JP3090756B2 - Chip inductor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates, on both end surfaces of the flange portion of the core
Connect the lead wires at both ends of the conductor wire wound around the winding body
And a chip inductor having a pair of electrode plates .

[0002]

2. Description of the Related Art In a conventional chip inductor 17, as shown in FIG. 10, a lead wire 21 such as a solder-plated copper wire is bonded to a flange 19 at both ends of a core 18 such as a ferrite by an insulating adhesive 20 (see FIG. 10). a), core conductors 22 such as a polyurethane covered wire
18 wound once barrel 23 wound in, connect the lead wire 24 of the wire 22 <br/> at lead wire 21 wound once solder 25 adhered to both end flange portion 19 of the straight Secco A 18 and (b), the equipped with a lead wire 21 to the electrode plate 26 which is processed into a hoop, soldered and its electrode plate 26 and the rie <br/> lead wire 21 by a laser, the solder 25 After the lead wire 21 at the tip is cut off from the attached portion (c), the core 18 and the conductive wire 22 are covered with a mold insulator 27 (d), and the portion of the electrode plate 26 exposed from the mold insulator 27 is bent. (E).

[0003]

However, the chip inductor 17 having the above-mentioned conventional structure requires an electrode plate 26 formed into a hoop shape and a lead wire 21 such as a solder-plated copper wire. There is a step of soldering the lead wire 21 such as a solder-plated copper wire with a laser, which increases the material cost and is inefficient. Moreover, the thermal stress at the time of soldering the rie <br/> lead wire 21 and the electrode plate 26 by the laser, cause short circuit of the conductors 22, the yield is deteriorated. Moreover, it is uneconomical since the distal end portion of the lead wire 21 after the solder 25 with is discarded cut off. The core 18, such as ferrite, lead 21, such as solder-plated copper wire, a wire 22 such as a polyurethane covered wire, hoop to processed steps and laser <br/> by azure over mounted to the electrode plate 26 The equipment for the step of soldering the lead wire 21 and the electrode plate 26 and the step of cutting off the unnecessary lead wire 21 becomes large. Furthermore, since the connection between the conductive wire 22 and the electrode plate 26 is made via the lead wire 21 such as a solder-plated copper wire, the chip inductor 17
Is limited by miniaturization.

[0004] The present onset Akira has been made in view of the above problems, efficiently
It shall be the object of providing an effective small <br/> chip inductor also can Energy Conservation measures economically manufactured.

[0005]

Chip inductor mounting serial to claim 1 SUMMARY OF THE INVENTION comprises a winding barrel core, respectively cross-section to form a flange portion at both ends is substantially H-shaped, and the winding body of the core and winding the formed conductor, and the pair of electrode plates which are respectively attached by heat-resistant insulating adhesive on both end surfaces of the flange portion of the core, and the conductive wire is exposed a part of the electrode plate with the core and a mold insulator, the electrode plate through a bonding portion to be bonded to the end <br/> face of the core, the fold line to the bonded portion communicating covering
Portion of the distal end or internal et outer portion of connection teeth the mold insulator
Is exposed at the base of this electrode and both sides
A notch is provided at the edge, which is inclined along the fold line.
Is formed narrower toward the end face of the flange portion of the serial core winding the lead wire at both ends of the conductive wire is connected is wound by soldering
Part .

[0006] The chip inductor of the mounting come to claim 2, 請
In the chip inductor according to Motomeko 1, winding <br/> times of conductive plates are those folded portion was be folded formed <br/> the edge of the notch.

[0007] serial mounting of the chip inductor in claim 3, 請
3. The chip inductor according to claim 1, wherein one or a plurality of cut portions are formed in the bonded portion of the electrode plate.

[0008] Chip inductor mounting serial to claim 4, 請
The chip inductor according to any one of claims 1 to 3,
In the flange portion of the core is one in which the electrode plates in heat resistance insulation adhesive has have a concave arc-like surface that will be bonded to the end surface.

[0009]

[Action] chip inductor mounting serial to claim 1, the conductor
Both end surfaces of the flange portion of the core by winding the base end of the electrode portion of the electrode plate bonding portion is bonded by insulation adhesive to the winding drum portion, both sides
Make a notch at the edge over the fold line with the adhesive
The lead wires at both ends of the conductor are wound narrow toward the end face of the core.
To Rukoto provided with a wound portion that is connected by soldering is wound
Ri, Ru is wound in place of the lead lines of conducting wire wound around the adjacent along the end face of the core.

[0010] Ji Ppuindakuta according to claim 2,請
In the chip inductor according to claim 1, the lead wire of the wound conductive wire is wound around the winding portion by forming a folded portion at the edge of the cut in the winding portion formed on the electrode portion of the electrode plate. When the conductor is wound, the cut in the electrode plate
Not cut or scratched at the edges of

[0011] Ji Ppuindakuta according to claim 3, 請
In the chip inductor according to Motomeko 1 or 2, since the forms <br/> shaped cuts 1 or a plurality of cut portions in the bonding portion of the electrode plate, the adhesion strength between the flange portions at both ends of the core and the electrode plate And yield is improved.

[0012] Ji Ppuindakuta according to claim 4, 請
The chip inductor according to any one of claims 1 to 3,
Heat-resistant insulation bonding of the electrode plate to the end face of the core flange
Since the formation of the concave arc-shaped surface for bonding with adhesive, more compact by arranging the thickness of the adhesive portion of the core end face on the layer thickness and the electrode plate of the adhesive provided in the flange portion of the inside concave arcuate surface Ru be <br/>.

[0013]

BRIEF DESCRIPTION assumptions become technology configurations for illustrating a chip inductor of an embodiment of the present invention with reference to FIGS.

The core 1 is formed in a substantially H-shaped cross section by a winding body 2 made of ferrite and flanges 3 integrally formed at both ends of the winding body 2. A conductor 4 such as a polyurethane-coated electric wire is wound around the core 1 and the winding body 2. Further, 5 in the electrode plate, and the adhesive portion 7 which is bonded to both end surfaces of the flange portion 3 of the core 1 in the heat-resistant insulating adhesive agent 6, via a substantially right angle bend polygonal line from the end portion of the bonding portion 7 To the adhesive 7
And has a substantially L-shape. Further, 9 is molded insulator covering exposes a portion of the distal end of the electrode portion 8 of the core 1 collector plate 5. Then, the electrode portion 8 exposed from the mold insulator 9 of the electrode plate 5 is bent along the outer periphery of the mold insulator 9, and the display portion such as display ink and insulating paint is formed on the surface of the mold insulator 9.
Bake 10 to form.

[0015] Incidentally, as shown by the chain line in FIG. 3, conductive plate 5
If adhesive bonding portion 7 of the end face substantially the entire surface of the flange portion 3 of the core 1, the adhesive area is enlarged.

Next, a description will be given of a method of manufacturing a chip inductor having the configuration based on the above-mentioned premise with reference to FIG.

Firstly, bonding the bonding portion 7 of the electrode plates 5, so that the electrode portions 8 are positioned on a plane substantially parallel to the end surface of both end flange portion 3 of the core 1 in the heat-resistant insulating adhesive 6 (A). Winding barrel portion 2 of the lead wire 4 core 1 such as a polyurethane coated wire
Turn wound, wound the base close to the flange portion 3 the end face of the electrode portion 8 of the lead line 11 the conductive plate 5 at both ends of the guide line 4 is connected fixed with solder 12 (b).

Furthermore, after the step of connecting at Handa 12 Core 1
And including a connecting portion of the extraction line 11 of the winding forming the conductor 4 and is bonded to both ends of the core 1 electrodeposition plate 5 and the guide line 4 on the core 1, the electrostatic electrode plate core 1 5 A part of the electrode part 8 is exposed and covered with a mold insulator 9 (c). Then, the display unit 10 is formed by baking display ink, insulating paint, or the like. Then, the exposed portion of the electrode portion 8 of the conductive plate 5 bent along the peripheral surface of the mold insulating body 9 (d).

[0019] to the next, a description will be given of the operation of the configuration of the technologies that are the premise.

The electrode plate 5 can be manufactured economically by using a lead wire such as a solder-plated copper wire and an electrode plate processed in a hoop shape, so that the number of soldering steps can be reduced and the manufacturing steps can be omitted. Further, since the solder 12 with a lead line 11 by turning directly wound from wire 4 to electrostatic electrode plate 5, it is a reliable connection of the electrode plate 5 and the lead wire 11.

Next, an embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG.

The electrodes 8 of the electrode plate 5 are cut along the fold line in such a manner that both side edges are tapered so that the width decreases toward the base located on the end face side of the flange 3 of the core 1 of the core 1. , to form a winding portion 13 for winding the lead wire 11 of the conductor 4
You. With this configuration , the conductor 4 can be wound at a fixed position by approaching the flange 3 of the core 1.

Next , another embodiment of the present invention will be described with reference to FIG.
Will be explained. As shown in FIG. 7, the cut portion 14 is folded to form a winding portion 13 for winding the lead wire 11 of the conductor 4 .
You. Edge of this configuration, the lead line 11 is cut
Can be prevented from being cut and damaged Ri by the edge portion is.

Next , another embodiment of the present invention will be described with reference to FIG.
Will be explained. As shown in FIG. 8, one or a plurality of cut portions 15 are formed in the bonding portion 7 of the electrode plate 5 . In this configuration
Thereby , the bonding outer peripheral line of the bonding portion 7 is enlarged, and the bonding effect can be enhanced.

Next , another embodiment of the present invention will be described with reference to FIG.
Will be explained. As shown in FIG. 9, a substantially conical concave surface 16 is formed on the end surface of the flange portion 3 of the core 1, and the bonding portion 7 of the electrode plate 5 having a curved surface along the concave surface 16 is made of a heat insulating material. Adhesion is performed with an insulating adhesive 6 . This configuration can be miniaturized thickness of the adhesive portion 7 and heat-resistant insulating adhesive 6 of the electrode plate 5.

[0026]

According to the invention described in claim 1 according to the present invention, the <br/> winding portion for winding the lead wire of the provided conductor to the proximal end of the electrode portion of the conductive plate, both side edges of the electrode portions At the bent line with the adhesive
Beveled notch and narrowed toward core end face
To reason, cut with miniaturization co If can be wound in close <br/> the position along the lead lines of the conductor on the end surface of the core.

According to the invention described in claim 2 , according to claim 1
In addition to the effects of the chip Inductors described, for forming folded folded portion at the edge of the cut in the windings of the electrode plates, Ku wound such that the lead wire of the lead is scratched or cut at the cutting edges made of the electrode plate And yield is improved.

According to the invention described in claim 3 , according to claim 1
Or in addition to the effect of the chip inductor described in 2,
To form cuts one or a plurality of cut portions in the connection portion of the plate, to improve the adhesive strength between the adhesive portion of the flange portion of the core and the electrode plate with a stable quality can be obtained in co the yield is improved.

According to the invention described in claim 4 , according to claim 1 of the present invention,
The effect of the chip inductor according to any one of the above items 1 to 3
In addition, to form a concave arcuate surface portions on the end face of the flange portion of the core, it is possible to dispose the plate thickness of the adhesive portion of the layer thickness of the adhesive and the electrode plate into the concave arc-shaped plane, it is small in al Can be

[Brief description of the drawings]

FIG. 1 is a vertical sectional front view of a chip inductor showing one embodiment of the present invention.

FIG. 2 is a perspective view of the same core and an electrode plate.

FIG. 3 is a front view of the same.

FIG. 4 is a perspective view of the same chip inductor.

FIGS. 5 (a), (b), (c), and (d) are manufacturing process diagrams of the chip inductor of the present invention.

FIG. 6 is a plan view of a core and an electrode plate of a chip inductor according to another embodiment of the present invention.

FIG. 7 is a developed view of an electrode plate of a chip inductor according to another embodiment of the present invention.

FIG. 8 is a perspective view of a core and an electrode plate of a chip inductor according to another embodiment of the present invention.

FIG. 9 is a front view of a chip inductor according to another embodiment of the present invention, in which a part of a core and an electrode plate are cut away.

FIG. 10 (a), (b), (c), (d), (e)
FIG. 2 is a manufacturing process diagram of a conventional chip inductor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Core 2 Winding trunk part 3 Flange part 4 Conductor wire 5 Electrode plate 6 Heat resistant insulating adhesive 7 Adhesive part 8 Electrode part 9 Mold insulator 11 Lead wire 12 Solder

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-185906 (JP, A) JP-A-1-223709 (JP, A) JP-A-60-214509 (JP, A) JP-A 58-185 166713 (JP, A) JP-A-64-46907 (JP, A) JP-A-1-173916 (JP, U) JP-A-64-394 (JP, U) (58) Fields investigated (Int. ⁷ , DB name) H01F 27 / 28,27 / 29 H01F 27 / 32,41 / 04

Claims (4)

(57) [Claims] And 1. A winding barrel core, respectively cross-section to form a flange portion on both ends of the substantially H-shaped, and the wound formed conducting wire winding barrel portion of the core, both ends of the flange portion of said core comprising a pair of electrode plates which are bonded respectively in the heat-resistant insulating adhesive surface and a mold insulator said conductive wire together with said core covering to expose part of the electrode plate, the electrode plate, the core A bonding portion bonded to the end face of the
An electrode portion which is partially exposed on the distal end side to <br/> inside or al outer portion of succession the mold insulator via fold lines to the adhesive portion, the
Provided at the base end of the electrode section and sloped on both sides along the fold line
And a notch is provided toward the end face of the flange of the core.
Width is formed to a narrow Te leading lines winding of both ends of said conductor
It is in chip inductors characterized by comprising a winding section connected by soldering. Wherein windings of conductive electrode plate, according to claim <br/> return part folding the edge of the notch is characterized in that it is folded form 1
A chip inductor according to claim 1. 3. A conductive adhesive portion of the electrode plate, according to claim 1 characterized in that one or a plurality of cut portions are cut formed
Or the chip inductor according to 2 . The flange portion of wherein core is according to any one of claims 1 to, characterized in that the electrode plates in heat resistance insulation adhesive has have a concave arc-like surface that will be bonded 3 to the end face Chip inductor.