JP3111230B2 - Manufacturing method of laminated dielectric component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing various laminated dielectric components including a laminated chip type capacitor, a C network, a ceramic laminated substrate, and the like.

[0002]

2. Description of the Related Art Hitherto, in the above-described dielectric component, the entire component base having electrodes built therein is formed of a ceramic material having a high dielectric constant.

In this dielectric component, since the base itself is a structure made of a high dielectric material, stray capacitance is easily generated, and barium titanate or titanium oxide having a high dielectric constant is brittle as a structural material. There is a disadvantage that cracks, chips, chipping, and the like are likely to occur on the component substrate.

[0004]

SUMMARY OF THE INVENTION According to the present invention, a component base is formed of a dielectric material having a relatively low dielectric constant in order to mainly suppress generation of stray capacitance and to improve mechanical strength of the component base. , A multilayer type dielectric component in which a dielectric material layer having a relatively high dielectric constant is interposed between electrodes provided inside the component base and integrally formed to form a multilayer type dielectric component simply, efficiently and with high precision. An object of the present invention is to provide a method for manufacturing a dielectric component.

[0005]

In a method of manufacturing a laminated dielectric component according to the present invention, a green sheet for forming a component base is formed from a dielectric material paste having a specific material, and the green sheet is formed. A hole of a predetermined pattern is formed on the sheet surface by photomasking, and a dielectric material paste different from the material of the green sheet is filled in the hole to form a green sheet having a different dielectric material portion, An electrode is formed of a conductive paste corresponding to at least a foreign dielectric portion of the green sheet, and a plurality of green sheets on which the electrode is formed are laminated and fired, and a foreign dielectric layer is formed inside the component base. The entire component is integrally formed by being interposed between the provided electrodes.

[0006]

In the method of manufacturing a laminated dielectric component according to the present invention, a sheet method is applied to form a green sheet for one layer constituting a component base from a dielectric material paste having a specific material. Holes are formed by photomasking on the sheet surface of the green sheet at the stage of forming the green sheet, and a dielectric material material different from the material of the green sheet is filled in the inside of the hole to form a different dielectric material portion Then, after forming a conductive paste on the electrode corresponding to the foreign dielectric part, a plurality of green sheets are laminated and fired, and the foreign dielectric part provided on the green sheet is interposed between the electrodes to form a component. Since the whole is integrally formed, the whole part including the component base, the electrode, and the foreign dielectric part made of a dielectric material can be efficiently manufactured, and the dielectric material can be used. By placing a different dielectric material inside the component base and forming it easily and with high precision, and by forming the component base with a dielectric material having a relatively low dielectric constant, the mechanical strength of the component base can be increased and It can be manufactured as a laminated dielectric component having excellent electrical characteristics by preventing generation of stray capacitance.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a method of manufacturing a laminated dielectric component, a sheet method is applied, a green sheet is formed from each step described later, and a plurality of sheets are laminated and fired to form a capacitor, a C network or a ceramic. It is applied to manufacture various laminated dielectric components including a multilayer substrate and the like. The sheet method is preferable because the lead time can be shortened and the productivity can be improved, and by applying the image processing technology and the mechanical control technology, the sheet can be made thinner and the lamination accuracy can be improved.

In the illustrated embodiment, in order to mainly suppress the generation of stray capacitance and to improve the mechanical strength of the component substrate, the component substrate is provided with a relatively low dielectric constant (hereinafter referred to as "low dielectric constant" or "low dielectric constant"). Dielectric material), and a dielectric material layer having a relatively high dielectric constant (hereinafter, referred to as "high dielectric constant" or "high dielectric constant") interposed between electrodes provided therein. 2. Description of the Related Art A laminated dielectric component in which the entire component is integrally formed is manufactured.

During the manufacturing process, the high dielectric material paste is filled in the holes formed in the sheet surface of the green sheet in addition to the green sheet made of the low dielectric material paste and the electrode made of the conductive paste constituting the component substrate. Then, a high dielectric material portion is formed on the green sheet. This hole is
It can be formed by applying a photolithography (resolution lithography) method or a photo etching method described later.

As a ceramic material for forming the component substrate, barium titanate, titanium oxide, alumina or the like having a low dielectric constant can be used. In addition, as the high dielectric material forming the high dielectric material portion, barium titanate which can be co-fired with the low dielectric material and has a high dielectric constant from the composition,
Titanium oxide, alumina, glass (SiO ₂ ), or the like can be used. The dielectric constant of a high dielectric constant material is
What is necessary is just to set so that the low dielectric constant material is about 1 to 10 with respect to 10,000.

FIG. 1 shows a case in which a hole is formed in a manufacturing process of a green sheet by applying a photolithography method, and a process of forming one green sheet including a process of forming an electrode is sequentially performed. Show.

In the drawing, reference numeral 10 denotes a green sheet of a low dielectric material constituting a component base, 11 denotes a hole formed in the green sheet, 12 denotes a high dielectric material portion provided on the green sheet 10, and 12a denotes a high dielectric material. A high dielectric material sheet for forming the portion 12, 13 for an electrode, 20 for a base film such as a polyethylene terephthalate film as a base for forming the green sheet 10, 21 for photomasking for forming a hole 11 in the green sheet, 22 for high 4 shows photomasking for forming a dielectric material portion 12.

When the photolithography method is applied, the green sheet 10 is formed by using a low dielectric material paste containing a ceramic powder of a low dielectric material and a photosensitive resin, and the low dielectric material paste has a flexibility. An acrylic or butyral-based binder is mixed to impart toughness.

The green sheet 10 is used as a base film 20
After forming on the film surface of the green sheet 10 by a normal sheet method, a photomasking 21 having a predetermined light-transmitting pattern is put on the sheet surface of the green sheet 10 to perform a light irradiation treatment. The light-transmitting pattern of the photomasking 21 substantially corresponds to the shape of the electrode 13 formed in a later step, and ultraviolet rays, deep ultraviolet rays, g-rays, i-rays, EB, excimer laser, or the like may be used as the irradiation light. it can.

By the light irradiation, an exposed portion 10a is formed on the sheet surface of the green sheet 1, and the exposed portion 10a is
-1-1 A development hole is formed as a hole 11 by performing development processing with trichloroethane or an alkali and removing and drying. Since the photolithography method is applied by irradiating the photomask 21 with a light beam by the photomask 21, the holes 11 can be formed at a higher speed and with higher precision than laser processing and punching processing.

A high dielectric material portion 12 is formed in the hole 11 by filling the above high dielectric material paste. To form the high dielectric material portion 12, a photolithography method similar to the formation of the hole 11 can be applied. In that case, mix the photosensitive resin into the high dielectric material paste,
An acrylic or butyral-based binder is used.

Using the high dielectric material paste, a high dielectric material sheet 12a is formed by applying the paste to the sheet surface of the green sheet 10 in which the holes 11 are formed. Next, a photomask 22 is put on the sheet surface of the high dielectric material sheet 12a, and the high dielectric material portion 12 filled in the hole 11 is formed by irradiating light rays in the same manner as described above.

As the photomask 22, one having a light transmission pattern opposite to that of the photomask 22 for forming a hole is used, and the light exposure by the photomask 22 causes the exposure portion 12 b opposite to the exposure portion 10 a of the green sheet 10 to be exposed. To form The exposed portion 12b is developed with 1-1-1 trichloroethane or alkali or the like, and is removed and dried, and the high dielectric material portion 12 is formed by the sheet portion remaining inside the hole 11. Note that the high dielectric material portion 12 can also be formed by applying a printing method such as screen printing.

After the formation of the high dielectric material portion 12, an electrode 13 is formed at a predetermined portion of the green sheet 10 including the high dielectric material portion 12. This electrode 13 can be formed by screen printing by using a conductive paste containing a conductive material. An ethyl cellulose-based binder is added to the conductive paste in order to impart printability.

Instead of the screen printing, the electrodes 13 are preferably formed by a photolithography method in the same manner as in the step of forming the holes 11 and the high dielectric material portion 12. FIG. 2 shows the electrode 1
3 shows a molding step by photolithography, in which a conductive material paste containing a photosensitive resin is used to form a conductive material sheet 13a on the sheet surface of the green sheet on which the high dielectric material portion 12 is formed. Form.

The conductive material sheet 13a is covered with photomasking 23 to form an exposed portion 13b by light beam irradiation. The photomask 23 may have the same light-transmitting pattern as the photomask 22 for forming the high dielectric material portion, and may form the exposed portion 13b having the same pattern as the exposed portion 12b of the high dielectric material sheet 12a. Also,
The exposed portion 13b is similarly removed by development processing, and can be formed as the electrode 13 overlapping the high dielectric material portion 12 in the remaining sheet portion.

According to this step, since all steps including the conductive pattern can be processed by the sheet method, it is desirable because productivity can be improved by a common processing system. In particular, when the electrode 13 is formed by a sheet method, a thickness of several tens of μm or more can be applied, and the electrode can be made finer with a shape accuracy of 20 to 30 μm and a thickness of about 30 μm.

As the binder to be added to the conductive material paste, an acrylic or butyral-based binder similar to the binder of each paste forming the green sheet 10 and the high dielectric material portion 12 made of a low dielectric material is used. Therefore, since the binder removal temperature can be made common, it is possible to prevent peeling or internal destruction between the green sheet 10, the high dielectric material portion 12 and the electrode 13 or between the green sheets during firing.

After the electrodes 13 are formed in this manner, the green sheet 10 is peeled off from the base film 20 to obtain one layer for forming a laminated dielectric component. A plurality of the green sheets 10 are laminated and compression-molded, and then fired at a predetermined temperature to form a chip component or a multilayer substrate.

FIG. 3 shows a manufacturing process by a photoresist method. In this case, after a green sheet 10 made of a low dielectric material is formed on the film surface of the base film 20, the sheet surface of the green sheet 10 is formed. The resist agent layer 14 is formed using a resist agent.

Next, a photomask 21 having a predetermined light-transmitting pattern similar to that described above is applied to the green sheet 1.
A light beam irradiation process is performed on the sheet surface of No. 0. As the light beam, ultraviolet light, deep ultraviolet light, g-line, i-line, EB, excimer laser, or the like can be used as in the photolithography method.

Depending on the light irradiation, the resist agent layer 14
The exposed portion 14a is formed on a predetermined sheet surface of the green sheet 10 covered with the above, and the exposed portion 14a is removed after development processing with 1-1-1 trichloroethane or alkali or the like, so that the remaining resist agent layer 14 A hole 11 is formed in the sheet surface of the green sheet 1 covered.

For the etching, a wet etching method can be applied to a green sheet containing a photosensitive resin binder, or a dry etching method can be applied to a normal green sheet.

In the hole 11 formed in the sheet surface of the green sheet 10, the green sheet 1 is formed in the same manner as described above.
The high-dielectric material portion 12 is formed by filling a high-dielectric material paste that can be fired at the same time as 0. To form the high dielectric material portion 12, a sheet method or a printing method is applied, and a high dielectric material paste is applied to the sheet surface of the green sheet 10 in which the holes are formed, so that the high dielectric material portion 12 is formed. The holes 11 can be filled and formed.

After the formation of the high dielectric material portion 12, the resist agent layer 14 remaining on the sheet surface of the green sheet 10 is peeled off and removed. Along with the removal of the resist agent layer 14, the unnecessarily applied high dielectric material paste can be removed. After the green sheet 10 having the high dielectric material portion 12 is obtained, the electrode 13 is formed at a predetermined position including the high dielectric material portion 12 of the green sheet 10 in the same manner as described above, thereby forming a dielectric component. Green sheet.

FIGS. 4 to 6 show specific examples of the laminated dielectric component which can be manufactured by the above-described steps. FIG. 4 shows a capacitor, and FIG. 5 shows a C network. Each of these electronic components is configured as a unit of a dielectric component, has a component substrate 1 made of a low dielectric material, and is interposed between electrodes 13 formed inside the component substrate 1 so as to be made of a high dielectric material. It is constituted by providing each of the parts 12. FIG. 6 shows a ceramic multi-layer substrate.
It is formed as a dielectric component on which other components such as C2, inductor 3, and resistor 4 are mounted.

In this dielectric component, since the component base 1 is formed of a low dielectric material and the high dielectric material portion 12 is interposed between the electrodes 13, the occurrence of stray capacitance in the component base 1 made of the low dielectric material can be suppressed. Not only that, the mechanical strength of the component substrate 1 can be improved, and the component substrate 1 can be configured as a dielectric component having excellent electrical characteristics.

In the above-described embodiment, the component base 1
Is formed from a dielectric material having a relatively low dielectric constant, and the heterogeneous dielectric portion 12 is formed from a dielectric material having a relatively high dielectric constant. The same applies to the case where the dielectric material portion 12 is formed of a dielectric material having a relatively low dielectric constant, and is formed of a dielectric material having a relatively high dielectric constant.

[0034]

As described above, according to the method of manufacturing a laminated dielectric component according to the present invention, a laminated magnetic component having excellent electrical and mechanical strength can be produced, and a laminated magnetic component can be formed inside a component substrate. Even if a dielectric material portion of a different dielectric material is provided integrally, it can be formed simply, efficiently and with high precision, and the productivity can be improved.

[Brief description of the drawings]

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an explanatory view sequentially showing steps of manufacturing a green sheet by a method of manufacturing a laminated dielectric component according to the present invention.

FIG. 2 is an explanatory view showing an electrode forming process applicable in the method of manufacturing a laminated dielectric component according to the present invention.

FIG. 3 is an explanatory view sequentially showing steps of manufacturing a green sheet by a method of manufacturing a laminated dielectric component according to another embodiment of the present invention.

FIG. 4 is an explanatory diagram showing the internal structure of a capacitor that can be manufactured by applying the method of manufacturing a multilayer dielectric component according to the present invention.

FIG. 5 is an explanatory diagram showing an internal structure of a C network that can be manufactured by the same method.

FIG. 6 is an explanatory diagram showing an internal structure of a multilayer substrate that can be manufactured by the same method.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 Component base 10 Green sheet forming component base 11 Drilled hole 12 Dielectric material part different from component base 13 Electrode 21, 22, 23 Photomasking

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junichi Sudo 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (56) References JP-A-49-58358 (JP, A) JP-A-1 -312815 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01G 4/00-4/40 H01G 13/00-13/06

Claims (1)

(57) [Claims] 1. A green sheet for one layer constituting a component substrate is formed from a dielectric material paste having a specific material,
A hole having a predetermined pattern is formed on the sheet surface of the green sheet by photomasking, and a dielectric material paste of a material different from the material of the green sheet is filled in the hole to form a green sheet having a different dielectric material portion. An electrode is formed of a conductive paste corresponding to at least a foreign material portion of the green sheet, a plurality of green sheets on which the electrode is formed are laminated and fired, and a foreign material layer is formed on the component substrate. Characterized in that the whole component is integrally formed by interposing between electrodes provided inside the multi-layer dielectric component.