JP3103343U - Planar anisotropic conductive adhesive sheet - Google Patents

Abstract

Electrical connection means capable of easily performing an electrical connection when a conductor pattern on a circuit board is cut or the like, and being applicable irrespective of the width and the width of the conductor pattern on the circuit board. To provide.
A conductive adhesive layer (3) and an insulating adhesive layer (4) are alternately arranged in a stripe pattern on an insulating sheet (2).
[Selection diagram] Fig. 1

Description

  The present invention relates to a planar anisotropic conductive pressure-sensitive adhesive sheet which is an electrical connection means for electrically connecting, for example, cut conductor patterns on a circuit board, or for electrically connecting conductive terminals of the circuit board. .

As a method of electrically connecting the circuit boards, there is a method of electrically connecting the conductive terminals of both circuit boards in the connector main body so as to contact each other. As such a device, for example, a connector body having openings at both ends is used, a flexible board is directly inserted through one opening of the connector body, and another flexible board is held by the other opening of the connector body. There is a connector that is inserted while being held by a body and makes electrical connection by contacting conductive terminals of a flexible substrate in a connector body (for example, see Patent Document 1).
Japanese Utility Model Publication No. 07-042045

  However, according to the method using the connector main body, the substrate holder, and the like as described above, since the shapes of the connector main body, the substrate holder, and the like are complicated, the manufacturing is not always easy. According to the method of using the connector body, the board holder, and the like as described above, when the shape of the circuit board to be connected is different, it is necessary to remanufacture the connector body, the board holder, and the like in accordance with the shape. . Therefore, there is a demand for an electrical connection means which can be easily manufactured and has a wide application range.

  In addition to the electrical connection between the circuit boards as described above, there is a demand for a means for easily electrically connecting the cut portions when, for example, the conductor pattern on the circuit board is cut.

  The present invention has been made to solve the above-described problems, and is intended to electrically connect the cut conductor patterns on the circuit board, or to electrically connect the conductive terminals of the circuit board. It is an object of the present invention to provide a planar anisotropic conductive pressure-sensitive adhesive sheet which is easy to manufacture and can be easily applied to circuit boards having different widths of conductive patterns and conductive terminals.

  The planar anisotropic conductive pressure-sensitive adhesive sheet according to the present invention is characterized in that a conductive pressure-sensitive adhesive layer and an insulating pressure-sensitive adhesive layer are alternately arranged in a stripe pattern on an insulating sheet.

  In the planar anisotropic conductive pressure-sensitive adhesive sheet of the present invention, a release sheet is provided on the surface of the conductive pressure-sensitive adhesive layer and the insulating pressure-sensitive adhesive layer opposite to the surface on which the insulating sheet is provided. It may be attached.

  In the planar anisotropic conductive pressure-sensitive adhesive sheet of the present invention, the conductive pressure-sensitive adhesive layer and the insulating pressure-sensitive adhesive layer are alternately arranged in a stripe pattern on an insulating sheet, so that, for example, a cut conductor on a circuit board is cut. It becomes easy to electrically connect the patterns and electrically connect the conductive terminals of the circuit board, and it is also easy to apply the circuit board and the conductive terminals having different widths and intervals to the conductive terminals. Furthermore, it can be manufactured easily.

Hereinafter, the present invention will be described in detail.
FIG. 1 is a plan view showing an example of the planar anisotropic conductive pressure-sensitive adhesive sheet 1 of the present invention, and FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. The planar anisotropic conductive pressure-sensitive adhesive sheet 1 comprises an insulating sheet 2 and conductive pressure-sensitive adhesive layers 3 and insulating pressure-sensitive adhesive layers 4 alternately arranged in a direction parallel to the surface of the planar anisotropic conductive pressure-sensitive adhesive sheet 1. They are arranged in stripes. FIG. 1 is a view of the two main surfaces of the planar anisotropic conductive pressure-sensitive adhesive sheet 1 as viewed from the main surface on which the conductive pressure-sensitive adhesive layer 3 and the insulating pressure-sensitive adhesive layer 4 are formed.

  The shape of the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is not particularly limited, and can be appropriately selected. Specific shapes of the planar anisotropic conductive pressure-sensitive adhesive sheet 1 include, for example, a square shape and a rectangular shape. The planar anisotropic conductive pressure-sensitive adhesive sheet 1 is, for example, elongated in the line direction (longitudinal direction) of the conductive pressure-sensitive adhesive layer 3 and the insulating pressure-sensitive adhesive layer 4, and is formed into a roll shape by winding the sheet. Is also good. Such a roll-shaped planar anisotropic conductive pressure-sensitive adhesive sheet 1 can be used after being cut into a predetermined length at the time of use.

  In addition, at the end of the plane anisotropic conductive pressure-sensitive adhesive sheet 1 in the direction in which the conductive pressure-sensitive adhesive layer 3 and the insulating pressure-sensitive adhesive layer 4 repeat in a striped manner, both ends are insulated as shown in FIGS. The conductive adhesive layer 4 may be used, the both ends may be the conductive adhesive layer 3, or one end may be the conductive adhesive layer 3 and the other end may be the insulating adhesive layer. The adhesive layer 4 may be used.

  In the planar anisotropic conductive pressure-sensitive adhesive sheet 1 according to the present invention, the conductive pressure-sensitive adhesive layers 3 and the insulating pressure-sensitive adhesive layers 4 are alternately arranged in a striped manner so that the line direction (longitudinal) of the conductive pressure-sensitive adhesive layer 3 is long. Direction), but not in the direction in which the conductive adhesive layer 3 and the insulating adhesive layer 4 are alternately striped. By utilizing such a property, for example, as a repair member for electrically connecting the cut portion when the conductor pattern formed on the circuit board is cut, or electrically connecting the conductive terminals of the two circuit boards to each other. It can be used as electrical connection means such as a simple connector for connecting to a computer.

  Further, in the planar anisotropic conductive pressure-sensitive adhesive sheet 1 of the present invention, by adopting the above-described configuration, for example, the width of the conductive pattern or the conductive terminal formed on the circuit board is different, or the width of the conductive pattern or the conductive terminal is different. Even in the case where the intervals are different, it is possible to cope without changing the configuration of the planar anisotropic conductive pressure-sensitive adhesive sheet 1 or by slightly changing the width and the intervals of the conductive pressure-sensitive adhesive layer 3 and the insulating pressure-sensitive adhesive layer 4. Therefore, the necessity of remanufacturing each circuit board is greatly reduced, and the cost can be improved. Moreover, the planar anisotropic conductive pressure-sensitive adhesive sheet 1 of the present invention has a configuration in which the conductive pressure-sensitive adhesive layers 3 and the insulating pressure-sensitive adhesive layers 4 are alternately arranged on the insulating sheet 2 in a stripe pattern. Therefore, it can be easily manufactured.

  Examples of the insulating sheet 2 used for such a planar anisotropic conductive pressure-sensitive adhesive sheet 1 include a plastic film having an insulating property. Examples of the plastic film having insulating properties include, for example, those made of polyimide resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyester resin, polyethylene naphthalate resin, polyvinyl chloride resin, etc. What consists of a polyimide resin or polyester resin is preferable from the point of being excellent.

  The thickness of the insulating sheet 2 is not particularly limited, but is preferably from 10 μm to 50 μm. If the thickness is less than 10 μm, it may be difficult to maintain the shape of the planar anisotropic conductive pressure-sensitive adhesive sheet 1. If the thickness exceeds 50 μm, the flexibility may be reduced. It may not be suitable for repair.

  It is preferable that the conductive pressure-sensitive adhesive layers 3 formed in a plurality of stripes on the insulating sheet 2 have substantially the same linear width and are parallel to each other. Further, the width of each conductive pressure-sensitive adhesive layer 3 is preferably in the range of 50 μm or more and 200 μm or less. If the width of the conductive pressure-sensitive adhesive layer 3 is less than 50 μm, the resistance of the conductive pressure-sensitive adhesive layer 3 increases, and problems such as heat generation are likely to occur, which is not preferable.

  If the width exceeds 200 μm, for example, when used for repairing circuit boards or connecting circuit boards as described later, there is a risk that adjacent conductor patterns or conductive terminals on the circuit board may be short-circuited. For this reason, it is more preferable that the width of the conductive pressure-sensitive adhesive layer 3 is smaller than the distance between adjacent conductive patterns or conductive terminals on the circuit board to be repaired or joined.

  Further, the conductive pressure-sensitive adhesive layers 3 are preferably formed at intervals of 50 μm or more and 200 μm or less. If the spacing is less than 50 μm, the electrical insulation between the conductive pressure-sensitive adhesive layers 3 may not be sufficient. If the spacing exceeds 200 μm, for example, when the conductive pressure-sensitive adhesive Since the space between the layers 3 is too wide, the conductor pattern to be repaired may be located in this space, and the conductor pattern may not be electrically connected and may not be repaired.

  Similarly, in the connection between circuit boards, if the distance between the conductive pressure-sensitive adhesive layers 3 is too wide, the conductive terminal to be connected is located in the space between the conductive pressure-sensitive adhesive layers 3, and the electrical connection is made. May not be connected. For this reason, the distance between the conductive pressure-sensitive adhesive layers 3 is preferably equal to or smaller than the width of the conductor pattern or the width of the conductive terminal of the circuit board.

  The thickness of the conductive pressure-sensitive adhesive layer 3 is preferably from 10 μm to 50 μm. If the thickness of the conductive pressure-sensitive adhesive layer 3 is less than 10 μm, the resistance of the conductive pressure-sensitive adhesive layer 3 increases, and problems such as heat generation are likely to occur. The resistance of the conductive pressure-sensitive adhesive layer 3 can be sufficiently reduced, and if provided beyond this, not only does the resistance not decrease, but also the amount of the conductive pressure-sensitive adhesive used increases, which is not preferable. The thickness is a length in a direction perpendicular to the main surface of the insulating sheet 2.

  As the conductive pressure-sensitive adhesive for forming the conductive pressure-sensitive adhesive layer 3, a known conductive pressure-sensitive adhesive can be used, and examples thereof include a resin and a conductive filler. Examples of the resin include an epoxy resin, a phenol resin, a melamine resin, an addition-type imide resin, a polyimide, a polyamide, and a polyester. Among them, the epoxy resin is preferable because of its excellent balance of adhesiveness and mechanical strength.

  Examples of the epoxy resin include epoxy resins such as a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol AD epoxy resin, a glycidylamino group-containing epoxy resin, a resorcinol epoxy resin, and a novolak epoxy resin. When an epoxy resin is used, a known curing agent can be included. Examples of the curing agent include phenol novolak resins, phenol resins such as bisphenol A and bisphenol F, amines such as dicyandiamide, and imidazole.

  Examples of the conductive filler include metals such as gold, silver, copper, iron, nickel, cobalt, manganese, chromium, and lead, and among these, silver powder is preferably used. The conductive adhesive may be wetted with a hygroscopic agent such as calcium oxide or magnesium oxide, an adhesion enhancer such as a silane coupling agent or a titanium coupling agent, a nonionic surfactant, or a fluorine surfactant as necessary. An enhancer, an antifoaming agent such as silicone oil, and an ion trapping agent such as an inorganic ion exchanger may be added.

  The insulating pressure-sensitive adhesive layer 4 is formed between such conductive pressure-sensitive adhesive layers 3. In addition, as described above, the insulating adhesive layer 4 may or may not be formed at the end in the direction in which the conductive adhesive layer 3 and the insulating adhesive layer 4 repeat in a stripe pattern. Good. The width of the insulating pressure-sensitive adhesive layer 4 is determined by the distance between the conductive pressure-sensitive adhesive layers 3, and is preferably from 50 μm to 200 μm as described above.

  It is preferable that the thickness of the insulating pressure-sensitive adhesive layer 4 is adjusted to the thickness of the conductive pressure-sensitive adhesive layer 3, specifically, the same thickness as the conductive pressure-sensitive adhesive layer 3 in a range of 10 μm or more and 50 μm or less. preferable. For example, when the thickness of the insulating pressure-sensitive adhesive layer 4 is larger than the thickness of the conductive pressure-sensitive adhesive layer 3, when the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is bonded, the conductive pressure-sensitive adhesive layer 3 is sufficiently bonded. It is not preferable because it may not be performed.

  As the insulating pressure-sensitive adhesive forming such insulating pressure-sensitive adhesive layer 4, a known insulating pressure-sensitive adhesive can be used, and examples thereof include an epoxy resin, a phenol resin, a melamine resin, an addition-type imide resin, a polyimide, a polyamide, and a polyester. Among them, epoxy resins are preferable because of their excellent balance of adhesiveness and mechanical strength.

  Examples of the epoxy resin include epoxy resins such as a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol AD epoxy resin, a glycidylamino group-containing epoxy resin, a resorcinol epoxy resin, and a novolak epoxy resin. When an epoxy resin is used, a known curing agent can be included. Examples of the curing agent include phenol novolak resins, phenol resins such as bisphenol A and bisphenol F, amines such as dicyandiamide, and imidazole.

  Insulating pressure-sensitive adhesives include, as necessary, hygroscopic agents such as calcium oxide and magnesium oxide, adhesive strength improvers such as silane coupling agents and titanium coupling agents, nonionic surfactants, fluorine surfactants, and the like. , A defoaming agent such as silicone oil, and an ion trapping agent such as an inorganic ion exchanger may be added.

  For example, as shown in FIG. 3, the planar anisotropic conductive pressure-sensitive adhesive sheet 1 has a conductive pressure-sensitive adhesive layer 3 and an insulating pressure-sensitive adhesive layer 4 on the side opposite to the surface on which the insulating sheet 2 is provided. The release sheet 5 may be adhered to the surface of. By sticking such a releasable sheet 5 and peeling off the releasable sheet 5 at the time of use, unnecessary sticking is suppressed, and storage and transportation are excellent. It can be.

  The planar anisotropic conductive pressure-sensitive adhesive sheet 1 of the present invention is provided on the insulating sheet 2 while moving the insulating sheet 2, for example, and is provided in parallel in a direction perpendicular to the moving direction. The conductive pressure-sensitive adhesive and the insulating pressure-sensitive adhesive can be simultaneously extruded from a plurality of nozzles so that the pressure-sensitive adhesive and the insulating pressure-sensitive adhesive are alternately applied, and then dried to manufacture. Thereafter, the sheet may be cut as necessary, or the release sheet 5 may be attached.

  Next, an example of use of the planar anisotropic conductive pressure-sensitive adhesive sheet 1 of the present invention will be described. First, the case where the planar anisotropic conductive pressure-sensitive adhesive sheet 1 of the present invention is used as a repair member will be described. FIG. 4 shows a circuit board 6 to be repaired. The circuit board 6 to be repaired is, for example, one in which a plurality of conductor patterns 8 are formed in parallel on a base material 7 and a part of the conductor pattern 8 is electrically cut. In FIG. 4, the portion shown by the dotted line shows the state of the conductor pattern 8 before cutting. The circuit board 6 is not particularly limited, and may be any of a flexible wiring board and a rigid wiring board.

  As shown in FIG. 5, the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is attached so as to straddle the conductor patterns 8 on both sides of the cut portion. At this time, the surface of the planar anisotropic conductive pressure-sensitive adhesive sheet 1 on which the conductive pressure-sensitive adhesive layer 3 and the insulating pressure-sensitive adhesive layer 4 are formed is in contact with the surface of the circuit board 6 on which the conductive pattern 8 is formed, and Then, the adhesive is applied such that the line direction (longitudinal direction) of the conductor pattern 8 on the circuit board 6 and the line direction of the conductive pressure-sensitive adhesive layer 3 and the insulating pressure-sensitive adhesive layer 4 on the planar anisotropic conductive pressure-sensitive adhesive sheet 1 match. .

  The planar anisotropic conductive pressure-sensitive adhesive sheet 1 may be in a state where it is simply stuck to the circuit board 6, but may be subjected to a heat treatment thereafter. If the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is simply stuck, it can be freely detached, but easily peeled off, but can be securely fixed by heat treatment.

  By sticking the planar anisotropic conductive pressure-sensitive adhesive sheet 1 to the circuit board 6 in this manner, each cut portion of the conductor pattern 8 on the circuit board 6 is formed by the conductive pressure-sensitive adhesive layer on the planar anisotropic conductive pressure-sensitive adhesive sheet 1. 3, and the adjacent conductor patterns 8 on the circuit board 6 are not electrically connected to each other, so that the circuit board 6 can be easily repaired.

  The width of the conductive pressure-sensitive adhesive layer 3 formed on the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is preferably smaller than the distance between adjacent conductor patterns 8 of the circuit board 6 to be repaired. . As can be seen from FIG. 5, when the width of the conductive pressure-sensitive adhesive layer 3 is equal to or larger than the interval between the conductor patterns 8, the conductive pressure-sensitive adhesive layer 3 may be stuck over these. However, these are not preferable because they are electrically connected.

  The distance between the conductive pressure-sensitive adhesive layers 3 formed on the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is equal to or smaller than the width of the conductor pattern 8 of the circuit board 6 to be repaired. Is preferred. As can be seen from FIG. 5, when the interval between the conductive adhesive layers 3 is wider than the width of the conductive pattern 8, the conductive pattern 8 may enter the interval between the conductive adhesive layers 3, It is not preferable because some of them are not electrically connected.

  Next, an example in which the planar anisotropic conductive adhesive sheet 1 of the present invention is used as a simple connector will be described. As shown in FIG. 6, circuit boards 9 and 10 to be connected are, for example, substrates 11 and 12 on which conductive terminals 13 and 14 are formed. Here, the circuit boards 9 and 10 are not particularly limited, and may be any of a flexible wiring board and a rigid wiring board.

  Each of the circuit boards 9 and 10 is arranged such that the end side surfaces on the side on which the conductive terminals 13 and 14 are formed face each other and the surfaces on which the conductive terminals 13 and 14 are formed face the same direction. . Then, in this state, a reinforcing adhesive sheet 15 is attached from the side of the substrates 11 and 12 of the circuit boards 9 and 10 so as to straddle them. The pressure-sensitive adhesive sheet 15 for reinforcement is not particularly limited as long as it is made of an insulating material.

  Then, the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is attached to both of the main surfaces of the circuit boards 9 and 10 on the surface on which the conductive terminals 13 and 14 are formed so as to straddle these conductive terminals 13 and 14. . At this time, of the two main surfaces of the planar anisotropic conductive pressure-sensitive adhesive sheet 1, the surface on which the conductive pressure-sensitive adhesive layer 3 and the insulating pressure-sensitive adhesive layer 4 are formed corresponds to the conductive terminals 13 and 14 of the circuit boards 9 and 10. The conductive adhesive layer 3 and the insulating adhesive in the line direction (longitudinal direction) of the conductive terminals 13 and 14 in the circuit boards 9 and 10 and the planar anisotropic conductive adhesive sheet 1 The layer 4 is adhered so that the line direction (longitudinal direction) of the layer 4 matches.

  By sticking the planar anisotropic conductive adhesive sheet 1 in this manner, the conductive terminals 13 of one circuit board 9 and the conductive terminals 14 of the other circuit board 10 are electrically connected in a one-to-one relationship. Is done. For the same reason as described in the example of the repairing member, the width of the conductive pressure-sensitive adhesive layer 3 formed on the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is the same as that of the adjacent conductive terminals 13 and 14. It is preferable that the interval is smaller than the interval of the narrowest portion. Also, the interval between the conductive pressure-sensitive adhesive layers 3 formed on the planar anisotropic conductive pressure-sensitive adhesive sheet 1 is preferably equal to or smaller than the width of the widest part of the conductive terminals 13 and 14.

  The example in which the planar anisotropic conductive pressure-sensitive adhesive sheet 1 of the present invention is used as a repair member and a simple connector has been described above. However, the use form is not necessarily the same, and the use thereof is not limited to the purpose of the present invention. The form can be changed as appropriate. Further, the planar anisotropic conductive pressure-sensitive adhesive sheet 1 of the present invention is not limited to use as a repair member or a simple connector, but can be applied to other uses as long as it does not contradict the purpose of the present invention.

The top view which showed an example of the planar anisotropic conductive adhesive sheet of this invention. FIG. 2 is a cross-sectional view of the plane anisotropic conductive pressure-sensitive adhesive sheet of FIG. FIG. 4 is a cross-sectional view showing another planar anisotropic conductive pressure-sensitive adhesive sheet of the present invention. The figure for demonstrating the method of using the planar anisotropic conductive adhesive sheet of this invention as a repair member. The figure for demonstrating the method of using the planar anisotropic conductive adhesive sheet of this invention as a repair member. The figure for demonstrating the method of using the planar anisotropic conductive adhesive sheet of this invention as a simple connector. The figure for demonstrating the method of using the planar anisotropic conductive adhesive sheet of this invention as a simple connector.

Explanation of reference numerals

  DESCRIPTION OF SYMBOLS 1 ... Planar anisotropic conductive adhesive sheet, 2 ... Insulating sheet, 3 ... Conductive adhesive, 4 ... Insulating adhesive, 5 ... Release sheet

Claims (4)

  A planar anisotropic conductive pressure-sensitive adhesive sheet, wherein conductive pressure-sensitive adhesive layers and insulating pressure-sensitive adhesive layers are alternately arranged in stripes on an insulating sheet.   2. A release sheet is attached to a surface of the conductive pressure-sensitive adhesive layer and the insulating pressure-sensitive adhesive layer opposite to a surface on which the insulating sheet is provided. Planar anisotropic conductive pressure-sensitive adhesive sheet.   The planar anisotropic conductive pressure-sensitive adhesive sheet according to claim 1, wherein the width of the conductive pressure-sensitive adhesive layer is 50 μm or more and 200 μm or less.   4. The planar anisotropic conductive pressure-sensitive adhesive sheet according to claim 1, wherein the width of the insulating pressure-sensitive adhesive layer is 50 μm or more and 200 μm or less. 5.

Images