JP3094523B2 - Electronic component mounting mark, printed circuit board, and electronic component mounting method - Google Patents
Electronic component mounting mark, printed circuit board, and electronic component mounting methodInfo
- Publication number
- JP3094523B2 JP3094523B2 JP03180303A JP18030391A JP3094523B2 JP 3094523 B2 JP3094523 B2 JP 3094523B2 JP 03180303 A JP03180303 A JP 03180303A JP 18030391 A JP18030391 A JP 18030391A JP 3094523 B2 JP3094523 B2 JP 3094523B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- mark
- electronic
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Printing Methods (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント基板などに電子
部品を自動装着する時に位置決めに用いる電子部品装着
マーク、その電子部品装着マークを有するプリント基
板、および、電子部品装着マークを用いて電子部品を装
着する電子部品装着方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting mark used for positioning when electronic components are automatically mounted on a printed circuit board or the like, and a printing base having the electronic component mounting mark.
Electronic components are mounted using the board and the electronic component mounting mark.
About the electronic component mounting how to wear.
【０００２】[0002]
【従来の技術】ビデオカメラ，ビデオテープレコーダな
どの電子機器の小型化に伴い，それらの電子機器に搭載
されているプリント基板も小型化され，プリント基板に
装着する電子部品の装着密度も高くなっている。このよ
うなプリント基板への電子部品の装着は自動化されてい
る。たとえば，緑色に着色されたプリント基板には予め
導電性金属の配線パターンがプリント配線されている
他，種々の電子部品を半田づけする位置を指定するマー
クが白色で印刷されており，それらのマークを画像処理
して電子部品装着の位置決めを行い，該当する位置に部
品を装着し，半田づけを行う。このような電子部品の装
着において，ＩＣチップなどのように装着の方向性，電
解コンデンサなどのように極性を持つ電子部品（有極部
品）の装着は，単に位置を装着認識するだけでなくその
向き（極性）を一致させて装着するためプリント基板上
に向き（極性）を指示する必要がある。2. Description of the Related Art With the downsizing of electronic devices such as video cameras and video tape recorders, the size of printed boards mounted on those electronic devices has been reduced, and the mounting density of electronic components mounted on the printed circuit boards has also increased. ing. Mounting of electronic components on such a printed circuit board is automated. For example, a printed circuit board colored in green has a wiring pattern of conductive metal printed thereon in advance, and a mark for designating a position where various electronic components are to be soldered is printed in white. Is image-processed to position electronic component mounting, the component is mounted at a corresponding position, and soldering is performed. In mounting such electronic parts, mounting of electronic parts (polarized parts) having a mounting direction such as an IC chip and a polarity such as an electrolytic capacitor not only recognizes the position but also recognizes the position. It is necessary to indicate the direction (polarity) on the printed circuit board in order to mount with the direction (polarity) being matched.
【０００３】図３にこのような有極部品を装着するプリ
ント基板の部分図を示す。この例は緑色に着色された下
地のプリント基板の電子部品装着領域１ａ内に有極指示
マーク６ａを有する有極部品６を金属ランド２，３を介
して半田づけを行う例を示す。図３（Ａ）は有極部品６
が装着される前のプリント基板の部分平面図，図３
（Ｂ）は装着の対象となる有極指示マーク６ａ付き有極
部品６の平面図，図３（Ｃ）は電子部品装着領域１ａ内
に有極部品６を装着した平面図を示す。半田づけに先立
って有極部品６をランド２，３に正確の載置するため，
中心位置を指示する白色の中心位置マーク４が印刷され
ている他，ランド２の上部に有極指示マーク６ａの向き
を指示する白色の極性指示マーク７が印刷されている。
電子部品自動装着機（図示せず）は有極部品６を所定の
半田づけ位置に載置するに先立って中心位置マーク４お
よび極性指示マーク７を画像認識し，有極部品６を装着
するための画像処理による位置決めを行うとともに，有
極指示マーク６ａを極性指示マーク７を指向するように
して向きを調整して装着する。その他の電子部品もこの
ように装着した後，半田づけを行う。FIG. 3 is a partial view of a printed circuit board on which such a polarized component is mounted. This example shows an example in which a polar component 6 having a polar indication mark 6a is soldered via metal lands 2 and 3 in an electronic component mounting region 1a of an underlying printed circuit board colored green. FIG. 3A shows a polarized part 6.
FIG. 3 is a partial plan view of a printed circuit board before mounting is performed.
3B is a plan view of the polar component 6 with the polar indication mark 6a to be mounted, and FIG. 3C is a plan view of the polar component 6 mounted in the electronic component mounting area 1a. In order to accurately place the polarized component 6 on the lands 2 and 3 prior to soldering,
A white center position mark 4 indicating the center position is printed, and a white polarity indicating mark 7 indicating the direction of the polarized indicating mark 6a is printed on the land 2.
The electronic component automatic placement machine (not shown) recognizes the center position mark 4 and the polarity indication mark 7 before placing the polarized component 6 at a predetermined soldering position, and mounts the polarized component 6. And the orientation is adjusted so that the polar indicator mark 6a is directed to the polar indicator mark 7 and mounted. After other electronic components are mounted in this manner, soldering is performed.
【０００４】[0004]
【発明が解決しようとする課題】ランド２の上部に有極
指示マーク６ａの向きを指示する極性指示マーク７を印
刷しているため，電子部品装着領域１ａの高さ（長さ）
Ｈａが長くなり，実装密度が低下するという問題があ
る。したがって，本発明の目的は，上記中心位置マーク
４の機能と極性指示マーク７の機能を有しつつ，電子部
品装着領域を可能な限り縮小可能としプリント基板の実
装密度を向上させうる電子部品装着マークを提供するこ
とにある。Since the polarity indication mark 7 for indicating the direction of the polarization indication mark 6a is printed on the upper part of the land 2, the height (length) of the electronic component mounting area 1a is increased.
There is a problem that Ha becomes long and the mounting density is reduced. Accordingly, it is an object of the present invention to provide an electronic component mounting apparatus which has the function of the center position mark 4 and the function of the polarity indicating mark 7 and can reduce the electronic component mounting area as much as possible to improve the mounting density of a printed circuit board. To provide a mark.
【０００５】[0005]
【課題を解決するための手段】本発明の第１の観点によ
れば、中央部と、該中央部の両側に電子部品から突出す
るように対称に形成された、幅広部と、幅狭部と、上記
幅広部と上記幅狭部との間に形成された凹部とを有し、
電子部品を装着する部分の近傍の隣接するランドの間に
印刷され、または、配設される、電子部品装着マークが
提供される。According to a first aspect of the present invention, a central portion and both sides of the central portion project from electronic components.
The wide part, the narrow part, and the
Having a concave portion formed between the wide portion and the narrow portion,
Between adjacent lands near the part where electronic components are mounted
An electronic component mounting mark is provided that is printed or disposed .
【０００６】本発明の第２の観点によれば、上記電子部
品装着マークを有するプリント基板、すなわち、複数の
ランドを有し、電子部品が装着されるプリント基板にお
いて、中央部と、該中央部の両側に電子部品から突出す
るように対称に形成された、幅広部と、幅狭部と、上記
幅広部と上記幅狭部との間に形成された凹部とを有する
電子部品装着マークが、隣接するランドの間の所定位置
に印刷され、または、 配設されていることを特徴とする
プリント基板が提供される。According to a second aspect of the present invention, there is provided a printed circuit board having the electronic component mounting mark, that is, a plurality of printed circuit boards.
Printed circuit board with land and electronic components
And protrudes from the electronic component on the center and on both sides of the center.
The wide part, the narrow part, and the
Having a recess formed between the wide portion and the narrow portion
The electronic component mounting mark is located at a predetermined position between adjacent lands.
Characterized by being printed or arranged on
A printed circuit board is provided.
【０００７】本発明の第３の観点によれば、上記電子部
品装着マークを用いて電子部品をプリント基板に装着す
る方法、すなわち、下記の諸工程を有する複数のランド
を有するプリント基板に電子部品を装着する電子部品装
着方法が提供される。当該電子部品装着方法は、 （１）中央部と、該中央部の両側に電子部品から突出す
るように対称に形成された、幅広部と、幅狭部と、上記
幅広部と上記幅狭部との間に形成された凹部とを有する
電子部品装着マークを、前記プリント基板における隣接
するランドの間の所定位置に印刷する、または、配設す
る工程と、 （２）前記電子部品装着マークを含む領域を撮像して画
像データを生成する工程と、 （３）前記生成した画像データを信号処理して、前記電
子部品装着マークの幅広部と、幅狭部と、凹部とを識別
し、これら認識した幅広部と、幅狭部と、凹部とから、
前記電子部品装着マークの位置、および、向きを認識す
る工程と、 （４）前記認識した位置および向きを参照して、電子部
品を前記プリント基板の所定位置に装着する工程と を有
する 。 According to a third aspect of the present invention, the electronic part
Attach an electronic component to a printed circuit board using the product attachment mark
A plurality of lands having the following steps:
Electronic component mounting electronic component on printed circuit board having
A method of wearing is provided. The electronic component mounting method includes: (1) a central portion and projecting from the electronic component on both sides of the central portion.
The wide part, the narrow part, and the
Having a recess formed between the wide portion and the narrow portion
The electronic component mounting mark is positioned adjacent to the printed circuit board.
Print or arrange in place between
And that step, image by imaging an area including the (2) the electronic component mounting mark
Generating image data; and (3) performing signal processing on the generated image data to generate the image data.
Wide part, narrow part, and concave part of child component mounting mark
Then, from the recognized wide portion, narrow portion, and concave portion,
Recognize the position and orientation of the electronic component mounting mark.
That a step, with reference to the position and orientation and the recognition (4), an electronic unit
Yes and the step of attaching the article to a predetermined position of the printed circuit board
I do .
【０００８】[0008]
【作用】本発明の電子部品装着マークを用いると、
（ａ）幅広部と幅狭部との位置、向きから装着向きが判
り、（ｂ）凹部の位置から電子部品装着マークの全体の
位置が判り、（ｃ）両側に、対称に、幅広部と、幅狭部
と、凹部が形成されているから、位置決め、向き決めが
正確になり、（ｄ）部品から突出しているから、部品装
着後も、位置決めに使用でき、（ｅ）それでいて、電子
部品の形状とは異なるから、電子部品との識別が容易で
ある。さらに本発明の電子部品装着マークは、（ｆ）比
較的簡単な形状をしているから、画像処理が容易な形状
であり、（ｇ）ランドに印刷するから、場所をとらず、
（ｈ）寸法が小さいから、場所をとらない。When the electronic component mounting mark of the present invention is used,
(A) The mounting direction can be determined from the position and orientation of the wide portion and the narrow portion, (b) the entire position of the electronic component mounting mark can be determined from the position of the concave portion, and (c) the wide portion and the wide portion are symmetrically arranged on both sides. Since the narrow portion and the concave portion are formed, positioning and orientation can be accurately performed. (D) Since it protrudes from the component, it can be used for positioning even after mounting the component. Since the shape is different from that of the electronic component, it is easy to identify the electronic component. Furthermore, the electronic component mounting mark of the present invention has a (f) relatively simple shape, so that image processing is easy, and (g) printing on a land requires no space.
(H) Since the dimensions are small, no space is required.
【０００９】本発明の上述した電子部品装着マークを有
するプリント基板には、電子部品を正確に装着できる。
本発明の電子部品装着マークはランドとランドの間に印
刷または配設されるから，これらのランドの外に特別の
場所を必要とせず，プリント基板における電子部品装着
領域が縮小できる。An electronic component can be accurately mounted on a printed circuit board having the electronic component mounting mark according to the present invention.
Since the electronic component mounting mark of the present invention is printed or arranged between lands, no special place is required outside these lands, and the electronic component mounting area on the printed circuit board can be reduced.
【００１０】本発明の電子部品装着方法においては、上
記電子部品装着マークの位置、向きが画像処理により自
動的に正確に識別でき、その結果に基づいて正確な電子
部品の自動装着が可能である。In the electronic component mounting method according to the present invention, the position and orientation of the electronic component mounting mark can be automatically and accurately identified by image processing, and accurate automatic mounting of the electronic component can be performed based on the result. .
【００１１】[0011]
【実施例】本発明の実施例の電子部品装着マークを図１
に示す。この実施例は図３に示した例に対応しており，
図１（Ａ）はプリント基板内の電子部品装着領域１内に
形成された金属ランド２と３，および，電子部品装着マ
ーク５の平面図を，図１（Ｂ）はランド２，３に装着さ
れる有極部品６の平面図，図１（Ｃ）は図１（Ａ）の電
子部品装着領域１に有極部品６が装着された平面図を示
す。プリント基板は緑色に着色されており，半田づけに
適した金属のランド２，３が緑色のプリント基板に形成
され，これらのランド２，３の間に白色の電子部品装着
マーク５が印刷されている。FIG. 1 shows an electronic component mounting mark according to an embodiment of the present invention.
Shown in This embodiment corresponds to the example shown in FIG.
FIG. 1A is a plan view of metal lands 2 and 3 and an electronic component mounting mark 5 formed in an electronic component mounting area 1 in a printed circuit board, and FIG. 1 (C) is a plan view of the polar component 6 mounted on the electronic component mounting area 1 in FIG. 1 (A). The printed circuit board is colored green, and metal lands 2 and 3 suitable for soldering are formed on the green printed circuit board. A white electronic component mounting mark 5 is printed between these lands 2 and 3. I have.
【００１２】 図２に電子部品装着マーク５の拡大図を示
す。電子部品装着マーク５は本体部５０と，１対の幅広
部５１と，１対の凹部５２と，１対の幅狭部５３とから
なる。幅広部５１の幅ｗ１は幅狭部５３の幅ｗ３より広
い。本実施例ではこの幅広部５１がある方のランド２に
有極部品６の有極指示マーク６ａが位置し，幅狭部５３
がある方のランド３に有極指示マーク６ａの対向部分が
位置する。凹部５２は幅ｗ２の切り込みが付けられてい
るが，この切り込みがランド２とランド３との間のほぼ
中心に位置し，有極部品６をランド２とランド３に装着
する時の位置決めに使用される。電子部品装着マーク５
は緑色に着色されたプリント基板に画像処理で識別可能
なように白色で印刷されているが，ランド２，３と同
様，金属などでパターニングされていてもよい。また電
子部品装着マーク５は印刷に限らず，画像処理で識別可
能な任意の方法で配設されまたは付されていればよい。 FIG . 2 is an enlarged view of the electronic component mounting mark 5. The electronic component mounting mark 5 includes a main body 50, a pair of wide portions 51, a pair of recesses 52, and a pair of narrow portions 53. The width w1 of the wide portion 51 is wider than the width w3 of the narrow portion 53. In the present embodiment, the polar indication mark 6a of the polar component 6 is located on the land 2 where the wide portion 51 is located, and the narrow portion 53
The opposite part of the polarized indication mark 6a is located on the land 3 where there is. The notch 52 has a notch of width w2, which is located substantially at the center between the land 2 and the land 3, and is used for positioning when the polarized component 6 is mounted on the land 2 and the land 3. Is done. Electronic component mounting mark 5
Is printed in white on a printed circuit board colored green so as to be identifiable by image processing, but may be patterned with metal or the like as in the lands 2 and 3. Further, the electronic component mounting mark 5 is not limited to printing, but may be provided or attached by any method that can be identified by image processing.
【００１３】 電子部品自動装着機（図示せず）は有極部
品６を電子部品装着領域１に装着するに際して，ＣＣＤ
カメラなどの撮像手段を用いてプリント基板を走査し
て，電子部品装着領域１内のランド２，３，および電子
部品装着マーク５を画像データとして入力し，その画像
データを画像処理してそれらの位置を認識する。電子部
品自動装着機は，画像処理によって検出された電子部品
装着マーク５の凹部５２の位置を参照して有極部品６を
装着する際の中心位置決めを行い，さらに，画像処理に
よって検出された幅広部５１と幅狭部５３とを比較して
幅の広い方の幅広部５１が印刷されているランド２側に
有極部品６の有極指示マーク６ａが向くように向き調整
を行って，有極部品６をランド２とランド３に装着す
る。図１（Ｃ）は電子部品装着領域１内に有極部品６が
装着された状態を示す。有極指示マーク６ａが電子部品
装着マーク５の幅広部５１側のランド２に載置されてい
る。必要な電子部品についてプリント基板への装着が終
了すると，半田づけが行われる。 When mounting the polar component 6 in the electronic component mounting area 1, an automatic electronic component mounting machine (not shown) uses a CCD.
The printed circuit board is scanned using an imaging means such as a camera, and the lands 2, 3, and the electronic component mounting mark 5 in the electronic component mounting area 1 are input as image data, and the image data is subjected to image processing and Recognize the position. The electronic component automatic placement machine refers to the position of the concave portion 52 of the electronic component placement mark 5 detected by the image processing, performs center positioning when mounting the polarized component 6, and furthermore, detects the wide area detected by the image processing. By comparing the portion 51 with the narrow portion 53, the orientation is adjusted so that the polar indication mark 6a of the polar component 6 faces the land 2 on which the wider portion 51 is printed. The pole parts 6 are mounted on the lands 2 and 3. FIG. 1C shows a state in which the polarized component 6 is mounted in the electronic component mounting area 1. The polarization indicating mark 6a is placed on the land 2 on the wide portion 51 side of the electronic component mounting mark 5. When the necessary electronic components have been mounted on the printed circuit board, soldering is performed.
【００１４】 図１から明らかなように，電子部品装着マ
ーク５は，図３に示した中心位置マーク４の機能と極性
指示マーク７との機能を有しており，有極部品６の位置
決め，および有極指示マーク６ａの向き決定は従来と同
様に行うことができる。しかも，電子部品装着マーク５
はランド２とランド３との間に印刷されているから，電
子部品装着領域１の長手方向においてランド２の外側に
場所を取らない。したがって，図１（Ａ）に示すよう
に，電子部品装着領域１の高さ（長さ）Ｈは上記極性指
示マーク７を印刷しない長さだけ，図３の電子部品装着
領域１ａの長さＨａより短くなり，プリント基板の実装
密度を向上させることができる。 As is apparent from FIG . 1, the electronic component mounting mark 5 has the function of the center position mark 4 and the function of the polarity indicating mark 7 shown in FIG. The direction of the polarized indication mark 6a can be determined in the same manner as in the related art. Moreover, the electronic component mounting mark 5
Is printed between the land 2 and the land 3, so that no space is taken outside the land 2 in the longitudinal direction of the electronic component mounting area 1. Therefore, as shown in FIG. 1A, the height (length) H of the electronic component mounting area 1 is the length Ha of the electronic component mounting area 1a in FIG. It is shorter and the mounting density of the printed circuit board can be improved.
【００１５】 電子部品装着マーク５の長さは，必ずしも
図１に示したように，ランド２，ランド３の横幅あるい
は有極部品６の横幅より長い必要はないが，図示のよう
に，少なくとも有極部品６の幅より長く印刷されている
と，有極部品６を装着後に有極部品６の装着状態の検査
を行う時，極性も正確に一致しているか否かを検査する
ことができるという利点がある。 The length of the electronic component mounting marks 5 are not necessarily as shown in FIG. 1, the land 2 is longer need not than the width or the width of the polarized component 6 of the lands 3, as shown, at least Yes If the polar part 6 is printed longer than the width of the polar part 6, it is possible to check whether the polarities match exactly when inspecting the mounting state of the polar part 6 after mounting the polar part 6. There are advantages.
【００１６】 電子部品装着マーク５の形状は図２に図示
した形状に限らず，凹部５２のように有極部品６の装着
位置決めに使用する部分と，幅広部５１と幅狭部５３と
の関係のようにその向きを識別できるものであればよ
い。そのような電子部品装着マークとしては，たとえ
ば，電子部品装着マーク５のような形状に代えて台形の
形状にし，本体部５０に位置決めの基準となる長手方向
孔（スリット）を穿孔させ，台形の底辺に位置する隅を
幅広部５１として使用し，幅狭部５３に相当する部分を
無くしてもよい。 The shape of the electronic component mounting marks 5 is not limited to the shape shown in FIG. 2, the relationship of the parts to be used for mounting the positioning of the polarized component 6 as recesses 52, the wide portion 51 and narrow portion 53 What is necessary is just to be able to identify the direction like this. As such an electronic component mounting mark, for example, a trapezoidal shape is used in place of the shape of the electronic component mounting mark 5, and a longitudinal hole (slit) serving as a reference for positioning is formed in the main body 50 so that the trapezoidal shape is obtained. The corner located on the bottom side may be used as the wide portion 51, and the portion corresponding to the narrow portion 53 may be eliminated.
【００１７】 上記実施例は有極指示マーク６ａを有する
有極部品６について例示したが，本発明の電子部品装着
マーク５は有極部品に必らず，向きを持って装着する電
子部品に広く適用できる。 In the above-described embodiment, the polarized component 6 having the polarized indication mark 6a is exemplified. However, the electronic component mounting mark 5 of the present invention is not limited to the polarized component but is widely applied to the electronic component mounted with a direction. Applicable.
【００１８】[0018]
【発明の効果】本発明の電子部品装着マークは下記の効
果を奏する。 （ａ）幅広部と幅狭部との位置、向きから装着向きが判
る。 （ｂ）凹部の位置から電子部品装着マークの全体の位置
が判 る。（ｃ）両側に、対称に、幅広部と、幅狭部と、凹部が形
成されているから、位置決め、向き決めが正確になる。 （ｄ）部品から突出しているから、部品装着後も、位置
決めに使用できる。 （ｅ）それでいて、電子部品の形状とは異なるから、電
子部品との識別が容易である。 （ｆ）比較的簡単な形状をしているから、画像処理が容
易な形状であり、画像処理が容易である。 （ｇ）ランドに印刷または配設するから、場所をとらな
い。 （ｈ）寸法が小さいから、場所をとらない。 The electronic component mounting mark of the present invention has the following effects.
Play a fruit. (A) The mounting direction is determined from the positions and orientations of the wide portion and the narrow portion.
You. (B) Overall position of electronic component mounting mark from position of recess
There Ru determine. (C) Symmetrically wide, narrow, and concave portions on both sides
Because of this, positioning and orientation are accurate. (D) Since it protrudes from the component, the position remains
Can be used for decision. (E) Since the shape of the electronic component is different from that of the electronic component,
It is easy to identify the child parts. (F) Since the shape is relatively simple, image processing is
The shape is easy, and image processing is easy. (G) Since printing or arranging on the land, take place.
No. (H) Since the dimensions are small, no space is required.
【００１９】上述した電子部品装着マークを有する本発
明のプリント基板には、電子部品を正確に装着できる。
本発明の電子部品装着マークはランドとランドの間に印
刷または配設されるから，これらのランドの外に特別の
場所を必要とせず，プリント基板における電子部品装着
領域が縮小できる。その結果、プリント基板の実装密度
を向上させることができる。The present invention having the above-described electronic component mounting mark
Electronic components can be accurately mounted on the printed circuit board.
The electronic component mounting mark of the present invention is printed between lands.
Special printing outside of these lands
Mounting electronic components on printed circuit boards without requiring space
The area can be reduced. As a result, the mounting density of the printed circuit board can be improved.
【００２０】本発明の電子部品装着方法においては、上
記電子部品装着マークの位置、向きが画像処理により自
動的に正確に識別でき、その結果に基づいて正確な電子
部品の自動装着が可能である。 本発明の電子部品装着方
法によれば、プリント基板における電子部品装着領域を
縮小することができる。 In the electronic component mounting method of the present invention,
The position and orientation of the electronic component mounting mark are automatically
Dynamic and accurate identification and accurate electronic
Automatic mounting of parts is possible. Electronic component mounting method of the present invention
According to the method, the electronic component mounting area on the printed circuit board is
Can be reduced.
【図１】本発明の実施例の電子部品装着マーク，およ
び，このマークが印刷される電子部品装着領域と有極部
品の装着状態を示す図である。FIG. 1 is a diagram illustrating an electronic component mounting mark according to an embodiment of the present invention, an electronic component mounting area where the mark is printed, and a mounted state of a polarized component.
【図２】図１に示した電子部品装着マークの拡大図であ
る。FIG. 2 is an enlarged view of the electronic component mounting mark shown in FIG.
【図３】従来の電子部品装着マーク，および，このマー
クが印刷される電子部品装着領域と有極部品の装着状態
を示す図である。FIG. 3 is a diagram showing a conventional electronic component mounting mark, an electronic component mounting area where the mark is printed, and a mounted state of a polarized component.
１・・電子部品装着領域，２，３・・ランド，５・・電
子部品装着マーク５６・・有極部品，６ａ・・有極指示
マーク，５１・・幅広部，５２・・凹部，５３・・幅狭
部。1 ··· Electronic component mounting area, 2,3 ·· land, 5 ·· Electronic component mounting mark 56 ·· Polar component, 6a ·· Polar indication mark, 51 ··· Wide portion, 52 ·· Recess, 53 ·・ Narrow part.
フロントページの続き (56)参考文献 特開 昭63−73592（ＪＰ，Ａ) 特開 平２−184100（ＪＰ，Ａ) 実開 平１−156599（ＪＰ，Ｕ) 実開 平４−40538（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 13/04 Continuation of the front page (56) References JP-A-63-73592 (JP, A) JP-A-2-184100 (JP, A) JP-A-1-156599 (JP, U) JP-A-4-40538 (JP) , U) (58) Field surveyed (Int.Cl. 7 , DB name) H05K 13/04
Claims (3)
突出するように対称に形成された、幅広部と、幅狭部
と、上記幅広部と上記幅狭部との間に形成された凹部と
を有し、 電子部品を装着する部分の近傍の隣接するランドの間に
印刷され、または、配設される、 電子部品装着マーク。 1. A central part and electronic parts on both sides of the central part.
Wide and narrow parts formed symmetrically to protrude
And a recess formed between the wide portion and the narrow portion.
The a, between adjacent land in the vicinity of the portion for mounting the electronic component
An electronic component mounting mark that is printed or arranged .
るプリント基板において、 中央部と、該中央部の両側に電子部品から突出するよう
に対称に形成された、幅広部と、幅狭部と、上記幅広部
と上記幅狭部との間に形成された凹部とを有する電子部
品装着マークが、隣接するランドの間の所定位置に印刷
され、または、配設されていることを特徴とするプリン
ト基板。 2. An electronic device having a plurality of lands, on which electronic components are mounted.
The printed circuit board has a central portion and both sides of the central portion protruding from the electronic component.
A wide portion, a narrow portion, and the wide portion formed symmetrically with each other.
And an electronic part having a recess formed between the narrow part
Product mounting mark is printed at a predetermined position between adjacent lands
Pudding characterized by being provided or arranged
Board.
部品を装着する電子部品装着方法において、 中央部と、該中央部の両側に電子部品から突出するよう
に対称に形成された、幅広部と、幅狭部と、上記幅広部
と上記幅狭部との間に形成された凹部とを有する電子部
品装着マークを、前記プリント基板における隣接するラ
ンドの間の所定位置に印刷する、または、配設する工程
と、 前記電子部品装着マークを含む領域を撮像して画像デー
タを生成する工程と、 前記生成した画像データを信号処理して、前記電子部品
装着マークの幅広部と、幅狭部と、凹部とを識別し、こ
れら認識した幅広部と、幅狭部と、凹部とから、前記電
子部品装着マークの位置、および、向きを認識する工程
と、 前記認識した位置および向きを参照して、電子部品を前
記プリント基板の所定 位置に装着する工程と を有するこ
とを特徴とする電子部品装着方法。 3. A printed circuit board having a plurality of lands has electronic components.
In the electronic component mounting method for mounting components, a central portion and both sides of the central portion may be protruded from the electronic component.
A wide portion, a narrow portion, and the wide portion formed symmetrically with each other.
And an electronic part having a recess formed between the narrow part
Product mounting marks on adjacent printed circuit boards.
Printing or arranging in a predetermined position between hands
When the image data by imaging a region including the electronic component mounting mark
Generating the data, and performing signal processing on the generated image data to generate the electronic component.
Identify the wide, narrow, and concave parts of the mounting mark and
From the recognized wide portion, narrow portion, and concave portion, the electric power is obtained.
Step of recognizing the position and orientation of the child component mounting mark
With reference to the recognized position and orientation,
This and a step of mounting a predetermined position of the serial PCB
And an electronic component mounting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03180303A JP3094523B2 (en) | 1991-06-25 | 1991-06-25 | Electronic component mounting mark, printed circuit board, and electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03180303A JP3094523B2 (en) | 1991-06-25 | 1991-06-25 | Electronic component mounting mark, printed circuit board, and electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH053400A JPH053400A (en) | 1993-01-08 |
| JP3094523B2 true JP3094523B2 (en) | 2000-10-03 |
Family
ID=16080851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03180303A Expired - Fee Related JP3094523B2 (en) | 1991-06-25 | 1991-06-25 | Electronic component mounting mark, printed circuit board, and electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3094523B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007006149A (en) * | 2005-06-23 | 2007-01-11 | Hosiden Corp | Electronic part |
| CN106163099B (en) * | 2016-08-31 | 2019-12-13 | 上海传英信息技术有限公司 | Circuit board and soldering structure |
-
1991
- 1991-06-25 JP JP03180303A patent/JP3094523B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH053400A (en) | 1993-01-08 |
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