JP3087703B2 - Adhesive resin composition and adhesive sheet - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel adhesive resin composition for electronic parts and an adhesive sheet containing the same as a main component.

[0002]

2. Description of the Related Art Conventionally, as adhesives for fixing electric and electronic parts such as semiconductor chips, substrates and lead frames, paste adhesives and adhesives coated on heat-resistant base materials are known. Have been. Examples of the adhesive used here include thermosetting resins such as epoxy resin, acrylic resin, and rubber-phenol resin.

[0003] However, these adhesives require a high temperature and a long time for heat curing, and thus are inferior in bonding workability. In addition, these adhesives generate a large amount of volatile components during heat curing and cause lead frame contamination, as well as high hygroscopicity and cracks during solder reflow.
It has various disadvantages.

As described above, conventional adhesives for fixing electric and electronic parts are not said to have the high reliability required for electric and electronic parts, and are sufficiently satisfactory. Has not been obtained.

On the other hand, a hot-melt type film adhesive using a thermoplastic polyimide resin can be thermally bonded to an adherend in a short time. Such an adhesive does not require heat curing after bonding, but requires a high temperature for processing because of its high glass transition temperature, and is likely to cause thermal damage to an adherend. On the other hand, when an adhesive having a low glass transition temperature is used, the low-temperature workability is excellent, but the heat resistance is low and the reliability is significantly reduced.

Furthermore, these thermoplastic polyimide resins have a high moisture absorption rate, require complicated steps such as predrying to remove moisture absorption before bonding, and have low productivity.

Further, Japanese Patent Application Laid-Open No. Sho 62-1714,
JP-A-239427 and JP-A-5-320611 disclose an adhesive resin composition having improved fluidity by blending a polycarbodiimide resin with an epoxy resin having a relatively low molecular weight to improve such workability. Are listed. However, this composition has problems in storage stability and hygroscopicity due to the epoxy resin, and satisfactory results have not been obtained.

[0008]

DISCLOSURE OF THE INVENTION The present inventors have intensively studied an adhesive resin composition which can be bonded in a short time even at a low temperature, has high heat resistance, has low moisture absorption and hardly causes package cracks and the like. As a result, they have found that a resin composition containing a polycarbodiimide resin and a bisalkenyl-substituted nadiimide satisfies such requirements, and have completed the present invention.

The present invention provides an adhesive resin composition containing a polycarbodiimide resin represented by the following general formula (1) and a bisalkenyl-substituted nadimide represented by the following general formula (2). is there.

[0010]

Embedded image [In the formula, n represents a positive integer, and A represents a divalent organic group.]

[0011]

Embedded image [In the formula, R ₁ and R ₂ are independently selected as hydrogen or a methyl group, R ₃ represents a diamine residue] Further, the present invention provides an adhesive sheet made of the resin composition . Further, the present invention provides an adhesive sheet provided with the resin composition on at least one surface of a support.

JP-A-7-286140, JP-A-7-258353 and JP-A-7-330873 disclose that a bisalkenyl-substituted nadimide, which is an essential component of the present invention, has thermosetting properties excellent in heat resistance. Coating materials,
A resin composition in which bismaleimide, an epoxy resin and the like are blended is described. However, there is no description in this document that blending a bisalkenyl-substituted nadimide has good hygroscopicity and storage stability, and no satisfactory results have been obtained with respect to such adhesives in terms of adhesiveness and flexibility.

[0013]

DETAILED DESCRIPTION OF THE INVENTION Hereinafter, the present invention will be described in more detail.

The degree of polymerization (n) of the polycarbodiimide, which is one component of the composition of the present invention, is not particularly limited, but is preferably from 2 to 200, and more preferably from 8 to 40. The mixing ratio of the bisalkenyl-substituted nadiimide compound, which is the other component, to the polycarbodiimide resin is not particularly limited, and is determined in consideration of the workability and adhesiveness of the adhesive sheet. The compounding amount is the bisalkenyl-substituted nadimide compound 1 to 100 parts by weight based on 100 parts by weight of the polycarbodiimide resin.
Parts by weight, preferably 5 to 80 parts by weight, more preferably 1 to
0 to 60 parts by weight. If the amount of the bisalkenyl-substituted nadimide compound is less than 1 part by weight, the effect of adding the bisalkenyl-substituted nadimide compound cannot be obtained. On the other hand, if the amount is more than 100 parts by weight, the strength of the adhesive sheet is undesirably reduced.

(A) Polycarbodiimide resin The polycarbodiimide resin used in the present invention can be produced by a conventionally known method. For example, LMAlberi
no et al. (J. appl.Polym.Sci., 21, PP1999 (1977))
As disclosed in JP-A-292316 and JP-A-4-275359, it can be obtained by reacting an organic diisocyanate in an organic solvent in the presence of a carbodiimidization catalyst.

As such organic polyisocyanates, aromatic diisocyanates, specifically 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1-methoxyphenyl-2,4-diisocyanate, 4,4 '-Diphenylmethane diisocyanate, 3,
3'-dimethoxy-4,4'-diphenylmethane diisocyanate, 3,3'-dimethyl-4,4'-diphenylmethane diisocyanate, 4,4'-diphenyl ether diisocyanate, 3,3'-dimethyl-4,4'-diphenyl ether diisocyanate , O-tolylene diisocyanate and the like.

Further, as the aliphatic diisocyanate,
4,4-methylenebis (cyclohexylisocyanate), bis (isocyanatemethyl) cyclohexane, isophorone diisocyanate, cyclohexylene diisocyanate, adamantyl diisocyanate, hexamethylene diisocyanate, p-xylylene diisocyanate, m-xylylene diisocyanate, octamethylene diisocyanate, etc. are used. be able to. These can be used alone or in combination of two or more (a copolymer is obtained).

Further, an organic polyisocyanate produced from a diamine by the following known method may be used.
That is, a method in which phosgene, diphenyl carbonate, or carbonyldiimidazole is allowed to act on the corresponding diamine, a method in which a dicarboxylic acid is produced by Curtius rearrangement, and the like are exemplified. In addition, a method of isocyanation by thermal decomposition of the corresponding urethane (G. Greber, et.
l., Angew. Int. Ed., Vol. 7. No.12.941 (1968), V.
LK Valli, et.al., J. Org. Chem., Vol. 60.257
(1995)).

As the diamine as the raw material for the diisocyanate, an aromatic diamine is preferably used.
For example, 2,2'-bis [4- (4-aminophenoxyphenyl)] propane, 2,2'-bis [4- (4-aminophenoxyphenyl)] hexafluoropropane, 1,3- or 1,4- Bis (4-aminophenoxy) benzene, 2,4-
Or 2,6-diaminotoluene, diaminodiphenylmethane, 4,4′-diamino-2,2′-dimethyl or bis (trifluoromethyl) biphenyl, but is not limited thereto. These isocyanates may be used alone or may be mixed and used as a copolymer.

As the solvent used for the production of the isocyanate, any of the solvents known for such a reaction may be used. Specifically, halogenated hydrocarbon solvents such as tetrachloroethylene, 1,2-dichloroethane and chloroform; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; cyclic ether solvents such as tetrahydrofuran and dioxane; Mixtures can be used.

The catalyst for carbodiimidization is 3-
Methyl-1-phenyl-2-phospholene-1-oxide, 1-phenyl-2-phospholene-1-oxide, 3
Using a phospholen oxide such as -methyl-2-phospholene-1-oxide, 1-ethyl-2-phospholene-1-oxide, 1-methyl-2-phospholene-1-oxide, or a 3-phospholene isomer thereof can do.

(B) Bisalkenyl-substituted nadimide The bis-alkenyl-substituted nadimide which is another essential component of the resin composition of the present invention is described in JP-A-59-80662.
JP-A-60-178882, JP-A-61-187
Any of the known bisalkenyl-substituted nadimides described in JP-A-61-170358 and JP-A-63-170358 can be used. This bisalkenyl-substituted nadimide can generally be prepared by reacting the corresponding alkenyl-substituted nadic acid with a diamine.

Such bisalkenyl-substituted nadimides include N, N'-ethylene-bis (allylbicyclo [2,2,1] hept-5-, wherein the diamine is an aliphatic diamine.
Ene-2,3-dicarboximide), N, N'-trimethylene-bis (allylbicyclo [2,2,1] hept-5-ene-2,3-dicarboximide), N, N'-hexa Methylene-bis (allylbicyclo [2,2,1] hept-5-ene-2,3-dicarboximide), N, N′-dodecamethylene-bis (allylbicyclo [2,2,1] hept-5 -Ene-2,3-dicarboximide) and the like.

Further, as another bisalkenyl-substituted nadimide, N, N'-p
-Phenylene-bis (allylbicyclo [2,2,1] hept-5-ene-2,3-dicarboximide), N, N'-m
-Phenylene-bis (allylbicyclo [2,2,1] hept-5-ene-2,3-dicarboximide), bis {4-
(Allylbicyclo [2,2,1] hept-5-ene-2,3-
Dicarboximido) phenyl} methane, bis {4- (allylbicyclo [2,2,1] hept-5-ene-2,3-dicarboximido) phenyl} ether and the like. Further, the diamine is phenylene alkylene diamine,
N, N'-p-xylylene-bis (allylbicyclo [2,2,
1] Hept-5-ene-2,3-dicarboximide),
N, N'-m-phenylene-bis (allylbicyclo [2,2,
1] Hept-5-ene-2,3-dicarboximide) and the like. These bisalkenyl-substituted nadimides may be used alone or as a mixture.

(Curing Catalyst) In order to shorten the curing time of the composition, a curing catalyst of a polycarbodiimide resin and a bisalkenyl-substituted nadimide may be used in combination. The amount of the curing catalyst used is 0.1 to 100 parts by weight of both resins in total.
The amount is from 01 to 30 parts by weight, preferably from 0.5 to 5 parts by weight.

Examples of the curing catalyst include organic peroxides, onium salts, cationic catalysts, and organic group-containing metal compounds.

(I) As the organic peroxide, di-t-butyl peroxide, di-t-amyl peroxide, t-
Butyl cumyl peroxide, diacetyl peroxide,
Dipropionyl peroxide, di-iso-butyryl peroxide, benzoyl peroxide, peroxysuccinic acid, t-butyl hydroperoxide, cyclohexyl hydroperoxide, cumene hydroperoxide, t-
Butylperoxybenzoate, t-butylperoxypivalate, 1,1-di-t-butylperoxycyclohexane, di- (t-butylperoxy) isophthalate, t-butylperoxymaleate, t-butylperoxyisopropyl carbonate, 2 -Di-t-butylperoxybutane and the like.

(Ii) Examples of the onium salt include ammonium compounds, phosphonium compounds, arsonium compounds, stibonium compounds, oxonium compounds, sulfonium compounds, selenonium compounds, stannonium compounds, and iodonium compounds.

Specific examples of the ammonium compound include benzyltriethylammonium chloride, benzyltriethylammonium bromide, phenyltrimethylammonium bromide, tetra-n-butylammonium chloride, tetra-n-butylammonium perchlorate, and tetraethylammonium tetrafluoroborate. , M-trifluoromethylphenyltrimethylammonium bromide, tetra-n-butylammonium trifluoromethanesulfonate and the like, as phosphonium compounds, methyltriphenylphosphonium iodide, methyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide , 3-bromopropyltriphenylphosphonium And arborium compounds such as benzyltriphenylarsonium chloride, tetraphenylarsonium bromide and tetra-n-butylarsonium chloride, and stibonium compounds such as benzyltriphenylstibonium chloride and tetraphenylstibonium bromide. etc,

Examples of the oxonium compound include triphenyloxonium chloride and triphenyloxonium bromide, and examples of the sulfonium compound include triphenylsulfonium tetrafluoroborate, triphenylsulfonium hexafluoroarsenate, and tri (p-methoxyphenyl) sulfonium hexafluoro. Phosphate, tri (p-tolyl) sulfonium tetrafluoroborate, dimethylphenacylsulfonium hexafluorophosphate, dimethylphenacylsulfonium tetrafluoroborate and the like, as selenonium compounds, triphenylselenonium tetrafluoroborate, triphenylselenonium hexafluoro Arsenate, triphenylselenonium hexafluoroantimonate, p- (t-butylphenyl) Sulfonyl) diphenyl seleno hexafluoroarsenate, etc., as the stannonium compounds, triphenyl Stan Roh chloride, triphenyl Stan Roh bromide, tri -n- butyl Stan Roh bromide, benzyl diphenyl Stan Roh chloride or the like,

Examples of the iodonium compound include diphenyliodonium chloride, diphenyliodonium bromide, diphenyliodonium perchlorate, diphenyliodonium tetrafluoroborate, iodonium hexafluoroarsenate, iodonium hexafluorophosphate, iodonium hexafluoroantimonate, and (p-methoxyphenyl) Phenyliodonium tetrafluoroborate, di (2-nitrophenyl) iodonium hexafluoroarsenate, di (p-tolyl) iodonium hexafluorophosphate, di (p-
(Chlorophenyl) iodonium hexafluoroarsenate.

(Iii) As the cation catalyst, for example, sulfuric acid, dimethyl sulfate, diethyl sulfate, pyridine sulfate, phosphoric acid, phosphorous acid, phenylphosphonic acid, phenylphosphinic acid, triethyl phosphate, dimethyl phosphate, phosphorous acid Phenyl acid, methanesulfonic acid, trifluoromethanesulfonic acid, m-xylene-4-sulfonic acid, p-xylene-2-sulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, p-toluenesulfonic acid / triphenylamine complex , P-toluenesulfonic acid nitrobenzenesulfonic acid / pyridine complex, naphthalenesulfonic acid,
Methyl benzenesulfonate, ethyl p-toluenesulfonate, or other acid or acid-releasing Prensted acid, or its ester or amine complex; boron trichloride, boron trifluoride, boron trifluoride ether complex, trichloride iron,
Examples thereof include tin tetrachloride, titanium tetrachloride, aluminum chloride, aluminum chloride / pyridine complex, aluminum bromide, zinc chloride, antimony pentachloride and the like, halides exhibiting Lewis acidity, and complexes with bases thereof.

(Iv) Organic group-containing metal compounds include magnesium, zinc, titanium, vanadium, chromium,
Manganese, iron, cobalt, nickel, copper, zirconium, molybdenum, ruthenium, rhodium, lanthanum, cerium, hafnium, transition elements such as tantalum or tungsten, preferably magnesium, zinc, vanadium, acetylacetone salts such as manganese, iron or cerium, Carboxylates, metallocenes, alcoholates, chelate compounds or organometallic compounds, more preferably acetylacetone salts or carboxylates such as magnesium, zinc, vanadium, manganese, iron or cerium.

(C) Other Components The heat-resistant resin of the present invention may be blended with a fine inorganic filler as long as the processability and heat resistance are not impaired. Also, in order to impart surface smoothness, a leveling agent, a leveling agent,
Various additives such as a defoaming agent may be added as necessary.

The resin composition of the present invention can be used as a varnish by dissolving the polycarbodiimide resin and the alkenyl-substituted nadiimide compound in their respective common solvents, and can be formed into a film by an ordinary method to form an adhesive sheet. be able to. The thickness of the sheet is generally 1 to 2000 μm, but is not limited thereto, and can be appropriately determined according to the purpose of bonding. Also, the shape and size of the sheet can be appropriately determined according to the adherend such as a lead frame and a semiconductor chip.

In forming the adhesive sheet, it is necessary to provide conductivity, improve heat transfer, adjust elastic modulus, improve dimensional stability,
Especially for the purpose of increasing the elastic modulus, for example, aluminum,
Metals or alloys such as copper, silver, gold, nickel, chromium, lead, tin, zinc, palladium, solder, alumina, silica,
Various inorganic powders composed of ceramics such as magnesia and silicon nitride, and other carbons can be used alone or in combination of two or more as needed.

The coating temperature of the film is from 20 to 150 ° C., preferably from 50 to 120 ° C., most preferably from 70 to 100 ° C.
° C. If the coating temperature is lower than 20 ° C., the solvent may remain in the film. At a high temperature exceeding 150 ° C., the heat curing of the film may proceed.

Further, these films may be formed on a support. In order to produce a laminated adhesive sheet having such a configuration, a solution of the resin composition of the present invention may be applied on a support, and the laminate is formed by laminating a film formed in advance by pressing or the like. Is also good.

As the support, a metal foil, an insulating film or the like can be used. Aluminum, copper, silver, gold, nickel, indium, chromium, lead,
Any of tin, zinc, palladium, iron and the like are preferably used, and they may be used alone or may be an alloy of a plurality of metals. Various films may be used as the insulating film as long as the film has heat resistance and chemical resistance such as polyimide, polyester, and polyethylene terephthalate.

The above-mentioned metal foil and insulating film may be used alone, respectively.
A two-layer substrate such as an insulating film may be used. Examples of the two-layer substrate include a copper / polyimide two-layer substrate.

The adhesive sheet of the present invention is thermally cured by a heat treatment to exhibit a strong adhesive force and to be a cured product having low moisture absorption. The heat treatment can be performed by an appropriate method such as a heater, ultrasonic waves, and ultraviolet rays. Therefore, the adhesive sheet of the present invention can be preferably used for the bonding treatment of various materials, and in particular, electric / electronic parts typified by semiconductor chips and lead frames, etc., which require low moisture absorption and highly reliable fixing treatment. It is preferred for fixing treatment and surface protection.

The adhesive sheet of the present invention has a small coefficient of thermal expansion, is excellent in dimensional stability against temperature change, has low moisture absorption, is flexible and easy to handle, and has an adhesive property to a semiconductor element. It is excellent in that it is good and has good storage stability.

The resin composition of the present invention is used as a varnish, and the varnish is applied to one surface of the metal foil and dried. The metal foil with an adhesive layer is particularly useful for producing a multilayer circuit board and the like.

[0044]

Next, the present invention will be described more specifically with reference to examples and comparative examples. In addition, the characteristics of the obtained resin composition and the adhesive sheet were measured as follows.

Adhesiveness: The adhesive sheets produced in each of the examples and comparative examples were cut into strips having a width of 10 mm, and were pressed under the following conditions: temperature: 200 ° C., pressure: 40 kg / cm ² ,
At time: 20 s, it was thermocompression bonded to a 42 alloy (42% Ni-Fe main component alloy) plate. Next, the adhesive force between the adhesive sheet of the sample manufactured here and the 42 alloy plate was measured by 180 degree peel. Adhesive strength is Shimadzu Autograph AGS-10
It was measured using 0D.

Example 1 500 g of 2,4-tolylene diisocyanate was used as a carbodiimidization catalyst 3-methyl-1
The mixture was reacted with 6 g of -phenyl-2-phospholene-1-oxide in 2000 mL of toluene at 60 ° C for 6 hours to obtain a polycarbodiimide solution. To this solution was added 25 g of N, N'-hexamethylene-bis (allylbicyclo [2,2,
1] Hept-5-ene-2,3-dicarboximide),
(Manufactured by Maruzen Petrochemical Co., Ltd., BANI-H, hereinafter abbreviated as BANI-H) and mixed uniformly. This solution was applied to the roughened surface of an electrolytic copper foil having a thickness of 35 μm, and dried with hot air at 90 ° C. for 30 minutes.
The adhesive sheet of the present invention was obtained by further drying at 150 ° C. for 1 hour. Next, when the adhesiveness was evaluated using this adhesive sheet, the adhesive strength was 1100 g / cm. The moisture absorption of this adhesive sheet was 0.1% or less, and no decrease in adhesiveness was observed even after standing at room temperature for one month.

Example 2 An adhesive sheet was prepared in the same manner as in Example 1 except that 100 g of BANI-H was used. When the adhesiveness was evaluated using this adhesive sheet, the adhesive strength was 1000 g / cm. The moisture absorption of this adhesive sheet was 0.1% or less, and no decrease in adhesiveness was observed even after standing at room temperature for one month.

Example 3 Instead of BANI-H, bis {4-
(Allylbicyclo [2,2,1] hept-5-ene-2,3-
An adhesive sheet was prepared in the same manner as in Example 1, except that 50 g of (dicarboximido) phenyl} methane (BANI-M, manufactured by Maruzen Petrochemical Co., Ltd.) was used. When the adhesiveness was evaluated using this adhesive sheet, the adhesive strength was 1
It was 200 g / cm. The moisture absorption of this adhesive sheet was 0.1% or less, and no decrease in adhesiveness was observed even after standing at room temperature for one month.

Example 4 500 g of 2,2'-bis [4- (4-isocyanatophenoxy) phenyl] hexafluoropropane was mixed with 3 g of carbodiimidation catalyst 3-methyl-1-phenylphospholene in tetrahydrofuran 30.
The reaction was performed in 00 mL at 60 ° C. for 7 hours to obtain a polycarbodiimide solution. 50 g of N, N'-p-xylylene-bis (allylbicyclo [2,2,1] hept-5-
Ene-2,3-dicarboximide) and (BANI-X manufactured by Maruzen Petrochemical Co., Ltd .; hereinafter abbreviated as BANI-X) were added and mixed uniformly. This solution was applied to the roughened surface of an electrolytic copper foil having a thickness of 35 μm, dried with hot air at 90 ° C. for 30 minutes, and further dried at 150 ° C. for 1 hour to obtain an adhesive sheet of the present invention. Next, when the adhesiveness was evaluated using this adhesive sheet, the adhesive strength was 1100 g / cm. The moisture absorption of this adhesive sheet was 0.1% or less, and no decrease in adhesiveness was observed even after standing at room temperature for one month.

Comparative Example 1 An epoxy resin (Epicoat 828, Yuka Shell Epoxy Co., Ltd.) was used instead of BANI-H.
An adhesive sheet was produced in the same manner as in Example 1 except that (1) was used. When the adhesiveness of this sheet was evaluated, the adhesive strength was 750 g / cm. The moisture absorption of the adhesive sheet was 0.5%. Further, after the sheet was allowed to stand at room temperature for one month, the adhesive strength was measured in the same manner. As a result, it was lowered to 280 g / cm, and the storage stability was low.

Comparative Example 2 An adhesive sheet was produced in the same manner as in Example 1 without adding BANI-H. Next, when the adhesiveness was evaluated using this adhesive sheet, the adhesive strength was 50.
g / cm.

Comparative Example 3 An adhesive sheet was produced in the same manner as in Example 4 without adding BANI-X. Next, when the adhesive property was evaluated using this adhesive sheet, the adhesive strength was 30.
g / cm.

[0053]

The resin composition of the present invention and the adhesive sheet using the same have low moisture absorption, excellent storage stability, and can be stored at room temperature for a long period of time. In addition, the low-temperature adhesiveness is excellent, and the workability is improved. In particular, an alloy containing Ni-Fe as a main component, for example, 42 alloy (42% Ni-Fe alloy), 45 alloy
(45% Ni-Fe alloy), 36 alloy (36% Ni-Fe alloy)
alloy), it is extremely useful industrially as a microelectronic material, a semiconductor packaging material and the like.

────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI // C08G 18/02 C08G 18/02 Z 18/79 18/79 Z (72) Inventor Yuji Hotta 1 Shimohozumi, Ibaraki-shi, Osaka Chome 1-2 Nitto Denko Corporation (58) Field surveyed (Int. Cl. ⁷ , DB name) C08L 79/08 C08K 5/3415 C09J 7/00 C09J 7/02 C09J 179/08 C08G 18 / 02 C08G 18/79

Claims (7)

(57) [Claims] 1. An adhesive resin composition comprising a polycarbodiimide resin represented by the following general formula (1) and a bisalkenyl-substituted nadimide represented by the following general formula (2). Embedded image [In the formula, n represents a positive integer, and A represents a divalent organic group.] [Wherein, R ₁ and R ₂ each independently represent a hydrogen or methyl group, and R ₃ represents a diamine residue] 2. The adhesive resin composition according to claim 1, wherein n is an integer of 2 to 200. 3. The adhesive resin composition according to claim 1, wherein 1 to 100 parts by weight of a bisalkenyl-substituted nadimide is mixed with 100 parts by weight of the polycarbodiimide resin. 4. The composition according to claim 1, further comprising at least one curing catalyst selected from the group consisting of an organic peroxide, an onium salt, a cationic catalyst, and an organic group-containing metal compound.
Adhesive resin composition. 5. The compounding amount of the curing catalyst is 100 in total of the polycarbodiimide resin and the bisalkenyl-substituted nadimide.
The amount is 0.01 to 30 parts by weight with respect to parts by weight.
Adhesive resin composition. 6. An adhesive sheet comprising the adhesive resin composition according to claim 1. 7. The method according to claim 1, wherein at least one surface of the support is provided.
An adhesive sheet provided with the adhesive resin composition of (1).