JP3090849B2 - Substrate for arraying small metal balls - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an arrangement substrate for arranging a large number of minute metal balls for forming bumps when the bumps are joined to electrode portions of a semiconductor device.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device, in order to connect an electrode portion (electrode pad) of a semiconductor element to a lead or the like, both are bump-bonded via a minute metal ball.
At the time of this bump bonding, an arrangement substrate having a large number of arrangement holes corresponding to the electrode portions of the semiconductor element to be bump-joined, and arranged in such arrangement holes with fine metal balls in a row is used.

[0003] The arrangement substrate absorbs minute metal balls into its arrangement holes by a method such as vacuum suction and is conveyed to a bump bonding stage. Then, a large number of minute metal balls are joined to a joined portion such as an electrode pad on the joining stage.

[0004]

By the way, in the conventional arrangement substrate, it is inspected by using an image recognition device whether or not minute metal balls are properly arranged in each arrangement hole. According to this image recognition device, an image of the arrangement substrate in which the minute metal balls are arranged in the arrangement holes is taken, and the appropriateness of the arrangement state of the minute metal balls is determined based on the image signal. However, in such an image recognition apparatus, a considerable processing time (on the order of seconds) has to be applied until an image signal is generated, and the signal is processed to obtain a validity conclusion. Further, the configuration of such an image recognition device is large and complicated, and there are problems that the cost is considerably increased.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a substrate for arranging minute metal balls which can easily and accurately confirm the arrangement state of minute metal balls.

[0006]

The substrate for arranging minute metal balls of the present invention has a plurality of arranging holes formed so as to correspond to the electrode portions of the semiconductor element, and is joined to the electrode section of the semiconductor element. The small metal balls to be formed can be adsorbed to the openings of the arrangement holes. In particular, conductive balls provided on the substrate surface are provided between the adjacent arrangement holes.

In the substrate for arranging minute metal balls of the present invention, a circuit is constituted by the minute metal balls and the arrangement holes, and the circuit is electrically connected when the minute metal balls are arranged in all the arrangement holes. It is connected to.

In the substrate for arranging minute metal balls according to the present invention, the conductive wiring is formed by print molding.

Further, in the substrate for arranging minute metal balls according to the present invention, at least a part of the conductive wiring connecting the arrangement holes is separated from each other by predetermined arrangement holes.

[0010]

According to the present invention, the adjacent arrangement holes are connected to each other by the conductive wiring, so that when the minute metal balls are attracted to the arrangement holes, a series of minute metal balls and the conductive wiring form one. One check circuit is configured. In other words, if the minute metal balls are properly arranged in all the arrangement holes, the check circuit is closed, while if there is at least one arrangement hole in which the minute metal balls are missing. It becomes open. Therefore, the appropriateness of the arrangement state of the minute metal balls can be easily and reliably confirmed by the closed or open state of the check circuit.

Further, the conductive wiring can be preferably formed by print molding, whereby the arrangement substrate itself has a simple structure and can be easily formed.

In the arrangement board according to the present invention, at least a part of the conductive wiring connecting the arrangement holes is separated between the predetermined arrangement holes, and the cut portion is configured as described above. A check connection terminal for the check circuit can be configured.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a substrate for arranging minute metal balls according to the present invention will be described below with reference to FIGS.

FIG. 1 shows an arrangement substrate 1 according to this embodiment.
2 shows a configuration example. The arrangement substrate 1 has a plurality of arrangement holes 2 formed so as to correspond to the electrode portions of the semiconductor elements to be bump-bonded. Each array hole 2 is formed as a through hole, and the minute metal ball 3
Can be adsorbed (see FIG. 3). In this example, the arrangement holes 2 are arranged in a row along four sides of the arrangement substrate 1.

In the arrangement substrate 1, the adjacent arrangement holes 2 are connected to each other by a conductive wiring 10 provided on the substrate surface (opening 2a side). This conductive wiring 10 may be preferably formed by print molding. And, by the conductive wiring 10,
A check circuit 11 is formed as described later.

[0016] In this example, SEQ holes 2 _1, 2 ₂ conductive wires 10 in between each other are disconnected. The conductive wirings 10a and 10b at the separation portion are connected to the check circuit 11
Is configured as a check connection terminal. That is, FIG.
As shown in FIG. 2, these conductive wirings 10a, 10b
For resistance value measurement (normal current / voltmeter etc. may be used)
By connecting the check circuit 100, one closed circuit can be formed by the check circuit 11.

In the arrangement substrate 1 of the present embodiment, the minute metal balls 3 are sucked into the arrangement holes 2 on the side of the opening 2a. The arrangement holes 2 are connected to each other by the conductive wiring 10. Therefore, the check circuit 11 is configured by attracting the minute metal balls 3 to the arrangement holes 2. When the resistance value measuring device 100 is connected to the check connection terminal composed of the conductive wires 10a and 10b in a state where the minute metal ball 3 is attracted as described above, the check circuit 11
Constitutes one closed circuit.

If the minute metal balls 3 are properly arranged in all the arrangement holes 2, the check circuit 11
Is in the closed state.
Is a relatively small predetermined resistance value. on the other hand,
As shown in FIG. 3, when one of the minute metal balls 3 is missing, the check circuit 11
Is open. In this case, the resistance value measuring device 1
The measured value of 00 is much larger than in the closed state. Therefore, the presence or absence of the minute metal balls 3 can be determined based on the resistance value of the check circuit 11 as described above, and the appropriateness of the arrangement state of the minute metal balls 3 with respect to the arrangement holes 2 can be confirmed.

As described above, the minute metal balls 3
When suction is performed, the appropriateness of the arrangement state of the minute metal balls 3 can be quickly and accurately inspected by a simple operation of merely measuring the resistance value of the check circuit 11 by the resistance value measuring device 100. In that case, it is not necessary to use a conventional image recognition device, and therefore, the cost can be significantly reduced. Although the conductive wirings 10 are provided between the arrangement holes 2, they do not impair the suction function of the arrangement holes 2 at all, and as a matter of course, guarantee an appropriate arrangement function. .

FIG. 4 shows another embodiment of the arrangement substrate 1. As shown in FIG. In this example, the arrangement hole 2 is formed up to the inner region of the arrangement substrate 1, and the conductive wiring 20 is provided corresponding to the arrangement hole 2. As shown in the illustrated example, the conductive wiring 21 connects the outer array holes 2 to each other.
And conductive wiring 22 for connecting between array holes 2 therein
Is formed. In this case, the conductive wirings 21a, 21a at the cut-off portions of the conductive wirings 21 and 22 are respectively provided.
21b and the conductive wirings 22a and 22b form check connection terminals for the check circuits.

Using the resistance value measuring device 100 described above, the conductive wires 21a and 21b or the conductive wires 22a and 22b
To the conductive wiring 21 and the conductive wiring 22 to determine whether or not the minute metal ball 3 is missing. As in the case of the above-described embodiment, the minute metal ball 3 The propriety of the arrangement state can be confirmed. When a large number of arrangement holes 2 are formed up to the inner region of the arrangement substrate 1 as in this example, the conductive wiring 21 and the conductive wiring 2 are formed so as to form a plurality of check circuits.
2 may be divided, and such a configuration is effective.

Further, as shown in FIG. 5, a large number of arrangement holes 2 including the outer arrangement holes 2 and the inner arrangement holes 2 are connected in a zigzag manner by conductive wirings 30. In this case, one check circuit is formed by the minute metal balls 3 adsorbed in the arrangement holes 2 and the conductive wiring 30. In this case, however, the resistance value is connected to the check connection terminals of the conductive wirings 30a and 30b. By connecting the measuring device 100, it is possible to quickly and accurately inspect whether the arrangement state of the minute metal balls 3 is appropriate.

The present invention has been described with reference to the embodiment.
The present invention is not limited to the specific numerical values and the like described in these embodiments, and various modifications can be made within the scope of the present invention. For example, the formation pattern of the conductive wiring constituting the check circuit is not limited to the illustrated example, and various patterns can be formed as long as a closed circuit can be formed. Further, two or more cut-off portions in the conductive wiring for connecting the resistance value measuring device may be provided in the conductive wiring, and in each case, the same operation and effect as those of the above embodiment are obtained. be able to.

[0024]

As described above, according to the present invention, the arrangement state of the minute metal balls is formed by connecting adjacent arrangement holes by conductive wiring in the arrangement substrate of the minute metal balls of this kind. Can be easily and reliably checked. In addition, a large-scale image recognition device or the like conventionally used is no longer necessary, and it is possible to reliably check the properness of the arrangement state with such a simple configuration, which is extremely advantageous in terms of cost. The use of such an array substrate has advantages such as the ability to maintain and improve product quality in a later process and to increase production efficiency.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration example of an embodiment of an array substrate for micro metal balls according to the present invention.

FIG. 2 is a cross-sectional view of an embodiment of the substrate for arranging minute metal balls according to the present invention.

FIG. 3 is a cross-sectional view illustrating a state in which a minute metal ball is adsorbed in one embodiment of the substrate for arranging minute metal balls according to the present invention.

FIG. 4 is a plan view showing a configuration example of another embodiment of a substrate for arranging minute metal balls according to the present invention.

FIG. 5 is a plan view showing a configuration example of still another embodiment of a substrate for arranging minute metal balls according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Arrangement board 2 Arrangement hole 3 Micro metal ball 10 Conductive wiring 10a, 10b Conductive wiring 11 Check circuit 20 Conductive wiring 30 Conductive wiring

Claims (4)

(57) [Claims] A plurality of arrangement holes formed to correspond to the electrode portions of the semiconductor element, wherein minute metal balls to be joined to the electrode portions of the semiconductor element are attracted to openings of the arrangement holes. A substrate for arranging minute metal balls, comprising: a conductive wiring provided on the surface of the substrate between adjacent ones of the arrangement holes. 2. A circuit is formed by the minute metal balls and the arrangement holes, and the circuit is electrically connected when the minute metal balls are arranged in all the arrangement holes. Item 2. A substrate for arranging minute metal balls according to Item 1. 3. The substrate according to claim 1, wherein the conductive wiring is formed by print molding. 4. The arrangement of the minute metal balls according to claim 1, wherein at least a part of the conductive wiring connecting the arrangement holes is separated between predetermined arrangement holes. Substrate.