JP3097136B2 - Wafer processing method using multi-chamber process equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a weather using a multi-chamber process apparatus used in the manufacturing process of the semiconductor device
(C) A processing method .

[0002]

2. Description of the Related Art In recent years, along with miniaturization of IC patterns, diversification such as higher precision and complexity of a process and a larger diameter of a wafer is required. Against this background, the increase in the number of complex processes and the increase in throughput due to the single wafer processing
From a viewpoint , a multi-chamber process apparatus is receiving attention.

Conventionally, as this type of multi-chamber process apparatus, the one shown in FIG. 3 is known. This apparatus is provided with a plurality of (two in the figure) peripheral portions of a wafer transfer chamber 1 having a preliminary evacuation function and a wafer transfer arm 1A.
) And a wafer load chamber 3 are connected and fixed to each other. As shown in FIG. 4, the process chamber 2 is provided with an adjustment mechanism 4 such as a temperature adjustment mechanism and a pressure adjustment mechanism at a lower portion. When the process chamber 2 is assembled to the wafer transfer chamber 1, the opening 1a of the wafer transfer chamber 1 is opened. A gate valve 2A through which a wafer is loaded and unloaded by the wafer transfer arm 1A is provided on a side wall facing the. The gate valve 2A is opened and closed to open and close windows. A plurality of bolt insertion holes 2b are formed in the peripheral portion of the side wall 2B of the process chamber 2 where the gate valve 2A is provided.
As shown in FIG. 5, a bolt 5 is inserted into the bolt insertion hole 2b and screwed and connected and fixed.

[0004] As another prior art, "1990"
Annual Monthly Semiconductor World Special Issue "
Apparatus described on pages 284 to 297;
An apparatus described in US Pat. No. 5,559,926 is known. These prior arts also have a process chamber assembly structure similar to that of the above-described conventional example.

[0005] In such a multi-chamber process apparatus, a chamber (module) suitable for the process is selected to optimize specifications.

[0006]

In such a conventional apparatus, for example, a trouble occurs in one process chamber, or as the film formation is repeated, the particle level deteriorates, and finally, mechanical cleaning or the like becomes necessary. If this happens, the process chamber must be repaired. In this case, the process chamber 2 must be disassembled and repaired by detaching the process chamber 2 from the wafer transfer chamber 1. For this reason, the wafer transfer chamber 1 is opened at the place where the process chamber 2 is removed, so that other processes can be performed. The transfer of the wafer to the chamber 2, the processing in another process chamber 2, and the like cannot be performed, and the entire apparatus must be stopped. For this reason, there is a problem that the downtime increases in proportion to the number of process chambers. In particular, in the conventional apparatus, as shown in FIG. 5, since it is required to remove the bolts 5 to 5 after removing the wall plate 2C of the process chamber 2, the assembly and removal of the process chamber 2 are required. There was a problem that it was complicated.

The present invention has been made in view of such conventional problems, and can easily repair and maintain a process chamber without stopping other process chambers. It is an object to obtain a wafer processing method using a multi-chamber process apparatus.

[0008]

Means for Solving the Problems] The present invention, Mar
In a processing method using a multi-chamber process apparatus,
EHA transport chamber and multiple professionals for single wafer processing
A process chamber is provided in the wafer transfer chamber.
Parallel so that communication is possible through each gate valve
And detachably connected via pinching means
Using a multi-chamber process apparatus
The transfer means in the transfer chamber is used for transferring the wafer.
Between the chamber and each process chamber.
Loading and unloading the wafer through the
A selected one of the plurality of process chambers
One or more of the gates associated with the selected process chamber.
Operate the holding means with the heat valve closed.
The solution is to attach and detach from the wafer transfer chamber.
It is a step.

[0009]

When the process chamber is removed from the wafer transfer chamber, the closed state of the wafer transfer chamber can be maintained, so that the pressure in the wafer transfer chamber does not change, and Contamination from the atmosphere is prevented from entering the chamber. Therefore, it is not necessary to stop the operation of the wafer transfer chamber and other process chambers. In addition,
Assembly and removal of the process chamber becomes easy.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of a wafer processing method using a multi-chamber process apparatus according to the present invention will be described below with reference to the drawings.

The multi-chamber process apparatus of this embodiment has a configuration as shown in FIG. In the figure, reference numeral 10 denotes a multi-chamber process apparatus.
Is a wafer load chamber 11 and a buffer chamber 13 connected to the wafer load chamber 11 via a gate valve 12.
A wafer transfer chamber 15 connected to the buffer chamber 13 via a gate valve 14, and gate valves 16A and 16A connected to the wafer transfer chamber 15, respectively.
The process chambers 17A, 17B, and 17C are communicatively connected via B and 16C.

In the wafer loading chamber 11, a wafer cassette 18 accommodating a plurality of wafers a is disposed and an apparatus 10 is provided.
To supply the wafer a.

The buffer chamber 13 has a preliminary exhaust function, and is provided with a wafer transfer arm 19 for transferring a wafer therein. The wafer transfer chamber 15 is also provided with a wafer transfer arm 20 so that the wafer a can be transferred to each of the process chambers 17A, 17B, and 17C.

The gate valves 16A, 16B, 16
C is provided on the wafer transfer chamber 15 side.
Outside the gate valves 16A, 16B, 16C,
Communication pipes 21, 22, 23 in which flange portions 21a, 22a, 23a are respectively formed are provided. On the side of the process chambers 17A, 17B, and 17C, flange portions 17a, 17b, and 17c are formed at connection end portions, respectively. The flange 21 on the wafer transfer chamber 15 side
a, 22a, and 23a are flange portions 1 formed in the process chambers 17A, 17B, and 17C provided respectively.
7a, 17b, and 17c are pressed into contact with each other via an O-ring 29, and are detachably locked by a plurality of clamps 24 to 24.

Further, the process chambers 17A, 17
B and 17C are two guide rails 25a and 25b, respectively.
Is mounted so as to be able to travel via wheels. Also,
Other electric wirings (not shown) such as a gas introduction pipe 27 and an exhaust pipe 28 for a reactive gas and the like connected to the process chambers 17A, 17B, and 17C have flexibility and process on the guide rails 25a and 25b. A sufficient length is ensured so that the chamber can run.

In this embodiment, the wafer transfer chamber 15 and the process chamber 1
7A, 17B and 17C can be easily attached and detached.
If the process chamber 17A needs to be repaired,
Clamps 24 to 24 with gate valve 16A closed
And remove the process chamber 17A from the guide rail 25.
It is possible to secure a work space apart from the wafer transfer chamber 15 along a and 25b. During this time, it is not necessary to stop the operation of the other process chambers 17B and 17C, and it is possible to avoid stopping the operation of the entire apparatus as in the related art.

Although the present embodiment has been described above, the present invention is not limited to the above embodiment, and the process chamber is substantially closed with respect to the wafer transfer chamber. Any configuration may be used as long as it is detachably connected in the state.

For example, in the above-described embodiment, the process chamber and the wafer transfer chamber are locked by the clamp. However, the two chamber flanges may be locked by another locking means.

It is needless to say that the number of wafer transfer chambers and the number of process chambers can be appropriately changed according to the complex process.

[0020]

As is apparent from the above description , wafer processing using the multi-chamber process apparatus according to the present invention.
According to the method , without stopping the operation of the entire device,
There is an effect that repair, maintenance and the like of the process chamber can be easily performed.

[Brief description of the drawings]

FIG. 1 is a plan view of a multi-chamber process apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a main part of the embodiment.

FIG. 3 is an explanatory plan view of a conventional example.

FIG. 4 is a front view of a conventional process chamber.

FIG. 5 is a sectional view of a main part of a conventional example.

[Explanation of symbols]

10: Multi-chamber process apparatus, 15: Wafer transfer chamber, 16A, 16B, 16C: Gate valve,
17A, 17B, 17C: process chamber, 20: wafer transfer arm (wafer transfer means), 24: clamp.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/68 H01L 21/205 H01L 21/285 H01L 21/3065 H01L 21/31

Claims (1)

(57) [Claims] 1. A wafer transfer chamber and a wafer processing unit
A plurality of process chambers for transferring the wafer.
Communication is possible through each gate valve provided in the chamber
Are connected in parallel so that
Multi-chamber process equipment connected detachably
Using, by the transfer means of the wafer transfer chamber, the U
Between the chamber for transfer and each process chamber.
Loading and unloading the wafer via gate valve for processing
And one or more selected from the plurality of process chambers.
Above, the gates for the selected process chambers
With the valve closed, operate the holding means to
(C) The multi-type is detachable from the transfer chamber.
A wafer processing method using a chamber process device.