JP3114964B2 - Method for manufacturing insulating gate type field effect semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film transistor, and more particularly, to a thin film transistor which can be applied to a liquid crystal electro-optical device, a perfect contact type image sensor device and the like.

[0002]

2. Description of the Related Art Conventionally known insulated gate field effect semiconductor devices are widely used in various fields. This semiconductor device is formed on a silicon substrate, and is used as an IC or LSI by functionally integrating a large number of semiconductor elements.

On the other hand, a thin-film insulated-gate field-effect semiconductor device (hereinafter referred to as a TFT) formed by laminating thin films on an insulating substrate or the like, while being a similar insulated-gate field-effect semiconductor device.
) Has begun to be actively used in the switching element portion of the pixel of the liquid crystal electro-optical device, the driving circuit portion, the reading circuit portion of the contact type image sensor, and the like.

Since this TFT is formed by laminating a thin film on an insulating substrate by a vapor phase method as described above, it can be formed at a temperature as low as 500 ° C. at the highest, and can be made of inexpensive soda glass or borosilicate. Acid glass or the like can be used as the substrate.

As described above, a transistor can be formed on an inexpensive substrate, and the maximum dimension to be formed is limited only to the size of an apparatus for forming a thin film by a vapor phase method. It has the advantage of being able to be formed, and is therefore expected to be used for a liquid crystal electro-optical device having a matrix structure having a large number of pixels or a one-dimensional or two-dimensional image sensor, and has been partially realized.

FIG. 2 schematically shows a typical structure of this conventional TFT.

In FIG. 2, 1 is an insulating substrate made of glass, 2 is a thin film semiconductor made of an amorphous semiconductor, 3
Is a source and drain region, 7 is a source and drain electrode, and 8 is a gate electrode.

In general, such a TFT is formed by first forming a semiconductor film on a substrate and then patterning the semiconductor region 2 in a required portion in an island shape using a first mask. Next, the gate insulating film 6 is formed, a gate electrode material is formed thereon, and the gate electrode 8 and the gate insulating film 6 are patterned using a second mask.

[0009] Thereafter, using the photoresist mask formed by the third mask and the gate electrode 8 as a mask, the source and drain regions 3 are formed in the semiconductor region 2 in a self-aligned manner.
To form Thereafter, an interlayer insulating film 4 is formed. A contact hole is formed in the interlayer insulating film by using a fourth mask for connecting an electrode to the source / drain region 3. After the formation of the electrode material, the electrode material is patterned by the fifth mask to form the electrode 7, thereby completing the TFT.

[0010]

As described above, a general TFT uses five masks, and a complementary TFT requires six masks. Naturally, in the case of a complicated integrated circuit, more masks than this number are required. The use of such a large number of masks requires complicated steps in the process of manufacturing a TFT element, and naturally increases the number of times of mask alignment. They are,
This causes a decrease in the yield and productivity of TFT element production. Furthermore, an increase in the size of an electronic device using a TFT element, a reduction in the size of the TFT element itself, and a miniaturization of a pattern have been factors that further reduce these. TFT for that
In the fabrication process, a process that does not require complicated steps, a novel T that reduces the number of masks required for TFT fabrication
An FT structure was desired.

Therefore, the present invention relates to a novel structure and a simple manufacturing process of an insulated gate type field effect semiconductor device.
T can be manufactured.

[0012]

An anodized film of a material constituting the gate electrode is provided near the side surface of the gate electrode of the TFT according to the present invention, and the electrodes connected to the source and drain regions are formed on the source and drain regions. An electrode that is in contact with the upper surface and the side surface and is connected to the source and the drain extends over an insulating film provided near the side surface of the gate electrode.

That is, as shown in the schematic sectional view of the TFT of the present invention shown in FIG. 1, an anodic oxide film 10 is provided at least near the side surface of the gate electrode 8, and the source, The upper surface and the side surface of the drain region 3 slightly protrude, and the electrode 7 is connected to the source and drain regions 3 at the protruding portion, so that the connection area is large. Further, this electrode 7 extends to above the insulating film 11 on the gate electrode 8, and is patterned at this portion to be separated into individual electrodes.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The steps of fabricating a TFT having the structure shown in FIG. 1 are schematically shown in FIGS. In the drawings described in this specification, dimensions are merely different from actual dimensions and shapes because they are merely schematic for explanation.
Hereinafter, an example of a manufacturing process of the TFT of the present invention will be described with reference to FIGS.

First, as shown in FIG.
For example , if the insulating surface is made of heat-resistant crystallized glass 1
The semiconductor layer 2 is formed on a substrate having the same. As the semiconductor layer, a wide variety of semiconductors such as an amorphous semiconductor and a polycrystalline semiconductor can be used. As a forming method, a plasma CVD method,
A sputtering method, a thermal CVD method, or the like can be selected. Here, the following steps will be described using a polycrystalline silicon semiconductor as an example.

Next, a silicon oxide film 6 serving as a gate insulating film is formed on the semiconductor layer 2. Further, on this, aluminum is formed as an electrode material to be a gate electrode, here as an electrode material. Further, a silicon oxide film is formed as an insulating film 11 on the upper surface by a sputtering method. After this,
Using the first mask, the insulating film 11 and the gate electrode 8 are patterned. Thereafter, in the electrolytic solution for anodic oxidation, the vicinity of the side surface of the gate electrode 8 is anodized to convert at least the nonporous aluminum oxide 10 into
Fig. 3 (B) near the side of the gate electrode near the channel region.
It is formed as follows.

As the solution used for the anodic oxidation, a strong acid solution such as sulfuric acid, nitric acid, phosphoric acid or the like, or a mixed acid obtained by mixing tartaric acid, citric acid with ethylene glycol, propylene glycol or the like can be used. Also, if necessary,
In order to adjust the pH of this solution, a salt or an alkaline solution can be mixed.

First, with respect to 1% of a 3% aqueous solution of tartaric acid, 9
The substrate was immersed in an AGW electrolytic solution to which propylene glycol was added at a ratio of 1. The aluminum gate electrode was connected to the anode of a power supply, and DC power was applied using platinum as the cathode.

The conditions of the anodic oxidation are as follows. First, a current is passed for 30 minutes at a current density of ^2.5 mA / cm ² in a constant current mode, and then a treatment is performed for 5 minutes in a constant voltage mode. Formed near the side. When the insulating property of this aluminum oxide was examined using a sample manufactured under the same conditions as the oxidation treatment, the specific resistance was 10 ⁹ Ωm,
It was an aluminum oxide film having a dielectric strength of 2 × 10 ⁵ V / cm.

Further, when the surface of this sample was observed with a scanning electron microscope, it was possible to observe irregularities on the surface at a magnification of about 8000 times, but no fine holes were observed. Met.

Next, after a silicon oxide film 12 is formed on the upper surface by a plasma CVD method, anisotropic etching is performed on the substrate in a direction substantially perpendicular to the substrate from this state.
As shown in FIG. 3D, silicon oxide 13 is formed on the side wall position of the convex portion composed of insulating film 11, gate electrode 8 and anodic oxide film 10.
Leave.

The silicon oxide film 12 is formed at an ambient temperature of 200 ° C., which is lower than usual, at the time of its production so that the etching rate is higher than that of the insulating film 11. In addition, as this film, not only a silicon oxide film but also an organic resin film and other films can be used. Next, the remaining silicon oxide 13 and the insulating film 11, the gate electrode 8, and the anodic oxide film 10 at the convex portions are formed.
Using this as a mask, the underlying semiconductor layer 2 is etched away by self-alignment. The state at this time is shown in FIG.

FIG. 5A shows the state of the upper surface at this time. Further, a cross section corresponding to AA ′ in FIG.
Is shown in Next, from this state, the silicon oxide film 13 and the gate insulating film 6 are selectively etched away using only the convex portions as masks, and only the silicon oxide is removed as shown in FIGS. 4F and 5B. Part is exposed from the end of the gate electrode.

Next, the exposed portions are doped with impurities so as to form source and drain regions. As shown in FIG. 4B, the gate anodic oxide film 10
Is used as a mask, and phosphorus ions are ion-implanted from the upper surface of the substrate. As a result, the outer end of the anodic oxide film 10
It substantially coincides with the inner ends of the source and drain regions. Thus, the source and drain regions 3 are formed. After this,
A laser is applied to this area to activate the area,
The source and drain regions are activated by laser annealing. As the activation process, a thermal annealing process or the like can be employed.

Next, aluminum serving as source and drain electrodes is formed on the upper surface, and the source and drain electrodes are etched into a predetermined pattern using a second mask to separate the source and drain electrodes. . This state is shown in FIG. Finally, using the source and drain electrodes 7 and the projections as a mask, the semiconductor layer 2 protruding from the periphery is removed by etching.
A TFT as shown in FIG.

In the above description, the manufacturing process of the TFT described above is an example, and the present invention is not limited to the manufacturing process described in this description. For example, the impurity doping process of the source and drain regions is performed in the above-described manner. In the description, as shown in FIG. 4B, the patterning was performed after the patterning of the semiconductor layer 2, but in the state of FIG.
It is also possible to perform the ion implantation using the mask as a mask.

[0027] Thus, according to the present invention, only 2 to 3
With the use of one mask, a TFT can be manufactured. When the TFT has a complementary structure, it can be achieved by adding one or two masks.

Further, whether the connection from the outside to the gate electrode is a part of the gate electrode during the anodic oxidation process so as not to contact the electrolytic solution for the anodic oxidation to form an anodic oxide film, the last unwanted semiconductor After the layer is etched, the connection can be made by removing the anodic oxide film exposed outside by selective etching of the source and drain electrodes and the anodic oxide film. Of course, it is also possible to use a new mask to make a contact hole in the insulating film at a specific location.

[0029]

[Embodiment] "Example 1" This example illustrates an example of applying the TFT of the present invention to an active matrix type liquid crystal electro-optical device having a circuit configuration as shown in FIG. As is clear from FIG. 11, the active element of this embodiment has a complementary structure, and the PTF is applied to one pixel electrode.
T and NTFT are provided.

[0030] shows the arrangement of such actual electrode corresponding to the circuit arrangement in FIG. 11. For simplicity of description, only portions corresponding to 2 × 2 are described.

Firstly, a method of manufacturing the substrate for a liquid crystal electro-optical device used in the present embodiment uses to FIGS. Figure in 8 (A), less expensive, such as quartz glass 7
Using a magnetron RF (high frequency) sputtering method, a silicon oxide film as a blocking layer 51 is formed on a glass 50 capable of withstanding a heat treatment at a temperature of 00 ° C. or less, for example, about 600 ° C.
It is made to a thickness of 3000 mm. Process condition is oxygen 1
00% atmosphere, film formation temperature 15 ° C, output 400 to 800
W, pressure 0.5 Pa. The film formation rate using quartz or single crystal silicon as a target was 30 to 100 ° / min.

On this, a silicon film 52 to be a source, drain and channel formation region later was formed by LPCVD (low pressure gas phase), sputtering or plasma CVD. When formed by the reduced pressure gas phase method, the temperature is 1
450-550 ° C lower by 00-200 ° C, for example 530 ° C
CVD of disilane (Si ₂ H ₆ ) or trisilane (Si ₃ H ₈ )
The film was supplied to the apparatus to form a film. Reactor pressure is 30 ~ 300
Pa. The deposition rate was 50-250 ° / min.
Threshold voltage (Vt) between PTFT and NTFT
In order to control substantially the same as in h), boron may be added at a concentration of 1 × 10 ¹⁵ to 1 × 10 ¹⁸ cm ⁻³ during film formation using diborane.

When the sputtering method is used, the back pressure before the sputtering is set to 1 × 10 ⁻⁵ Pa or less, and single crystal silicon is used as a target in an atmosphere in which hydrogen is mixed with 20 to 80% of argon. For example, argon was 20% and hydrogen was 80%.
The film formation temperature was 150 ° C., the frequency was 13.56 MHz, the sputter output was 400 to 800 W, and the pressure was 0.5 Pa.

When a silicon film is formed by the plasma CVD method, the temperature is, for example, 300 ° C., and monosilane (SiH ₄ ) or disilane (Si ₂ H ₆ ) is used. These were introduced into a PCVD apparatus, and a high-frequency power of 13.56 MHz was applied to form a film.

The coatings formed by these methods are:
It is preferable that oxygen is 5 × 10 ²¹ cm ⁻³ or less. If the oxygen concentration is high, it is difficult to crystallize, and the heat annealing temperature must be increased or the heat annealing time must be increased.
If the amount is too small, the lamp is turned off by the backlight.
Current increases. Therefore, 4 × 10 ¹⁹ to 4 × 10 ²¹
The range was cm ⁻³ . Hydrogen is 4 × 10 ²⁰ cm ^-3 and silicon 4
It was 1 atomic% when compared with × 10 ²² cm ⁻³ . Also,
In order to promote crystallization of the source and the drain, the oxygen concentration is set to 7 × 10 ¹⁹ cm ⁻³ or less, preferably 1 × 10 ¹⁹ cm ^−3.
cm ⁻³ or less, and oxygen is ion-implanted only in a channel formation region of a TFT constituting a pixel to form 5 × 10 ^{20 to} 5 × 10
You may add so that it may be set to ²¹ cm- ³ . At that time, since light is not irradiated to the TFT constituting the peripheral circuit, it is effective to reduce the mixing of oxygen and to have a higher carrier mobility in order to operate at a high frequency.

[0036] By the above method, 500 to 3000 Å silicon film in an amorphous state, after making a thickness of, for example, 1500 Å, the heat treatment of the intermediate temperature at 12-70 hours non-oxide atmosphere at a temperature of 450-700 ° C., For example, it was kept at a temperature of 600 ° C. in a hydrogen atmosphere. Since a silicon oxide film having an amorphous structure is formed on the surface of the substrate under the silicon film, no specific nucleus is present in this heat treatment, and the whole is annealed uniformly.

The annealing - by Le, the silicon film moves in a high state of orderliness amorphous structure, some mobility ho carrier obtained exhibited crystalline state - Le mobility (μh) = 1
0 to 200 cm ² / VSec, electron mobility (μe) = 15
３００300 cm ² / VSec are obtained.

[0038] In FIG. 8 (A), the silicon film subjected to a photo-etching in the first photomask, the left side of the drawing area 30 for PTFT (channel width 20 [mu] m), NTFT
Region 40 was formed on the right side.

On this, a silicon oxide film was formed as a gate insulating film 53 to a thickness of 500 to 2000 { for example, 700 } . This was performed under the same conditions as those for forming the silicon oxide film 51 as the blocking layer. During this film formation, a small amount of fluorine is added,
Sodium ions may be immobilized. In this embodiment, a silicon nitride film 54 having a thickness of 50 to 200 (for example, 100) is formed on the silicon oxide film as a blocking layer having a function of suppressing the reaction between the gate electrode and the gate insulating film formed on the upper surface.

[0040] After this, as the material for the gate electrode in this upper, aluminum by a known sputtering method 30
It was formed to a thickness of 00 to 1.5 μm, for example, 1 μm.

[0041] Molybdenum (Mo) as the gate electrode material in addition to aluminum, tungsten (W), titanium (Ti), tantalum (Ta) and the laminated wiring of these alloys were mixed silicon material and silicon and metal coating Etc. can be used.

When a metal material is used as the gate electrode as in the present embodiment, particularly in the case of a low-resistance material such as aluminum, the gate delay (the voltage propagating through the gate wiring) generated due to the large area and high definition of the substrate. (Delay of the pulse and distortion of the waveform) can be suppressed, and the area of the substrate can be easily increased.

[0043] Further, the insulating film 4 on the gate electrode material on
9B, a silicon oxide film is formed to a thickness of 3000-1 μm, here 6000 °, by a sputtering method, and then the insulating film 49 and the gate electrode material are patterned with a second photomask to form a film shown in FIG. As described above, a gate electrode 55 for PTFT and a gate electrode 56 for NTFT were formed. The gate electrodes are all connected to the same gate wiring 57.

Next against the substrate 3% aqueous tartaric acid solution 1, was added propylene glycol in a ratio of 9 AG
It was immersed in a W electrolytic solution, an aluminum gate electrode was connected to the anode of the power supply, and DC power was applied using platinum as the cathode. At this time, the gate electrodes are connected for each of the gate wirings, but connection terminals are provided near the ends of the substrate so that all the gate wirings are inserted and connected, and anodic oxidation is performed as shown in FIG. Anodized films 58 and 59 were formed near the side surfaces of the gate electrode.

Anodizing conditions are as follows. First, a current is applied at a current density of 4 mA / cm ² for 20 minutes in a constant current mode, and then a treatment is performed for 15 minutes in a constant voltage mode. Formed. This anodic oxide film is preferably formed as thick as possible, and is formed as thick as process conditions permit.

[0046] Then the nitride film 54 and silicon oxide film 53 on the semiconductor as shown in FIG. 9 (A) after etching is removed, boron as impurity for PTFT entire surface of the substrate 1 to 5
It was added by ion implantation at a dose of × 10 ¹⁵ cm ^-2 . The doping concentration is set to about 10 ¹⁹ cm ⁻³ to form the source 60 and the drain 61 of the PTFT. In this embodiment,
Although the ion doping was performed after removing the insulating film on the surface, the doping can be performed through the insulating films 53 and 54 on the semiconductor film if the conditions of ion implantation are changed.

The photoresist 6 as shown in the next Figure 9 (B)
1 is formed using a third photomask, and after covering the PTFT region, phosphorus is ionized at a dose of 1 to 5 × 10 ¹⁵ cm ⁻² to the source 62 drain 63 for the NTFT. It was added by an injection method so that the doping concentration was about 10 ²⁰ cm ⁻³ .

Next, 10-50 hours heating annealed again at 600 ° C. - was carried out an activation treatment of the impurity regions do Le. P
The source 60 and the drain 61 of the TFT and the source 62 and the drain 63 of the NTFT were formed as P ⁺ and N ⁺ by activating impurities. Channel formation regions 64 and 65 are formed below the gate electrodes 55 and 56. In this embodiment, annealing by heat is employed as the activation process. However, other than this method, a method of irradiating the source and drain regions with laser light to perform the activation process can also be employed. In this case, since the activation process is performed instantaneously, there is no need to consider the diffusion of the metal material used for the gate electrode, and the function for blocking on the gate insulating film employed in the present embodiment is employed. The silicon nitride film 54 can be omitted.

[0049] The next sputtering with said insulating film on此upper surface formed as a silicon oxide film. The thickness of this film is as large as possible, for example, 0.5 to 2.0 μm. In this embodiment, the film is formed to a thickness of 1.2 μm. Remaining region 6 near the side wall of the convex portion composed of an oxide film
6 is formed. This is shown in FIG. 9 (C).

Next as a mask and a remaining region 66 and the convex portion, the unnecessary portions of the semiconductor film 52 is etched away, the remaining area 66 is removed existing near the side surface of the convex portion, the convex portion A semiconductor film 52 serving as a source / drain region of each TFT was exposed outside. Figure this state 10
It is shown in (A).

Further , aluminum is formed on the entire surface by sputtering, and leads 67, 68 and contact portions 69, 70 are patterned by a fourth mask, and then electrodes 67, 68, 69, 70 and a gate electrode are formed. The insulating film 49 on 55 and 56 and the semiconductor film protruding from the anodic oxide films 58 and 59 near the side surfaces are removed by etching to complete the element isolation to complete the TFT. According to such a manufacturing method, a TFT having a complementary structure can be manufactured using four masks. Figure 1 shows this situation.
0 (B).

In this TFT, the periphery of the side of the gate electrode is wrapped with an anodic oxide film, and the source and drain regions protrude only from the gate electrode portion to the electrode connection portion, but all other portions exist below the gate electrode. . In addition, the source and drain electrodes are in contact with each other at two locations on the top and side surfaces of the source and drain regions, and a sufficient ohmic connection is guaranteed.

In this way, a C / TFT can be manufactured without applying a temperature to 700 ° C. or more in all steps, even though it is a self-aligned type. Therefore, it is not necessary to use an expensive substrate such as quartz as a substrate material, and this is a process very suitable for the large-pixel liquid crystal electro-optical device of the present invention.

[0054] Thermal annealing in this embodiment - le is FIG. 8 (A), the FIG.
Performed twice in 9 (B). But Ani in FIG 8 (A) - Le omitted by required characteristics, annealing shown in FIG. 9 (B) both - may be shortened manufacturing time serves as the Le. In this embodiment, aluminum is used as the gate electrode. However, since the silicon nitride film 54 is provided under the gate electrode, aluminum does not react with the underlying gate insulating film, thereby realizing good interface characteristics. Was completed.

[0055] Then two TFT as shown in FIG. 10 (C)
In order to connect the output terminal of the liquid crystal device to an electrode of one pixel of the liquid crystal device as a transparent electrode, an ITO (indium tin oxide film) was formed by a sputtering method. It was etched with a fifth photomask to form the pixel electrode 71. This ITO is between room temperature and 1
Films were formed at 50 ° C. and achieved with oxygen at 200-400 ° C. or annealing in air. Like this, PTFT
30, NTFT 40 and transparent conductive electrode 71 were formed on the same glass substrate 50. The electrical characteristics of the obtained TFT are PTFT, the mobility is 20 (cm ² / Vs), and Vth is −
5.9 (V), NTFT mobility is 40 (cm ² / Vs),
Vth was 5.0 (V).

[0056] shows how the arrangement of the electrodes or the like of the liquid crystal electro-optical device in FIG. 11. Line C-C 'cross section shown in FIG. 11 (A) corresponds to the cross section of the manufacturing process of FIGS. 8-10. PTF
T30 is provided at the intersection of the first signal line 72 and the third signal line 57, and the first signal line 72 and the third signal line 76 on the right
PTFTs for other pixels are similarly provided at the intersection with. On the other hand, the NTFT is provided at the intersection of the second signal line 75 and the third signal line 57. Further, a PTFT for another pixel is provided at the intersection of the adjacent first signal line 74 and third signal line 57. A matrix configuration using such a C / TFT is provided. P
The TFT 30 is connected to the first signal line 72 by the electrode of the drain 61.
, And the gate 55 is connected to the signal line 57. The output terminal of the source 60 is connected to the electrode 71 of the pixel via a contact.

[0057] On the other hand, nTFTs 40 is connected to the second signal line 73 in the electrode of the source 62, gate 56 is a signal line 57
The output terminal of the drain 63 is connected to the PTF through a contact.
Like T, it is connected to the pixel electrode 71. Also, another C connected to the same third signal line and provided next to it.
The PTFT 31 is connected to the first signal line 74 by the NTFT.
41 is connected to the second signal line 75. Thus, between the pair of signal lines 72 and 73 (inside), one pixel 80 was constituted by the pixel electrode 71 made of a transparent conductive film and the C / TFT. By repeating such a structure horizontally and vertically, a liquid crystal electro-optical device having a large pixel of 640 × 480 or 1280 × 960 obtained by enlarging a 2 × 2 matrix can be obtained. It is to be noted that the impurity regions of the TFT are referred to as a source and a drain here for the purpose of explanation, and may have a function different from that of the name when actually driven.

In the present embodiment, the semiconductor film 52 is
Using a photomask of
Element isolation of each TFT is performed. As a result, there is no semiconductor film below the gate wiring other than the TFT area, and the substrate or the insulating film on the substrate is located below the gate wiring, and this portion forms the gate input side capacitance. Because there is no response, high-speed response is possible.

[0059] Further, shown in FIG. 11 (B) is a cross-sectional view along D-D 'cross section in the FIG. 11 (A). As described above, in the present invention, since the insulating film 49 is always provided on the gate electrode wiring at the intersection of the gate electrode wirings 57 and 76 and the wiring 72, the generation of capacitance due to the wiring at this part can be prevented.
With only four masks, a TFT integrated circuit having a multilayer wiring structure can be manufactured.

A liquid crystal electro-optical device is formed by using the substrate provided with the active elements manufactured as described above. First, on the substrate, a resin having an ultraviolet curing property, in which 50% by weight of nematic liquid crystal was dispersed in an epoxy-modified acrylic resin, was formed by a screen method. The screen used had a mesh density of 125 meshes per inch and an emulsion thickness of 15 μm. The squeegee pressure was 1.5 kg / cm ² .

[0061] Next, after the leveling of 10 minutes 236nm
With a high-pressure mercury lamp having an emission wavelength centered on
2,000 mJ of energy to cure the resin, 12
A light control layer having a thickness of μm was formed.

Thereafter , the Mo sputtering is performed using the DC sputtering method.
(Molybdenum) was deposited at 2500 ° to form a second electrode.

[0063] Then, a black epoxy resin, subjected to printing using a screen method, after 30 minutes calcined at 50 ° C.,
Main firing was performed at 180 ° C. for 30 minutes to form a 50 μm protective film.

A TAB-shaped drive IC was connected to the leads on the substrate, and a reflection type liquid crystal display device composed of only one substrate was completed.

In this embodiment, one set of complementary TFTs is provided for each pixel as an active element. However, the present invention is not limited to this structure. A plurality of sets of complementary TFTs are provided.
T may be provided, and a plurality of complementary TFTs
May be provided for a plurality of divided pixel electrodes.

In this way, a liquid crystal electro-optical device in which active elements were provided in a dispersion type liquid crystal was completed. Since the dispersion type liquid crystal of this embodiment requires only one substrate, a light and thin liquid crystal electro-optical device can be realized at a low cost, without using a polarizing plate and without requiring an alignment film. Since the liquid crystal electro-optical effect can be realized with only the substrate, a very bright liquid crystal electro-optical device can be realized. The present invention can be applied to one of the substrates of other liquid crystal electro-optical devices.

[0067] In "Example 2" This example, as shown in FIG. 12, for one pixel, employing the present invention to a liquid crystal electro-optical device having a modified transfer gate TFT complementary configuration. The fabrication of the TFT in this embodiment is basically the same as that in the first embodiment.
Proceed in the same manner as 4. However, since in this embodiment employs a C / TFT variant transfer gate, FIG. 8
The arrangement is a through 10 are different, the actual arrangement TFT is in the position as shown in FIG. 15 are arranged connected.

As shown in FIG . 12 , the common gate wiring 9
1 has a PTFT 95 and an NTFT 96 connected to a gate. These connect the source and drain regions and are connected to the other signal line 93. The other source and drain regions are also commonly connected to the pixel electrode. I have.

[0069] First of all, the magnetron RF on the glass 98
(High frequency) A silicon oxide film as the blocking layer 99 is formed to a thickness of 1000 to 3000 ° by sputtering. Process conditions are 100% oxygen atmosphere, film formation temperature 15
° C, output 400-800W, pressure 0.5Pa. The film formation rate using quartz or single crystal silicon as a target was 30 to 100 ° / min.

On this, a silicon film 97 was formed by LPCVD (low pressure vapor phase), sputtering or plasma CVD.

In FIG . 13A , a silicon film was subjected to photoetching using a first photomask to form a PTFT region on the left side of the drawing and an NTFT region on the right side. In the present embodiment, unlike the case of the first embodiment, this semiconductor region is determined so as to be a TFT region. On the other hand, in the case of Example 1, since the region of the TFT is determined again by anisotropic etching in a later step, the first mask is roughly aligned.

On this, a silicon oxide film is formed on the gate insulating film 103.
To a thickness of 500 to 2000 {for example, 700}. This was performed under the same conditions as those for forming the silicon oxide film 99 as the blocking layer.

[0073] Then, as the material for the gate electrode 107 on the upper side, 3000A～1.5Myuemu example 1μ aluminum-silicon alloy by a known sputtering method
m.

[0074] Molybdenum (Mo) in addition to aluminum silicide as the gate electrode material, tungsten (W), titanium (Ti), tantalum (Ta), chromium (Cr) or an alloy or a mixture of silicon to these materials these Alloy of the material itself or a laminated wiring of silicon and a metal coating can be used.

Further , an insulating film 1 is formed on the gate electrode material.
The thickness of the silicon oxide film as a 06 3000A～1myuemu, wherein after formation by sputtering 6000Å is pattern and the insulating film 106 and the gate electrode 107 in the second photomask - training to FIG 13 (B) The gate electrode 107 and the insulating film 106 were formed as described above.

[0076] Then with respect to the substrate 3% aqueous tartaric acid solution 1, was added propylene glycol in a ratio of 9 AG
It was immersed in a W electrolyte solution, a gate electrode of aluminum silicide was connected to the anode of the power supply, and DC power was applied using platinum as the cathode. In this case although the gate electrode is connected to each gate line performs anodizing is provided a connection terminal to connect by sandwiching all of the gate wiring in the vicinity of the edge of the substrate as shown in FIG. 13 (C) An anodic oxide film 100 was formed near the side surface of the gate electrode.

[0077] Then 13 an insulating film 103 on the semiconductor as (D) after etching is removed, boron 1 to 5 × 10 ¹⁵ cm as an impurity for PTFT entire surface of the substrate ^-2
Was added by an ion implantation method at a dose of. The doping concentration is set to about 10 ¹⁹ cm ⁻³ to form the source and drain regions of the PTFT. In this embodiment, the ion doping is performed after removing the insulating film on the surface. However, if the conditions of the ion implantation are changed, the doping can be performed through the insulating film 103 on the semiconductor film.

[0078] then 14 photoresist 110 as (A) is formed using a third photomask, PTF
After covering the T region, phosphorus is added to the source and drain regions for NTFT by an ion implantation method at a dose of 1 to 5 × 10 ¹⁵ cm ⁻² , and the doping concentration is 10 ²⁰ cm ^{−. It was} about ^three .

[0079] Next, the laser light source, is irradiated to the drain region activation treatment, in this case, since the instantaneous activation process, considering that the diffusion of metal materials used in the gate electrode Therefore, a highly reliable TFT could be manufactured.

[0080] In addition, aluminum
The electrode lead 102 is formed by a fourth
After patterning by the electrode, the electrode 102 and the gay
Of the insulating film 106 on the gate electrode 107 and the vicinity thereof.
Etching the semiconductor film off the extreme oxide film 100
The TFT is completely removed to complete the TFT.
According to such a manufacturing method, four TFTs having a complementary structure are formed.
It was possible to manufacture with the mask of. Fig.14
It is shown in (B).

[0081] Then two TFT as shown in Fig. 14 (C)
In order to connect the output terminal of the liquid crystal device to an electrode of one pixel of the liquid crystal device as a transparent electrode, an ITO (indium tin oxide film) was formed by a sputtering method. It was etched with a fifth photomask to form the pixel electrode 108.

[0082] As described above, FIG. 15 (A), the
A modified transfer gate TFT having the arrangement and structure shown in (B) and (C) was completed. Figure 15 (B) is a sectional view corresponding to F-F 'cross section in the FIG. 15 (A), the
Figure 15 (C) is a sectional view corresponding to E-E 'cross section in the FIG. 15 (A). As apparent from FIGS. 15B and 15C, the interlayer insulating film 106 always exists on the gate electrode 107, and the lead portion and the source and drain of the gate wiring 107 as shown in FIG. A sufficient interlayer insulating function was exerted at the intersection of the wiring 102 with the lead portion, and the generation of wiring capacitance at the intersection could be suppressed.

[0083] Thus, embodiments in the present embodiment example 1
With the same number of masks as above, without using the advanced process technology of anisotropic etching, the capacity near the wiring is smaller, the possibility of short circuit near the gate insulating film is smaller, and the active TFT with the element structure is active. The element substrate was completed.

Using this substrate as a first substrate, an STN-type liquid crystal is injected between the substrates by a well-known technique by using a second substrate having a counter electrode and an alignment treatment layer formed on the counter substrate. Thus, an active matrix type STN liquid crystal electro-optical device was completed.

In each of the above examples, an example in which the present invention is applied to a liquid crystal electro-optical device is shown. However, the present invention is not limited to this example, and it is needless to say that the present invention can be applied to other devices and three-dimensional integrated circuit elements. No.

[0086]

According to the structure of the present invention, it is possible to manufacture a TFT element using a very small number of masks as compared with the conventional case. When a semiconductor product is manufactured by applying an element having this structure, the number of masks can be reduced, and the manufacturing process can be simplified and the manufacturing yield can be improved.
As a result, a semiconductor application device with a low manufacturing cost can be provided.

[0087] The present invention, by using a metal material to the gate electrode material, providing an oxide film by anodic oxidation of the metal material on the surface, on the provision of the three-dimensional wiring with crossing to the It is characterized by. In addition, the gate electrode and the oxide film near the side surface of the electrode provide only the source / drain contact portions exposed from the gate electrode, and the power supply point is brought closer to the channel, thereby lowering the frequency characteristics of the device and increasing the ON resistance. Could be prevented.

In the present invention, when aluminum is used as the gate electrode material, the hydrogen in the gate oxide film is reduced from H _{2 to} H by the catalytic effect of aluminum during annealing during the element formation step, thereby further reducing the hydrogen. As a result, the interface state density (Q _SS ) can be reduced as compared with the case where silicon gate is used, and the device characteristics can be improved.

Further , since the source and drain regions of the TFT are self-aligned, and the contact portions of the electrodes for supplying power to the source and drain regions are also self-aligned, the area required for the TFT is reduced, and the integration degree is reduced. Can be improved. When used as an active element of a liquid crystal electro-optical device, the aperture ratio of the liquid crystal panel could be increased.

Further, a TFT having a characteristic structure is proposed by positively utilizing the anodic oxide film near the side surface of the gate electrode.
In addition, a very small number of masks, such as at least two, could be used for manufacturing the TFT.

[Brief description of the drawings]

FIG. 1 shows an example of an element structure of a TFT of the present invention.

FIG. 2 shows an element structure of a conventional TFT.

FIG. 3 shows a schematic cross-sectional view of a manufacturing process of the TFT of the present invention.

FIG. 4 shows a schematic cross-sectional view of a manufacturing process of the TFT of the present invention.

FIG. 5 shows a top view of a manufacturing process of the TFT of the present invention.

FIG. 6 shows a top view of the manufacturing process of the TFT of the present invention.

FIG. 7 is a schematic diagram of a circuit when the TFT of the present invention is applied to a liquid crystal electrochemical device as a complementary type.

FIG. 8 is a schematic cross-sectional view of a manufacturing process when a TFT of the present invention is applied to a liquid crystal electro-optical device as a complementary type.

FIG. 9 is a schematic cross-sectional view of a manufacturing process when the TFT of the present invention is applied to a liquid crystal electro-optical device as a complementary type.

FIG. 10 is a schematic cross-sectional view of a manufacturing process when the TFT of the present invention is applied to a liquid crystal electro-optical device as a complementary type.

FIG. 11 is a schematic diagram showing an arrangement on a substrate when a TFT of the present invention is applied to a liquid crystal electro-optical device as a complementary type.

FIG. 12 is a schematic diagram of a circuit when the TFT of the present invention is applied to a liquid crystal electro-optical device as a complementary type.

FIG. 13 is a schematic cross-sectional view of a manufacturing process when the TFT of the present invention is applied to a liquid crystal electro-optical device as a complementary type.

FIG. 14 is a schematic cross-sectional view of a manufacturing process when the TFT of the present invention is applied to a liquid crystal electro-optical device as a complementary type.

FIG. 15 is a schematic view showing an arrangement on a substrate when a TFT of the present invention is applied to a liquid crystal electro-optical device as a complementary type.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Semiconductor layer 3 Source / drain region 6 Gate insulating film 7 Source / drain electrode 8 Gate electrode 10 Anodized film 11 Insulating film 13 Remaining region 49 Insulating film 55 Gate electrode 56 Gate electrode 60 Source 61 Drain 62 Source 63 Drain 66 Remaining area 71 Pixel electrode 100 Anodized film

Continuation of the front page (56) References JP-A-3-42868 (JP, A) JP-A-2-277244 (JP, A) JP-A-1-187814 (JP, A) JP-A-63-197376 (JP) JP-A-63-9978 (JP, A) JP-A-58-23479 (JP, A)

Claims (4)

(57) [Claims] (A) forming a pair of island-shaped semiconductor layers on a substrate having an insulating surface; and (b) forming a gate electrode on the pair of island-shaped semiconductor layers via a gate insulating film. Forming; (c) forming an insulating layer covering the upper surface of the gate electrode; and (d) anodizing the gate electrode to form an anodic oxide film on at least side surfaces of the gate electrode. (E) introducing a first conductivity type impurity into a part of the pair of island-shaped semiconductor layers using the gate electrode and the anodic oxide film as a mask, and introducing the impurity into each of the pair of island-shaped semiconductor layers; Forming a pair of impurity regions of the first conductivity type; (f) forming a mask so as to cover one of the pair of island-shaped semiconductor layers on which the gate electrodes are formed; and (g) forming the gate. Using the electrode and the anodic oxide film as a mask, A second conductivity type impurity is introduced into a part of a pair of island-shaped semiconductor layer other semiconductor layer, and forming a pair of impurity regions of a second conductivity type, Ji Yaneru area of each The semiconductor layer is formed between the pair of impurity regions, and a boundary between the channel region and the pair of impurity regions substantially coincides with an outer end of the anodic oxide film formed on a side surface of the gate electrode. A method for manufacturing an insulated gate type field effect semiconductor device, wherein: 2. The insulating gate type according to claim 1, further comprising a step of irradiating the semiconductor layer on which the pair of impurity regions are formed with a laser beam to activate the pair of impurity regions. A method for manufacturing a field-effect semiconductor device. 3. The insulated gate field effect semiconductor device according to claim 1, wherein said metal or metal silicide is made of a material selected from aluminum, molybdenum, tungsten, titanium, tantalum and silicide thereof. Production method. 4. A step of: (a) forming a semiconductor layer on a substrate having an insulating surface; (b) forming a gate insulating film on the semiconductor layer; and (c) blocking on the gate insulating film. Forming a layer; (d) forming a gate electrode made of metal or metal silicide on the blocking layer via the gate insulating film and the blocking layer; and (e) forming an upper surface of the gate electrode. Forming an insulating layer to cover; (f) anodizing the gate electrode to form an anodic oxide film on at least side surfaces of the gate electrode; and (g) forming the anodic oxide film on the gate electrode. Introducing an impurity into the semiconductor layer as a mask to form an impurity region in the semiconductor layer, wherein a channel region is formed between the impurity regions,
A method of fabricating an insulated gate type field effect semiconductor device, wherein a boundary between the channel region and the impurity region is arranged so as to substantially coincide with an outer end portion of the anodic oxide film formed on a side surface of the gate electrode. .