JP3103823U - Printed wiring board processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board processing apparatus capable of improving the processing efficiency of a printed wiring board.
SOLUTION: The drill 20 is cooled by injecting air from nozzles 50A and 50B, and chips generated during cutting are removed from the drill 20. Thereby, the use time of the drill 20 can be extended, and the rotation speed of the drill 20 can be increased. In addition, since the brush 40 is provided, the brush 40 prevents air from flowing into the pressure foot 10, removes chips from the drill 20 during cutting with air that is efficiently injected, and pressurizes the pressure via the dust collection duct 12. It can be discharged from the inside of the foot 10.
[Selection diagram] Fig. 1

Description

  The present invention relates to a printed wiring board processing apparatus for performing an external router processing and a counterbore processing of a printed wiring board used for a mobile device such as a mobile phone, a digital camera, a video camera, and an infrastructure substrate.

Conventionally, a printed wiring board processing apparatus having a pressure foot as shown in FIGS. 6 (A) and 6 (C) has been used as a processing apparatus for performing external router processing and counterboring processing of a printed wiring board with a drill. Was.
The pressure foot 110 rotatably supports a spindle 130 having a drill 120 attached to the tip, and is sent horizontally to the printed wiring board 80. For example, in the printed wiring board processing apparatus shown in FIG. 6A, air is sent to the cutting unit through a hollow-structured spindle 130 and a drill 120 to remove cutting chips from the printed wiring board 80. In addition, a configuration is employed in which chips in the pressure foot are discharged through the duct 112. Here, the cross section of the drill 120A and the side surface of the tip are shown in FIG. The drill 120A is provided with an air hole 122 for blowing air to the outside. FIG. 6C shows a pressure foot of a printed wiring board processing apparatus provided with a groove 124 for guiding air to the side of the drill 120B, and FIG. 6D is a perspective view of the drill 120B.

Here, Patent Literature 1 discloses a printed wiring board processing apparatus that presses a pressure foot against a printed wiring board using compressed air. Patent Document 2 discloses a printed wiring board processing apparatus that cools a drill with water.
JP-A-3-3713 JP-A-6-55403

  However, in the printed wiring board processing apparatus shown in FIG. 6A, since the drill 120A is hollow, it cannot be applied to a small-diameter drill. Specifically, it was only applicable to drills having a drill diameter of 2 mm or more. In addition, durability was poor due to the hollow structure. In the printed wiring board processing apparatus shown in FIG. 6B, the processing cost for forming the groove 124 beside the drill 120B increases, and in addition, heat generated due to friction between the chips and the chips is generated after the chips are left on the drill. And the durability of the drill was inferior. The technique disclosed in Patent Document 1 is a technique for making a hole in a printed wiring board, and it is difficult to use the technique for outer shape router processing and counterbore processing. Moreover, in the water cooling system of Patent Document 2, it was difficult to remove chips.

  The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a printed wiring board processing apparatus capable of improving the processing efficiency of a printed wiring board.

In order to achieve the above object, the present invention provides a printed wiring board processing apparatus having a pressure foot for rotatably supporting a spindle having a drill attached to a tip thereof.
A nozzle for injecting air into the drill, a dust collection duct for discharging air in the pressure foot together with chips when cutting the printed wiring board, and And a brush for preventing air from flowing into the engine.

  The invention of claim 1 cools a drill by injecting air from a nozzle. In addition, by injecting air from the nozzle, chips generated during cutting are removed from the drill and discharged from the pressure foot by the dust collection duct. Since the chips do not cling together with the cooling of the drill, the use time of the drill can be extended, and the time required for drill replacement can be reduced. In addition, the number of rotations of the drill can be increased, and further, since cutting chips are eliminated, cutting resistance is reduced and the feed rate of the drill can be increased, thereby improving processing efficiency (productivity of printed wiring boards). Become. In addition, a brush is provided on the bottom surface of the pressure foot so as to contact the printed wiring board and prevent air from flowing into the pressure foot. Therefore, when performing external router processing and counterbore processing while moving the pressure foot with respect to the printed wiring board, the brush prevents the inflow of air into the pressure foot and efficiently cuts with air jetted from the nozzle. The cutting chips can be removed from the drill, and can be discharged from the pressure foot by the dust collection duct.

  In the printed wiring board processing apparatus according to the second aspect, the brush has a bunch of brush bristles arranged concentrically in two or more rows, and the bundles are arranged in a staggered manner in adjacent rows. For this reason, it is possible to prevent the inflow of air into the pressure foot with the brush, and to remove chips from the drill from the drill with the air injected from the nozzle and discharge it from the pressure foot through the dust collection duct. Can be done.

  In the printed wiring board processing apparatus of the third aspect, the brush has a longer bristles on the outer circumference than on the inner circumference. For this reason, even if a brush is applied to the end of the printed wiring board during processing, the bristles on the long outer periphery hit the end of the printed wiring board from the side, so that the brush prevents air from flowing into the pressure foot. be able to.

  According to the printed wiring board processing apparatus of the fourth aspect, the brush has a thicker bristles on the inner peripheral side than on the outer peripheral side. Since the brush bristles on the inner peripheral side are thicker, the force for holding down the printed wiring board is increased, and the displacement of the printed wiring board during processing can be suppressed by the brush.

  According to the printed wiring board processing apparatus of the fifth aspect, a sleeve-shaped skirt is provided on the bottom surface of the pressure foot. For this reason, the inflow of air into the pressure foot can be prevented, the chips from the drill at the time of cutting can be removed by the air jetted efficiently from the nozzle, and the dust can be discharged from the pressure foot by the dust collection duct. In addition, since the sleeve-shaped skirt is made of a flexible member having a length that does not contact the printed wiring board, the sleeve is not easily damaged by pins or the like protruding from the printed wiring board when the pressure foot is moved.

  The printed wiring board processing apparatus according to claim 6 is arranged such that the blowing direction of the nozzle is directed to the drill. For this reason, it is possible to efficiently remove chips from the drill at the time of cutting with the air injected from the nozzle and discharge the chips from the pressure foot by the dust collection duct.

  Since the printed wiring board processing apparatus according to claim 7 is provided with a plurality of nozzles, by colliding air jetted from the nozzles in the vicinity of the drill to create a tornado-shaped air current, chips generated during cutting are removed from the drill, and dust is collected. The duct allows efficient discharge from the pressure foot.

  In the printed wiring board processing apparatus according to the eighth aspect, a pair of nozzles are provided so that the blowing direction is line-symmetric, and the dust collection duct is disposed on a reference line that makes the blowing direction line-symmetric. Therefore, the chips removed from the drill can be efficiently discharged from the dust collection duct.

  In the printed wiring board processing apparatus of the ninth aspect, the blowing direction of the nozzle is directed to the moving direction of the pressure foot. For this reason, it is possible to cleanly remove swarf remaining in the processing trace of the drill by injection from noise.

  In the printed wiring board processing apparatus according to the tenth aspect, since air to the nozzle is supplied from the air pressure source for raising and lowering the pressure foot, it is not necessary to provide a dedicated air pressure source, and the apparatus can be configured at low cost.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First embodiment]
FIG. 1A shows a pressure foot 10 according to the embodiment, and FIG. 1B shows the arrangement position of nozzles of the pressure foot. The pressure foot 10 supports a spindle 30 having a drill 20 attached to the tip so as to be slidable in the axial direction, and is sent horizontally to the printed wiring board 80. An opening 14 for extending a drill is formed in the bottom of the pressure foot 10. The brush 40 that contacts the printed wiring board 80 is provided on the bottom surface 10B of the pressure foot 10. A pair of nozzles 50A and 50B (see FIG. 1B) are arranged on the lower surface of the pressure foot. The nozzles 50A and 50B are arranged such that the blowing direction is directed to the drill. Air of ² kg / m ² is supplied to the nozzles 50A and 50B via the vinyl pipe 52. Here, the inner diameters of the nozzles 50A and 50B at the tips are set to 1 mm, and the inner diameter of the vinyl pipe 52 is set to 6 mm. Further, on the side of the pressure foot 10, there is provided a dust collection duct 12 for discharging air in the pressure foot together with chips generated when cutting the printed wiring board. 40 m ² / min of air is exhausted through the dust collection duct 12, and the pressure foot 10 is pressed against the printed wiring board 80 by the generated negative pressure.

  In the first embodiment, the drill 20 is cooled by injecting air from the nozzles 50A and 50B. In addition, by blowing air from the nozzles 50 </ b> A and 50 </ b> B, chips generated during cutting are removed from the drill 20 and discharged from the pressure foot 10 by the dust collection duct 12. Since the chips do not cling together with the cooling of the drill 20, the use time of the drill 20 can be extended, and the time required for drill replacement can be reduced. In addition, the number of rotations of the drill 20 can be increased, and the feed rate of the drill 20 can be increased by eliminating cutting chips and reducing cutting resistance, thereby improving processing efficiency (productivity of printed wiring boards). . In addition, a brush 40 is provided which abuts on the printed wiring board 80 on the bottom surface 10B of the pressure foot 10 and prevents air from flowing into the pressure foot 10. For this reason, when performing the external router processing and the counterboring processing while moving the pressure foot 10 with respect to the printed wiring board 80, the brush 40 prevents the air from flowing into the pressure foot 10 and efficiently performs the nozzle 50A, Chips at the time of cutting are removed from the drill 20 by air jetted from 50B, and can be discharged from the pressure foot 10 by the dust collection duct 12.

  FIG. 2A is a view taken in the direction of arrow D in FIG. 1B. The blowing direction 50A-Y of the nozzle 50A and the blowing direction 50B-Y of the nozzle 50B are provided to be line-symmetric, and a reference line X- which makes the blowing directions 50A-Y and 50B-Y line-symmetric. A dust collection duct 12 is arranged on X. Here, as shown by the arrow in FIG. 2A, when the pressure foot 50 is sent to the right in the drawing along the reference line X, the blowing directions 50A-Y, 50B- of the nozzles 50A, 50B. Y is directed to the direction of movement of the pressure foot 10 and to the right in the drawing. On the other hand, as shown in FIG. 2B, when the movement direction is reversed (movement to the left in the figure), the dust collection duct 12 is on the left side (leading side in the traveling direction), and the nozzles 50A and 50B are on the right side ( In the tail direction).

  The printed wiring board processing apparatus of the first embodiment is arranged so that the blowing direction of the nozzle is directed to the drill. For this reason, it is possible to efficiently remove chips from the drill at the time of cutting with the air injected from the nozzle and discharge the chips from the pressure foot by the dust collection duct.

  In addition, since a plurality of nozzles are provided, air ejected from the nozzles 50A and 50B is collided in the vicinity of the drill 20 to create a tornado-like air current, thereby removing chips from the drill 20 during cutting, and applying pressure to the dust collection duct 12 by the dust collection duct 12. It can be efficiently discharged from the inside of the foot 10.

  Further, a pair of nozzles 50A and 50B are provided so that the blowing directions 50A-Y and 50B-Y are line-symmetric, and the dust collection duct is placed on a reference line XX that makes the blowing directions 50A-Y and 50B-Y line-symmetric. 12 are arranged. Therefore, the chips removed from the drill 20 can be efficiently discharged from the dust collection duct 12.

  Further, the blowing directions 50A-Y and 50B-Y of the nozzles 50A and 50B are directed to the moving direction of the pressure foot 10. For this reason, it is possible to remove all the chips remaining on the processing trace of the drill by jetting from the noises 50A and 50B.

  FIG. 3 is a view of the brush 40 shown in FIG. Bundles of brush bristles 42a, 42b, 42c, 42d, and 42e of nylon or the like are coaxially arranged around the drill 20 in five rows. Here, the bristles 42a and bristles 42b, the bristles 42b and bristles 42c, the bristles 42c and bristles 42d, the bristles 42d and bristles 42e And are arranged in a zigzag pattern. For this reason, it is possible to prevent the air from flowing into the pressure foot 10 with the brush 40, and to remove chips from the drill 20 at the time of cutting with air jetted from the nozzles 50 </ b> A and 50 </ b> B. 10 can be efficiently discharged.

  Here, the diameter d2 of the bottom surface 10B of the pressure foot 10 is formed, for example, to be 75 mm, and the diameter d1 of the opening 14 for extending the drill 20 is formed to be 25 mm. The diameter d1 of the opening 14 is preferably １ ／ to の of the diameter d2 of the bottom surface 10B in order to maintain airtightness. The bristles 42a, 42b, 42c and 42d of the inner rows are arranged, for example, at 25 mm. On the other hand, the outermost row of the bristles 42e of the bristles is adjusted to 27 mm. That is, in the first embodiment, in the brush 40, the bundle 42e of the bristles on the outer circumference is longer than that on the inner circumference. For this reason, even if a brush is applied to the end of the printed wiring board during processing, the brush bristles on the long outer periphery hit the end of the printed wiring board from the side, so that the brush 40 allows air to flow into the pressure foot 10. Can be prevented.

FIG. 4 is a block diagram illustrating a control configuration of the printed wiring board processing apparatus according to the first embodiment.
In the printed wiring board processing apparatus according to the first embodiment, the mechanical drive of the bolt and nut and the air pressure are used together when the pressure foot 10 is moved up and down. That is, the pressure foot 10 is sent mechanically until it comes close to the printed wiring board 80, and is sent by air pressure until it comes into contact with the printed wiring board 80 so that the printed wiring board is not damaged. I have. The air pressure (8 Kg / m ² ) for raising and lowering the pressure foot 10 is generated by an air pressure source 62, and this air pressure is switched by a pressure foot raising / lowering electromagnetic valve 68. This switching control is performed by the main body control panel 70 together with the above-described mechanical drive control of the bolt and nut.

The air pressure (8 kg / m ² ) generated by the above-described air pressure source 62 is reduced to ² kg / m ² by the regulator 64 and supplied to the solenoid valve 66. The solenoid valve 66 is operated by the potential (24 V) when the pressure foot lifting / lowering electromagnetic valve 68 for raising / lowering the pressure foot 10 from the main body control panel 70 is operated, and the air injection from the nozzles 50A and 50B is started. That is, when the pressure foot 10 comes into contact with the printed wiring board 80, the air injection from the nozzles 50A and 50B starts. In the first embodiment, since the injection from the nozzles 50A and 50B is performed using the air pressure that moves up and down the regulator 64, there is no need to separately provide an air pressure source.

[Second embodiment]
5A is a configuration diagram showing a configuration of a pressure foot of the printed wiring board processing apparatus according to the second embodiment of the present invention, and FIG. 5B is a bottom view of the brush of the second embodiment. .
On the bottom surface of the pressure foot according to the first embodiment described above with reference to FIG. 3, bundles 42a, 42b, 42c, 42d and 42e of brush hairs such as nylon are coaxially arranged around the drill 20 in five rows. It had been. On the other hand, in the second embodiment, a sleeve-like skirt 44 is provided between the row of the bristles 42a and the row of the bristles 42b together with the bristles. For this reason, the inflow of air into the pressure foot 10 is prevented, and chips generated during cutting can be removed from the drill 20 with air efficiently ejected from the nozzle, and can be discharged from the pressure foot 10 by the dust collection duct 12. Here, the sleeve-shaped skirt 44 is set to a length (23 mm) shorter than the length of the brush bristle (25 mm) so as not to contact the printed wiring board, and is made of a flexible member such as a vinyl film. Therefore, even when the pressure foot 10 is moved, the pressure foot 10 is not easily damaged by pins or the like protruding from the printed wiring board. The sleeve-shaped skirt 44 may be disposed between the rows of the bristles of the bristles as described above, or may be disposed inside the innermost circumference of the bristles 42a of the bristles or at the outermost circumference. Can be arranged outside the bundle 42e of brush hairs.

  FIG. 2C is an explanatory diagram of the pipe arrangement according to the second embodiment. In the first embodiment described above with reference to FIG. 2A, a pair of nozzles is provided. On the other hand, in the second embodiment, the three nozzles 50A, 50B, and 50C are arranged such that the blowing directions 50A-Y, 50B-Y, and 50C-Y point toward the drill 20, respectively. Note that any number of nozzles can be arranged as long as one or more nozzles are provided.

[Third embodiment]
In the printed wiring board processing apparatus according to the third embodiment, the brush is provided with eight rows of bristles, and the bristles on the inner peripheral side are made thicker than the outer peripheral side. The inner two rows of bristles are arranged, for example, to a length of 25 mm and a diameter of 0.3 mm. On the other hand, the outer bunch of six rows of brush bristles is adjusted to a length of 27 mm and a diameter of 0.15 mm. Since the brush bristles on the inner peripheral side are thick, the force for pressing the printed wiring board 80 is increased, and the displacement of the printed wiring board during processing can be suppressed by the brush.

  The effect of the first embodiment will be described. Here, a drill having a drill diameter of 0.8 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.4 mm, 1.5 mm, 1.6 mm, and 2.0 mm was used. A drill with a drill diameter of 0.8 mm is 45000 rpm, a drill with a drill diameter of 1.0 mm, 1.1 mm and 1.2 mm is 35000 rpm, a drill with a drill diameter of 1.4 mm, 1.5 mm and 1.6 mm is 30000 rpm and a drill diameter is 2. Processing was performed by using a 0 mm drill at 25000 rpm. Processing was performed by stacking five glass epoxy 8-layer multilayer printed wiring boards (1.1 mm thick, with a 30 μm thick solder resist layer made of epoxy on both sides).

  In the present embodiment, the roughing process (drilling of an opening in a printed wiring board) is performed by increasing the rotation speed of the drill by 20% and increasing the feed speed with respect to the printed wiring board processing apparatus having the configuration shown in FIG. ) Was improved by 50%, and the productivity of the end face processing of the printed wiring board was improved by 20 to 30%. Furthermore, the cut end could be finished smoothly. Also, when used at the same feed rate of the drill, processing is possible even when six drills are piled up (work efficiency is improved by 20% with respect to five piles), and seven piles can withstand practical use (working efficiency). 32% improvement).

  Here, when the temperature of the drill during processing was measured, it was 140 ° C. in the printed wiring board processing apparatus having the configuration shown in FIG. 6B, but was lowered to 80 ° C. in the first embodiment. Was completed. Further, in the printed wiring board processing apparatus having the configuration shown in FIG. 6B, the temperature of the chips attached to the drill was 175 ° C., whereas in the first embodiment, no chips were attached. Was. In this way, since the chips do not cling together with the cooling of the drill 20, the use time of the drill 20 can be extended, and the time required for drill replacement can be reduced. Further, since the chips do not stick to the drill, the cutting resistance is reduced and the feed speed of the drill can be increased. Thereby, the productivity of the printed wiring board can be increased.

  In the second embodiment, since the sleeve-shaped skirt 44 is provided, the inflow of air into the pressure foot 10 is obstructed, and chips that are cut during cutting are efficiently removed from the drill 20 by air jetted from the nozzle. 12 allows the pressure foot 10 to be discharged from the inside.

  Further, in the third embodiment, since the brush bristles on the inner peripheral side are thickened, the force for pressing the printed wiring board 80 is increased, and the displacement of the printed wiring board during processing can be suppressed by the brush.

FIG. 1A is a configuration diagram showing a configuration of a pressure foot of the printed wiring board processing apparatus according to the first embodiment of the present invention, and FIG. 1B is an explanatory diagram of a nozzle arrangement position. FIGS. 2A and 2B are views of the pipe arrangement in FIG. FIG. 2C is an explanatory diagram of the pipe arrangement according to the second embodiment. FIG. 2 is a view of the brush in FIG. FIG. 3 is a block diagram illustrating a control configuration of the printed wiring board processing apparatus according to the first embodiment. FIG. 5A is a configuration diagram showing a configuration of a pressure foot of the printed wiring board processing apparatus according to the second embodiment of the present invention, and FIG. 5B is a bottom view of the brush of the second embodiment. is there. FIG. 6A is an explanatory diagram of a pressure foot of a printed wiring board processing apparatus according to the related art, and FIG. 6B is a cross-sectional view and a side view of the drill in FIG. (C) is an explanatory view of a pressure foot of a printed wiring board processing apparatus according to another related art, and FIG. 6 (D) is a perspective view of a drill in FIG. 6 (C).

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 10 Pressure foot 12 Dust collection duct 20 Drill 30 Spindle 40 Brush 42a, 42b, 42c, 43d, 42e Bundle of brush hair 44 Skirt 50A, 50B Nozzle 52 Vinyl pipe 80 Printed wiring board

Claims (10)

In a printed wiring board processing machine with a pressure foot rotatably supporting a spindle with a drill attached to the tip:
A nozzle for injecting air into the drill;
A dust collection duct for discharging air in the pressure foot together with chips generated when cutting a printed wiring board;
A brush that abuts a bottom surface of the pressure foot on a printed wiring board and prevents air from flowing into the pressure foot. 2. The printed wiring board processing apparatus according to claim 1, wherein the brush is configured such that two or more rows of brush bristles are concentrically arranged, and the bundles are arranged in a staggered manner in adjacent rows. 3. The printed wiring board processing apparatus according to claim 1, wherein the brush has a brush bristle on an outer peripheral side longer than that on an inner peripheral side. 3. The printed wiring board processing apparatus according to claim 1, wherein the brush has a thicker bristles on an inner circumference side than on an outer circumference side. 4. 3. The pressure foot according to claim 1, further comprising: a sleeve-shaped skirt formed of a flexible member having a length not in contact with a printed wiring board on a bottom surface of the pressure foot to prevent air from flowing into the pressure foot. 3. The printed wiring board processing apparatus according to any one of 3. The printed wiring board processing apparatus according to any one of claims 1 to 5, wherein a blowing direction of the nozzle is arranged so as to point to the drill. The printed wiring board processing apparatus according to claim 6, comprising a plurality of the nozzles. 7. The printed wiring board processing apparatus according to claim 6, wherein a pair of the nozzles is provided so that the blowing direction is line-symmetric, and the dust collection duct is disposed on a reference line that makes the blowing direction line-symmetric. The printed wiring board processing apparatus according to any one of claims 1 to 8, wherein a blowing direction of the nozzle is directed to a moving direction of a pressure foot. 10. The printed wiring board processing apparatus according to claim 1, wherein air to the nozzle is supplied from an air pressure source for raising and lowering a pressure foot.

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