JP3118763B2 - Epoxy resin composition and semiconductor encapsulating material - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention is a novel material having excellent heat resistance, water resistance, high temperature properties, fluidity, moldability and low internal stress. Insulation materials, fiber reinforced composite materials, coating materials, molding materials,
The present invention relates to an epoxy resin composition which is extremely useful for an adhesive material and the like, and a semiconductor encapsulating material which is excellent in heat resistance, curability, moldability, and solder crack resistance in addition to those properties.

[0002]

2. Description of the Related Art Epoxy resins are generally cured with various curing agents to give cured products having excellent mechanical properties, water resistance, chemical resistance, heat resistance, and electrical properties. It is used in a wide range of fields, such as paints, laminates, molding materials, and casting materials.

In recent years, particularly in the application of semiconductor encapsulating materials, semiconductor packages have tended to be thinner in order to cope with higher packaging densities.
OP type packages have also been used. Therefore, in order to cope with these, a sealing material having a low melt viscosity and a high fluidity is required.

[0004] Orthocresol novolak type epoxy resin (hereinafter referred to as "ECN") has been widely used as an epoxy resin composition satisfying such required characteristics, but the resin has excellent heat resistance. And had a defect of poor moisture resistance.

A sealing material using a dicyclopentadiene type epoxy resin as a high-performance semiconductor sealing material having excellent heat resistance and moisture resistance is disclosed in, for example, JP-A-61-29332.
No. 19, JP-A-61-168618 and U.S. Pat. No. 4,701,481.

[0006]

However, when any of the above epoxy resin compositions uses a high melt viscosity of the epoxy resin, the fluidity at the time of molding is poor. In addition to the problem that defects such as misalignment of the lead frame occur when sealing microstructured chips, voids occur in molded products when epoxy resin with low melt viscosity is used. In any case, there is a problem that the moldability is inferior.

An object of the present invention is to provide an epoxy resin composition which is excellent in flowability of a resin composition and which does not cause voids or the like in a molded product, and which is extremely excellent in moldability as compared with the prior art; It is another object of the present invention to provide a semiconductor encapsulating material that does not cause displacement of a lead frame in semiconductor encapsulating material applications and that can effectively suppress generation of voids.

[0008]

Means for Solving the Problems As a result of intensive studies, the present inventors have found that a polyglycidyl ether of a resin in which an alicyclic hydrocarbon group is bonded to a phenol as a bonding group is used as an epoxy resin. It has been found that the above problems can be solved by using a specific amount of a compound having two aromatic hydrocarbon nuclei per molecule of the above, and the present invention has been completed.

Accordingly, the present invention is a polyglycidyl ether of a resin bound phenols an alicyclic hydrocarbon group as binding Semmoto, the aromatic hydrocarbon nucleus per molecule 2
A compound having pieces in a proportion of 40 to 70 wt%, or
The melt viscosity at 150 ° C. is 1.0 poise or less.
An epoxy resin composition comprising an epoxy resin (A) and a curing agent (B) as essential components, and
A polyglycidyl ether resin bound phenols an alicyclic hydrocarbon group as binding Semmoto, a compound having two aromatic hydrocarbon nucleus per molecule in a proportion of 40 to 70 wt%, And its melt viscosity at 150 ° C.
A semiconductor encapsulating material comprising, as essential components , an epoxy resin (A), a curing agent (B) and an inorganic filler (C) having a value of 1.0 poise or less .

The epoxy resin (A) used in the present invention is a polyglycidyl ether of a resin in which an alicyclic hydrocarbon group is bonded to a phenol with a bonding group, and an aromatic hydrocarbon nucleus per molecule. 40 to 7 compounds having two
Although it is contained at a ratio of 0% by weight, since the fluidity during molding when sealing a semiconductor is excellent, the moldability of a thin package is also excellent. In addition, the curability is excellent, so that the releasability from the mold is also excellent. In addition, the heat resistance after curing is excellent, and the reliability of the semiconductor device is excellent. In addition, water absorption is low,
Furthermore, the elastic modulus near the solder reflow temperature is low, so that the solder crack resistance when mounted on a printed circuit board is extremely excellent.

[0011] The epoxy resin (A), Ru der melt viscosity at 0.99 ° C. 1.0 poise or less. Fluidity at the time of molding is further improved, and it is possible to suppress the occurrence of defects such as shift movement of a lead frame when sealing a chip having a fine structure, particularly in a semiconductor sealing material application, and furthermore, the filling rate of an inorganic filler is reduced. As a result, the coefficient of linear expansion is increased to a satisfactory level, and the solder cracking resistance is significantly improved . In this case, the internal stress is also reduced, and problems such as crack generation during a heat cycle can be improved.

The phenols constituting the epoxy resin (A) are not particularly restricted but include, for example, phenol, cresol isomers, xylenol isomers and other alkyl groups having 1 to 6 carbon atoms. Alkyl-substituted phenol isomers, dialkyl-substituted phenols substituted with alkyl groups having 2 to 6 carbon atoms, trialkyl-substituted phenols substituted with alkyl groups having 2 to 6 carbon atoms, naphthol, dihydroxynaphthalene, Hydroquinone, resorcinol, bisphenol A,
Bisphenol F and the like, and a mixture thereof can be mentioned, but phenol and cresol or a mixture thereof are preferable from the viewpoint of property balance and ease of distillation and recovery during production.

The alicyclic hydrocarbon group constituting the epoxy resin (A) serves as a binding group for a phenol skeleton forming a glycidyl ether structure site of the epoxy resin, and the structure is not particularly limited. However, among them, those having a cyclohexane ring or a cyclohexene ring in the skeleton thereof are preferred because they have an excellent effect of improving the water resistance of the cured product. Among these, the effect is particularly remarkable. Specifically, divalent hydrocarbon groups based on unsaturated bonds in the molecular skeleton of dicyclopentadiene, limonene, or 3a, 4,7,7a-tetrahydroindene Is preferred. These compounds may be used alone or in combination of two or more. Further, among these, a divalent hydrocarbon group based on an unsaturated bond in the molecular skeleton of dicyclopentadiene is preferable because the heat resistance and the moisture resistance of the cured product can be further improved.

The epoxy resin (A) used in the present invention
Is a polyglycidyl ether of a polyphenol having a structure in which phenols are bonded via the above-mentioned bonding group. Various molecular weights are obtained depending on the number of aromatic hydrocarbon nuclei repeated by the bonding group. The epoxy resin (A) is obtained as a mixture of compounds having various numbers of nuclei, but in the present invention, a compound having two aromatic hydrocarbon nuclei per molecule (hereinafter, referred to as a compound having two aromatic nuclei).
This compound is abbreviated as "compound having two nuclei") in the resin in an amount of 40 to 70% by weight.

Here, the compound having two nuclei includes, specifically, a compound represented by the following general formula (1).

General formula (1)

[0017]

Embedded image

(In the general formula (1), X is an alicyclic hydrocarbon group, R ₁ is a hydrogen atom or a methyl group, R ₂ and R ₃ are each independently a halogen atom or a carbon atom having 1 to 1 carbon atoms.
Represents 10 alkyl groups. )

The ratio of the compound having two nuclei in the epoxy resin (A) is a value analyzed by gel permeation chromatography.

The method for obtaining the above-mentioned epoxy resin (A) is not particularly limited, and the above-mentioned phenol resin and the unsaturated alicyclic compound are subjected to a polyaddition reaction to give a phenol resin as an intermediate. After production, epihalohydrin may be reacted, or phenols, unsaturated alicyclic compound and epihalohydrin may be reacted at once. Among them, from the viewpoint that the melt viscosity of the obtained epoxy resin (A) can be adjusted to be lower, the former method of once producing a phenol resin by the polyaddition reaction and then reacting with the epihalohydrin is preferable.

The unsaturated alicyclic compound used herein includes, for example, dicyclopentadiene, tetrahydroindene, 4-vinylcyclohexene, 5-vinylnorborna
Examples include, but are not limited to, 2-ene, α-pinene, β-pinene, limonene, and the like.

Further, dicyclopentadiene is preferred from the viewpoint of a balance of properties, particularly, heat resistance and water resistance. Further, since dicyclopentadiene is contained in the petroleum fraction, industrial aliphatic dicyclopentadiene may contain other aliphatic or aromatic dienes as impurities, but heat resistance, curability, In consideration of moldability and the like, it is desirable to use a product having a purity of 90% by weight or more of dicyclopentadiene.

In the former method in which a phenol is subjected to a polyaddition reaction with an unsaturated alicyclic compound and then an epihalohydrin is reacted, the production conditions of the phenol resin as an intermediate are particularly limited. Although it is not a thing, in order to set the content of the compound having 2 nuclei in the range of 40 to 70% by weight, it is necessary to adjust the molar ratio of phenols and polycyclic aliphatic dienes during the reaction. Preferably
It is preferable to use 4 moles or more of phenols per 1 mole of unsaturated alicyclic compound. Among them, when the phenol / unsaturated alicyclic compound is synthesized within the range of 2.5 / 1 to 15/1 (molar ratio), the above-mentioned epoxy resin (A)
To obtain a preferred polyaddition reactant.

The method for producing the polyadduct is described in detail below. A polyaddition catalyst is added to a molten or solution of phenol, and an unsaturated alicyclic compound is appropriately added thereto. The addition reaction is allowed to proceed, and thereafter, excess phenols are recovered by distillation to obtain a polyaddition reaction product. Here, examples of the polyaddition catalyst include inorganic acids such as hydrochloric acid and sulfuric acid, organic acids such as p-toluenesulfonic acid, and Lewis acids such as AlCl3 and BF3.

Next, the desired epoxy resin (A) can be obtained by reacting the thus obtained polyaddition reaction product with epihalohydrin. This reaction may be carried out according to a known method. The following reaction may be mentioned.

First, 2 is added to the hydroxyl group in the polyaddition reaction product.
3 to 10 equivalents, preferably 3 to 10 equivalents of epihalohydrin are dissolved from the viewpoint of excellent melt viscosity reducing effect, and then 0.8 to 1.2 equivalents to the hydroxyl group in the polyaddition product. 5 to 10% NaOH aqueous solution
It takes 3 to 5 hours at a temperature of 0 to 80 ° C. to be lowered. After the lowering, the stirring is continued at that temperature for about 0.5 to 2 hours. After standing, the lower saline solution is discarded. Next, the excess epihalohydrin is recovered by distillation to obtain a crude resin. Toluene, MIBK
And the like, and the desired resin can be obtained through a water washing-dehydration-filtration-desolvation step. In addition, a solvent such as dioxane or DMSO may be used in the reaction for the purpose of reducing the amount of impurity chlorine.

The epihalohydrin used herein includes:
Epichlorohydrin is the most common, but epiiodohydrin, epibromohydrin, β-methylepichlorohydrin and the like can also be used.

The epoxy resin (A) thus obtained
Has a melt viscosity at 150 ° C. of 1.0 poise or less and a binuclear component content in the range of 40 to 70% by weight, and further has an epoxy equivalent of 245 to 28
Those having a range of 5 g / eq are preferable because the above-mentioned excellent properties are more remarkable.

As the curing agent (B) used in the present invention, all compounds usually used as curing agents for epoxy resins can be used, and are not particularly limited. Examples thereof include diethylene triamine, Aliphatic amines such as triethylenetetramine, aromatic amines such as metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, phenol novolak resin, orthocresol novolak resin, bisphenol A novolak resin, bisphenol F novolak resin, and phenols-diamine Cyclopentadiene polyaddition type resin, dihydroxynaphthalene novolak resin, polyhydric phenols having xylidene as a binding group, phenol-aralkyl resins, naphthol resins, polyamide resins and modified products thereof Maleic anhydride, phthalic anhydride, hexahydrophthalic anhydride, acid anhydride curing agents such as pyromellitic anhydride, dicyandiamide, imidazoles, B
Latent curing agents such as F3-amine complexes and guanidine derivatives. Above all, for semiconductor encapsulants, aromatic hydrocarbon-formaldehyde resins such as the above-mentioned phenol novolak resins have excellent curability, moldability and heat resistance, and phenol-aralkyl resins have curability, moldability and low water absorption. It is preferable because it is excellent.

The amount of the curing agent (B) used is not particularly limited as long as it can cure the epoxy resin, but is preferably not limited, but is preferably the number of epoxy groups contained in one molecule of the epoxy resin used. The amount is such that the number of active hydrogens in the curing agent is close to the equivalent.

When each of the above compounds is used as a curing agent, a curing accelerator can be appropriately used.

As the curing accelerator, any known and commonly used curing accelerators can be used. Examples thereof include phosphorus compounds, tertiary amines, imidazoles, metal salts of organic acids, Lewis acids, and amine complex salts. Not only one kind but also two or more kinds can be used in combination.

The epoxy resin composition of the present invention contains the above-mentioned epoxy resin (A) and the curing agent (B) as essential components, but is further cured by using an inorganic filler (C) in combination. This is preferable because the mechanical strength and hardness of the product can be increased. In particular, as a semiconductor sealing material of the present invention, an inorganic filler is an essential component, and can not only increase mechanical strength and hardness, but also achieve a low water absorption and a low coefficient of linear expansion, and enhance a crack prevention effect. be able to.

The compounding amount is not particularly limited, but when it is used in the range of 75 to 95% by weight in the composition, the characteristics thereof are particularly remarkable. It is preferable because the cracking property is very excellent.

It should be noted that, even if an inorganic filler is added in an amount of 75% by weight or more in the present invention, fluidity,
That is, the moldability is not impaired at all. .

The inorganic filler (C) is not particularly limited, but may be fused silica, crystalline silica, alumina,
Examples include talc, clay, and glass fiber. Among these, fused silica and crystalline silica are generally used especially for semiconductor encapsulating materials, and fused silica is particularly preferred from the viewpoint of excellent fluidity. Spherical silica, pulverized silica, and the like can also be used.

The epoxy resin composition of the present invention may use another epoxy resin (D) in addition to the above-mentioned epoxy resin (A) which is an essential component. As the epoxy resin (D) used at this time, any known and commonly used epoxy resin can be used. For example, bisphenol A diglycidyl ether type epoxy resin, phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, bisphenol A novolak type Examples include, but are not limited to, epoxy resins, bisphenol F novolak type epoxy resins, brominated phenol novolak type epoxy resins, naphthol novolak type epoxy resins, and biphenyl type bifunctional epoxy resins.

Of these, ortho-cresol novolak type epoxy resins are particularly preferred from the viewpoint of excellent heat resistance, and biphenyl type bifunctional epoxy resins are preferred from the viewpoint of excellent fluidity.

If necessary, various known and commonly used additive components such as a coloring agent, a flame retardant, a release agent, and a coupling agent can be appropriately blended. Further, in order to prepare a molding material from the epoxy resin composition of the present invention, the epoxy resin, the curing agent, the curing accelerator, and other additives are sufficiently uniformly mixed by a mixer or the like, and then further heated or kneaded. Can be obtained by melt-kneading, etc., pulverizing after injection or cooling.

The thus obtained epoxy resin composition of the present invention is not particularly limited in its use.
For example, semiconductor sealing materials and varnishes for use in electric laminates because of their excellent solvent solubility in epoxy resins. Further, an oligomer type epoxy resin obtained by modifying the epoxy resin of the present invention with a brominated polyhydric phenol may be used for a laminate. Furthermore, a system in which a polyfunctional epoxy resin is blended or modified to impart heat resistance can also be used.

In order to obtain a polymer type epoxy resin, it is also possible to use the resin as a raw material resin for the two-stage reaction. Among these applications, semiconductor encapsulant applications are extremely useful, in particular, due to their advantages such as remarkably excellent solder crack resistance.

The semiconductor encapsulating material of the present invention includes:
Particularly preferred compositions of the above-mentioned components include (A) to
(C) In addition to each component, terabromo A epoxy resin,
Brominated epoxy resins such as brominated phenol novolak type epoxy resins, flame retardants such as antimony trioxide and hexabromobenzene, coloring agents such as carbon black and red iron oxide, release agents such as natural wax and synthetic wax, and silicone oil It is preferable to appropriately add additives such as low-stress additives such as synthetic rubber and silicone rubber.

[0043]

Next, the present invention will be described in detail with reference to Production Examples, Examples and Comparative Examples. In the examples, all parts are by weight unless otherwise specified.

The melt viscosity is 50 Hz.
eseach equipment LTD. "ICI"
CONE & PLATE VISCOMETER ". The content of the binuclear component is determined by a gel permeation chromatography (GP) manufactured by Tosoh Corporation.
C) "(measurement conditions: flow rate = 1.0 ml / min, pressure = 92)
Kg / cm ² , column = G4, ³ , ² , 2HXL, detector = RI 32 × 10 ⁻⁶ RIUFS). The softening point is "Softening Point Measuring Device" (Heating: H
U-MK, detector ASP-M2) measured.

Production Example 1 940 g of phenol in a four-necked flask with a stirrer, thermometer
(10 mol) was added to 18 g of BF3.phenol complex and mixed well. Then 185 g of dicyclopentadiene
(1.4 mol) was added over 1 hour while maintaining the temperature in the system at 90 to 100 ° C. Thereafter, the temperature in the system was maintained at 100 ° C., and the mixture was heated and stirred for 3 hours, and a magnesium compound “KW-1000” (trade name; Kyowa Chemical Industry Co., Ltd.)
(Manufactured by Co., Ltd.), and the mixture was stirred for 30 minutes to deactivate the catalyst, and then the reaction solution was filtered. Excess phenol is distilled and recovered from the obtained clear solution to obtain a brown solid resin 40.
8 g were obtained. The softening point of this resin was 96 ° C., and the hydroxyl equivalent was 169 g / eq.

Epichlorohydrin 9 was added to 338 g of this resin.
25 g (10 mol) are added and dissolved. And 2 at 80 ° C
440 g (2.2 mol) of 0% NaOH was added dropwise with stirring over 3 hours, and stirring was further continued for 30 minutes, and then allowed to stand. The lower saline solution was discarded, and epichlorohydrin was distilled and collected at 150 ° C.
g was added, and 250 g of water was further added, followed by washing at 80 ° C. After discarding the lower layer of washing water, MIBK was desolvated at 150 ° C. through dehydration and filtration to obtain 427 g of the desired epoxy resin (A). This resin was a brown solid, had a softening point of 63 ° C., a melt viscosity at 150 ° C. of 0.7 poise, a binuclear component content of 54% by weight, and an epoxy equivalent of 257 g / eq.

Production Example 2 411 g of an epoxy resin (B) was obtained in the same manner as in Example 1 except that the intermediate obtained in Production Example 1 was used and epichlorohydrin was changed to 678 g (7 mol). This resin was a brown solid, had a softening point of 65 ° C., a melt viscosity at 150 ° C. of 1.0 poise, a binuclear component content of 48% by weight, and an epoxy equivalent of 267 g / eq.

Production Example 3 Example 1 was repeated except that the intermediate obtained in Production Example 1 was used and the amount of epichlorohydrin was changed to 1110 g (12 mol).
In the same manner as in the above, 430 g of an epoxy resin (C) was obtained. This resin was a brown solid, had a softening point of 62 ° C., a melt viscosity at 150 ° C. of 0.5 poise, a binuclear component content of 58% by weight, and an epoxy equivalent of 253 g / eq.

Production Example 4 428 g of an epoxy resin (D) was obtained in the same manner as in Production Example 1 except that the amount of phenol used for producing the intermediate was changed to 1222 g (13 mol). This resin was a brown solid, had a softening point of 58 ° C., a melt viscosity at 150 ° C. of 0.4 poise, a binuclear component content of 65% by weight, and an epoxy equivalent of 248 g / eq.

Production Example 5 Phenol used for producing an intermediate was converted to cresol 1006.
422 g of an epoxy resin (E) was obtained in the same manner as in Production Example 3 except that the amount was changed to g (10 mol). This resin is a brown solid, has a softening point of 64 ° C., a melt viscosity at 150 ° C. of 0.9 poise, a binuclear component content of 52% by weight, and an epoxy equivalent of 2%.
It was 74 g / eq.

Production Example 6 Phenol alone for producing an intermediate was replaced with phenol 46
425 g of an epoxy resin (F) was obtained in the same manner as in Production Example 3 except that the mixture was changed to a mixture of 3 g (5 mol) and 530 g (5 mol) of cresol. This resin was a brown solid, had a softening point of 63 ° C., a melt viscosity at 150 ° C. of 0.7 poise, and an epoxy equivalent of 264 g / eq.

Production Comparative Example 1 Production Example 1 was carried out except that the intermediate obtained in Production Example 1 was used and epichlorohydrin was changed to 416 g (4.5 mol).
In the same manner as in the above, 400 g of an epoxy resin (G) was obtained. This resin was a brown solid, had a softening point of 71 ° C., a melt viscosity at 150 ° C. of 2.4 poise, a binuclear component content of 38% by weight, and an epoxy equivalent of 287 g / eq.

Production Comparative Example 2 526 g (4 mol) of phenol used for producing an intermediate
Except that the softening point was changed to 113.
421 g of the intermediate at ℃ were obtained. Its hydroxyl equivalent is 181
g / eq. Using this intermediate, 402 g of an epoxy resin (H) was obtained in the same manner as in Production Example 1. This resin is a brown solid and has a softening point of 82 ° C., a melt viscosity at 150 ° C. of 4.0 poise, a binuclear component content of 32% by weight, and an epoxy equivalent of 2%.
It was 91 g / eq.

Production Comparative Example 3 A softening point of 8 was obtained in the same manner as in Production Example 1 except that the phenol used in producing the intermediate was changed to 1410 g (15 mol).
380 g of an intermediate at 1 ° C. were obtained. Its hydroxyl equivalent is 16
It was 4 g / eq. Using this intermediate, 456 g of an epoxy resin (I) was obtained in the same manner as in Production Example 1. This resin is a brown solid and has a softening point of 49 ° C and a melt viscosity at 150 ° C of 0.1.
The 5-poise, binucleate component content was 77% by weight, and the epoxy equivalent was 231 g / eq.

Examples 1 to 8 and Comparative Examples 1 to 6 A mixture prepared according to the composition shown in Table 1 was kneaded with a hot roll at 100 ° C. for 8 minutes, and then ground to 1200 to 1400 kg / cm. ^A tablet was prepared at a pressure of ² and was sealed with a transfer molding machine under the conditions of a plunger pressure of 80 kg / cm ² , a mold temperature of 175 ° C., and a molding time of 100 seconds. A flat package was prepared as a test piece for evaluation. Then 175
Post-curing was carried out at 8 ° C. for 8 hours.

The test piece was measured for void generation rate using an ultrasonic tester. The measurement was performed at 175 ° C. and 70 Kg / cm 2 using a mold conforming to the spiral flow EMMI standard. Using this test piece for evaluation, 85 ° C, 85%
The water absorption under RH conditions, the glass transition temperature by DMA and the dynamic viscoelasticity were measured.

Further, the test piece was left in an atmosphere of 85 ° C. and 85% RH for 72 hours to perform a moisture absorption treatment.
It was immersed in a solder bath at 0 ° C. for 10 seconds, and the crack generation rate at that time was examined to evaluate the solder crack resistance. The number of test pieces is 20 pieces. The results are also shown in Table 1.

Here, DCE-400 is a dicyclopentadiene-cresol polyadduct type epoxy resin (trade name: DCE-400, softening point 92, manufactured by Sanyo Kokusaku Pulp Co., Ltd.)
C, epoxy equivalent 310 g / eq, binuclear component content 28% by weight), TACTIX 556 is dicyclopentadiene-
Phenol polyadduct type epoxy resin (The Dow Chemical C
Ompany product name: TACTIX556, semi-solid, epoxy equivalent 229 g / eq, binucleate component content 80% by weight), N-665 is orthocresol novolac type epoxy resin (manufactured by Dainippon Ink and Chemicals, Inc.) : E
PICLON N-665, softening point 68 ° C, epoxy equivalent 208 g / eq), 153 is a tetrabromobisphenol A type epoxy resin (manufactured by Dainippon Ink and Chemicals, Inc., trade name: EPICLON 153, softening point 70 ° C, epoxy equivalent) TD-2131 is a phenol novolak resin (Dainippon Ink & Chemicals, Inc.)
Phenolite TD-2131, softening point 80 ° C, hydroxyl equivalent 104 g / eq).

[0059]

[Table 1]

[0060]

[Table 2]

[0061]

[Table 3]

[0062]

According to the present invention, the resin composition is excellent in fluidity, and does not generate voids or the like in a molded product. An excellent epoxy resin composition and a semiconductor encapsulation material that does not cause displacement of the lead frame in semiconductor encapsulation applications, can significantly suppress the occurrence of voids, and has good solder crack resistance. A stop material can be provided.

Claims (7)

(57) [Claims] 1. A polyglycidyl ether resin an alicyclic hydrocarbon group bonded with phenol as binding Semmoto, of a compound having two aromatic hydrocarbon nucleus per molecule 40 to 70 wt% Containing at a rate of 150
An epoxy resin composition comprising, as essential components , an epoxy resin (A) having a melt viscosity at 1.0 ° C. of 1.0 poise or less and a curing agent (B). Wherein the epoxy resin (A) is an epoxy resin composition according to claim 1, wherein the epoxy equivalent is in a range of 245~285g / eq. Wherein phenol is a phenol, claim 1 also alicyclic hydrocarbon group is a divalent hydrocarbon group based on unsaturated bonds in the molecular structure of dicyclopentadiene
Is the epoxy resin composition according to 2. 4. A polyglycidyl ether of a resin in which an alicyclic hydrocarbon group is bonded to a phenol with a bonding group, and a compound having two aromatic hydrocarbon nuclei per molecule is 40 to 70% by weight. %, And 1
A semiconductor encapsulating material comprising, as essential components, an epoxy resin (A) having a melt viscosity at 50 ° C. of 1.0 poise or less, a curing agent (B), and an inorganic filler (C). 5. The semiconductor sealing material according to claim 4 , wherein the epoxy resin (A) has an epoxy equivalent in the range of 245 to 285 g / eq. 6. The semiconductor encapsulating material according to claim 4 , wherein a filling rate of the inorganic filler (C) in the composition is 75 to 95% by weight. 7. The phenol is phenol, and the alicyclic hydrocarbon group is a divalent hydrocarbon group based on an unsaturated bond in the molecular structure of dicyclopentadiene .
7. The semiconductor sealing material according to any one of 6 .