JP3091004B2 - Method of connecting cover tape for electronic component carrier - Google Patents
Method of connecting cover tape for electronic component carrierInfo
- Publication number
- JP3091004B2 JP3091004B2 JP03353348A JP35334891A JP3091004B2 JP 3091004 B2 JP3091004 B2 JP 3091004B2 JP 03353348 A JP03353348 A JP 03353348A JP 35334891 A JP35334891 A JP 35334891A JP 3091004 B2 JP3091004 B2 JP 3091004B2
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- tape
- cover
- reel
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品用テ−プ状キャ
リアのカバ−に使用するカバ−テ−プの接続方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a cover tape used for covering a tape carrier for electronic parts.
【０００２】[0002]
【従来の技術】回路板に電子部品を実装する場合、テ−
プ状キャリアを使用することがあり、そのテ−プ状キャ
リアとしてカバ−テ−プ方式が公知である。図４はその
カバ−テ−プ方式の一例を示している。図４において、
ｂ’はテ−プ状のキャリア基体であり、一定の間隔ごと
に電子部品収容孔を有し、リ−ル６１’から連続的に送
り出されていく。１ｎ’は下側カバ−テ−プであり、片
面にホットメルト型接着剤層２’を有し、この接着剤層
２’を上側に向けてリ−ル６２’から送り出され、加熱
部ｃ１’とガイド部ｃ１”との間をキャリア基体ｂ’と
共に通過して加熱部ｃ ’によりキャリア基体ｂ’に融
着され、以後、キャリア基体と一体的に走行されてい
く。2. Description of the Related Art When electronic components are mounted on a circuit board, a tape is required.
A tape carrier may be used, and a cover tape system is known as the tape carrier. FIG. 4 shows an example of the cover tape system. In FIG.
Reference numeral b 'denotes a tape-shaped carrier base, which has holes for accommodating electronic components at regular intervals, and is continuously fed from the reel 61'. 1n 'is a lower cover tape having a hot-melt type adhesive layer 2' on one side, and the adhesive layer 2 'is sent out from the reel 62' with the adhesive layer 2 'facing upward, and the heating section c 1 ′ and the guide portion c 1 ″ pass together with the carrier base b ′, and are fused to the carrier base b ′ by the heating section c ′, and thereafter travel integrally with the carrier base.
【０００３】ｈ’は電子部品装填部を示し、下側カバ−
テ−プ１ｎ’が融着された走行中のキャリア基体に電子
部品ｅ’が次々と収納されていく。１ｍ’は上側カバ−
テ−プであり、片面にホットメルト型接着剤層２’を有
し、この接着剤層２’を下側に向けてリ−ル６３’から
送り出され、電子部品装填後のキャリア基体と共に加熱
部ｃ２’とガイド部ｃ２”との間を通過して加熱部
ｃ２’によりキャリア基体に融着され、以後、巻取りリ
−ル６４’に巻取られていく。[0003] h 'indicates an electronic component loading portion, and a lower cover is provided.
Electronic components e 'are successively stored in the traveling carrier base to which the tape 1n' is fused. 1m 'is the upper cover
A tape having a hot-melt type adhesive layer 2 'on one side, which is sent out from the reel 63' with the adhesive layer 2 'facing downward, and heated together with the carrier substrate after the electronic components are loaded. The sheet passes between the section c 2 ′ and the guide section c 2 ″ and is fused to the carrier base by the heating section c 2 ′, and thereafter, is wound up on a take-up reel 64 ′.
【０００４】上記において、リ−ル６２’または６３’
のカバ−テ−プが使い尽くされて次のリ−ルに交換する
際、従来においては、先のリ−ルのカバ−テ−プ終端部
をカバ−テ−プ自体のホットメルト型接着剤層でキャリ
ア基体に融着し、その融着したカバ−テ−プ終端部上に
次のリ−ルのカバ−テ−プ先端部を融着し、更にそのカ
バ−テ−プ接続部をキャリア基体に融着し、而るのち、
交換したリ−ルからのカバ−テ−プをキャリア基体に融
着していくようにしている（特開昭５６−１３１９９９
号）。In the above, reels 62 'or 63'
Cover tape is exhausted and replaced with the next reel
Conventionally, the end portion of a cover tape of the above-mentioned reel is conventionally used.
With the hot melt adhesive layer of the cover tape itself.
A) Fused to the substrate and placed on the end of the fused cover tape.
The tip of the cover tape of the next reel is fused, and
The bar-tape connection is fused to the carrier base, and then
The cover tape from the replaced reel is fused to the carrier substrate.
(JP-A-56-131999).
No.)
【０００５】しかしながら、この方法ではカバ−テ−プ
接続部の加圧をキャリア基体の巾両端部でしか行い得
ず、従って、カバ−テ−プ接続部の引張り強度が低く、
電子部品実装ステ−ジでのカバ−テ−プの剥離時にカバ
−テ−プの接続部が分断されて剥離作業を円滑に行い難
い。また、キャリア基体の走行を一時的に停止する必要
があり、作業能率上も問題がある。 However, in this method, a cover tape is used.
The connection can be pressed only at both ends of the width of the carrier base.
Therefore, the tensile strength of the cover tape connection is low,
When the cover tape is peeled off at the electronic component mounting stage
-The tape connection is cut off, making it difficult to perform peeling work smoothly.
No. In addition, it is necessary to temporarily stop the carrier base from running.
There is a problem in work efficiency.
【０００６】本発明の目的は、一定の間隔ごとに電子部
品収容孔を有するキャリア基体に、リ−ルからのホット
メルト型接着剤層付きカバ−テ−プをそのホットメルト
型接着剤により加熱部で融着させるテ−プ状キャリア方
式において、カバ−テ−プをキャリア基体の存在に影響
されることなくカバ−テ−プを強固に熱融着でき、しか
もキャリア基体の走行を中断すること無くその融着を可
能とする電子部品キャリア用カバ−テ−プの接続方法を
提供することにある。[0006] It is an object of the present invention to provide an electronic unit at regular intervals.
Hot from the reel on the carrier substrate
The hot-melt cover tape with the melt-type adhesive layer
Tape-shaped carrier to be fused in the heating section with a mold adhesive
In the equation, the cover tape affects the presence of the carrier substrate.
Without being cover - Te - flop can firmly heat-sealed, yet without electronic components carrier for cover to allow the fusion interrupting the travel of the carrier substrate - Te - to provide a method of connecting flops It is in.
【０００７】[0007]
【課題を解決するための手段】本発明の電子部品キャリ
ア用カバ−テ−プの接続方法は、一定の間隔ごとに電 子
部品収容孔を有するキャリア基体に、リ−ルからのホッ
トメルト型接着剤層付きカバ−テ−プをそのホットメル
ト型接着剤により加熱部で融着させるテ−プ状キャリア
方式において、カバ−テ−プ相互間の接続を上記加熱部
とリ−ルとの間においてカバ−テ−プ自体のホットメル
ト型接着剤で行うことを特徴とする構成であり加熱部と
リ−ルとの間にカバ−テ−プ蓄え部を設け、蓄えておい
たカバ−テ−プを放出しつつカバ−テ−プ相互間の接続
を行うことができる。 Means for Solving the Problems] cover electronic component carrier of the present invention - Te - how to connect up the child collector at regular intervals
The carrier from the reel is attached to the carrier base having the component accommodation holes.
The cover tape with the melt-type adhesive layer is hot-melted.
Tape-shaped carrier fused in the heating section
In the method, the connection between the cover tapes is made by the heating section.
Hot melt of the cover tape itself between the reel and the reel
It is a configuration characterized by performing with an adhesive
A cover tape storage section is provided between the reel and the reel.
Connection between the cover tapes while releasing the cover tapes
It can be performed.
【０００８】[0008]
【実施例】以下、図面を参照しつつ本発明の実施例を説
明する。図１は本発明において使用する電子部品キャリ
ア用カバ−テ−プ及びカバ−テ−プ接続治具を示してい
る。図１において、１はカバ−テ−プであり、片面にホ
ットメルト型接着剤層２を設けてある。３はヒ−トシ−
ル用熱板、４は受台、５はシリコンゴム等の緩衝層であ
る。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an electronic component carrier used in the present invention.
And a cover tape and a cover tape connecting jig.
You. In FIG. 1, reference numeral 1 denotes a cover tape provided with a hot-melt adhesive layer 2 on one side. 3 is heath
Reference numeral 4 denotes a receiving table, and reference numeral 5 denotes a buffer layer of silicon rubber or the like.
【０００９】この電子部品キャリア用カバ−テ−プを接
続するには、電子部品キャリア用カバ−テ−プ１をホッ
トメルト型接着剤層２を下側に向けて配し、そのテ−プ
両端部１０，１０を受台４上で重ね合せて接着面１２と
非接着面１１とを接触させ、この重ね合せ部分の上面側
である非接着面１１側に熱板３を加圧接触させる。In order to connect the electronic component carrier cover tape, the electronic component carrier cover tape 1 is disposed with the hot melt type adhesive layer 2 facing downward, and the tape is provided. Both end portions 10 and 10 are superimposed on the receiving table 4 so that the adhesive surface 12 and the non-adhesive surface 11 are in contact with each other, and the hot plate 3 is brought into pressure contact with the non-adhesive surface 11 side which is the upper surface side of the overlapped portion. .
【００１０】この熱板３の加圧接触により熱板３の熱が
重ね合せ接触面ａに伝達され、その接触面ａのホットメ
ルト型接着剤層１２並びにカバ−テ−プ材自体が軟化さ
れ、加圧のためにその接触面ａでの軟化物の拡散が促さ
れ、かつ、重ね合せ部分全体の厚さが減少される。The heat of the hot plate 3 is transferred to the overlapping contact surface a by the press contact of the hot plate 3, and the hot melt adhesive layer 12 and the cover tape material on the contact surface a are softened. Due to the pressurization, the diffusion of the softened material on the contact surface a is promoted, and the thickness of the entire overlapped portion is reduced.
【００１１】次いで、加熱板３を離隔し、溶融物の冷却
・固化によってヒ−トシ−ルが完結し、これにて、電子
部品キャリア用カバ−テ−プ１，１の接続を終了する。Next, the heating plate 3 is separated, and the heat seal is completed by cooling and solidifying the molten material, whereby the connection of the electronic component carrier cover tapes 1, 1 is terminated.
【００１２】上記のヒ−トシ−ル時、重ね合せ部分の裏
面側、即ち、受台４側のホットメルト型接着剤層１２に
おいては、熱板３から隔てられており、かつ緩衝層５に
よって支承されているから、当該ホットメルト型接着剤
層１２が軟化してもその拡散が生じ難く、冷却によって
元の固相状態にたやすく戻される。従って、後述のキャ
リア基体に接触されるところのホットメルト型接着剤層
を充分、元のままに保持できる。At the time of the heat sealing, the hot melt type adhesive layer 12 on the back side of the overlapped portion, that is, the hot melt type adhesive layer 12 on the receiving stand 4 side, is separated from the hot plate 3 and the buffer layer 5 Because it is supported, even if the hot melt type adhesive layer 12 is softened, its diffusion is unlikely to occur, and it is easily returned to the original solid phase state by cooling. Therefore, the hot-melt type adhesive layer that is in contact with the carrier substrate described later can be sufficiently maintained as it is.
【００１３】また、接続部分の厚さ方向の熱抵抗を、そ
の厚さを加圧により薄くできるために低くでき、カバ−
テ−プ自体の厚さ方向の熱抵抗との差を充分に小さくし
得、両者の熱抵抗をほぼ同程度に近づけることができ
る。Further, the thermal resistance in the thickness direction of the connection portion can be reduced because the thickness can be reduced by pressurizing, and the cover can be covered.
The difference between the tape and the thermal resistance in the thickness direction of the tape itself can be made sufficiently small, and the thermal resistance of both can be made almost the same.
【００１４】本発明は、一定の間隔ごとに電子部品収容
孔を有するキャリア基体に、リ−ルからのホットメルト
型接着剤層付きカバ−テ−プをそのホットメルト型接着
剤により所定の加熱部で融着させるテ−プ状キャリア方
式において、加熱部とリ−ルとの間においてカバ−テ−
プ相互間の接続を上記図１により示したように、カバ−
テ−プ自体のホットメルト型接着剤により行う方法であ
り、図２は本発明が使用されるテ−プ状キャリア方式の
一例を示している。図２において、キャリア基体ｂをリ
−ル６１から連続的に繰り出し、片面にホットメルト型
接着剤層２を有する下側カバ−テ−プ１ｎをリ−ル６２
から繰り出して加熱部ｃ１によりキャリア基体ｂに融着
させ、この下側カバ−テ−プ融着キャリア基体に電子部
品ｅを装填し、次いで、片面にホットメルト型接着剤層
２を有する上側カバ−テ−プ１ｍをリ−ル６３から繰り
出して加熱部ｃ２により電子部品装填キャリア基体ｂ１
に融着させ、最終的にリ−ル６４で巻取っている。ｆ２
（ｆ３）はダンサ−ロ−ルである。 According to the present invention, electronic components are housed at regular intervals.
Hot melt from a reel on a carrier substrate with holes
Hot-melt adhesive bonding of a cover tape with an adhesive layer
Tape-shaped carrier that is fused by a predetermined heating unit
In the formula, a cover is provided between the heating section and the reel.
As shown in FIG. 1 above, the connection between
This is a method performed by using a hot-melt adhesive on the tape itself.
FIG. 2 shows a tape carrier system in which the present invention is used.
An example is shown. In FIG. 2, a carrier base b is continuously fed out from a reel 61, and a lower cover tape 1n having a hot melt type adhesive layer 2 on one side is reeled 62.
Fused to the carrier substrate b by the heating portion c 1 by feeding from the lower cover - Te - PuToruchaku loaded with electronic components e in the carrier substrate, then the upper having a hot-melt adhesive layer 2 on one side cover - Te - a flop 1m Li - electronic components loaded carrier substrate b 1 by the heating portion c 2 by feeding the Le 63
And finally wound up with a reel 64. f 2
(F 3 ) is a dancer roll.
【００１５】本発明は、図２においてリ−ル６２（６
３）のカバ−テ−プを使い尽くしたときに、当該ダンサ
−ロ−ルｆ２（ｆ３）を上方向に移動させ、たるみによ
り蓄えておいたカバ−テ−プを放出し、この間、ダンサ
−ロ−ルｆ２（ｆ３）よりもリ−ル６２（６３）側のカ
バ−テ−プ部分を静止状態にし、リ−ル６２（６３）を
カバ−テ−プ満巻リ−ルに交換し、該新規リ−ルのカバ
−テ−プ先端と上記静止カバ−テ−プの後端とを前記図
１で示した方法により接続して実施することができる。In the present invention, the reel 62 (6
Te - - when exhausted flop, the dancer - birch 3) B - Le f 2 a (f 3) is moved upward, cover had been accumulated by the slack - Te - releases up, during which , dancer - b - le f 2 (f 3) Li than - le 62 (63) side of the cover - Te - the up portion stationary, Li - Le 62 (63) cover - Te - flop fully wound Li In this case, the front end of the cover tape of the new reel is connected to the rear end of the stationary cover tape by the method shown in FIG.
【００１６】上記において、熱板によるヒ−トシ−ルに
は、図３の（イ）に示すような全面ヒ−トシ−ル、図３
の（ロ）に示すようなストライプ状ヒ−トシ−ル、また
は図３の（ハ）に示すような、ドット状ヒ−トシ−ル等
を使用できる。In the above description, the heat seal by the hot plate includes an entire heat seal as shown in FIG.
(B) or a dot-shaped heat seal as shown in (c) of FIG. 3 can be used.
【００１７】上記において、カバ−テ−プ基材には熱可
塑性樹脂（但し、ホットメルト型接着剤よりも高融点）
を使用できる。また、クラフト紙のような非熱可塑性テ
−プでも、カバ−テ−プの重ね合せ接触面のホットメル
ト型接着剤層が溶融し、これで紙の繊維間隙が充填され
て接続部分の厚さ方向の熱抵抗がよく低減されるから、
クラフト紙もカバ−テ−プ材として使用できる。In the above, a thermoplastic resin (however, a melting point higher than that of a hot melt adhesive) is used for the cover tape base material.
Can be used. Further, even with a non-thermoplastic tape such as kraft paper, the hot-melt adhesive layer on the overlapping contact surface of the cover tape is melted, thereby filling the fiber gap of the paper and increasing the thickness of the connection portion. The thermal resistance in the vertical direction is well reduced,
Kraft paper can also be used as a cover tape material.
【００１８】本発明においては、上記熱板加圧によるヒ
−トシ−ルに代え、工具ホ−ンをカバ−テ−プの重ね合
せ部分の非接着面に接触させ、この工具ホ−ンの超音波
振動により重ね合せ接触面を超音波溶接する方法を使用
することもでき、この場合、周波数２８KHZで、振幅３
０μｍ，振動速度５〜６ｍ／sec,加速度９５０００Ｇと
することが適切である。In the present invention, a tool horn is brought into contact with the non-adhesive surface of the overlapping portion of the cover tape in place of the above-mentioned heat seal by hot plate pressurization. It is also possible to use a method of ultrasonic welding of the overlapping contact surfaces by ultrasonic vibration, in which case, the frequency is 28 KHZ and the amplitude is 3
It is appropriate that the vibration velocity is 0 μm, the vibration velocity is 5 to 6 m / sec, and the acceleration is 95,000 G.
【００１９】[0019]
【発明の効果】 本発明の電子部品キャリア用カバ−テ−
プの接続方法においては、キャリア基体にカバ−テ−プ
を熱融着する位置より上流側（カバ−テ−プのリ−ル
側）でカバ−テ−プ相互を融着接続し、この融着接続し
たカバ−テ−プをキャリア基体に熱融着しているから、
カバ−テ−プをキャリア基体の存在に影響されることな
く重ね面全体で融着でき、カバ−テ−プを優れた耐引張
り強度で接続できる。従って、電子部品実装段階でのカ
バ−テ−プのキャリア基体の剥離をカバ−テ−プ接続部
の分断の畏れなく円滑に行うことができる。また、融着
圧力を高くしてカバ−テ−プ接続部の厚みをほぼカバ−
テ−プの厚みに等しくすることができ、カバ−テ−プ接
続部の厚さ方向の熱抵抗を他のカバ−テ−プ部分と同等
の低抵抗にできるから、接続したカバ−テ−プを、その
接続部分においても他の部分と同様にキャリア基体に良
好に融着できる。更に、加熱部とリ−ルとの間にカバ−
テ−プ蓄え部を設け、蓄えておいたカバ−テ−プを放出
しつつカバ−テ−プ相互間の接続を行うことができ、搬
送を続行したままでカバ−テ−プを接続することが可能
となり、優れた搬送能率を保証できる。【The invention's effect】 Cover for electronic component carrier of the present invention
In the connection method of the tape, the cover tape is attached to the carrier base.
Upstream of the heat-sealing position (cover tape reel)
Side), the cover tapes are fusion-spliced to each other, and the fusion splicing is performed.
Since the cover tape is thermally fused to the carrier substrate,
The cover tape is not affected by the presence of the carrier substrate.
Can be fused over the entire overlapping surface, and the cover tape has excellent tensile strength
Connection with high strength. Therefore, power at the electronic component mounting stage
The peeling of the carrier base of the tape is performed at the cover tape connecting portion.
Can be performed smoothly without fear of division. Also, fusion
Increase the pressure to increase the cover tape connection thickness
It can be made equal to the thickness of the tape,
Thermal resistance in the thickness direction of the connecting part is equal to that of other cover tape parts.
Because the resistance can be reduced, the connected cover tape can be
The connection part is as good as the other parts in the carrier base.
Can be fused well. Further, a cover is provided between the heating section and the reel.
A tape storage unit is provided to release the stored tape.
Connection between the cover tapes while
Cover tape can be connected while sending is continued
And excellent transfer efficiency can be guaranteed.
【図１】本発明において使用するカバ−テ−プの接続治
具の一例を示す図面である。FIG. 1 is a drawing showing an example of a cover tape connecting jig used in the present invention.
【図２】本発明の一実施例を示す図面である。FIG. 2 is a drawing showing an embodiment of the present invention.
【図３】本発明で使用するヒ−トシ−ルのパタ−ンの異
なる例を示す図面である。FIG. 3 is a view showing another example of a heat seal pattern used in the present invention.
【図４】従来の電子部品キャリアの製作方法の一例を示
す説明図である。FIG. 4 is an explanatory view showing an example of a conventional method for manufacturing an electronic component carrier.
１ｎ カバ−テ−プ １ｍ カバ−テ−プ ２ ホットメルト型接着剤層 ６２ リ−ル ６３ リ−ル ｂ キャリア基体 1n Cover tape 1m Cover tape 2 Hot melt type adhesive layer 62 reel 63 reel b Carrier substrate
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭56−131999（ＪＰ，Ａ) 特開 平３−239578（ＪＰ，Ａ) 特開 昭63−248150（ＪＰ，Ａ) 特開 昭61−221034（ＪＰ，Ａ) 特公 昭48−29694（ＪＰ，Ｂ１) (58)調査した分野(Int.Cl.7，ＤＢ名) B65B 15/04 B65H 69/02 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-56-131999 (JP, A) JP-A-3-239578 (JP, A) JP-A-63-248150 (JP, A) JP-A 61-1999 221034 (JP, A) JP 48-29694 (JP, B1) (58) Fields investigated (Int. Cl. 7 , DB name) B65B 15/04 B65H 69/02
Claims (2)
キャリア基体に、リ−ルからのホットメルト型接着剤層
付きカバ−テ−プをそのホットメルト型接着剤により加
熱部で融着させるテ−プ状キャリア方式において、カバ
−テ−プ相互間の接続を上記加熱部とリ−ルとの間にお
いてカバ−テ−プ自体のホットメルト型接着剤で行うこ
とを特徴とする電子部品キャリア用カバ−テ−プの接続
方法。An electronic component receiving hole is provided at regular intervals.
Hot melt adhesive layer from reel on carrier substrate
Cover tape with the hot melt adhesive.
In the tape carrier method of fusing in the hot zone,
-Connect the tapes between the heating section and the reel.
A cover tape for an electronic component carrier , which is performed by using a hot-melt adhesive of the cover tape itself .
部を設け、蓄えておいたカバ−テ−プを放出しつつカバ
−テ−プ相互間の接続を行う請求項１記載の電子部品キ
ャリア用カバ−テ−プの接続方法。2. A cover tape is stored between a heating section and a reel.
Section and release the stored cover tape while covering
2. The method of connecting a cover tape for an electronic component carrier according to claim 1, wherein the connection between the tapes is performed .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03353348A JP3091004B2 (en) | 1991-12-16 | 1991-12-16 | Method of connecting cover tape for electronic component carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03353348A JP3091004B2 (en) | 1991-12-16 | 1991-12-16 | Method of connecting cover tape for electronic component carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05170220A JPH05170220A (en) | 1993-07-09 |
| JP3091004B2 true JP3091004B2 (en) | 2000-09-25 |
Family
ID=18430238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03353348A Expired - Lifetime JP3091004B2 (en) | 1991-12-16 | 1991-12-16 | Method of connecting cover tape for electronic component carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3091004B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06165325A (en) * | 1992-11-19 | 1994-06-10 | Mitsubishi Electric Corp | Cable-laying technique |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100502222B1 (en) | 1999-01-29 | 2005-07-18 | 마츠시타 덴끼 산교 가부시키가이샤 | Electronic parts mounting method and device therefor |
| CN113621316A (en) * | 2021-10-08 | 2021-11-09 | 潍坊同有新材料科技有限公司 | Hot melt adhesive tape for bonding speaker mesh and preparation method thereof |
-
1991
- 1991-12-16 JP JP03353348A patent/JP3091004B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06165325A (en) * | 1992-11-19 | 1994-06-10 | Mitsubishi Electric Corp | Cable-laying technique |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05170220A (en) | 1993-07-09 |
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