JP3115569U - Computer case with built-in heat dissipation device - Google Patents

Computer case with built-in heat dissipation device Download PDF

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JP3115569U
JP3115569U JP2005006387U JP2005006387U JP3115569U JP 3115569 U JP3115569 U JP 3115569U JP 2005006387 U JP2005006387 U JP 2005006387U JP 2005006387 U JP2005006387 U JP 2005006387U JP 3115569 U JP3115569 U JP 3115569U
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computer case
heat dissipation
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陳▲うえん▼翰
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Abstract

【課題】 水冷放熱システムをコンピュータ筐体内の設置平台に設置し、空間利用を節約できると同時にコンピュータ筐体の美観を保つことができ、水冷放熱システムの水チューブを外部に接続する必要がないため、長さを短く設けることができ、コンピュータ筐体内の装置に接触し破損させる危険を防止した、放熱装置内蔵式コンピュータ筐体の提供。
【解決手段】 コンピュータ筐体内部に設置された設置平台と、該設置平台を覆う開閉自在の蓋体を含み、該設置平台に水冷放熱システム設備を設置するための専用空間が設けられ、水冷放熱システムがコンピュータ筐体と一体を成してその内部に設置され、該蓋体に該コンピュータ筐体内の熱気をコンピュータ筐体外部に排出するための複数の空気孔を設け、該設置平台の辺縁部に水の注入と排出を行うための水交換孔を設ける。
【選択図】 図3
PROBLEM TO BE SOLVED: To install a water-cooling heat dissipation system on an installation base in a computer case, and to save space use, while maintaining the aesthetic appearance of the computer case, and without having to connect the water tube of the water-cooling heat dissipation system to the outside. Providing a computer case with a built-in heat dissipation device that can be provided with a short length and prevents the risk of touching and damaging the device in the computer case.
An installation platform including an installation platform and an openable / closable cover that covers the installation platform, and a dedicated space for installing a water-cooling heat radiation system facility is provided on the installation platform, The system is integrated with the computer case and installed therein, and the lid is provided with a plurality of air holes for discharging hot air in the computer case to the outside of the computer case, Water exchange holes for injecting and discharging water are provided in the section.
[Selection] Figure 3

Description

本考案は、放熱装置内蔵式コンピュータ筐体に関し、詳細には、コンピュータ筐体内の空間運用を変え、コンピュータ筐体内部に設置平台を設け、該設置平台で区画した空間を水冷放熱システムの水タンク設備、放熱装置設備、ファン設備及びモータ設備を設置するための専用空間とし、水冷放熱システムをコンピュータ筐体内に一体を成して設置でき、且つ、開閉自在の蓋体を設けて設置平台を覆い隠したり露出させたりすることができ、さらに該蓋体にコンピュータ筐体内の熱気を排出するための複数の空気孔を設けた、放熱装置内蔵式コンピュータ筐体に関する。   The present invention relates to a computer case with a built-in heat radiating device, and more specifically, the space operation in the computer case is changed, an installation flat base is provided inside the computer case, and the space partitioned by the installation flat base is a water tank of the water cooling heat dissipation system. A dedicated space for installing equipment, heat dissipation equipment, fan equipment, and motor equipment, and a water-cooled heat dissipation system can be installed in a computer case, and an openable lid is provided to cover the installation platform. The present invention relates to a computer case with a built-in heat dissipation device, which can be hidden or exposed, and further provided with a plurality of air holes for discharging hot air in the computer case.

図1及び図2に示すように、本体Aは一般的な従来のコンピュータ筐体であり、水タンク設備B2、放熱装置設備B3、ファン設備B4、モータ設備B5及び熱伝導板B6を含む水冷放熱システムBを設置したい場合、コンピュータ筐体周囲に水冷放熱システムBに必要な設備を設置するための空間を確保する必要があり、空間が占用されるだけでなく、騒音上の問題もある。   As shown in FIGS. 1 and 2, the main body A is a general conventional computer case, and includes water-cooled heat radiation including a water tank facility B2, a heat dissipation device facility B3, a fan facility B4, a motor facility B5, and a heat conduction plate B6. When it is desired to install the system B, it is necessary to secure a space for installing the equipment necessary for the water-cooling heat dissipation system B around the computer case, which not only occupies the space but also has a problem in noise.

また、水冷放熱システムBの設備間を水チューブB1で接続し、熱伝導板B6をコンピュータ筐体外部から内部のマザーボードCPU(Central Processing Unit)上に接続する必要があり、該熱伝導板B6に接続された水チューブB1が外部設備の位置移動に伴い移動され、コンピュータ筐体内の装置に接触し破損してしまうことがある。   Moreover, it is necessary to connect the facilities of the water-cooling heat dissipation system B with the water tube B1, and to connect the heat conduction plate B6 from the outside of the computer casing to an internal motherboard CPU (Central Processing Unit). The connected water tube B1 may be moved along with the movement of the position of the external equipment, and may come into contact with and damage the device in the computer casing.

このため、上述の問題をいかに排除するかが本考案の解決する技術的問題である。   Therefore, how to eliminate the above problem is a technical problem to be solved by the present invention.

本考案の目的は、水冷放熱システムをコンピュータ筐体内の設置平台に設置し、空間利用を節約できると同時にコンピュータ筐体の美観を保つことができ、水冷放熱システムの水チューブを外部に接続する必要がないため、長さを短く設けることができ、コンピュータ筐体内の装置に接触し破損させる危険を防止した、放熱装置内蔵式コンピュータ筐体を提供することにある。   The purpose of the present invention is to install a water-cooling heat dissipation system on the installation base in the computer case, so that space can be saved and at the same time the aesthetics of the computer case can be maintained. Therefore, it is an object of the present invention to provide a computer case with a built-in heat dissipation device which can be provided with a short length and prevents the risk of contact with and damage to the device in the computer case.

本考案の放熱装置内蔵式コンピュータ筐体は設置平台と蓋体を含み、該設置平台に水冷放熱システム設備を設置するための専用空間が設けられ、該設置平台がコンピュータ筐体内部に設置され、水冷放熱システムがコンピュータ筐体と一体を成してその内部に設置され、該蓋体がコンピュータ筐体の外縁と対称を呈し、開閉自在に設置平台を覆って設置され、該蓋体でコンピュータ筐体内の設置平台を覆うか、外部に露出して使用することができ、該蓋体に該コンピュータ筐体内の熱気をコンピュータ筐体外部に排出するための複数の空気孔を設け、該設置平台の辺縁部に水の注入と排出を行うための水交換孔を設け、該水冷放熱システムの水タンク設備、放熱装置設備、ファン設備及びモータ設備が該コンピュータ筐体内の設置平台に設置され、該水冷放熱システムとコンピュータ筐体内部の装置間の距離が短縮され、該水冷放熱システムを接続する水チューブの長さが短縮されることを特徴とする。   The computer case with built-in heat dissipation device of the present invention includes an installation flat base and a lid, and the installation flat base is provided with a dedicated space for installing a water-cooling heat dissipation system facility, and the installation flat base is installed inside the computer case, A water-cooling heat dissipation system is integrated with the computer case and installed inside the computer case. The cover is symmetrical with the outer edge of the computer case and is installed so as to be openable and closable. The installation platform can be used by covering the installation platform or exposed to the outside, and the lid is provided with a plurality of air holes for exhausting hot air in the computer enclosure to the outside of the computer enclosure. A water exchange hole for injecting and discharging water is provided at the edge, and the water tank equipment, heat radiator equipment, fan equipment, and motor equipment of the water-cooling heat radiation system are installed on the installation base in the computer case It is, reduces the distance between the devices of the water-cooling heat dissipation system and the computer housing portion, wherein the length of the water tube connecting the water cooling heat dissipation system is shortened.

本考案の進歩性と実用性をよりはっきりと示すため、以下、従来のものと比較して分析する。
《従来品の欠点》
1.水冷放熱システムの設備をコンピュータ筐体の周囲に設置しなければならず、空間上の無駄を生じる。
2.水冷放熱システムを設置するとき、コンピュータ筐体を改造しなければならず、施工が難しい。
3.水冷放熱システムは外部に水チューブを接続しなければならず、水冷放熱システムの設備を移動させるとき、水チューブが移動に伴って動き、コンピュータ筐体内の装置に接触し、破損してしまうことがある。
4.コンピュータ筐体を開いて水冷放熱システムを設置した後、水チューブが外部に接続されているため、コンピュータ筐体を元通りに組み立てることができず、美観が損なわれる。
5.水冷放熱システムに接続された水チューブが長すぎ、破損と漏水が起こりやすい。
In order to show the inventiveness and practicality of the present invention more clearly, the following analysis is made in comparison with the conventional one.
《Disadvantages of conventional products》
1. Water-cooling heat dissipation system equipment must be installed around the computer case, resulting in wasted space.
2. When installing a water-cooled heat dissipation system, the computer housing must be modified, making it difficult to install.
3. The water-cooled heat dissipation system must have a water tube connected to the outside, and when moving the water-cooled heat dissipation system equipment, the water tube moves as it moves, touching the device in the computer housing, and may be damaged. is there.
4). After opening the computer casing and installing the water cooling heat dissipation system, the water tube is connected to the outside, so that the computer casing cannot be reassembled and the aesthetics are impaired.
5. The water tube connected to the water-cooling heat dissipation system is too long and is prone to breakage and water leakage.

《本考案の利点》
1.水冷放熱システムをコンピュータ筐体内の設置平台に設置するため、空間利用を節約できる。
2.設置した水冷放熱システムの水チューブは外部に接続されないため、コンピュータ筐体内の装置に接触し破損させることがない。
3.水冷放熱システムがコンピュータ筐体内に設置され、蓋体で隠されるため、コンピュータ筐体の美観が保たれる。
4.設置が便利でコンピュータ筐体を改造する必要がなく、蓋体を開けばすぐに水冷放熱システムを設置平台に設置できる。
5.水冷放熱システムがコンピュータ筐体内に設置されているため、接続する水チューブの長さを短くすることができ、水チューブが長すぎることによる破損や漏水の問題を防止することができる。
6.コンピュータ筐体内の熱気が熱対流効果で運ばれ、水冷放熱システムのファン設備が迅速にこの熱気を蓋体の空気孔から排出することができ、高い放熱効果が得られる。
7.進歩性と実用性を兼ね備えている。
8.産業的競争力が向上される。
<Advantages of the present invention>
1. Space-saving can be saved because the water-cooling heat dissipation system is installed on the installation platform in the computer case.
2. Since the water tube of the installed water-cooling heat dissipation system is not connected to the outside, it does not come into contact with or damage the device in the computer casing.
3. Since the water-cooling heat dissipation system is installed in the computer casing and hidden by the lid, the aesthetic appearance of the computer casing is maintained.
4). Installation is convenient and there is no need to modify the computer case, and a water-cooled heat dissipation system can be installed on the installation base as soon as the lid is opened.
5. Since the water-cooling heat dissipation system is installed in the computer casing, the length of the water tube to be connected can be shortened, and damage due to the water tube being too long and problems of water leakage can be prevented.
6). The hot air in the computer case is carried by the heat convection effect, and the fan equipment of the water-cooled heat dissipation system can quickly exhaust this hot air from the air hole of the lid, so that a high heat dissipation effect is obtained.
7). It has both inventive step and practicality.
8). Industrial competitiveness is improved.

以下、本考案について図面と具体的な実施例に基づき、詳細に説明する。本考案の放熱装置内蔵式コンピュータ筐体は、図3及び図4に示すように、コンピュータ筐体C内部の上方に設置平台C1及び蓋体C2を設置し、該設置平台C1で区画した空間を水冷放熱システムの水タンク設備、放熱装置設備、ファン設備及びモータ設備を設置するための専用空間とする。該設置平台C1は、コンピュータ筐体C内部に設置されるため、水冷放熱システムを設置平台C1に設置するとき、水冷放熱システムとコンピュータ筐体内部の装置間の距離が近くなり、水チューブで接続する長さを短くでき、水チューブが長すぎることによる破損や漏水の発生を防止すると共に、空間利用を節約し、環境の美観を保つことができる。該設置平台C1の辺縁部に水交換孔C4を設け、水の注入及び排出に用い、水冷放熱システム内の水はコンピュータ筐体Cを分解することなく交換を行うことができる。   Hereinafter, the present invention will be described in detail based on the drawings and specific embodiments. As shown in FIGS. 3 and 4, the computer case with a built-in heat dissipation device of the present invention is provided with an installation base C1 and a cover C2 above the interior of the computer case C, and a space partitioned by the installation base C1. A dedicated space for installing water tank equipment, heat radiation equipment, fan equipment, and motor equipment for the water-cooling heat radiation system. Since the installation flat base C1 is installed inside the computer casing C, when the water cooling heat dissipation system is installed on the installation flat base C1, the distance between the water cooling heat dissipation system and the device inside the computer casing is reduced, and is connected by a water tube. It is possible to shorten the length of the water tube, prevent breakage and leakage due to the water tube being too long, save space use, and maintain the aesthetics of the environment. A water exchange hole C4 is provided at the edge of the installation flat base C1, and is used for injecting and discharging water. The water in the water-cooled heat dissipation system can be exchanged without disassembling the computer casing C.

蓋体C2は設置平台C1を覆うために設置され、設置平台C1をコンピュータ筐体C内に隠すことができ、騒音を阻隔すると同時に美観を保つことができる。また、蓋体C2を開いて設置平台C1を外部に露出することもでき、設置時の利便性を高め、且つ、水冷放熱システム内の放熱装置設備はファン設備により埃がたまることがあるが、該蓋体C2を開くと掃除がしやすく便利である。該蓋体C2はさらに複数の空気孔C3を備え、これにより設置平台C1上の水冷放熱システム内に設置されたファン設備がコンピュータ筐体C内の熱気を迅速にコンピュータ筐体Cの外へ排出でき、優れた放熱効果を発揮することができる。   The lid C2 is installed to cover the installation flat base C1, and the installation flat base C1 can be hidden in the computer casing C, so that noise can be blocked and at the same time an aesthetic appearance can be maintained. In addition, the lid C2 can be opened to expose the installation flat base C1 to the outside, improving the convenience during installation, and the heat radiation equipment in the water-cooled heat radiation system may accumulate dust due to the fan equipment. Opening the lid C2 is easy to clean and convenient. The lid C2 further includes a plurality of air holes C3, so that the fan equipment installed in the water-cooled heat dissipation system on the installation flat base C1 quickly exhausts the hot air in the computer case C to the outside of the computer case C. And can exhibit an excellent heat dissipation effect.

本考案の実施方式は、図5及び図6に示すように、コンピュータ筐体Cの上方に設置平台C1及び蓋体C2を設置し、該設置平台C1で区画した空間を、水タンク設備B2、放熱装置設備B3、ファン設備B4及びモータ設備B5を含む水冷放熱システムを設置する空間として用いる。水冷放熱システムはコンピュータ筐体C内部に設置されるため、空間利用を節約できる。開閉が可能な蓋体C2は設置平台C1を覆うために設置され、設置平台C1をコンピュータ筐体C内に隠すことができ、開けると設置平台C1が外部に露出される。該蓋体C2はさらに複数の空気孔C3を備え、設置平台C1上に設置された水冷放熱システムがコンピュータ筐体C内の熱気を該空気孔C3から排出することができ、優れた放熱効果を発揮する。   As shown in FIGS. 5 and 6, the implementation method of the present invention is such that an installation flat base C1 and a lid C2 are installed above a computer casing C, and a space defined by the installation flat base C1 is divided into a water tank facility B2, It is used as a space for installing a water-cooled heat dissipation system including the heat dissipation device facility B3, the fan facility B4, and the motor facility B5. Since the water-cooling heat dissipation system is installed inside the computer casing C, space use can be saved. The lid C2 that can be opened and closed is installed to cover the installation platform C1, and the installation platform C1 can be hidden in the computer case C, and when installed, the installation platform C1 is exposed to the outside. The lid C2 further includes a plurality of air holes C3, and the water-cooled heat dissipating system installed on the installation flat base C1 can exhaust the hot air in the computer case C from the air holes C3. Demonstrate.

水冷放熱システムの設備間は水チューブB1で接続され、水冷放熱システムはモータ設備B5の運転により、水タンク設備B2内の水源を水チューブB1の接続を介して循環流動させ、該水冷放熱システムの熱伝導板B6をコンピュータ筐体C内のマザーボードCPU(Central Processing Unit)上に接続し、動作中のCPU(Central Processing Unit)が発生する熱が熱伝導板B6内を循環流動する水によって運ばれ、CPU(Central Processing Unit)の温度が迅速に下がり、効果的に放熱を行うことができる。熱を帯びた水は、放熱装置設備B3によりその熱が吸収・分散され、且つ、ファン設備B4から送られる風により、放熱装置設備B3で分散された熱気が、蓋体C2の空気孔C3からコンピュータ筐体Cの外へ排出される。コンピュータ筐体C内の熱気は、熱対流効果で熱気Dが上方向へ流動する原理で、円滑に空気孔C3から排出され、冷気Eがコンピュータ筐体Cの下方空気孔Fから進入するため、コンピュータ筐体C内の放熱效果を高めることができ、且つ、蓋体C2はさらに騒音を阻隔する効果もあり、コンピュータ筐体Cの騒音提言効果を強化することができる。   The facilities of the water cooling heat dissipation system are connected by a water tube B1, and the water cooling heat dissipation system circulates and flows the water source in the water tank facility B2 through the connection of the water tube B1 by operating the motor facility B5. The heat conduction plate B6 is connected to a motherboard CPU (Central Processing Unit) in the computer casing C, and the heat generated by the operating CPU (Central Processing Unit) is carried by water circulating and flowing in the heat conduction plate B6. The temperature of the CPU (Central Processing Unit) can be quickly lowered to effectively dissipate heat. The heated water is absorbed and dispersed by the heat radiating device equipment B3, and the hot air dispersed by the heat radiating device equipment B3 is blown from the air holes C3 of the lid C2 by the wind sent from the fan equipment B4. It is discharged out of the computer casing C. The hot air in the computer case C is smoothly discharged from the air holes C3 on the principle that the hot air D flows upward due to the thermal convection effect, and the cold air E enters from the lower air holes F of the computer case C. The heat radiation effect in the computer case C can be enhanced, and the lid C2 has an effect of further blocking noise, and the noise recommendation effect of the computer case C can be enhanced.

以上で述べた本考案の説明は、最良の実施例に基づくものであり、本考案の権利範囲を制限するものではなく、本考案の明細書及び図面の内容に基づく同等効果を得る構造を、直接的または間接的にその他関連技術領域に用いたものはすべて本考案の要旨の範囲内に含まれるものとみなす。   The description of the present invention described above is based on the best embodiment, does not limit the scope of rights of the present invention, and has a structure for obtaining an equivalent effect based on the contents of the specification and drawings of the present invention. Anything directly or indirectly used in other related technical fields is considered to be included in the scope of the gist of the present invention.

上述のように、本考案は従来技術を打破する構造で、確実に増進を求める効果を得ることができ、且つ、関連技術を熟知していない人物でも容易に理解することができる。また、本考案は出願以前に公開されたことがなく、その進歩性と実用性は実用新案登録の出願要件を満たしているため、法に基づきここに実用新案登録を出願するものである。   As described above, the present invention has a structure that breaks down the prior art, can surely obtain the effect of seeking enhancement, and can be easily understood by a person who is not familiar with the related art. In addition, the present invention has not been published before the application, and its inventive step and practicality satisfy the application requirements for utility model registration.

従来のコンピュータ筐体の立体斜視図である。It is a three-dimensional perspective view of the conventional computer housing | casing. 従来のコンピュータ筐体に水冷放熱システムを取り付けた状態を示す立体斜視図である。It is a three-dimensional perspective view which shows the state which attached the water cooling heat dissipation system to the conventional computer housing | casing. 本考案のコンピュータ筐体の立体斜視図である。It is a three-dimensional perspective view of the computer case of this invention. 本考案のコンピュータ筐体の蓋体を開けた状態を示す立体斜視図である。It is a three-dimensional perspective view which shows the state which opened the cover body of the computer housing | casing of this invention. 本考案のコンピュータ筐体に水冷放熱システムを取り付けた状態を示す立体斜視図である。It is a three-dimensional perspective view which shows the state which attached the water cooling heat radiating system to the computer housing | casing of this invention. 本考案のコンピュータ筐体の使用時における熱気と冷気の流れを示す立体斜視図である。It is a three-dimensional perspective view showing the flow of hot air and cold air when using the computer case of the present invention.

符号の説明Explanation of symbols

A 本体
B 水冷放熱システム
B1 水チューブ
B2 水タンク設備
B3 放熱装置設備
B4 ファン設備
B5 モータ設備
B6 熱伝導板
C コンピュータ筐体
C1 設置平台
C2 蓋体
C3 空気孔
C4 水交換孔
D 熱気
E 冷気
F 下方空気孔
A body
B Water cooling heat dissipation system
B1 water tube
B2 Water tank equipment
B3 Heat dissipation equipment
B4 fan equipment
B5 Motor equipment
B6 heat conduction plate
C Computer case
C1 installation flat stand
C2 lid
C3 air hole
C4 water exchange hole
D Hot air
E cold
F Lower air hole

Claims (3)

設置平台と蓋体を含み、該設置平台に水冷放熱システム設備を設置するための専用空間が設けられ、該設置平台がコンピュータ筐体内部に設置され、水冷放熱システムがコンピュータ筐体と一体を成してその内部に設置されるコンピュータ筐体であって、該蓋体が開閉自在に設置平台を覆って設置され、且つ、コンピュータ筐体の外縁と対称を呈し、該蓋体でコンピュータ筐体内の設置平台を覆うか、外部に露出して使用することができ、該蓋体に該コンピュータ筐体内の熱気をコンピュータ筐体外部に排出するための複数の空気孔を設け、該設置平台の辺縁部に水の注入と排出を行うための水交換孔を設け、該水冷放熱システムの水タンク設備、放熱装置設備、ファン設備及びモータ設備が該コンピュータ筐体内の設置平台に設置され、該水冷放熱システムとコンピュータ筐体内部の装置間の距離が短縮され、該水冷放熱システムを接続する水チューブの長さが短縮されることを特徴とする放熱装置内蔵式コンピュータ筐体。   A dedicated space for installing the water-cooling heat dissipation system equipment is provided on the installation flatbed, including the installation flatbed and the lid, the installation flatbed is installed inside the computer case, and the water-cooling heat dissipation system is integrated with the computer case. A computer case installed inside the computer case, the cover body being installed so as to be openable and closable and covering the installation base, and symmetric with the outer edge of the computer case. The lid can be used by being exposed to the outside or being exposed to the outside, and the lid is provided with a plurality of air holes for discharging hot air in the computer casing to the outside of the computer casing, Provided with water exchange holes for injecting and discharging water, and water tank equipment, heat radiating equipment equipment, fan equipment and motor equipment of the water-cooled heat radiating system are installed on an installation base in the computer case, Reduces the distance between the devices of the cold heat dissipation system and the computer housing portion, the heat dissipation device built-in, characterized in that the length of the water tube connecting the water cooling heat dissipation system is shortened computer housing. 前記設置平台がさらに、コンピュータ筐体内部の前側、後ろ側、底部、上部、右側、左側及び該コンピュータ筐体の外縁に連続する部位のいずれかに設置可能である請求項1に記載の放熱装置内蔵式コンピュータ筐体。   The heat dissipating device according to claim 1, wherein the installation platform can be further installed at any one of a front side, a rear side, a bottom portion, an upper side, a right side, a left side, and a portion continuing to the outer edge of the computer case. Built-in computer housing. 前記設置平台がさらに、空冷放熱システム、熱導管放熱システム、MASC(Micro Air Conditioning System:マイクロ空調システム)放熱器及びその他放熱機能を備えたシステム設備を設置可能である請求項1に記載の放熱装置内蔵式コンピュータ筐体。   The heat dissipating apparatus according to claim 1, wherein the installation platform can further install an air cooling heat dissipating system, a heat conduit heat dissipating system, a MASC (Micro Air Conditioning System) heat dissipator, and other system facilities having a heat dissipating function. Built-in computer housing.
JP2005006387U 2005-08-08 2005-08-08 Computer case with built-in heat dissipation device Expired - Fee Related JP3115569U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005006387U JP3115569U (en) 2005-08-08 2005-08-08 Computer case with built-in heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005006387U JP3115569U (en) 2005-08-08 2005-08-08 Computer case with built-in heat dissipation device

Publications (1)

Publication Number Publication Date
JP3115569U true JP3115569U (en) 2005-11-10

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Country Status (1)

Country Link
JP (1) JP3115569U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108427486A (en) * 2018-05-23 2018-08-21 郑州天点科技有限公司 A kind of multifunctional table-type computer host box of high heat dispersion
CN112306178A (en) * 2020-11-09 2021-02-02 河南师范大学 Computer host with plug-in type mainboard configuration framework

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108427486A (en) * 2018-05-23 2018-08-21 郑州天点科技有限公司 A kind of multifunctional table-type computer host box of high heat dispersion
CN112306178A (en) * 2020-11-09 2021-02-02 河南师范大学 Computer host with plug-in type mainboard configuration framework

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