着し、チップを囲み、
接着剤は鏡台に押しつぶされ、導線に被せ、
鏡円筒はオスねじを設け、鏡台のメスねじに締めつけることを特徴とする、コンパクト画像センサーモジュール。 In a kind of compact image sensor module structure, including a substrate, a chip, a plurality of conductive wires, an adhesive, a mirror base and a mirror cylinder,
An upper surface and a lower surface are provided on the substrate, a first electrode is formed on the upper surface, a second electrode is provided on the lower surface, and corresponds to the first electrode,
A chip is provided on the upper surface of the substrate, on which a detection area and a solder pad are formed,
The plurality of conductive wires are electrically connected to the first electrode of the substrate by the solder pads of the chip,
Adhesive is applied to the upper surface of the substrate,
A side wall and a female screw are provided on the table, and the side wall is adhered to the upper surface of the substrate with an adhesive, enclosing the chip,
The adhesive is crushed by the table and put on the conductor,
A compact image sensor module, characterized in that the mirror cylinder is provided with a male screw and is fastened to the female screw of the mirror base. 請求項１記載のコンパクト画像センサーモジュールにおいて、基板の上表面にフランジ層を設け、接着剤はこのフランジ層に塗布し、鏡台の側壁は接着剤によりフランジ層に設けることを特徴とする、コンパクト画像センサーモジュール。   2. The compact image sensor module according to claim 1, wherein a flange layer is provided on the upper surface of the substrate, an adhesive is applied to the flange layer, and a side wall of the lens mount is provided on the flange layer by an adhesive. Sensor module. 請求項１記載のコンパクト画像センサーモジュールにおいて、鏡台一部分の側壁とこの鏡台に粘着する基板を切除し、小さい寸法のモジュールにすることを特徴とする、コンパクト画像センサーモジュール。   2. The compact image sensor module according to claim 1, wherein a side wall of a part of the lens mount and a substrate adhering to the lens mount are cut to form a module having a small size. 請求項１記載のコンパクト画像センサーモジュールにおいて、接着剤はチップを覆い、チップの検出区域のみを露出することを特徴とする、コンパクト画像センサーモジュール。
2. The compact image sensor module according to claim 1, wherein the adhesive covers the chip and exposes only the detection area of the chip.
JP2005010940U 2005-12-26 2005-12-26 Compact image sensor module Expired - Fee Related JP3120044U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113939110A (en) * 2021-10-14 2022-01-14 江西盛泰精密光学有限公司 Method for eliminating light reflection of chip connecting wire and camera module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113939110A (en) * 2021-10-14 2022-01-14 江西盛泰精密光学有限公司 Method for eliminating light reflection of chip connecting wire and camera module

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