JP3085902B2 - Contactless module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module used for an IC card or the like, and more particularly, to a non-contact type IC module for exchanging data between an IC card and a host computer by using inductive coupling by a coil. The present invention relates to an IC module for an IC card.

[0002]

2. Description of the Related Art At present, magnetic cards for storing a part of data of a computer are used in a very large number. In place of the magnetic cards, use of IC cards having an increased data storage amount is increasing. As an example of this IC card, there is a standardized card having a thickness of 0.76 mm, a width of 54 mm and a length of 85 mm.

In many cases, this IC card has a circuit board such as a memory and a microprocessor mounted inside a plate made of a synthetic resin having a predetermined size.
The C chip is embedded, and the back surface of the IC chip substrate on which the contacts are formed is exposed on the back surface of the IC card. When the IC card is inserted into the card reader, the contacts exposed on the back of the IC card come into contact with the contacts of the card reader, thereby exchanging data between the IC card and the host computer. Was.

In recent years, when an IC chip and a coil are embedded in an IC card and an antenna connected to a host computer via an interface and the IC card are brought close to each other, the embedded coil in the IC card is removed. A non-contact type IC card that enables data communication by electromagnetic induction with an antenna connected to a host computer has also been used.

[0005] This non-contact type IC card is extremely useful because data can be exchanged only by bringing the IC card close to the card reader. As shown in FIG. 4, an example of a contactless module to be embedded in this non-contact type IC card is an IC in which electronic components 13 such as a microprocessor, a memory, and a capacitor are fixed.
In many cases, the coil 21 is arranged around the C substrate 11 so that the IC substrate 11 and the coil 21 are integrated.

As shown in FIG. 5, the coil 21 is usually made of a conductive wire having a diameter of about 100 μm and coated with an insulating coating. As shown in FIG. The coil 21 is wound so as to have a thickness of about 400 μm and is formed into a disk shape, and has an inner peripheral end 23 at the beginning of winding and an outer peripheral end 25 at the end of winding. is there.

The coil 21 is formed by melting a coating resin provided on the outer peripheral surface of the insulating garment by heat treatment, and fixing the adjacent conductive wires to each other to form a thin disk-shaped coil 21 having a retaining shape. It is. And this coil 21
The IC board 11 on which the electronic components 13 such as IC chips and capacitors are fixed is inserted into the internal space 27 of
The inner peripheral end 23 and the outer peripheral end 25 of the coil 21 are connected to the connection portion 15 of the IC substrate 11.

The inner peripheral end 23 and the outer peripheral end 25 of the coil 21
As shown in FIG. 5, the connection between the coil and the IC substrate 11 uses a disc-shaped adhesive tape 39 having an outer diameter larger than the diameter of the internal space 27 which is the inner diameter of the coil body. As shown in FIG. 6, the IC substrate 11 is fixed to the center of the adhesive tape 39, and the peripheral portion of the adhesive tape 39 is adhered to the lower surface of the coil 21 so that the coil 21 and the IC substrate 11 are integrated.
The inner peripheral end 23 and the outer peripheral end 25 of the IC 21
To the inner peripheral end 23 and outer peripheral end of the coil 21
25 is connected to the IC substrate 11.

Furthermore, the inner peripheral end 23 and the outer peripheral end of the coil 21
After bonding 25 to the connection portion 15 of the IC substrate 11, the sealing resin 31 is filled in the internal space 27 of the coil 21 to protect the electronic component 13 fixed on the upper surface of the IC substrate 11,
The IC substrate 11 and the coil 21 are surely integrated. Then, after the IC substrate 11 and the coil 21 are integrated with the sealing resin 31, the adhesive tape 39 is peeled off to form a thin disk-shaped contactless module 10 having a flat upper and lower surfaces. It is.

In manufacturing the contactless module 10, as shown in FIG. 7, a band-shaped adhesive tape 39 is used, and the coil 21 is adhered to the adhesive tape 39. The IC substrate 11 is also fixed to the adhesive tape 39 so that the substrate 11 is positioned, and the inner peripheral end 23 and the outer peripheral end 25 of the coil 21 are bonded to the connection portion 15 of the IC substrate 11 and the sealing resin 31 is filled. Is performed, and I is
When embedding the contactless module 10 in which the C substrate 11 and the coil 21 are integrated into an IC card or the like, there is also one that is used by peeling off the thin-plate contactless module 10 from the adhesive tape 39 (for example, JP-A-2-220896).

[0011]

In a contactless module used for an IC card or the like, since the thickness of the IC card is specified to be about 760 microns, the thickness of the module is limited to about 400 to 500 microns. It is also required that the upper and lower surfaces of the contactless module be flat.

For this reason, in a contactless module, an extremely thin conductor is used as a conductor for forming a coil in order to make the entire module including the coil thinner.
Then, in order to connect the outer peripheral end of the coil to the connection portion of the IC board, to pull out the outer peripheral end of the coil from the outer peripheral portion of the coil to the internal space, when the upper end of the coil body is traversed, the outer peripheral end becomes It protruded from the upper surface of the coil, and an external force was likely to be applied to the outer peripheral end portion in the subsequent handling of the module, and there was a high risk of disconnection. Further, if a disconnection occurs, data communication between the contactless module and the host computer cannot be performed. Therefore, handling this module until embedding it in an IC card or the like requires careful handling of the module so as not to cause disconnection. However, it is difficult to handle the contactless module.

[0013]

According to the present invention, there is provided an IC substrate having an IC chip thinner than a coil and having a connection point with the coil formed on an upper surface, and a thin sheet adhered to the back surface of the IC substrate. The outer shape of the sheet is substantially equal to the outer shape of the coil, a flat coil is adhered to the upper surface of the sheet, and the outer peripheral end located at the outer periphery of the coil is sandwiched between the coil and the sheet. The outer peripheral end of the coil and the inner peripheral end located on the inner periphery of the coil are connected to the connection point of the IC substrate by drawing the portion into the internal space of the coil, and the sealing resin is filled in the internal space of the coil. The upper surface of the sealing resin is made substantially flush with the upper surface of the coil.

As described above, according to the present invention, since the outer peripheral end of the coil is sandwiched between the coil and the sheet, the outer peripheral end of the conductor traversing the coil body can be protected by covering it with the sheet.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the embodiment of the contactless module according to the present invention, as shown in FIG. 1, a sheet 35 is adhered to the entire back surface of the contactless module 10. The sheet 35 to be adhered to the back surface of the contactless module 10 has an outer shape substantially matching the outer shape of the coil 21 and is made of a synthetic resin sheet such as a thin polyester sheet having a thickness of about 10 to several tens of microns. 35 is used.

The IC substrate 11 is bonded and fixed to the center of the upper surface of the sheet 35, and the coil 21 is further bonded and fixed to the upper surface of the sheet 35. Then, the inner peripheral end 23 of the coil 21
Is projected into the internal space 27 of the coil 21 and bonded to the connection portion 15 of the IC substrate 11, and the outer peripheral end 25 of the coil 21 is
Is drawn out into the internal space 27 of the coil 21 between the coil 21 and the sheet 35, and is bonded to the connection portion 15 of the IC substrate 11 located in the internal space 27.

Incidentally, an IC substrate to be bonded and fixed to the sheet 35
Reference numeral 11 denotes a substrate of a chip which is formed as an IC chip for an IC card having a flat surface on the lower surface and a connection portion 15 for the electronic component 13 and the coil 21 formed on the upper surface.
It is formed as a micron to about 300 microns. When the IC substrate 11 is bonded and fixed to the center of the sheet 35, the sheet 35 and the IC substrate 11 are integrated by bonding the electronic component 13 and the connecting portion 15 to the upper surface and the lower surface to the sheet 35.

The contactless module 10
As in the prior art, a wire having a diameter of about 100 μm coated with an insulating coating is used as the coil 21, and the inner diameter of the coil body is set to a size that can accommodate the IC substrate 11.
Is formed from the inner peripheral end portion 23, the thickness is about 400 μm to 500 μm, and the coil 21 is formed into a plate shape having an appropriate outer shape by a required number of windings, and the outer peripheral end portion 25 is drawn out from the outer periphery. It is used.

Further, when the sheet 35 and the coil 21 are integrated, the outer peripheral end 25 of the coil 21 is traversed under the coil main body so that the outer peripheral end 25 is located at the center of the coil 21 so that the outer peripheral end 25 is formed inside. The sheet 35 is pulled out into the space 27, and the sheet 35 is positioned so as to cover the outer peripheral end 25 crossing the coil 21.
By adhering and fixing the coil 21, the outer peripheral end 25 is sandwiched between the sheet 35 and the coil 21.

The inner peripheral end 23 of the coil 21 drawn into the inner space 27 of the coil 21 and the outer peripheral end of the coil 21 drawn from the outer periphery of the coil body into the inner space 27 of the coil 21
25 is bonded to the connection portion 15 of the IC substrate 11, and
Sealing resin in the internal space 27 of the coil 21 where the C substrate 11 is located
The electronic component 13, the inner peripheral end 23, and the outer peripheral end 25 are sealed by filling the sealing resin 31 so that the upper surface of the sealing resin 31 is aligned with the upper surface of the coil body.

As described above, the outer peripheral end 25 of the coil 21 is sandwiched between the sheet 35 and the coil 21, pulled out from the outer periphery of the coil 21 into the internal space 27, and the sealing resin is inserted into the internal space 27 into which the IC substrate 11 is inserted. Because of the filling of 31, the top surface of this contactless module 10 can be substantially complete, as shown in FIGS. As shown in FIG. 3, the lower surface of the contactless module 10 has a projecting portion 37 in which the position of the outer peripheral end 25 of the coil 21 traversing the coil 21 slightly swells.
However, the surface is covered with the sheet 35 and can be a relatively smooth plane.

The sheet 35 has a thickness of 1
By using a film sheet 35 of a synthetic resin such as polyester having a thickness of about 0 to 20 or 30 microns, the outer peripheral end 25 of the coil 21 traversing the coil body is protected while keeping the thickness of the contactless module 10 thin. Thus, handling of the module 10 can be facilitated.

The contactless module 10 shown in FIG. 1 and the like is a disc-shaped contactless module 10 having a circular outer shape of the coil 21, but a flat contactless module 10 having a rectangular coil 21. Similarly, if the coil 35 is drawn into the internal space 27 so as to sandwich the outer peripheral end 25 of the coil 21 between the sheet 35 and the coil body,
The contactless module 10 can be easily handled without causing disconnection.

[0024]

According to the present invention, an IC board on which electronic components are mounted and a flat coil arranged around the IC board are bonded to the same surface of the sheet using a thin sheet substantially equal to the outer shape of the contactless module. Since the outer peripheral end of the coil is drawn out into the internal space with the outer peripheral end of the coil sandwiched between the coil and the sheet, the outer peripheral end of the coil crossing the coil is covered with a sheet to protect the outer peripheral end. The present invention eliminates the risk of damaging a thin conductive wire and facilitates handling of a contactless module.

Further, using the sheet, the IC substrate and the coil can be integrated in advance, and the bonding process and the filling process of the sealing resin can be performed. After the coil and the IC substrate are integrated by the sealing resin, the sheet There is also an advantage that the contactless module can be easily manufactured because the sheet is integrated without peeling off the sheet.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional side view of a contactless module according to the present invention.

FIG. 2 is a top view of the contactless module according to the present invention.

FIG. 3 is a bottom view of the contactless module according to the present invention.

FIG. 4 is a top view showing an example of a conventional contactless module.

FIG. 5 is an exploded view showing an example of a conventional contactless module.

FIG. 6 is a partially sectional side view showing an example of a conventional contactless module.

FIG. 7 is a top view showing another example of a conventional contactless module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Contact lesbian module 11 IC board 13 Electronic component 15 Connection part 21 Coil 23 Inner peripheral end 25 Outer peripheral end 27 Internal space 31 Sealing resin 35 Sheet 37 Projection 39 Adhesive tape

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G06K 19/07-19/077 B42D 15/10 521

Claims (1)

(57) [Claims] 1. A sheet comprising a thin flat sheet, an IC board to which circuit components are mounted, and a flat coil having an internal space, wherein the size of the sheet is substantially equal to the size of the coil. An IC in which the IC substrate is fixed substantially at the center of the sheet, the outer shape of the sheet is substantially matched with the outer shape of the coil, the coil is fixed to the sheet, and the inner peripheral end of the coil is disposed in the inner space of the coil. In addition to being connected to the substrate, the outer peripheral end of the coil is sandwiched between the sheet and the coil body, drawn out into the internal space of the coil and connected to the IC substrate, and further, the internal space of the coil is sealed with a sealing resin. Contactless module characterized by being filled with.