JP3119964B2 - Semiconductor insertion / extraction device and semiconductor insertion / extraction method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inserting and removing a semiconductor (hereinafter, IC) from a test board in a final test step and a burn-in step, and to an insertion and extraction method using the apparatus.

[0002]

2. Description of the Related Art FIG. 9 is a schematic side view for explaining a conventional semiconductor insertion / extraction device. In the figure, reference numeral 1 (15) denotes a signal connection component called an IC socket for fixing a device without directly fixing it to a printed circuit board or the like, 2 denotes a burn-in board, 14 denotes a test board called a performance board. A board for relaying a signal and a power supply for testing a device so as to be electrically connected to a terminal of the device to be tested, and is configured so that the IC socket 1 can be mounted. ing. As described above, the test board is roughly divided into a burn-in board 2 used in a burn-in process and a performance board 14 used in a final test process. In the former case, the socket is an open top socket 1
In the latter case, a normal socket 15 is used. 3 is an IC which is a device to be tested, and 4 is an IC
3 is a tray for mounting the same. Reference numeral 5 denotes an IC suction device, and reference numeral 6 denotes a telescopic device for moving the IC suction device 5.

Next, the operation will be described. When the IC is inserted, the IC 3 on the tray 4 is stretched by the extension device 6 and sucked by the suction device 5, and in this state, the IC 3 is mounted on the open top socket 1 (normal socket 15) mounted on the burn-in board 2 (performance board 14). And insert the IC 3 into the IC socket 1. When the IC 3 is removed, the process is the reverse of the process when the IC 3 is inserted.

[0004]

Since the conventional semiconductor insertion / extraction device and the insertion / extraction method are configured as described above, foreign matter easily enters between the IC socket on the test board and the IC lead, and the contact failure is reduced. There was a problem that it occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a measure for reducing a contact failure between an IC and a socket in a final test process and a burn-in process can be realized easily and in a small space. It is an object of the present invention to obtain a semiconductor insertion / extraction device and a semiconductor insertion / extraction method suitable for the same.

[0006]

According to the present invention, there is provided a semiconductor insertion / extraction apparatus comprising: a test board having an IC socket mounted so that a lead insertion hole is located on a surface facing a tray; And an insertion / extraction mechanism for transferring the IC chip and inserting / removing the IC chip into / from the IC socket.

[0007] Further, a vibration generating mechanism for applying vibration to the IC socket is provided.

[0008] Further, the insertion / extraction mechanism is provided with an air blowing mechanism for blowing air to the IC socket.

[0009] Further, it has a file, a cleaning water tank, an air blowing mechanism, and the like, which are arranged to face the test board.
It is provided with a lead cleaning board for removing foreign matter from the leads of the IC chip before inserting the C socket.

[0010] The method of inserting and removing a semiconductor device according to the present invention comprises:
I so that the lead insertion hole of the IC chip is
A C socket is mounted on a test board, and an IC chip mounted on a tray is inserted into the socket.

[0011]

According to the present invention, the IC socket is mounted on the test board so that the lead insertion hole is located on the surface facing the tray, and the IC chip is inserted into the IC socket. The lead insertion hole of the socket is oriented in the vertical direction, so that foreign substances attached to the IC socket are easily removed, and foreign substances hardly enter the IC socket.

Further, by applying a vibration to the IC socket or blowing air to the IC socket, removal of foreign substances attached to the IC socket can be promoted.

Further, foreign matter adhering to the lead can be removed by bringing the lead of the IC chip into contact with a file, cleaning the lead in a cleaning water tank, or blowing air.

[0014]

【Example】

Embodiment 1 FIG. Hereinafter, a semiconductor insertion / extraction device according to a first embodiment of the present invention will be described with reference to FIG. In the figure, the same reference numerals as those in FIG. 9 indicate the same or corresponding parts. Here, the test board will be described as a burn-in board 2. In the figure, reference numeral 8 denotes hooks and rails for holding and moving the burn-in board 2, and an open socket 1 is mounted on the lower side of the burn-in board 2 in the drawing. Reference numeral 4 denotes a tray disposed so as to face the open socket 1, and a plurality of ICs 3 are mounted and moved. Reference numeral 20 denotes a support shaft movably held in a space between the burn-in board 2 and the tray 4, and a telescopic device 6 is attached to the support shaft 20 via a positioning rotation device 6.

Next, the operation will be described. The burn-in board 2 to which the open top socket 1 is attached is arranged on the hook and the rail such that the socket 1 faces downward. On the other hand, the tray 4 on which the IC 3 is mounted moves in the insertion / extraction device in the direction of the arrow in parallel with the burn-in board 2. With the support shaft 20 and the positioning rotation device 7,
The expansion and contraction device 6 is driven and controlled such that the expansion and contraction device 6 is positioned above the IC 3 that has been mounted and carried on the tray 4, and then the expansion and contraction device 6 extends and the suction device 5 approaches the IC 3, The IC 3 is adsorbed on the IC 3 by suction of air. After sucking the IC3, the telescopic device 6 contracts once, the positioning / rotating device 7 rotates around the support shaft 20, and makes the sucked IC3 face the open socket 1, and then the telescopic device 6 expands and sucks the IC3. Is attached to the socket 1 and the suction is released. By repeatedly performing the above operations, the ICs 3 mounted and carried on the tray 4 are sequentially mounted on the socket 1. It should be noted that the process of removing the IC 3 is the reverse of the process of inserting the IC 3.

As described above, in the present embodiment, the IC socket 1 is disposed facing the tray 4 on which the IC 3 is mounted, and the IC 3 on the tray 4 is attached by using the suction device 5, the extension device 6, and the positioning rotation device 7. Since the socket 1 is mounted from below, the IC insertion portion of the socket 1 faces downward, so that foreign substances adhering to the socket 1 can be easily removed, and foreign substances hardly enter the socket 1. In addition, contact failure between the IC 3 and the socket 1 can be reduced.

Embodiment 2 FIG. Next, a semiconductor insertion / extraction device according to a second embodiment of the present invention will be described with reference to FIG. In the figure, reference numeral 9 denotes a vibration device attached to the hook and rail 8.

Next, the operation will be described. By operating the vibration device 9 to apply vibration to the hook and rail 8, vibration is transmitted to the burn-in board 2 held by the hook and rail 8, and vibration is also applied to the socket 1 mounted thereon. Removal of foreign matter attached to the socket 1 is promoted.

As described above, according to the present embodiment, since the vibration device 9 is attached to the hook and the rail 8 and the vibration is applied to the socket 1, foreign substances attached to the socket 1 can be positively removed. , Contact failure between the IC 3 and the socket 1 can be further reduced.

Embodiment 3 FIG. Next, a semiconductor insertion / extraction device according to a third embodiment of the present invention will be described with reference to FIG. In the figure, reference numeral 10 denotes an air blowing device provided on the positioning / rotating device 7 at a position facing the telescopic device 6.

Next, the function and effect will be described. The method for inserting and removing the IC 3 is the same as that described in the first embodiment. In this embodiment, the process of sucking the IC 3 mounted on the tray 4 with the suction device 5 and then blowing air to the socket 1 by the air blowing device 10. Has been added. For this reason, removal of foreign substances can be promoted.

Embodiment 4 FIG. Next, a semiconductor insertion / extraction device according to a fourth embodiment of the present invention will be described with reference to FIGS.
In the drawing, reference numeral 11 denotes an IC lead cleaning unit for removing foreign substances adhering to the leads of the IC 3 adsorbed by the adsorption device 5. As a specific configuration of the cleaning section 11, as shown in FIG.
Is provided.

Next, the function and effect will be described. As shown in FIG. 5, the suction device 5 that has sucked the IC 3 is moved above the IC cleaning unit 11, and the lead 16 of the IC 3 is brought into contact with a fine file 17, thereby removing foreign matter attached to the IC lead 16. Can be.

Embodiment 5 FIG. Next, a semiconductor insertion / extraction device according to a fifth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, a fine file 1 is attached to the IC cleaning unit 11.
In the present embodiment, a cleaning water tank 18 is provided in the IC cleaning unit 11 and ultrasonic vibration is applied to the IC cleaning unit 11 by the vibration device 9. Lead 16
Is to be washed.

Next, the function and effect will be described. In the IC lead cleaning unit 11, the suction device 5 that has suctioned the IC 3 is moved above the IC cleaning unit 11 and
By immersing the tip of the lead 16 in the cleaning water tank 18 and applying ultrasonic vibration to the cleaning unit 11 using the vibrating device 9, foreign matter attached to the IC lead 16 can be removed.

Embodiment 6 FIG. Next, a semiconductor insertion / extraction device according to a sixth embodiment of the present invention will be described with reference to FIG. As shown in FIG. 7, in this embodiment, the IC lead cleaning unit 11
Is provided with an air blowing device 10.

Next, the function and effect will be described. In the IC lead cleaning unit 11, the suction device 5 that has suctioned the IC 3 is moved above the IC cleaning unit 11 and
The tip of the lead 16 is brought close to the air blowing device 10, and the IC
By blowing air on the leads 16, foreign substances adhering to the IC leads 16 can be removed.

In each of the above embodiments, the burn-in board 2 was used as a test board. However, as shown in FIG. 8, the same effect can be obtained when the performance board 14 used in the final test process of the IC 3 is used. To play. 13 is a performance board 14
Is a performance board attachment part for attaching the test board 12 to the test head 12.

[0029]

As described above, according to the present invention, the IC
Since the IC chip is inserted with the IC chip insertion portion of the socket positioned downward, foreign matter in the IC socket is easily removed, and foreign matter hardly enters the IC socket. In this case, there is an effect that contact failure can be reduced and foreign substances can be prevented from being carried into the next step.

Further, vibration is applied to the IC socket.
Alternatively, by blowing air, removal of the foreign matter can be promoted, and there is an effect that the contact failure can be further reduced.

Further, by bringing the lead of the IC chip into contact with a file, immersing it in a cleaning water tank, or blowing air, etc., there is an effect that foreign substances adhering to the lead can be positively removed.

[Brief description of the drawings]

FIG. 1 shows a semiconductor (IC) according to a first embodiment of the present invention.
It is a perspective view which shows an insertion / extraction apparatus.

FIG. 2 is a main part configuration diagram of an IC insertion / extraction device according to a second embodiment of the present invention.

FIG. 3 is a main part configuration diagram of an IC insertion / extraction device according to a third embodiment of the present invention.

FIG. 4 is a main part configuration diagram of an IC insertion / extraction device according to a fourth embodiment of the present invention.

FIG. 5 is a main part configuration diagram of a cleaning unit of the IC insertion / extraction device according to the embodiment.

FIG. 6 is a main part configuration diagram of a cleaning unit of an IC insertion / extraction device according to a fifth embodiment of the present invention.

FIG. 7 is a main part configuration diagram of a cleaning unit of an IC insertion / extraction device according to a sixth embodiment of the present invention.

FIG. 8 is a configuration diagram showing an application example of the IC insertion / extraction device according to the first embodiment of the present invention.

FIG. 9 is a front view showing a conventional IC insertion / extraction device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Open top socket 2 Burn-in board 3 IC 4 Tray 5 Suction device 6 Telescopic device 7 Positioning rotation device 8 Hook and rail 9 Vibration device 10 Air blowing device 11 IC lead cleaning part 12 Test head 13 Performance board mounting part 14 Performance board 15 Socket 16 IC lead 17 File 18 Cleaning water tank 20 Support shaft

Claims (8)

(57) [Claims] 1. An I which has been placed and carried on a tray.
The C chip is transferred and inserted into the IC socket mounted on the test head, or the I chip inserted into the IC socket.
A semiconductor insertion / extraction device for extracting a C chip and transferring the chip onto the tray, comprising: a test board having an IC socket disposed so as to face the tray and mounted so that a lead insertion hole of the IC chip is positioned downward; A semiconductor insertion / extraction device, comprising: an insertion / extraction mechanism movably disposed between the tray and the test board, for transporting the IC chip and inserting / extracting the IC socket. 2. The semiconductor insertion / extraction device according to claim 1, further comprising a vibration generating mechanism for applying vibration to the IC socket. 3. The semiconductor insertion / extraction device according to claim 1, wherein the semiconductor insertion / extraction mechanism includes an air blowing mechanism for blowing air to the IC socket. 4. The semiconductor insertion and removal device according to claim 1, further comprising a lead cleaning board arranged to face the test board and removing foreign matter from the leads before inserting the IC chip into the IC socket. A semiconductor insertion / extraction device characterized by the above-mentioned. 5. The semiconductor insertion and removal apparatus according to claim 4, wherein the lead cleaning board has a file on a surface thereof, and removes the foreign matter by bringing a lead of the IC chip into contact with the file. A semiconductor insertion / extraction device characterized by the above-mentioned. 6. The semiconductor insertion and removal device according to claim 4, wherein the lead cleaning board has a vibration generator that applies ultrasonic vibration to the board, and a cleaning water tank provided on a surface of the board. A semiconductor insertion and removal device, wherein the foreign matter is removed by immersing the lead of the IC chip in the cleaning tank and applying ultrasonic vibration in this state. 7. The semiconductor insertion / extraction device according to claim 5, wherein the lead cleaning board includes an air blowing mechanism for blowing air to the leads of the IC chip. 8. The I which has been placed and carried on a tray.
In a semiconductor insertion / extraction method of inserting a C chip into an IC socket mounted on a test head or extracting an IC chip inserted into an IC socket and transferring the chip onto the tray, the lead insertion hole of the IC chip faces downward. IC to be located in
A method for inserting and removing a semiconductor device, comprising: mounting a socket on a test board; and inserting an IC chip mounted on the tray into the socket.