JP3086493U - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
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- JP3086493U JP3086493U JP2001007938U JP2001007938U JP3086493U JP 3086493 U JP3086493 U JP 3086493U JP 2001007938 U JP2001007938 U JP 2001007938U JP 2001007938 U JP2001007938 U JP 2001007938U JP 3086493 U JP3086493 U JP 3086493U
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- main body
- heat
- upper main
- lower main
- heat radiating
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Abstract
(57)【要約】 （修正有）
【課題】 気密性が良好で加工が容易な放熱装置の提
供。
【解決手段】 液−気相間の変化を利用し放熱効果を加
速する放熱装置２０とされ、上主体２２と下主体２１を
具え、上主体と下主体が環状の上側壁２２１と下側壁２
１１、及び上側壁と下側壁に対応して設立された連通状
の凹溝２６を具え、上主体と下主体の結合後の内部に密
閉空間が形成され、並びに上述の密閉空間内に熱伝導速
度を増加可能な作業流体が充填され、凹溝にはんだ材料
が充填され、加熱後に、はんだ材料が溶融して連通状の
凹溝内に流入し、これにより毛細管現象によりはんだ材
料が上主体の四周及び下主体の下側壁の接合面部分にし
み込み、こうして簡単に上主体と下主体を溶接して一体
となし、気密性が良好で加工が容易な機能を達成する。
(57) [Summary] (with correction) [Problem] To provide a heat radiating device having good airtightness and easy processing. A heat radiating device (20) for accelerating a heat radiating effect by utilizing a change between a liquid and a gaseous phase, comprising an upper main body (22) and a lower main body (21), wherein the upper main body and the lower main body are annular upper side wall (221) and lower side wall (2).
11, and a communicating groove 26 formed corresponding to the upper wall and the lower wall to form a closed space inside the upper main body and the lower main body after being joined, and to conduct heat into the above-mentioned closed space. The working fluid capable of increasing the speed is filled, the groove is filled with the solder material, and after heating, the solder material is melted and flows into the communicating groove, whereby the solder material is mainly formed by the capillary phenomenon. It penetrates into the joint surface portion of the lower wall of the lower circumference and the four circumferences, thus easily welding the upper main body and the lower main body into one, and achieves a function with good airtightness and easy processing.
Description
【０００１】[0001]
本考案は一種の放熱装置に係り、特に、作業流体の液−気相変化と多孔構造の 毛細管現象により均一で且つ快速な放熱特性を達成し、且つその上主体と下主体 の環状の上側壁と下側壁間に連通状の凹溝が形成され、それにはんだ材料が充填 され且つ加熱後に上主体と下主体が接合され一体とされた、放熱装置に関する。 The present invention relates to a kind of heat radiating device, in particular, to achieve uniform and rapid heat radiating characteristics by a liquid-gas phase change of a working fluid and a capillary phenomenon of a porous structure, and furthermore, an annular upper wall composed of an upper main body and a lower main body. The present invention relates to a heat dissipating device in which a communicating groove is formed between an upper main body and a lower main body, and the upper main body and the lower main body are joined together after heating.
【０００２】[0002]
図１は周知の放熱装置の断面を示し、それは、放熱主体１２及び鰭片セット１ ３を具え、該放熱装置１０は電子製品１４、例えばＣＰＵ、ハードディスク或い はパワーサプライの上に設置され、この電子製品１４が作業で発生する熱エネル ギーを、銅或いはアルミ或いはその他の高い熱伝導性の金属で製造した放熱主体 １２により鰭片セット１３の正面に伝導し、さらにファン１１を利用して熱エネ ルギーを周囲の空気中に散布し、電子製品１４の作業温度を下げ、且つその使用 寿命を延長する。しかし、電子製品の作業の高速化の傾向に伴い、動作により発 生する熱エネルギーは高くなり、且つ電子製品の寸法がますます小さくなり、そ の熱エネルギーがますます集中し（即ちヒートポイントと称される）、迅速で有 効な放熱効果を達成するためには、放熱装置の寸法面積を増加し、ファンを増大 するか或いは風量を増加することが必要である。しかし、このような構造は却っ て電子製品の体積、重量、コストを増し、このようなファン及び風量を増大する 方式によると、騒音が過大となる欠点が発生し、これによりもう一つの解決の難 しい問題を形成した。 FIG. 1 shows a cross section of a known heat dissipating device, which comprises a heat dissipating body 12 and a fin set 13, the heat dissipating device 10 being mounted on an electronic product 14, such as a CPU, a hard disk or a power supply, The thermal energy generated by the operation of the electronic product 14 is conducted to the front of the fin piece set 13 by the heat radiating body 12 made of copper, aluminum or other high heat conductive metal, and furthermore, the fan 11 is used. The thermal energy is sprayed into the surrounding air to lower the working temperature of the electronic product 14 and prolong its service life. However, with the trend of faster operation of electronic products, the heat energy generated by the operation becomes higher, and the dimensions of electronic products become smaller and smaller, and the heat energy becomes more concentrated (ie, heat point and heat point). In order to achieve a rapid and effective heat dissipation effect, it is necessary to increase the dimensional area of the heat dissipation device, increase the number of fans or increase the air flow. However, such a structure rather increases the volume, weight, and cost of the electronic product, and the method of increasing the fan and the air flow has the disadvantage of generating excessive noise, which is another solution. Formed a difficult problem.
【０００３】 ゆえに、台湾特許公告第３０７８３７号（ヒートパイプ及びその製造方法）、 第４０６１８０号（板型ヒートパイプ及び該ヒートパイプを使用した冷却構造） で使用されている技術は、気−液相変化を利用して放熱目的を達成する放熱装置 であり、その放熱装置は、中空の金属底板を具え、且つ金属底板内部に気−液相 変化を行う作業流体が充填され、金属底板が電子製品に当接し、作業流体が電子 製品の発生する高熱により快速伝導を行い蒸発した後、さらに外界の空気と熱交 換を行い、このような快速熱交換技術により従来の、銅、アルミ或いはその他の 高熱伝導性金属で製造された放熱装置の発生する放熱効率不足の欠点を解決して いる。しかし、このような設計の金属底板はいずれも中空形式で設計されなけれ ば、作業流体のその内部に充填できず、ゆえに一般にメーカーは上主体と下主体 を接着して密閉空間を形成している。接着の方式は、上主体と下主体の有する環 状側壁の対応する表面で両者をはんだ付けして一体とする。しかし、直接はんだ 付けすると、上主体と下主体の対応する環状側壁がいずれも平坦な表面であり、 はんだ材料塗布の位置決めの部分がないため、はんだ材料が均一に付着しにくく 、安定してはんだ付けできず、環状下側壁に間隙表面が発生し、ゆえにこのよう な方式は大量生産及び使用時のいずれもコストを増加し或いは不良品の発生率を 増加し、ゆえに、いかに市場の要求に符合させるかが業者がいま一歩の改良を行 うべきところであった。[0003] Therefore, the technology used in Taiwan Patent Publication No. 307837 (heat pipe and its manufacturing method) and No. 406180 (plate-type heat pipe and cooling structure using the heat pipe) is based on the gas-liquid phase. A heat radiator that uses a change to achieve a heat radiation purpose. The heat radiator has a hollow metal bottom plate, and the inside of the metal bottom plate is filled with a working fluid that changes gas-liquid phase, and the metal bottom plate is an electronic product. The working fluid performs rapid conduction due to the high heat generated by the electronic product and evaporates.Then, the working fluid further exchanges heat with the outside air. With such rapid heat exchange technology, the conventional copper, aluminum or other It solves the shortcoming of the lack of heat dissipation efficiency generated by heat dissipation devices made of high thermal conductive metals. However, unless all of the metal bottom plates of such a design are designed in a hollow form, the working fluid cannot be filled into the inside, and therefore, in general, manufacturers adhere the upper body and the lower body to form a closed space. . In the bonding method, both are soldered on the corresponding surfaces of the annular side walls of the upper main body and the lower main body to be integrated. However, when directly soldered, the corresponding annular side walls of the upper and lower main bodies are both flat surfaces, and there is no positioning part for applying the solder material. In addition, such a method increases costs or increases the rate of rejection in both mass production and use, and thus meets market demands. To do so, the contractor had to make one step of improvement now.
【０００４】[0004]
本考案は上記従来の技術の欠点を解決し、上主体と下主体を簡単にはんだ付け してなる放熱装置を提供することを課題としている。 An object of the present invention is to solve the above-mentioned drawbacks of the conventional technology and to provide a heat radiating device in which an upper main body and a lower main body are easily soldered.
【０００５】 即ち、本考案の主要な目的は、作業流体の液−気相間の変化過程を利用して熱 集中現象を分散し放熱効率を増加する放熱装置を提供することにあり、この放熱 装置の上主体と下主体間に多孔構造と作業流体を充填する密閉空間が形成され、 且つ上主体と下主体の環状の上側壁と下側壁間に連通状の凹溝が形成され、それ にはんだ材料が充填され且つ加熱後に上主体と下主体が接合され一体とされた、 放熱装置であり、これにより、気密性が良好で、加工が容易な機能を達成する。[0005] That is, a main object of the present invention is to provide a heat radiating device that disperses a heat concentration phenomenon by using a change process between a liquid and a gas phase of a working fluid and increases heat radiating efficiency. A porous structure and a closed space for filling the working fluid are formed between the upper main body and the lower main body, and a communicating concave groove is formed between the upper and lower annular walls of the upper main body and the lower main body. A heat radiator in which a material is filled and an upper main body and a lower main body are joined and integrated after heating, thereby achieving a function with good airtightness and easy processing.
【０００６】[0006]
請求項１の考案は、放熱装置において、 上主体と下主体とされ、上主体の環状側壁と下主体の環状側壁の内部が密閉空 間とされ、上主体の上側壁と下主体の下側壁の対応接合部分に連通状の凹溝が形 成され、この凹溝にはんだ材料が充填され上主体と下主体がはんだ付けされて一 体とされた、上記上主体と下主体と、 該上主体と下主体の密閉空間内に充填される作業流体と、 多孔構造とされ、上主体と下主体の密閉空間の内部表面に設けられて熱伝導速 度と作業流体の蒸気の吸着を増加する、上記多孔構造と、 を具えたことを特徴とする、放熱装置としている。 請求項２の考案は、前記上主体と下主体の間に形成される凹溝が上主体の上側 壁と下主体の下側壁の対応し当接する表面部分に凹設されたことを特徴とする、 請求項１に記載の放熱装置としている。 請求項３の考案は、前記多孔構造が金属粉末を上主体と下主体の内部表面にお いて焼結し、且つ金属粉末を真空或いは還元気体或いは慣性気体環境下で焼結し てなり、該金属粉末が、銅粉、ニッケル粉、銀粉、及びその混合物或いは合金粉 末のいずれかで組成されたことを特徴とする、請求項１に記載の放熱装置として いる。 請求項４の考案は、前記多孔構造が上主体と下主体の内部表面を粗くして形成 されたことを特徴とする、請求項１に記載の放熱装置としている。 請求項５の考案は、前記上主体と下主体の一側辺にバキュームパイプが設置さ れ、且つバキュームパイプの一端と放熱装置内部の密閉空間が連通し、別端が密 閉状態とされたことを特徴とする、請求項１に記載の放熱装置としている。 請求項６の考案は、前記上主体と下主体の一側辺に中空管柱が設置され、且つ 該中空管柱の二端が放熱装置内部の密閉空間と連通することを特徴とする、請求 項１に記載の放熱装置としている。 請求項７の考案は、前記上主体と下主体が銅、アルミ或いはその合金のいずれ かで形成されたことを特徴とする、請求項１に記載の放熱装置としている。 The invention according to claim 1 is the heat radiating device, wherein the upper main body and the lower main body are made into a closed space, the upper main body annular side wall and the lower main body annular side wall are closed, and the upper main body upper side wall and the lower main body lower side wall. A communicating groove is formed in a corresponding joint portion of the upper body, the upper body, the lower body, and the upper body, which are filled with a solder material, and the upper body and the lower body are soldered together. The working fluid filled in the enclosed space between the main and lower bodies, and the porous structure, which is provided on the inner surface of the closed space between the upper and lower bodies to increase the heat transfer rate and the adsorption of the vapor of the working fluid , The above-mentioned porous structure, and a heat radiating device. The invention of claim 2 is characterized in that the concave groove formed between the upper main body and the lower main body is recessed in the corresponding surface portions of the upper wall of the upper main body and the lower wall of the lower main body. A heat dissipation device according to claim 1. According to a third aspect of the present invention, the porous structure comprises sintering the metal powder on the inner surface of the upper main body and the lower main body, and sintering the metal powder in a vacuum or a reducing gas or inert gas environment. 2. The heat radiating device according to claim 1, wherein the metal powder is composed of one of copper powder, nickel powder, silver powder, and a mixture or alloy powder thereof. The invention according to claim 4 is the heat radiating device according to claim 1, wherein the porous structure is formed by roughening the inner surfaces of the upper main body and the lower main body. In the invention of claim 5, a vacuum pipe is installed on one side of the upper main body and the lower main body, one end of the vacuum pipe communicates with a closed space inside the heat radiating device, and the other end is closed. The heat radiating device according to claim 1, wherein: The invention according to claim 6 is characterized in that a hollow tube is installed on one side of the upper body and the lower body, and two ends of the hollow tube communicate with a closed space inside the heat radiating device. The heat dissipation device according to claim 1. The invention according to claim 7 is the heat radiating device according to claim 1, wherein the upper main body and the lower main body are formed of one of copper, aluminum, and an alloy thereof.
【０００７】[0007]
図２、３を参照されたい。本考案の放熱装置２０は、伝熱しやすい金属材料（ 例えば、銀、銅、アルミ及びその合金等）で製造され、この放熱装置２０は上主 体２２と下主体２１で組成され、放熱装置２０内部に密閉空間が形成され、該放 熱装置２０が吸熱面２１３で電子製品１４の上に緊密に当接し、並びに放熱面２ ２３で熱エネルギーを空気中に伝導し、該電子製品１４の作業時に発生する熱エ ネルギーを排除する。本実施例中の電子製品１４はＣＰＵとされ、別に上述の放 熱装置２０は密閉空間を具え、その密閉空間内部に多孔構造２４と作業流体２３ が設けられ、上述の多孔構造２４は金属粉末（銅粉、ニッケル粉、銀粉、及びそ の混合物或いは合金粉等）を放熱装置２０の密閉空間内部で焼結するか或いは該 密閉空間内部の表面を粗化して形成され、その目的は、熱伝導の面積を増加する ことにあり、毛細管現象を利用して作業流体２３の発生する蒸気を吸着し、作業 流体２３の気−液相変化の循環使用を加速する。 Please refer to FIGS. The heat dissipating device 20 of the present invention is made of a metal material (for example, silver, copper, aluminum and its alloys) that easily conducts heat. The heat dissipating device 20 is composed of an upper main body 22 and a lower main body 21. An enclosed space is formed therein, and the heat dissipation device 20 closely contacts the electronic product 14 at the heat absorption surface 213, and conducts heat energy to the air at the heat dissipation surface 223 to operate the electronic product 14. Eliminates heat energy that is sometimes generated. In the present embodiment, the electronic product 14 is a CPU, and the above-mentioned heat radiation device 20 is provided with a closed space, and a porous structure 24 and a working fluid 23 are provided in the closed space. (Copper powder, nickel powder, silver powder, and mixtures or alloy powders thereof) are formed by sintering or roughening the surface of the enclosed space of the heat radiating device 20. The purpose of the present invention is to increase the area of conduction, so that the vapor generated by the working fluid 23 is adsorbed by utilizing the capillary phenomenon, and the circulating use of the gas-liquid phase change of the working fluid 23 is accelerated.
【０００８】 上述の多孔構造２４は金属粉末を焼結してなり、即ち焼結された金属粉末の半 径は以下の公式により獲得される。 １．ｒc ＝（４σ／△Ｐ）ｃｏｓγ／２ ｒc ：有効孔径（ｒａｄｉｕｓ ｏｆ ｃａｐｉｌｌａｒｙ） σ： 表面張力係数（ｓｕｒｆａｃｅ ｔｅｎｓｉｏｎ ｃｏｅｆｆｉｃ ｉｅｎｔ） △Ｐ： 毛細管作用力（ｐｒｅｓｓｕｒｅ ｄｒｏｐ‘ γ： 湿潤角（ｗｅｔｔｉｎｇ ａｎｇｌｅ） ２．ｒ＝ｒc ／ｃ（ｃは常数、それは焼結の金属粉末の形状により定められ、 一般には０．４１とされる） ｒ： 金属粉末半径（ｒａｄｉｕｓ ｏｆ ｐｏｗｄｅｒ）The above-described porous structure 24 is made by sintering a metal powder, that is, the radius of the sintered metal powder is obtained by the following formula. 1. r c = (4σ / △ P) cos γ / 2 r c : effective pore diameter σ: surface tension coefficient ΔP: capillary action force (wet angle) ) 2.r = r c / c ( c is constant, it is defined by the shape of the metal powder sintering, typically it is 0.41) r: metal powder radius (radius of powder)
【０００９】 さらに、その下主体２１に設置される多孔構造２４は電子製品１４の発生する 熱エネルギーを快速且つ均一に作業流体２３に伝導し、この焼結された金属粉末 は作業流体２３に容易に核沸騰する特性を持たせる。また、該多孔構造２４の厚 さは焼結された金属粉末の半径の２〜１０倍とされ、作業流体２３の充填量は金 属粉末孔率の０．５〜２倍とされる。このほか、該作業流体２３は潜熱が高く且 つ沸点の低い液体、例えば、水、エタノール、アセトン或いは冷媒で組成され、 多孔構造２４は放熱面積を増加して熱量交換を加速し、並びに毛細管現象を利用 し蒸発した作業流体２３を吸着し、さらに冷却して下主体２１の上表面に流して 戻す。Further, the porous structure 24 installed in the lower main body 21 quickly and uniformly conducts the heat energy generated by the electronic product 14 to the working fluid 23, and the sintered metal powder is easily transferred to the working fluid 23. Has the characteristic of nucleate boiling. The thickness of the porous structure 24 is 2 to 10 times the radius of the sintered metal powder, and the filling amount of the working fluid 23 is 0.5 to 2 times the metal powder porosity. In addition, the working fluid 23 is composed of a liquid having a high latent heat and a low boiling point, for example, water, ethanol, acetone, or a refrigerant. The porous structure 24 increases the heat radiation area to accelerate heat exchange, and also causes capillary action. The evaporating working fluid 23 is adsorbed by using the liquid, and is further cooled and flown back to the upper surface of the lower main body 21.
【００１０】 上述の放熱装置２０中、上主体２２と下主体２１の間の環状側壁は上側壁２２ １と下側壁２１１を含み、上主体２２の下表面と下主体２１の上表面の指示構造 は、少なくとも一つの第１支持部２２２と少なくとも一つの第２支持部２１２を 含み、上側壁２２１が下側壁２１１に対応しはんだ付けされ、且つ第１支持部２ ２２が第２支持部２１２に対応し且つ当接し、これにより本考案の放熱装置２０ の密閉空間構造が強化される。別に、第１支持部２２２、第２支持部２１２にも 多孔構造２４が設けられることにより、全体の放熱面積が増加される。このほか 、電子製品１４の作業時に発生する熱エネルギーが直接吸熱面２１３より作業流 体２３中に伝導される。別にその第１支持部２２２、第２支持部２１２は多孔性 材質とされ得て、且つ第１支持部２２２、第２支持部２１２の表面の該多孔構造 ２４に被覆される部分が、作業流体２３の蒸気を容易に凝結させ並びにその相変 化の循環を加速される機能を有する。ゆえに、上述の多孔構造２４は必ずしも均 一に第１支持部２２２、第２支持部２１２の表面を被覆せず、該作業流体２３の 相変化の状況及び放熱装置２０の密閉空間構造の必要な強度により定められる。 一般には、作業流体２３の蒸気の最も密集する或いは温度が最高の部分は、その 多孔構造２４の空孔率が比較的高い。In the above-described heat radiating device 20, the annular side wall between the upper main body 22 and the lower main body 21 includes the upper side wall 221 and the lower side wall 211, and the pointing structure of the lower surface of the upper main body 22 and the upper surface of the lower main body 21. Includes at least one first support part 222 and at least one second support part 212, the upper side wall 221 is soldered corresponding to the lower side wall 211, and the first support part 222 is connected to the second support part 212. The corresponding and abutting, thereby strengthening the closed space structure of the heat radiating device 20 of the present invention. Separately, the porous structure 24 is also provided on the first support portion 222 and the second support portion 212, so that the entire heat dissipation area is increased. In addition, the heat energy generated during the operation of the electronic product 14 is directly transmitted from the heat absorbing surface 213 into the working fluid 23. Alternatively, the first support portion 222 and the second support portion 212 can be made of a porous material, and the portions of the surfaces of the first support portion 222 and the second support portion 212 which are covered with the porous structure 24 are working fluids. It has the function of easily condensing the 23 vapors and accelerating the circulation of the phase change. Therefore, the above-described porous structure 24 does not necessarily cover the surfaces of the first support portion 222 and the second support portion 212 uniformly, and the state of the phase change of the working fluid 23 and the necessity of the closed space structure of the heat dissipation device 20 are required. Determined by strength. Generally, the most dense or hottest portion of the working fluid 23 vapor has a relatively high porosity in the porous structure 24.
【００１１】 下側壁２１１と上側壁２２１の周縁表面に対応して連通状の凹溝２６が設けら れ、この連通状の凹溝２６がはんだ材料２５（例えば銀ベース、銅ベース、ニッ ケルベース或いは錫ベースのはんだ材料）をその内部に収容し、上主体２２と下 主体２１が密着し且つ加熱された後、はんだ材料２５が溶融し、該連通状の凹溝 ２６内に流入し、毛細管現象によりはんだ材料２５が下側壁２１１と上側壁２２ １の接合面部分にしみ込み、上主体２２と下主体２１がはんだ付けされて一体と なり、該放熱装置２０がしっかりと成形されるが、放熱装置２０の密閉空間内部 で金属粉末を焼結したい時は高温下で行う必要があり、金属粉末或いは放熱装置 ２０が高温下で非常に容易に酸化物を形成し、ゆえに、本考案はさらに真空にあ って、気体（例えば水素ガス）を還元するか、或いは慣性ガス（例えば窒素ガス 或いはアルゴンガス）環境下で焼結して得られる。A communicating groove 26 is provided corresponding to the peripheral surfaces of the lower wall 211 and the upper wall 221, and the communicating groove 26 is formed of a solder material 25 (for example, a silver base, a copper base, a nickel base or After the upper main body 22 and the lower main body 21 are brought into close contact with each other and heated, the solder material 25 is melted, flows into the communicating concave groove 26, and causes a capillary phenomenon. As a result, the solder material 25 penetrates into the joint surface between the lower wall 211 and the upper wall 221, and the upper main body 22 and the lower main body 21 are soldered together to form the heat radiating device 20 firmly. If it is desired to sinter the metal powder inside the enclosed space of the device 20, it must be performed at a high temperature, and the metal powder or the heat radiating device 20 very easily forms an oxide at a high temperature. In (Eg, hydrogen gas) or by sintering in an inert gas (eg, nitrogen gas or argon gas) environment.
【００１２】 さらに、図２、３、４に示されるように、上主体２２と下主体２１が結合され た後、必ず先に作業流体２３を放熱装置２０の密閉空間内部に注入し、さらにバ キュームパイプ２７を利用し、放熱装置２０内部の空気を抽出し、その内部の真 空状態に接近させ、該作業流体２３の沸点を下げ、且つその液−気相間の変換を 加速する。放熱装置２０内部に近似真空状態が形成されるのを待って、バキュー ムパイプ２７を密封し、さらに余分のバキュームパイプ２７を切除する。Further, as shown in FIGS. 2, 3, and 4, after the upper main body 22 and the lower main body 21 are connected, the working fluid 23 is always injected into the closed space of the heat radiating device 20 first. The air inside the heat radiating device 20 is extracted using the vacuum pipe 27, and the air inside the heat radiating device 20 is brought close to the vacuum state therein, the boiling point of the working fluid 23 is lowered, and the conversion between the liquid and the gas phase is accelerated. After the approximate vacuum state is formed inside the heat radiating device 20, the vacuum pipe 27 is sealed, and the extra vacuum pipe 27 is cut off.
【００１３】 以下に、本考案の放熱装置２０がいかに放熱を加速するかのメカニズムについ て説明を行う。まず、吸熱面２１３と電子製品１４の接触を利用し、その熱エネ ルギーを放熱装置２０の作業流体２３に伝導し、即ちいわゆる蒸発端であり、作 業流体２３は熱エネルギー伝導により徐々に温度を上昇させ蒸発する。本考案の 放熱装置２０の内部は真空状態に接近し、作業流体２３の沸点は常圧下より低く 、そのうち、該放熱装置２０の内部圧力は１００ｔｏｒｒから１０−３ｔｏｒｒ の間とされる。水であれば、圧力が７６０ｔｏｒｒ（−大気圧）である時、その 沸点は１００℃で、圧力が５５ｔｏｒｒに下がると、その沸点は４０℃に下がる 。このため、該放熱装置２０内部の圧力が下がると、作業流体２３の蒸発速度が 加速する。作業流体２３が蒸発した後、その蒸気は上主体２２の上部に到達し（ 図３の中空矢印に示されるとおり）、さらに液体の潜熱現象により熱エネルギー が放熱面２２３に伝導され、更に熱エネルギーが空気中に伝導されて降温の目的 を達成する。別に、作業流体２３の蒸気が潜熱現象により凝結し液体となり、そ のうち、大部分の作業流体２３の蒸気は多孔構造２４の毛細管現象により吸着さ れ、並びに冷却されて蒸発端に戻り、図３に示される実心矢印のように、少部分 の冷却した作業流体２３が第２支持部２１２、第１支持部２２２に沿って流れ落 ち、こうして、有効に放熱装置２０の温度が最高の中間部分の熱エネルギーを空 気中に伝導する。ゆえに、本考案は作業流体２３の気−液相変換の循環により、 電子製品１４の迅速な放熱の目的を達成する。Hereinafter, a mechanism of how the heat radiating device 20 of the present invention accelerates heat radiation will be described. First, utilizing the contact between the heat absorbing surface 213 and the electronic product 14, the thermal energy is transmitted to the working fluid 23 of the heat radiating device 20, that is, a so-called evaporating end. And evaporate. The inside of the heat radiating device 20 of the present invention approaches the vacuum state, and the boiling point of the working fluid 23 is lower than the normal pressure, wherein the internal pressure of the heat radiating device 20 is between 100 torr and 10-3 torr. For water, when the pressure is 760 torr (-atmospheric pressure), its boiling point is 100 ° C., and when the pressure is reduced to 55 torr, its boiling point is reduced to 40 ° C. Therefore, when the pressure inside the heat radiating device 20 decreases, the evaporation rate of the working fluid 23 increases. After the working fluid 23 evaporates, the vapor reaches the upper part of the upper main body 22 (as shown by the hollow arrow in FIG. 3), and the thermal energy is further transmitted to the heat radiation surface 223 by the latent heat phenomenon of the liquid, and the thermal energy is further increased. Is conducted into the air to achieve the purpose of cooling. Separately, the vapor of the working fluid 23 condenses into a liquid due to the latent heat phenomenon, and most of the vapor of the working fluid 23 is adsorbed by the capillary action of the porous structure 24, and is cooled and returned to the evaporation end. 3, a small portion of the cooled working fluid 23 flows down along the second support portion 212 and the first support portion 222, and thus the temperature of the heat radiating device 20 is effectively maximized. Conducts heat energy in the middle to the air. Therefore, the present invention achieves the purpose of rapid heat dissipation of the electronic product 14 by circulating the gas-liquid phase conversion of the working fluid 23.
【００１４】 図５、６に示されるのは、本考案の別の実施例の放熱装置の断面図である。そ の放熱装置２０はさらに鰭片セット３８とファン４１を具えて放熱効率を増加し ている。本実施例では、該ファン４１は鰭片セット３８の上方に設置されて、放 熱装置２０が鰭片セット３８に伝導する熱エネルギーは直接空気中に伝導され、 該鰭片セット３８ははんだ材料例えば銀ベースはんだ材料により放熱面２２３の 上表面に固着される。FIGS. 5 and 6 are cross-sectional views of a heat radiating device according to another embodiment of the present invention. The heat dissipation device 20 further includes a fin piece set 38 and a fan 41 to increase the heat dissipation efficiency. In this embodiment, the fan 41 is installed above the fin set 38, and the heat energy transmitted from the heat radiating device 20 to the fin set 38 is directly conducted into the air. For example, it is fixed to the upper surface of the heat dissipation surface 223 by a silver-based solder material.
【００１５】 図７に示されるのは本考案の第３実施例の断面図であり、該放熱装置１１０の 一側辺にＵ形の中空管柱１１１が設けられ、該中空管柱１１１の二端が該放熱装 置１１０の密閉空間内部と連通し、こうして、作業流体の蒸気が中空管柱１１１ 中に進入し、並びに冷却されて該放熱装置１１０の密閉空間内部に流れて戻る。 さらに、該中空管柱１１１の上方或いは下方にファン（図示せず）を設置可能で 、それにより作業流体の冷却を加速できる。FIG. 7 is a sectional view of a third embodiment of the present invention, in which a U-shaped hollow tubular column 111 is provided on one side of the heat radiating device 110, and the hollow tubular column 111 is provided. The two ends communicate with the inside of the enclosed space of the heat radiating device 110, so that the vapor of the working fluid enters the hollow tube column 111, and is cooled and flows back into the inside of the enclosed space of the heat radiating device 110. . Further, a fan (not shown) can be installed above or below the hollow tube post 111, thereby accelerating the cooling of the working fluid.
【００１６】[0016]
総合すると、本考案の放熱装置は使用時に、確実にその機能と目的を達成し、 ゆえに本考案は実用性に優れた考案であり、実用新案登録の要件を具備している 。なお、本考案に基づきなしうる細部の修飾或いは改変は、いずれも本考案の請 求範囲に属するものとする。 Taken together, the heat radiator of the present invention reliably achieves its function and purpose at the time of use, and therefore the present invention is a device with excellent practicality and has the requirements for registration of a utility model. Any modification or alteration of details that can be made based on the present invention shall fall within the scope of the present invention.
【図１】周知の放熱装置の断面図である。FIG. 1 is a cross-sectional view of a known heat dissipation device.
【図２】本考案の実施例の断面図である。FIG. 2 is a sectional view of the embodiment of the present invention.
【図３】本考案の実施例の断面図である。FIG. 3 is a sectional view of the embodiment of the present invention.
【図４】本考案の実施例の斜視図である。FIG. 4 is a perspective view of the embodiment of the present invention.
【図５】本考案のもう一つの実施例の断面図である。FIG. 5 is a cross-sectional view of another embodiment of the present invention.
【図６】本考案のさらにもう一つの実施例の放熱装置の
斜視図である。FIG. 6 is a perspective view of a heat radiating device according to still another embodiment of the present invention.
【図７】本考案の第３実施例の放熱装置の斜視図であ
る。FIG. 7 is a perspective view of a heat radiating device according to a third embodiment of the present invention.
１０ 放熱装置 １１ ファン １３ 鰭片セ
ット １２ 放熱主体 １４ 電子製
品 ２０ 放熱装置 ２１ 下主体 ２２３ 放熱
面 ２１１ 下側壁 ２３ 作業流
体 ２２２ 第１支持部 ２１２ 第２
支持部 ２４ 多孔構造 ２５ はんだ
材料 ２６ 凹溝 ２２１ 上側
壁 ２２ 上主体 ３１ ファン ３２ はんだ
材料 ３８ 鰭片セット １１０ 放熱
装置 １１１ 中空管柱 ２７ バキュ
ームパイプDESCRIPTION OF SYMBOLS 10 Heat dissipation device 11 Fan 13 Fin piece set 12 Heat dissipation body 14 Electronic product 20 Heat dissipation device 21 Lower body 223 Heat dissipation surface 211 Lower side wall 23 Working fluid 222 First support part 212 Second
Supporting part 24 Porous structure 25 Solder material 26 Concave groove 221 Upper side wall 22 Upper main body 31 Fan 32 Solder material 38 Fin piece set 110 Heat dissipating device 111 Hollow tube column 27 Vacuum pipe
Claims (7)
状側壁の内部が密閉空間とされ、上主体の上側壁と下主
体の下側壁の対応接合部分に連通状の凹溝が形成され、
この凹溝にはんだ材料が充填され上主体と下主体がはん
だ付けされて一体とされた、上記上主体と下主体と、 該上主体と下主体の密閉空間内に充填される作業流体
と、 多孔構造とされ、上主体と下主体の密閉空間の内部表面
に設けられて熱伝導速度と作業流体の蒸気の吸着を増加
する、上記多孔構造と、 を具えたことを特徴とする、放熱装置。1. A heat dissipating device comprising: an upper main body and a lower main body; an inner space of the upper main body annular side wall and a lower main body annular side wall serving as a sealed space; A communicating groove is formed in the part,
An upper main body and a lower main body, the upper main body and the lower main body being integrated by soldering and filling the concave groove with a solder material; A heat dissipating device, characterized in that the heat dissipating device has a porous structure and is provided on an inner surface of a closed space between the upper main body and the lower main body and increases heat conduction speed and adsorption of vapor of a working fluid. .
溝が上主体の上側壁と下主体の下側壁の対応し当接する
表面部分に凹設されたことを特徴とする、請求項１に記
載の放熱装置。2. The method according to claim 1, wherein the recess formed between the upper main body and the lower main body is formed in a corresponding surface portion of the upper side wall of the upper main body and the lower side wall of the lower main body. Item 2. A heat dissipation device according to Item 1.
体の内部表面において焼結し、且つ金属粉末を真空或い
は還元気体或いは慣性気体環境下で焼結してなり、該金
属粉末が、銅粉、ニッケル粉、銀粉、及びその混合物或
いは合金粉末のいずれかで組成されたことを特徴とす
る、請求項１に記載の放熱装置。3. The porous structure comprises sintering a metal powder on the inner surface of an upper main body and a lower main body, and sintering the metal powder in a vacuum or a reducing gas or inert gas environment. The heat radiator according to claim 1, wherein the heat radiator is made of one of copper powder, nickel powder, silver powder, and a mixture or alloy powder thereof.
面を粗くして形成されたことを特徴とする、請求項１に
記載の放熱装置。4. The heat dissipation device according to claim 1, wherein the porous structure is formed by roughening the inner surfaces of an upper main body and a lower main body.
ムパイプが設置され、且つバキュームパイプの一端と放
熱装置内部の密閉空間が連通し、別端が密閉状態とされ
たことを特徴とする、請求項１に記載の放熱装置。5. A vacuum pipe is installed on one side of the upper main body and the lower main body, one end of the vacuum pipe communicates with a closed space inside the heat radiating device, and another end is closed. The heat radiating device according to claim 1, wherein
が設置され、且つ該中空管柱の二端が放熱装置内部の密
閉空間と連通することを特徴とする、請求項１に記載の
放熱装置。6. A hollow tube column is provided on one side of the upper main body and the lower main body, and two ends of the hollow column communicate with a closed space inside the heat dissipation device. Item 2. A heat dissipation device according to Item 1.
その合金のいずれかで形成されたことを特徴とする、請
求項１に記載の放熱装置。7. The heat radiating device according to claim 1, wherein the upper main body and the lower main body are formed of one of copper, aluminum, and an alloy thereof.
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|---|---|---|---|
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001007938U JP3086493U (en) | 2001-12-06 | 2001-12-06 | Heat dissipation device |
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| Publication Number | Publication Date |
|---|---|
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014045714A1 (en) * | 2012-09-19 | 2014-03-27 | 日本電気株式会社 | Cooling device, heat reception unit and boiling unit used therein, and method for manufacturing same |
| CN104976910A (en) * | 2014-04-14 | 2015-10-14 | 金兴倍 | Vapor Chamber with Structure having capillary force |
| KR20200048804A (en) * | 2018-10-30 | 2020-05-08 | 조인셋 주식회사 | Vapor chamber |
-
2001
- 2001-12-06 JP JP2001007938U patent/JP3086493U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014045714A1 (en) * | 2012-09-19 | 2014-03-27 | 日本電気株式会社 | Cooling device, heat reception unit and boiling unit used therein, and method for manufacturing same |
| EP2899753A1 (en) * | 2012-09-19 | 2015-07-29 | Nec Corporation | Cooling device, heat reception unit and boiling unit used therein, and method for manufacturing same |
| EP2899753A4 (en) * | 2012-09-19 | 2016-06-15 | Nec Corp | Cooling device, heat reception unit and boiling unit used therein, and method for manufacturing same |
| US9696068B2 (en) | 2012-09-19 | 2017-07-04 | Nec Corporation | Cooling apparatus, heat receiving section and boiling section used therein, and method of manufacturing the same |
| JP2018115858A (en) * | 2012-09-19 | 2018-07-26 | 日本電気株式会社 | Cooling device, heat receiving part and ebullition part for use therein, and method for producing the same |
| CN104976910A (en) * | 2014-04-14 | 2015-10-14 | 金兴倍 | Vapor Chamber with Structure having capillary force |
| KR20200048804A (en) * | 2018-10-30 | 2020-05-08 | 조인셋 주식회사 | Vapor chamber |
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