JP3079805B2 - Fault monitoring method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a FAIL lamp of a failure detection package when a failure occurs in a communication device such as a transmission device, and power supply to a power failure monitoring unit of the package.

2. Description of the Related Art In recent years, a method of displaying a failure occurrence for each package has been adopted as the number of packages to be used increases due to the complexity and sophistication of processing functions in a communication device such as a transmission device. In each of these cases, there is a strong demand for reducing alarm display errors due to power failure in the package.

[0003]

2. Description of the Related Art A conventional example will be described with reference to FIG.
A conventional transmission device is provided with each package (PK
G) Lamp (FAIL lamp) L that indicates the occurrence of a failure
To turn on P1, the power of the lamp is supplied from the power supply unit of the package, and the lamp is turned on by a FAIL command from the fault monitoring unit 21 provided in each package.

In a conventional transmission device, mounting information of each package is sent to a monitoring system. When a package is not mounted, an alarm of the package is masked.

[0005]

In such a conventional method, when the power of the package is cut off, the FAI
Since the L lamp is not turned on, it is not possible to judge whether or not the power supply of the package is turned off just by looking at the device.

Further, when the mounting information of each package is sent to the monitoring system, there is a problem that if the power of the package is cut off while the package is not mounted, the alarm is not generated. It was necessary to send an alarm to the monitoring system even when was interrupted.

As a means for sending an alarm to the monitoring system when the power supply in the package is cut off, a relay is operated by the power supply in the package, and the ground caused by the contact blockage when the power supply is cut off is used. However, the use of a relay has the disadvantage of high power consumption.

The mounting information uses a power-on reset circuit, and there is another problem that when the power is turned off, it appears as unmounted. SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problem, and an object of the present invention is to provide a failure monitoring method capable of turning on a FAIL lamp of a package in a device and enabling a power supply monitoring function operation even when the power supply of the package in the device is cut off. I do.

[0009]

FIG. 1 shows a first embodiment of a fault monitoring method according to the present invention. In the figure, 10 is a monitoring package (PKG), 11 is a FAIL monitoring unit, 20 is an in-apparatus package (PKG), 21 is a failure monitoring unit, and LP1 is a FAIL lamp.

The present invention relates to a communication apparatus such as a transmission apparatus, and a FAI mounted on a package 20 in an apparatus based on failure information detected by a failure monitor 21 provided in the package 20 in the apparatus.
In the fault monitoring method for notifying the occurrence of a fault by lighting the L lamp LP1, the FAIL
Power is supplied to the lamp LP1 and the failure monitoring unit 2
In response to the failure information detected in step 1, the FAIL lamp L
A monitoring package 10 having a FAIL monitoring unit 11 for giving a FAIL instruction to P1 is provided.

In the package 20 in the apparatus, the failure information received by the failure monitoring unit 21 is transmitted to the FAIL monitoring unit 1.
1 and power is supplied to the FAIL lamp LP1 from the power supply in the package of the monitoring package 10, and the FAIL lamp LP1 is turned on by a FAIL command from the FAIL monitoring unit 11. .

When a failure occurs in the in-device package 20, the FAIL monitoring unit 11 causes the failure monitoring unit 2
In response to the failure information sent from No. 1, a FAIL command is sent to the FAIL lamp LP <b> 1 and the FAIL lamp LP <b> 1 is turned on, thereby achieving the object.

Further, in the fault monitoring method for notifying the occurrence of a power failure detected by the power monitoring unit 23 provided in the package 20 in the device to an external alarm display unit, the power monitoring unit 23 in the package 20 in the device is provided. And a power supply failure monitoring unit 10 for supplying power to the power supply monitoring unit 23, receiving power supply failure information from the power supply monitoring unit 23, and notifying the occurrence of the power supply failure to the external alarm display unit.

Further, the power failure monitoring section 23 receives the power failure information received by the power monitoring section 23 from the power failure monitoring section 1 of the monitoring package 10.
Send to 2. The mounting information from the mounting information section 24 in the in-device package 20 is also sent to the power failure monitoring section 12.

The power supply of the power supply monitoring unit 23 in the package 20 is supplied from the power supply in the package of the monitoring package 10. When a power failure occurs in the in-device package 20, the power failure monitoring unit 11 receives the power failure information sent from the power monitoring unit 23 and displays the power failure on an external alarm display unit. The purpose can be achieved by transmitting information.

Further, based on the fault information detected by the fault monitoring unit 21 included in the package 20 in the apparatus, the FAIL lamp LP1 mounted on the package 20 in the apparatus is used.
In the fault monitoring method of notifying the occurrence of a fault by turning on the LED, the power supply to the FAIL lamp LP1 is connected to the power supply in the package of the device package 20 by the diode D3.
And the diodes D1 and D2 may be connected to the power supply in the package of the monitoring package 10, and the power may be supplied from a point where the diode D3 and the diode D2 are connected.

In the fault monitoring method for notifying an external alarm display unit of a power failure detected by the power monitoring unit 23 provided in the in-device package 20, the power supplied to the power monitoring unit 23 is controlled by the power supply. Device package 20
Connect the diode D6 to the power supply in the package of
The structure may be such that the diodes D4 and D5 are connected to the power supply in the package of the monitoring package 10, and the diode D6 is connected to the diode D5.

[0018]

According to the present invention, in a method of notifying a failure by lighting the lamp LP1 with the failure information detected by the failure monitoring unit 21 provided in the package 20 in the apparatus, the monitoring package 10 is provided and the FAIL in the package 20 is provided. Lamp LP
When the FAIL monitoring unit 11 receives power from the failure monitoring unit 21 in the in-device package 20 and supplies power to the
1 is given a FAIL instruction.

In the in-device package 20, the fault information received by the fault monitoring unit 21 is sent to the FAIL monitoring unit 11 of the monitoring package 10. In this way, when a failure occurs in the in-device package 20, the FAIL monitoring unit 11 of the monitoring package 10 receives the failure information sent from the failure monitoring unit 21 of the in-device package 20 and receives the FAIL lamp. FAIL on LP1
Since the FAIL lamp LP1 is turned on by sending a command and supplying power from the monitoring package 10, the lamp can be displayed even if the power of the in-apparatus package 20 is cut off.

In the case of a method of notifying the occurrence of a power failure in the package detected by the power monitoring unit 23 provided in the package 20 in the apparatus, power is supplied to the power monitoring unit 23 in the package 20 in the apparatus. Power supply monitoring unit 23
A monitoring package 10 having a power supply failure monitoring unit 12 that receives the power supply failure information from the server and notifies the external alarm display unit of the occurrence of the power supply failure.

The power supply failure information received by the power supply monitoring unit 23 in the in-device package 20 is transmitted to the monitoring package 10.
To the power supply failure monitoring unit 12. Also, the mounting information from the mounting information section 24 in the in-device package 20 is sent to the FAIL monitoring section 11.

The power supply of the power supply monitoring unit 24 in the package 20 is supplied from the power supply in the package of the monitoring package 10. In this way, when a power failure occurs in the in-device package 20, the power monitoring unit 23 receives power supply from the monitoring package 10 and can operate normally.

Further, the FAIL in the package 20 in the apparatus is used.
Regarding the power supplied to the lamp LP1, the diode D3 is connected to the power supply in the package of the device package 20, and the diodes D1 and D2 are connected to the power supply in the package of the monitoring package 10, so that the diodes D3 and D2 are connected. With the structure in which the power is supplied from the connection point, first, the power is supplied from the package 20 in the apparatus, and when the power of the package 20 in the apparatus is cut off, the power is supplied from the monitoring package 10 to the alarm lamp LP1. It becomes possible.

In the fault monitoring method for notifying the occurrence of a power failure detected by the power monitoring unit 23 provided in the in-device package 20, the power supplied to the power monitoring unit 23 in the in-device package 20 is controlled by the power supply monitoring unit 23. The diode D6 is connected to the power supply in the package, and the diodes D4 and D4 are connected to the power supply in the package of the monitoring package 10.
5 is connected and supplied from the connection point between the diodes D6 and D5. First, the power is supplied from the package 20 inside the apparatus, and when the power supply to the package 20 inside the apparatus is cut off, the package 10 for monitoring is used. The power supply can be supplied to the power supply monitoring unit 23.

[0025]

Next, an embodiment will be described with reference to FIGS. FIG. 1 shows a first embodiment of the fault monitoring method of the present invention, FIG. 2 shows a second embodiment of the fault monitoring method of the present invention, and FIG. 3 shows a third embodiment of the fault monitoring method of the present invention. FIG. 4 shows a fourth embodiment of the fault monitoring method of the present invention, and FIG. 5 shows a specific example of the power supply monitoring unit in the embodiment of the present invention.

In the figure, the same reference numerals as those in FIG.
10 is a monitoring package, 11 is a FAIL monitoring unit, 12
Is a power failure monitoring unit, 22 is a power supply unit, 23 is a power supply monitoring unit,
Reference numeral 24 denotes a mounting information section. LP1 is a FAIL lamp, D1 to D6 are diodes, C1 is a capacitor, R1
1 and R2 are resistors.

In the first to fourth embodiments, a plurality of in-apparatus packages 20 are usually used. However, in order to simplify the explanation, the description will be made as one unit. First, a first embodiment will be described with reference to FIG.

In the package 20 in the apparatus, if any trouble occurs in the operation of various functions, for example, in the case of a clock, for example, a signal of “L” was transmitted during normal operation, but when the clock stops. , “H” signal is sent to the fault monitoring unit 21. The fault information sent in this manner is sent to the FAIL monitoring unit 11 of the monitoring package 10.
On the other hand, in the FAIL monitoring unit 11, based on the transmitted failure information, the warning lamp LP1 such as a light emitting diode of the package 20 in the apparatus to which the failure information has been transmitted.
, A FAIL command is transmitted to turn on the lamp.

Next, in the second embodiment, a fault is monitored for a power source. The power source supplied to each function of the in-device package 20 from the power source unit 22 is taken into the power source monitoring unit 23, and the power source is monitored. When the voltage is instantaneously interrupted or reduced by a certain value or more, power failure information is transmitted. Naturally, if the power supply becomes abnormal, the power supply monitoring unit 23 does not operate normally.
More power is supplied.

Here, as a specific example of the power supply monitoring unit 23,
It can be realized using a circuit as shown in the example of FIG. That is, a circuit is configured as shown in the example of FIG. 5 using the IC (MB3771) 25, a power supply from the monitoring package 10 is connected to pin 7 of the IC 25, and a power supply monitoring unit 22 monitors the power supply. When the input is connected, power-off information can be obtained from pin 8. For example, the capacitor C1
100,000 pF, resistor R1 is 91 KΩ, resistor R2
Is 36KΩ, + 5V is +4.
When the voltage drops to 3V or less, "H" is output by pin 8 until then.
Changes to "L", it is possible to detect a drop in voltage.

Here, the monitoring voltage can be arbitrarily set by changing the values of the resistors R1 and R2. In the power supply information monitoring unit 12 of the monitoring package 10,
The mounting information from the mounting information section 24 from the in-device package 20, for example, "H" indicates that the package is not mounted, and "
In the case of L ", it is possible to judge by using information such as mounting together, and to determine whether the power-off information is true power-off or power-off due to no package mounting.

For example, the status of the package can be determined based on the monitoring result of the power supply information monitoring unit 12 and the status of the corresponding package as shown in the example of Table 1.

[0033]

[Table 1] The third embodiment is different from the first embodiment in that the power supply to the alarm lamp LP1 is supplied from the power supplies of the monitoring package 10 and the own package 20.

When both power supplies are normal, the diode D
3 and only one diode D1, D2
The power is supplied from the power supply of the own package 20 having a smaller voltage drop than that of the two monitoring packages 20 inserted. However, when the power supply of the own package 20 is reduced or cut off, It is supplied from a power supply.

The fourth embodiment is different from the second embodiment in that
The power supply supplied to the power supply monitoring unit 23 is monitored by the monitoring package 10.
Is supplied from the power source of the own package 20. As in the third embodiment, when both power supplies are normal, only one diode D6 is inserted, and compared with the monitoring package 20 side where two diodes D4 and D5 are inserted. Own package 2 with small voltage drop
The power is supplied from the power supply 0, but is supplied from the power supply of the monitoring package 10 when the power supply of the self-package 20 is reduced or cut off.

The first embodiment and the second embodiment, or the third embodiment and the fourth embodiment may be used simultaneously.

[0037]

As described above, according to the present invention, by using the power supply from another package, the FAIL lamp can be turned on even if the power supply of the own package is cut off. Therefore, it is possible to specify the faulty package simply by looking at the display of the FAIL lamp of the device.

Further, even if the power supply of the package is cut off,
Since the monitoring circuit can operate, the state of the package can be easily specified. Further, by using the first embodiment and the second embodiment or the third embodiment and the fourth embodiment of the present invention together, when a failure occurs, a package operation failure or a power supply failure can be immediately performed. This makes it possible to distinguish whether the device is missing or not mounted, which can greatly contribute to operation and maintenance.

[Brief description of the drawings]

FIG. 1 is a first embodiment of a fault monitoring method according to the present invention.

FIG. 2 is a second embodiment of the fault monitoring method of the present invention.

FIG. 3 is a third embodiment of the fault monitoring method of the present invention.

FIG. 4 is a fourth embodiment of the fault monitoring method according to the present invention.

FIG. 5 is a specific example of a power supply monitoring unit according to the embodiment of the present invention.

FIG. 6 is an example of a conventional fault monitoring method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 monitoring package 11 FAIL monitoring unit 12 power failure monitoring unit 20 in-device package 21 failure monitoring unit 22 power supply unit 23 power supply monitoring unit 24 mounting information unit 25 IC (MB3771) LP1 FAIL lamp D1 to D6 Diode C1 Capacitor R1, R2 Resistance

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-64-12745 (JP, A) JP-A-3-276303 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H04L 29/14

Claims (4)

(57) [Claims] 1. A communication device such as a transmission device, which is mounted on an in-device package (20) based on fault information detected by a fault monitoring unit (21) included in the in-device package (20).
In the fault monitoring method for lighting an AIL lamp (LP1) to notify the occurrence of a fault, the FAIL lamp (L) in the package (20) in the device is provided.
P1) and the fault monitoring unit (21)
In response to the fault information detected in the above, the FAIL lamp (L
FAIL monitoring unit (11) for giving a FAIL instruction to P1)
A monitoring package (10) having a fault monitoring unit (2) is provided in the device package (20).
The FAIL monitoring unit (11) receives the failure information received by 1).
And power is supplied to the FAIL lamp (LP1) from the power supply in the package of the monitoring package (10).
Further, the lighting of the FAIL lamp (LP1) is changed to the FAIL lamp.
When a failure occurs in the in-device package (20), the FAIL monitoring unit (11) sends the failure information sent from the failure monitoring unit (21). Receiving the FAIL lamp (L
P1), and sends the FAIL lamp (L
A fault monitoring method characterized by lighting P1). 2. A fault monitoring method for notifying an external alarm display of the occurrence of a power failure detected by a power monitoring section (23) provided in the package (20) in the apparatus, comprising: A power failure monitoring unit (12) that supplies power to the power monitoring unit (23), receives power failure information from the power monitoring unit (23), and notifies the external alarm display unit of the occurrence of the power failure. A monitoring package (10) for transmitting the power failure information received by the power monitoring unit (23) to the power failure monitoring unit (12) of the monitoring package (10); The mounting information section (2) in (20)
The mounting information from (4) is also sent to the power supply failure monitoring unit (12), and the power supply of the power supply monitoring unit (23) in the device package (20) is set in the package of the monitoring package (10). When a power failure occurs in the package (20) in the device, the power failure monitoring unit (11) is configured to supply the power monitoring unit (2).
A failure monitoring method characterized by receiving the power failure information sent from 3) and transmitting the power failure information to an external alarm display unit. 3. The apparatus package (2) according to claim 1, wherein power is supplied to the FAIL lamp (LP1) in the apparatus package (20).
0) a diode (D3) is connected to the power supply in the package, the diodes (D1 and D2) are connected to the power supply in the package of the monitoring package (10), and the diode (D3) and the diode (D3) are connected. D2), the failure monitoring method is provided from the point where the connection is made. 4. The power supply monitoring unit (2) according to claim 2, wherein the power supply monitoring unit (2) in the device package (20).
The power supply to 3) is connected to the diode (D6) from the power supply in the package of the device package (20), and the diodes (D4, D5) are connected to the power supply in the package of the monitoring package (10). And a structure in which the diode (D6) and the diode (D5) are supplied from a connected point.